CN108648175B

CN108648175B - Detection method and device

Info

Publication number: CN108648175B
Application number: CN201810325003.0A
Authority: CN
Inventors: 赵盾
Original assignee: Hangzhou Zhaotu Robot Co ltd
Current assignee: Hangzhou zhaotu robot Co.,Ltd.
Priority date: 2018-04-12
Filing date: 2018-04-12
Publication date: 2021-12-14
Anticipated expiration: 2038-04-12
Also published as: CN108648175A

Abstract

The invention discloses a detection method, which comprises the steps of adding an image shooting step after a component carrier surface mounting process, analyzing an image of a component carrier after the surface mounting process by combining with the preprocessing information of a computer on a CAD drawing to obtain more accurate and actual structural characteristic information of a tested product compared with the CAD drawing, and judging the installation defects of components such as metal wires or metal balls by comparing the structural characteristic information with the structural characteristics obtained by analyzing the image of the component carrier in the same batch after a wire welding process, thereby improving the defect judgment accuracy and avoiding the generation of wrong judgment and missed judgment.

Description

Detection method and device

Technical Field

The invention relates to the technical field of component defect detection, in particular to a method and a device for detecting mounting defects of a component mounted on a component carrier.

Background

An Integrated Circuit (IC) is a type of microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in the circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. In order to ensure the mounting quality of IC devices, it is important to detect defects of IC devices. At present, the detection of the installation defect of an IC component is mainly carried out by means of matching image identification with manual detection, the image of the IC component which finishes a Wire bonding process (Wire Bond) is obtained by a camera device, the obtained image is identified by manual or image processing software, whether the IC component has installation defect is judged according to the states of the identified gold Wire, gold ball, gold finger and the like, the prior art directly carries out defect analysis on the image which finishes the Wire bonding process, the image is fully distributed with the gold Wire and the gold ball, the structures of the gold ball, the gold finger and the like are partially overlapped in space, meanwhile, because the shapes of the image are different, the reflection of a camera light source is inconsistent, great difficulty is brought to the characteristic identification of the obtained image, and the automatic identification precision of the image of the structures can not meet the requirements of the current market, the auxiliary manual identification has the problems of high cost, low efficiency, easy fatigue of detection personnel, high misjudgment rate and the like.

Disclosure of Invention

The invention provides a detection method and a device aiming at the problem that the detection equipment in the prior art cannot effectively detect the installation defects caused by low identification precision of metal wires, metal balls and the like after the processes of surface mounting and wire bonding are finished, and the technical scheme is as follows:

an inspection method for inspecting a component mounted on a component carrier, comprising: acquiring a first image of the surface of the element carrier after the surface mounting process is finished through camera equipment; analyzing and processing the first image according to the CAD graph of the element carrier to obtain structural feature information; acquiring a second image of the surface of the element carrier after the wire welding process is finished through camera equipment; and comparing the structural feature information with the structural feature on the second image to judge whether the assembly is installed with defects.

Further, the structural feature includes a pad, the pad includes but is not limited to one or more of a wafer pad, a lead frame pad, and a PCB pad, and the analyzing the first image and then obtaining the structural feature information includes: and analyzing the outline or the area of the bonding pad on the first image to acquire the position information of the bonding pad.

Further, the structural feature includes a metal ball, wherein comparing the structural feature information with the structural feature on the second image includes: and comparing the position information of the bonding pad with the metal ball on the second image.

Further, the structural feature includes a metal wire, and obtaining structural feature information after analyzing and processing the first image includes: and analyzing the first image according to the CAD drawing of the element carrier to acquire the information of the metal wire connection position.

Further, the structural feature includes a metal wire, and obtaining structural feature information after analyzing and processing the first image includes: and acquiring a metal wire connection attribute according to the CAD graph of the element carrier, and marking a preset connection route of the metal wire on the first image according to the metal wire connection attribute.

Further, the components include, but are not limited to, metal wires and/or metal balls.

Further, the component carriers on the first image and the second image are different component carriers of the same batch.

Further, the first image and the second image are respectively acquired by using different angles, light source angles and/or light source intensities of the camera device.

The invention also discloses a detection device for detecting the components mounted on the component carrier, which comprises an image pickup device, a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor executes the computer program to realize the steps of the method.

The invention also discloses a computer-readable storage medium, in which a computer program is stored, which, when being executed by a processor, carries out the steps of the method as set forth in any one of the above.

The invention achieves the following beneficial effects:

the invention analyzes and processes the image of the element carrier after the surface mounting process by combining the CAD graph thereof to obtain accurate structural characteristic information, then analyzes the image of the element carrier in the same batch after the wire welding process by taking the structural characteristic information as the checking reference information of the element carrier in the batch to obtain the structural characteristic thereof, compares the structural characteristic with the structural characteristic information, and judges whether the assembly is installed with defects or not, so that the final detection result is more accurate. The invention adopts the technical scheme that the component carrier after the chip bonding process is subjected to structural characteristic information identification, so that the identification precision can be effectively improved, and the interference caused by the overlapping of metal wires after the wire bonding process can be effectively avoided by shooting the component carrier which is subjected to the chip bonding process but is not subjected to the wire bonding process in advance and analyzing and processing the structural characteristics of the acquired first image, so that the identification efficiency and the identification precision are improved. And subsequently, the component carrier which finishes the wire bonding process is shot to compare and analyze the structural characteristics of the metal wire, the metal ball or the bonding pad and the like on the acquired image with the structural characteristic information acquired in the first image so as to judge the installation defects of the components of the metal wire, the metal ball and the like, improve the defect judgment accuracy and avoid the generation of wrong judgment and missed judgment.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:

fig. 1 is a schematic flow chart of a detection method according to an embodiment of the invention.

Fig. 2 is a schematic diagram of a first image according to an embodiment of the invention.

FIG. 3 is a CAD drawing of a die attach, in accordance with an embodiment of the present invention.

FIG. 4 is a partial schematic view of a die attach CAD drawing in accordance with an embodiment of the present invention.

Fig. 5 is a diagram illustrating an effect of analyzing the first image according to an embodiment of the present invention.

Fig. 6 is a partially enlarged view of an effect diagram of the first image after being analyzed according to another embodiment of the present invention.

Fig. 7 is a schematic diagram of an image obtained after performing structural feature identification processing on the second image according to an embodiment of the present invention.

Fig. 8 is a schematic flow chart of a detection method according to another embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one.

Before describing the embodiments in detail, some terms are briefly explained. Die Bond process (Die Bond): the method is a process of bonding a wafer (wafer frame) to a device carrier such as a lead frame (lead frame) using an adhesive (epoxy) and then heating the wafer at a certain temperature for a certain time to fix the wafer. Wire bonding process (Wire Bond): the method is to Bond the aluminum Pad (Bond Pad) on the chip (DIE/chip) attached to the device carrier such as lead frame (lead frame) and the inner lead (Finger) of the lead frame with gold wire (gold wire) according to the bonding wire diagram, so that the outer lead and the inner lead of the lead frame can be connected to obtain the correct output of the designed function of the chip. Therefore, if the gold wire has various defects such as open circuit, short circuit and holes in the welding process or the gold ball has problems such as insufficient soldering and separation, the whole chip module is directly scrapped, and in order to prevent the chip module with the defects from entering a subsequent production link, the defect detection is carried out after the wire bonding process so as to prevent the defective chip module from entering the subsequent link.

The following will specifically select an image sensor (also known as a camera module) as an example, and describe in detail the specific application of the present invention in the process of mounting an integrated circuit and the process of bonding wires.

Fig. 1 is a detailed flowchart of a testing method for testing a component mounted on a component carrier according to an embodiment of the present invention, which specifically includes the following steps:

and S101, acquiring a first image of the surface of the element carrier after the chip mounting process is finished through the image pickup equipment.

In this embodiment, the shooting angle of the image pickup apparatus, the intensity of the auxiliary light source, or the light angle of the auxiliary light source are adjusted, and the component carrier after the Die Bond process (Die Bond) is completed, that is, the camera module in this embodiment, is photographed. The component carrier 4 may be a leadframe or circuit board with associated chips mounted thereon to capture a first image including an image of the electronic components on the component carrier, such as the one shown in fig. 2.

And S102, analyzing and processing the first image according to the CAD graph of the element carrier to obtain structural feature information.

In the present embodiment, as shown in fig. 2, the structural features may include, but are not limited to, one or more of a die 3, a die pad 2, a leadframe pad/PCB pad 1, or a metal line. The structural feature information may include location information of a pad, wafer location information, metal line connection location information, and the like. The metal wire may be made of various metal materials for connecting and transmitting electrical signals, including but not limited to gold wire, aluminum wire, copper wire, etc., and for convenience of description, the most commonly used gold wire is described below. The steps described in this embodiment include analyzing the first image based on the component carrier CAD drawing to obtain gold wire connection position information. Preferably, the gold wire connection attribute may be acquired according to a component carrier CAD drawing, and the predetermined connection route of the gold wire is identified on the first image according to the gold wire connection attribute. Specifically, the gold wire connection property in the component carrier CAD drawing may be mapped to the first image. Fig. 3 and 4 are wafer-bonding CAD drawings of the component carrier, in which gold wire bonding marks 7 in the wafer-bonding CAD drawings can be extracted, some common feature information in the CAD drawings and the first image is used as Mark points 8, the Mark points are used as positioning points to map the gold wire bonding marks 7 to the first processed image, and the first processed image with gold wire bonding marks shown in fig. 5 and 6 is obtained.

In this implementation, the outline or the area where the pad is located on the first image is analyzed to obtain the position information of the pad. Including but not limited to one or more of die pad 2, leadframe pad/PCB pad 1 (i.e., gold finger). Specifically, the structural features of the bonding pad on the first image are identified and processed for storage. In the detection method of this embodiment, an existing image processing technology such as image recognition software may be used to perform automatic image feature recognition on structural features such as pads in an acquired first image, identify an outline or an area of the structural features on the first image, and store the generated image with the position information of the outline or the area of the structural features as a first processed image. In this embodiment, the outline or the area where the pad is located on the first image may also be analyzed, and the position information of the pad may be obtained and stored. The structural feature information on the first image is identified and identified by using the image processing technology such as the existing image identification algorithm, so that the identification efficiency of the structural feature can be effectively improved. In other embodiments, of course, the obtained first image may also be processed manually by using drawing software and the like to identify each structural feature on the first image, and the structural feature profile is sketched on the first image by using the drawing software and stored as the first processed image, so that the manual identification can reduce the processing pressure of a computer, and meanwhile, the processing is more flexible, and the accuracy of identifying the structural feature of the special form is high.

In some embodiments, the structural feature may further include other electronic components on the component carrier 4, such as a capacitor, a resistor, an inductor, and the like, and the detection method further includes comparing the contour or area information of the structural feature on the first processed image with stored preset information or preset position information of the structural feature on the component carrier, and if the position information error is greater than a preset value, determining that the foregoing bonding process is defective, and stopping the subsequent wire bonding process. For example, in this embodiment, the area where the capacitor is located may be identified, the capacitor may be compared with the stored preset information or the preset position information on the component carrier, and if the position information error angle is greater than the preset value, it is determined that the capacitor components in the camera modules of the batch have defects in the foregoing mounting process. Whether the installation positions and the like of the components such as the wafer, the capacitor and the like are standard or not is detected after the chip mounting process, so that the situation that batch products with chip defects flow into links such as a subsequent wire welding process and the like and subsequent invalid production input is interrupted in time can be avoided, the production efficiency can be effectively improved, and the waste of production resources is reduced.

And S103, acquiring a second image of the surface of the element carrier after the wire bonding process is finished through the camera equipment.

In this embodiment, the component carrier after the Wire bonding process (Wire Bond) is completed is photographed to obtain a second image including images of electronic components, metal wires, metal balls, and the like on the component carrier, which is shown in fig. 3. The metal wire may be made of various metal materials for connecting and transmitting electrical signals, including but not limited to gold wire, aluminum wire, copper wire, etc., and for convenience of description, the most commonly used gold wire is described below. The metal ball may be made of various metal materials for connecting and transmitting electrical signals, and includes, but is not limited to, a gold ball, a copper ball, and the like.

And S104, comparing the structural feature information with the structural feature on the second image to judge whether the assembly is installed defectively.

Specifically, the method comprises the step of identifying partial structural features on the second image. Preferably, the partial structural features may include, but are not limited to, Gold balls (Gold balls) and/or Gold wires. In this embodiment, as shown in fig. 7, the partial structural features include gold balls 6 and gold wires 5, and the partial structural features such as gold balls or gold wires in the acquired second image are automatically image-feature-recognized by using an existing image processing technology such as image recognition software, and the outlines of the partial structural features are identified on the second image. In other embodiments, to reduce the workload, the gold wire outline identifier may be replaced by a single-line identifier for the gold wire 5, so as to reduce the interference between the structural feature identifiers on the second image compared with the identification of the gold wire outline. As described aboveThe structural feature information on the second image is recognized and identified by utilizing the image processing technologies such as the existing image recognition algorithm, and the identification efficiency of the structural feature can be effectively improved. Of course, in other embodiments, the obtained second image may also be manually processed by drawing software or the like to identify each structural feature on the second image, and the structural feature contour is sketched on the second image by the drawing software and stored, and the manual identification may be performedReducingThe processing pressure of a computer is reduced, and the identification accuracy rate can be effectively improved by manually identifying structural characteristic information of the structural characteristics such as gold wires coincident with the structural characteristics such as a wafer bonding pad and a lead frame bonding pad.

In some embodiments, the structural features include gold balls 6 and gold wires 5, but only the gold balls in the acquired second image are subjected to image feature automatic recognition by using the existing image processing technology such as image recognition software, and the outlines or areas of the gold balls are identified on the second image. Furthermore, the Mark point is used as a positioning point to map part or all of the information in the first processed image with the gold wire connection Mark to a second image, wherein the mapping information is position information of relevant structural features, and the mapping information comprises contour or area marks of the structural features such as the gold wire connection Mark and the bonding pad. In other embodiments, the structural features include gold balls 6 and gold wires 5, but only the gold balls in the acquired second image are subjected to image feature automatic recognition by using the existing image processing technology such as image recognition software, and the outlines or areas of the gold balls are identified on the second image. Further, extracting the gold wire connection attribute in the CAD graph, taking certain common characteristic information in the CAD graph and the second image as Mark points, and taking the Mark points as positioning points to map the gold wire connection attribute to the second image. The preset connecting route of the metal wire is obtained by mapping the gold wire connecting identification in the CAD graph to the second image, the identification and identification of the actually welded gold wire in the second image can be omitted, the connection position information of the actually welded gold wire and the metal wire can be directly corrected and detected, and then whether the gold wire has the problems of connection error, gold wire missing welding, gold wire falling and the like after the actual wire welding process can be judged, and the problems of poor gold wire identification precision and high identification error rate caused by different shapes, close intervals and the like of the actually welded gold wire when the actually welded gold wire in the second image is directly identified are avoided.

In other embodiments, similar to the above, the wafer pad identification in the CAD drawing may also be extracted, some common feature information in the CAD and first image or first processed image may be used as Mark points, and the Mark points may be used as anchor points to map the wafer pad information to the second image. Of course, the wafer pad information identifier may be mapped to the first image first, and then each piece of structural feature information on the first image may be mapped to the second image. By mapping the wafer bonding pad identification in the circuit schematic diagram, the identification accuracy of the wafer bonding pad on the first image can be improved, and the problems of low image identification rate, high identification error rate and high leakage rate of the wafer bonding pad caused by factors such as the size and the reflection of the wafer bonding pad are solved. In this embodiment, the component carriers on the first image and the second image are different component carriers of the same batch. Because the positions and the profiles of the wafer bonding pad and the lead frame bonding pad (namely the golden finger) on the same batch of element carriers are the same, under normal conditions, only one element carrier in the same batch which finishes the chip mounting process needs to obtain a first image, and the first image is stored as a reference image after the structural feature on the first image is identified and processed. In this embodiment, the obtained second image of the surface of each component carrier after the wire bonding process is completed in the batch is respectively superimposed with the first image, and the structural feature on the superimposed second image is identified. In other embodiments, the structural features on the second image of the surface of each component carrier obtained after the wire bonding process is completed for the batch are identified, and the identified second image is superimposed with the first image. Or, extracting the structural feature information on the first image, selecting an image reference point, mapping the structural feature information to the same position of each second image, and then performing gold thread or gold ball structural feature identification processing on the second image mapped with the feature information; or extracting the structural feature information on the first image, selecting an image reference point, and mapping the structural feature information to each second image of the installation batch which is subjected to the identification processing.

Further, the mounting defects of the components such as gold wires or gold balls are judged according to the comparison between the structural feature information and the structural feature on the second image: if no gold ball or gold wire exists on the wafer bonding pad or the lead frame bonding pad in the structural characteristics, judging that the missing routing defect exists; if the gold wire exists on the wafer bonding pad or the lead frame bonding pad in the structural characteristics but the gold ball does not exist, judging that the defect of gold ball falling exists; if the chip bonding pad or the lead frame bonding pad in the structural characteristic has the gold ball but does not have the gold wire, judging that the defect that the gold wire falls off exists; if the gold ball area exceeds the chip bonding pad or the lead frame bonding pad area to reach a preset proportion, judging that the gold ball has deviation; in addition, the installation defect of the component can be judged according to the structural characteristics after the identification processing: for example, if the gold ball is not connected to the gold wire, it is determined that there is a defect that the gold wire falls off; if the middle part of the gold wire is contacted with the gold ball area, judging that the gold wire has the wire collapse defect; and if the gold wire is not connected with the corresponding chip bonding pad or the corresponding lead frame bonding pad according to the gold wire connection identifier, judging that the gold wire has a connection error. In other embodiments, the radian of the gold wire can be identified, and when the radian of the gold wire exceeds a preset value, the gold wire is judged to have the defect of poor radian; the above is only a partial example of the defect determination method. The judgment can be automatically judged according to the preset corresponding rule by acquiring the structural feature information of the identifier through a program, or can be manually and directly analyzed and judged on the second image superposed with the structural feature identifier information according to the corresponding rule.

The method comprises the steps of adding an image shooting step after an element carrier pasting process (diebond), combining with computer to pre-processing information of a CAD drawing, analyzing and processing an image of an element carrier after the pasting process and the CAD drawing to obtain more accurate and actual structural feature information of a tested product compared with the CAD drawing, then using the structural feature information as verification reference information of the element carriers in the batch, analyzing the image of the element carrier in the same batch after the wire bonding process (wire bonding) to obtain the structural feature of the element carrier, comparing the structural feature with the structural feature information, and judging whether the assembly is defective or not so as to enable the final detection result to be more accurate. The invention adopts the technical scheme that the component carrier after the chip bonding process is subjected to structural characteristic credit line identification, so that the identification precision can be effectively improved, and the interference caused by gold wire overlapping generated after the wire bonding process can be effectively avoided by photographing the component carrier which is subjected to the chip bonding process but is not subjected to the wire bonding process in advance and analyzing and processing the structural characteristics of the acquired first image, so that the identification efficiency and the identification precision are improved. And subsequently, the component carrier which finishes the wire bonding process is shot to compare and analyze the structural characteristics of the gold wires, the gold balls or the bonding pads and the like on the acquired image with the structural characteristic information acquired in the first image so as to judge the installation defects of the components of the gold wires, the gold balls and the like, improve the defect judgment accuracy and avoid the generation of wrong judgment and missed judgment.

Fig. 8 is a detailed flowchart of a testing method for testing a component mounted on a component carrier according to another embodiment of the present invention, which specifically includes the following steps:

s201, acquiring a first image of the surface of the element carrier after the surface mounting process is finished through camera equipment;

s202, analyzing and processing the first image according to the CAD graph of the element carrier to obtain structural feature information;

s203, adjusting one or more parameters of a shooting angle, a light source angle or light source intensity of the camera equipment;

s204, acquiring a second image of the surface of the element carrier after the wire bonding process is finished through the camera equipment;

s205, comparing the structural feature information with the structural feature on the second image, and judging whether the assembly is installed with defects.

The difference between this embodiment and the foregoing embodiment is that in the additional step S203, since the device carrier has structural features such as a chip, a chip pad, a leadframe pad, etc. attached to the surface of the device carrier when the wire bonding process is not performed, and the chip pad, the leadframe pad, etc. reflect light seriously, the image capturing device or the auxiliary light source preferably forms an angle with the device carrier to obtain the first image. However, the gold wires, gold balls and other structural features after the wire bonding process are arranged in a three-dimensional manner on the surface of the component carrier, and in order to obtain the optimal second image, the original camera parameters need to be changed before the second image is obtained, for example, different angles, light source angles and/or light source intensities of the camera are adjusted, so as to obtain clear images of the structural features of the gold wires, the gold balls and the like. The step solves the problem that the image of each structural characteristic acquired by adopting the same shooting parameter is difficult to ensure to reach the image definition standard simultaneously because the light reflecting degrees of each structural characteristic to the auxiliary light source before and after the wire welding process are inconsistent.

An embodiment of the present invention also provides a detection apparatus for detecting a component mounted on a component carrier, including: an image pickup apparatus, a processor, a memory, and a computer program, such as an electronic component detection program, stored in the memory and executable on the processor. The processor implements the steps in the above-described respective detection method embodiments when executing the computer program.

Illustratively, the computer program may be partitioned into one or more modules/units that are stored in the memory and executed by the processor to implement the invention. The one or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution process of the computer program in the detection apparatus.

The Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. The general purpose processor may be a microprocessor or the processor may be any conventional processor or the like, the processor being the control center for the test device and connecting the various parts of the overall test device using various interfaces and lines.

The memory may be used to store the computer programs and/or modules, and the processor may implement the various functions of the detection apparatus by running or executing the computer programs and/or modules stored in the memory, and by calling up data stored in the memory. The memory may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function (such as an image editing function, etc.), and the like. In addition, the memory may include high speed random access memory, and may also include non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), at least one magnetic disk storage device, a Flash memory device, or other volatile solid state storage device.

The module integrated with the detection apparatus may be stored in a computer-readable storage medium if it is implemented in the form of a software functional unit and sold or used as a separate product. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method embodiments may be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

In summary, the above-mentioned embodiments are only preferred embodiments of the present invention, and all equivalent changes and modifications made in the claims of the present invention should be covered by the claims of the present invention.

Claims

1. An inspection method for inspecting a component mounted on a component carrier, comprising:

acquiring a first image of the surface of the element carrier after the surface mounting process is finished through camera equipment;

analyzing and processing the first image according to an element carrier CAD drawing to obtain structural characteristic information, wherein the structural characteristic information can comprise position information of a bonding pad, position information of a wafer or connection position information of a metal wire, obtaining a gold wire connection attribute according to the element carrier CAD drawing, marking a preset connection route of a gold wire on the first image according to the gold wire connection attribute, mapping the gold wire connection identifier to a first processing image by taking a Mark point as a positioning point, and obtaining a first processing image with the gold wire connection identifier;

adjusting one or more parameters of a shooting angle, a light source angle or light source intensity of a camera device, acquiring a second image of the surface of the element carrier after the wire bonding process is finished through the camera device, performing image feature recognition on a gold ball and a gold wire in the acquired second image, replacing a gold wire outline identifier with a single-line identifier, and identifying the outline or the area of the gold ball on the second image;

through structural feature information with structural feature on the second image compares, judges whether the subassembly installation has the defect, and the specific Mark point of wherein regard as the locating point to map the profile or the regional sign of having gold thread connection sign in the first processing image of gold thread connection sign to the second image, wherein mapping information includes gold thread connection sign and pad structural feature, through the actual welding gold thread on the second image with gold thread connection sign and pad profile sign in the mapping information carry out the proofreading and detect and judge whether the subassembly installation has the defect.

2. The inspection method of claim 1, wherein the structural features include bond pads including, but not limited to, one or more of die bond pads, leadframe bond pads, and PCB bond pads,

the step of obtaining structural feature information after analyzing and processing the first image comprises: and analyzing the outline or the area of the bonding pad on the first image to acquire the position information of the bonding pad.

3. The detection method of claim 2, wherein the structural feature comprises a metal ball,

wherein comparing the structural feature information with the structural feature on the second image comprises: and comparing the position information of the bonding pad with the metal ball on the second image.

4. The detection method according to any one of claims 1 to 3, wherein the structural feature comprises a metal wire,

the step of obtaining structural feature information after analyzing and processing the first image comprises: and analyzing the first image according to the CAD drawing of the element carrier to acquire the information of the metal wire connection position.

5. The detection method according to any one of claims 1 to 4, wherein the components include, but are not limited to, metal wires and/or metal balls.

6. The inspection method according to claim 5, wherein the component carriers on the first image and the second image are different component carriers of the same batch.

7. A detection apparatus for detecting a component mounted on a component carrier, comprising a camera device, a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 6 when executing the computer program.

8. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 6.