CN104768334A - Surface mounting method for dynamically adjusting surface mounting position and device thereof - Google Patents
Surface mounting method for dynamically adjusting surface mounting position and device thereof Download PDFInfo
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- CN104768334A CN104768334A CN201410006049.8A CN201410006049A CN104768334A CN 104768334 A CN104768334 A CN 104768334A CN 201410006049 A CN201410006049 A CN 201410006049A CN 104768334 A CN104768334 A CN 104768334A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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Abstract
The invention discloses a surface mounting method for dynamically adjusting a surface mounting position and a device thereof. The method is to mount at least one surface mounting element on a PCB substrate. The method comprises the following steps: at least one group of positioning welding pads is arranged on the PCB substrate, and a positioning through hole is arranged at a position, corresponding to each positioning welding pad, on a printing screen; the PCB substrate and the printing screen are overlapped, a printing step is executed, and a recognition pattern is printed on each positioning welding pad; a control center uses the presently-made recognition pattern as a reference point for optical positioning, a surface mounting step is executed, and a surface mounting machine mounts the surface mounting element on the PCB substrate executing the printing step. The surface mounting method is particularly suitable for surface mounting of small-size surface mounting elements, and a standing and separating phenomenon after a furnace can be effectively avoided.
Description
Technical field
The present invention relates to a kind of surface mounting technology (SMT, Surface Mounting Technology) in part attachment process and device, in particular to a kind of attaching method and the device thereof that dynamically adjust mounting position, it is particularly suitable for the minimum and surface mount of the components and parts that the size of the pad of correspondence is also minimum of volume and weight.
Background technology
The develop rapidly of science and technology, advancing by leaps and bounds of performance, makes electronic product instantly progressively move towards light, thin, miniature road.Typical electronic product, " stature " weight as mobile phone also moves ahead along this rule always, one of " overall dimension " important attraction having become end product.High density, undersized design have become a fiercest index of product competition, and the size of part is constantly compressed, and also constantly proposes new challenge to assembling parts (SMT) technique.
PCB configuration design, pad size design, press quality situation and PCB manufacture the series of factors such as processing quality, govern paster and the welding precision of minitype paster part all the time, many affect the factor of precision accumulation and cause producing yield and be difficult to promote always.
In existing surface mount process, modal problem is, in solder reflow process, surface mount elements such as patch capacitor or Chip-R can partly or wholly be holded up, thus generation is stood and the defect of sealing-off because sticking up, phenomenon that people are referred to as visually " setting up a monument ".The generation of phenomenon of " setting up a monument " is that the surface tension of surface mount elements two welding ends is uneven because the soldering paste on the pad of surface mount elements two ends is when refluxing fusing, and one end that tension force is larger hauls surface mount elements and causes along rotating bottom it.
The volume of surface mount elements is more little more easily there is " setting up a monument " phenomenon, this is because unbalanced tension force can pull surface mount elements easily.For minimum attachment components and parts 01005 part that current SMT industry uses, offset after the maximum deficient manufacturing procedure of SMT attachment process belongs to stove, set up a monument bad.
Producing above-mentioned phenomenon is the result that many-sided composite factor causes.First, wiring board manufactures in the course of processing and causes sheet material irregularities harmomegathus, is especially directed to FPC and FR4 many jigsaw Design Mode, and it is more obvious that harmomegathus shows, and the situation that actual harmomegathus size reaches more than 75um often has generation; Secondly, itself there is certain low precision in printing machine, industry can accomplish that more satisfactory low precision is 25um, generally maintains about 40 ~ 50um at present in printing process; In addition, own low precision about the 50um of high speed placement system.Directly affects 01005 process rate after these low precisions accumulation superposition, thus it is too high to cause bad item to show as the rate of setting up a monument.
Particularly, as shown in Figure 1, PCB 100 in kind shaping time, there is the harmomegathus of irregularities in its pad 101 and the pad 101 ' of original design file as designed in Gerber file.That is, the pad 101 of the PCB 100 obtained in actual production cannot mate with the position of the pad 101 ' in original design and size and corresponding completely completely.
As shown in Figure 2, printing machine prints by two optical locating points 102 on the sheet material of PCB 100, and because of sheet material harmomegathus and printing precision problem, occur situation as shown in Figure 3, tin cream 103 and pad 101 exist bias phenomenon.Two optical locating points 102 on sheet material are still adopted to position during chip mounter paster, because chip mounter program is according to gerber documenting, each patch location is fixed and close to the position of original gerber file, because of part two ends and tin cream 103 contact area difference, thus there is " setting up a monument " phenomenon because part two ends pulling force is uneven after causing stove, as shown in Figure 4.
That is, in the prior art, PCB 100 is in forming process, because the harmomegathus of sheet material, the position of its pad 101 does not arrive the position of setting, thus create first time deviation, and PCB 100 forms optical locating point 102, and optical locating point 102 provides identification datum mark for each follow-up step.Like this, in print steps, when positioning according to the optical locating point 102 preset, do not consider the harmomegathus of PCB 100, thus cause in printing process, create second time deviation, namely tin cream 103 is not printed on pad 101 completely accordingly.Then, when paster, the coordinate of paster is the coordinate in original gerber file, and be using optical locating point 102 as identification datum mark, thus be equivalent to have ignored completely foregoing first time deviation and second time deviation, cause components and parts when paster like this, the welding end face of components and parts neither be welded on tin cream 103 completely accordingly, thus creates third time deviation.
Like this, in the whole attachment process of minitype paster element, using fixing optical locating point as benchmark, follow-up printing and paster step is made to create relatively large deviation, thus the result of above-mentioned three deviations is surface mount elements creates more serious Component Displacement, and in reflow process, due to surface tension during solder paste melts pull surface mount elements automatically to correct time, because skew is serious, the welding end face of the surface mount elements larger with tin cream 103 contact area can obtain more thermal capacity and first melt, thus the pulling force that this automatic correction produces can make surface mount elements erect on the contrary thus produce " setting up a monument " phenomenon.
Thus, with fixing optical locating point for datum mark and printing and attachment time the printing coordinate that uses respectively and mounting coordinates be all the attachment process of the minitype paster element according to the preset coordinate in original Gerber file, be difficult to " setting up a monument " phenomenon when eliminating Reflow Soldering.
Summary of the invention
Main purpose of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, and described attaching method is particularly suitable for volume and weight is minimum and that the size of the pad of correspondence is also minimum mount components and is mounted in PCB substrate.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, described attaching method makes the tin cream location matches in described mount components and described PCB substrate, thus occurs " setting up a monument " phenomenon after being prevented stove.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, in paster step wherein in described attaching method, the identification icon being used as benchmark is in real time, field fabrication, thus ensure, when chip mounter completes described paster step, can accurately locate.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, in described paster step wherein in described attaching method, because use described identification icon as datum mark, the mounting coordinates of described like this mount components is no longer the position coordinates in original design, but be adjusted to the perforate coordinate of printed steel mesh, thus the mounting position of described mount components is more corresponded to actual needs.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, wherein because the identification icon being used as benchmark be in real time, field fabrication, thus when described chip mounter completes paster step, can adjust according to the different expansion-contraction degrees of described PCB substrate.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, because in described paster step, the described identification icon formed in preceding step is calibrated as datum mark, thus the superposition that the precision caused in abovementioned steps adds up can not produce serious influence to described paster step and make two welding end faces of described mount components and tin cream contact area produce larger difference, thus effectively prevent because each step precision accumulation superposition and setting up a monument of causing is bad.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, described attaching method makes the harmomegathus precision of the sheet material of described PCB substrate suitably can relax standard, the jigsaw number being convenient to follow-up sheet material strengthens, thus improving production efficiency.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, wherein described attaching method of the present invention adds the operation dynamically made described identification icon and position according to described identification icon, thus do not need the structure changing original PCB substrate, also do not need to change original document as the design in gerber file, thus described attaching method of the present invention is applicable to integrating with existing attachment process.
Another object of the present invention is to provide a kind of attaching method and the device thereof that dynamically adjust mounting position, its simplicity of design, easy to process, applicability is extremely strong, thus directly improving product yield, reduce and reprocess scrappage and cost-saving.
For reaching above object, the invention provides a kind of attaching method dynamically adjusting mounting position, at least one mount components is mounted in a PCB substrate by described method, and described method comprises the steps:
A () arranges at least one group of capture pad in described PCB substrate;
B () arranges positioning through hole in the corresponding position of capture pad described in each of Printing screen;
(c) by described PCB substrate and described Printing screen superimposed, and perform print steps, capture pad described in each be printed with identification icon; And
D () control centre carries out optical alignment using the described identification icon of existing system as datum mark, and perform paster step, and described mount components is mounted in the described PCB substrate after performing described print steps by chip mounter.
According to an example of the present invention, in above-mentioned attaching method, described one group of capture pad comprises two or more described capture pad, and correspondingly, described Printing screen has two or more positioning through hole.
According to an example of the present invention, in above-mentioned attaching method, capture pad described in each is arranged at the periphery nonclient area of described PCB substrate.
According to an example of the present invention, in above-mentioned attaching method, described one group of capture pad comprises two described capture pad, and lays respectively at two diagonal zones of described PCB substrate.
According to an example of the present invention, in above-mentioned attaching method, described PCB substrate is roughly rectangular, two described capture pad lay respectively at described PCB substrate compared with in two diagonal zones of long-diagonal.
According to an example of the present invention, in above-mentioned attaching method, described mount components is minitype paster electric capacity or Chip-R, such as, can be 01005 components and parts known in the industry.
According to an example of the present invention, in above-mentioned attaching method, the size of described positioning through hole is less than the size of corresponding described capture pad.
According to an example of the present invention, in above-mentioned attaching method, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon.
According to an example of the present invention, in above-mentioned attaching method, the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
According to an example of the present invention, in above-mentioned attaching method, described capture pad is made up of the first material, and corresponding described identification icon is made up of the second material, and described first material and described second material make described capture pad can distinguish with corresponding described identification icon.
According to an example of the present invention, in above-mentioned attaching method, described first material is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and described second material of correspondence is selected from the one in tin and nickel.
According to a further aspect of the invention, the present invention also provides a kind of method dynamically making identification icon in surface mount process, described identification icon be used for before described attachment process as datum mark to carry out optical alignment, described method comprises the steps:
I () arranges capture pad and positioning through hole respectively at the correspondence position of PCB substrate and Printing screen; And
(ii) by the described capture pad of described PCB substrate with and corresponding described Printing screen described positioning through hole aligned in position arrange, and perform print steps, described capture pad is printed with the described identification icon formed by printing material.
According to an example of the present invention, in the above-mentioned methods, capture pad described in each comprises central area and neighboring area, and corresponding described identification icon is formed on the described central area of described capture pad.
According to an example of the present invention, in the above-mentioned methods, the number of described capture pad is two or more, and capture pad described in each is positioned at the region of its corner of vicinity on the periphery of described PCB substrate.
According to an example of the present invention, in the above-mentioned methods, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon, and the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
According to an example of the present invention, in the above-mentioned methods, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described identification icon is selected from the one in tin and nickel.
According to a further aspect of the invention, the present invention also provides a kind of control method of carrying out optical alignment in surface mount process, and described control method comprises the steps:
(A) carry out first step optical alignment based on one group of first identification icon, wherein said first identification icon is preshaped in PCB substrate, after described first step optical alignment, performs print steps; And
(B) optical locating point is converted to one group of second identification icon now made, described second identification icon based on existing system carries out second step optical alignment, after described second step optical alignment, perform paster step, wherein described second identification icon of existing system is formed after the described print steps of described step (A).
According to an example of the present invention, in above-mentioned control method, the preparation method of described second identification icon of existing system comprises the steps: to arrange capture pad and positioning through hole respectively at the correspondence position of described PCB substrate and described Printing screen; And by the described capture pad of described PCB substrate with and corresponding described Printing screen described positioning through hole aligned in position arrange, and perform described print steps, described capture pad is printed with described second identification icon formed by printing material.
According to an example of the present invention, in above-mentioned control method, capture pad described in each comprises central area and neighboring area, and corresponding described second identification icon is formed on the described central area of described capture pad.
According to an example of the present invention, in above-mentioned control method, the number of described capture pad is two or more, and capture pad described in each is positioned at the region of its corner of vicinity on the periphery of described PCB substrate.
According to an example of the present invention, in above-mentioned control method, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon, and the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
According to an example of the present invention, in above-mentioned control method, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described second identification icon is selected from the one in tin and nickel.
According to a further aspect of the invention, the present invention also provides a kind of PCB substrate for surface mount process, and it comprises:
Be positioned at multiple work pads of service area, and
Be positioned at least one group of capture pad of nonclient area, wherein said capture pad is used in print steps, form the identification icon with optical alignment effect, thus in paster step, mount components is mounted on described multiple work pad exactly.
According to an example of the present invention, in above-mentioned PCB substrate, described nonclient area is the neighboring area of described PCB substrate, and capture pad described in each is positioned at the corner area of the described neighboring area of described PCB substrate.
According to an example of the present invention, in above-mentioned PCB substrate, described one group of capture pad comprises two or more described capture pad.
According to an example of the present invention, in above-mentioned PCB substrate, described one group of capture pad comprises two described capture pad, and lays respectively at two diagonal zones of described capture pad.
According to an example of the present invention, in above-mentioned PCB substrate, described capture pad and described work pad are molded in described PCB substrate simultaneously.
According to an example of the present invention, in above-mentioned PCB substrate, described PCB substrate is one-body molded described work pad, then in the described PCB substrate with described work pad, forms exposed described capture pad.
According to an example of the present invention, in above-mentioned PCB substrate, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described identification icon is selected from the one in tin and nickel.
According to a further aspect of the invention, the present invention also provides a kind of Printing screen tool for surface mount process, and described Printing screen tool comprises a web plate main body, and is positioned at the periphery around described web plate main body, and described Printing screen tool has:
Be formed at multiple work through holes of described web plate main body; And
Be formed at least one group of positioning through hole of described periphery, described positioning through hole for forming recognizable identification icon after the printing process in PCB substrate, for in paster step with described identification icon for datum mark carries out optical alignment, thus the paster coordinate transformation in described paster step is the coordinate of described work through hole.
According to an example of the present invention, in above-mentioned Printing screen tool, the number of described positioning through hole is two or more.
According to an example of the present invention, in above-mentioned Printing screen tool, described one group of positioning through hole comprises two described positioning through hole, and lays respectively at two diagonal zones on the described periphery of described Printing screen tool.
According to an example of the present invention, in above-mentioned Printing screen tool, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon.
Accompanying drawing explanation
Fig. 1 is the structural representation of PCB of the prior art.
Fig. 2 is the schematic diagram of the optical locating point of PCB of the prior art.
Fig. 3 is the schematic diagram that after performing print steps in prior art, deviation appears in tin cream and pad.
The schematic diagram of " setting up a monument " phenomenon is there is when Fig. 4 is Reflow Soldering in prior art.
Fig. 5 is the schematic diagram of the mounting system of attaching method according to a preferred embodiment of the present invention.
Fig. 6 is the structural representation according to PCB substrate in above preferred embodiment of the present invention.
Fig. 7 is the structural representation according to Printing screen in above preferred embodiment of the present invention.
Fig. 8 is the close-up schematic view at A place in Fig. 7, to illustrate that Printing screen has positioning through hole.
Fig. 9 is the schematic diagram according to performing the PCB substrate after print steps in above preferred embodiment of the present invention.
Figure 10 is the close-up schematic view at B place in Fig. 9, to illustrate to perform the identification icon formed after print steps.
Figure 11 is according to schematic diagram when performing paster step in above preferred embodiment of the present invention.
Figure 12 is according to schematic diagram when performing reflow step in above preferred embodiment of the present invention.
Figure 13 is the schematic flow sheet of the attaching method according to above preferred embodiment of the present invention.
Embodiment
Below describe and realize the present invention for disclosing the present invention to enable those skilled in the art.Preferred embodiment in below describing only as an example, it may occur to persons skilled in the art that other apparent modification.The general principle of the present invention defined in the following description can be applied to other embodiments, deformation program, improvement project, equivalent and not deviate from the other technologies scheme of the spirit and scope of the present invention.
The attaching method dynamically adjusting mounting position according to a preferred embodiment of the present invention and relevant apparatus as shown in Fig. 5 to Figure 13.Described attaching method is used at least one mount components 10 to be mounted on a PCB substrate 20, and described mount components 10 can be patch capacitor, Chip-R etc.The relevant apparatus used in described attaching method forms a mounting system, and particularly, described mounting system comprises Printing screen 30, printing machine 40, chip mounter 50, and a control centre 60.
In this preferred embodiment of the present invention, at least one group of capture pad 23 that described PCB substrate 20 comprises a mainboard 21, is molded over the multiple work pad 22 on described mainboard 21 and is molded on described mainboard 21.Described multiple work pad 21 for coupling with described mount components 10 in subsequent step, to form operating circuit.Described capture pad 23, for being formed dynamically the datum mark for optical alignment in subsequent step, will disclose in the following description further.
Described Printing screen 30 comprises a web plate main body 31, is formed at multiple work through holes 32 of described web plate main body 31 and one group of positioning through hole 33.The size and dimension of described Printing screen 30 is roughly consistent with the size and dimension of described PCB substrate 20.And, the position of the described work through hole 32 of described Printing screen 30 is corresponding with the location matches of the described work pad 22 of described PCB substrate 20, and the shape and size of the described work through hole 32 of described Printing screen 30 also can be consistent with the shape and size of the described work pad 22 of described PCB substrate 20.The position of the described positioning through hole 33 of described Printing screen 30 is corresponding with the location matches of the described capture pad 23 of described PCB substrate 20.
After described PCB substrate 20 can be arranged with described Printing screen 30 overlappingly, the through hole 32 that works described in each of described Printing screen 30 can arrange mutually alignedly with the corresponding described work pad 22 of described PCB substrate 20, and described Printing screen 30 each described in positioning through hole 33 can mutually arrange alignedly with the corresponding described capture pad 23 of described PCB substrate 20.Such as, the through hole 32 that works described in each of described Printing screen 30 is positioned at the top of the described work pad 22 of the correspondence of described PCB substrate 20, and described Printing screen 30 each described in positioning through hole 33 be positioned at the top of the described capture pad 23 of the correspondence of described PCB substrate 20.When then performing print steps, described printing machine 40 printing material can be filled enter described Printing screen 30 each described in work through hole 32 and positioning through hole 33 described in each.Like this, the pad 22 that works described in each of described PCB substrate 20 is printed with described printing material, capture pad 23 described in each is formed with identification icon 24.
Described control centre 60 can connect with described printing machine 40 and described chip mounter 50, thus controls the operation of described printing machine 40 and described chip mounter 50.Correspondingly, described control centre 60 comprises image collecting device 61, identification module 62 and a control module 63.Described control module 63 to described printing machine 40 and described chip mounter 50 transmit operation instruction, to control the operation of described printing machine 40 and described chip mounter 50.Described image collecting device 61 can gather the data of the described identification icon 24 of existing system, then the described data obtained are sent to described identification module 62, like this, described control centre 60 is using identification icon described in each 24 as datum mark, complete the optical alignment of described PCB substrate 20, thus follow-up paster step can be performed.In described paster step, the welding end of described mount components 10 is mounted on corresponding being printed with described in printing material and works described in each on pad 22 by described chip mounter 50, thus described mount components 10 is mounted in described PCB substrate 20.
More specifically, in this preferred embodiment of the present invention, the pad 22 that works described in each of described PCB substrate 20 is arranged on the service area of the described mainboard 21 of described PCB substrate 20, and capture pad 23 described in each, it is naked state, is arranged on the nonclient area on described mainboard 21.More specifically, capture pad 23 described in each can be arranged on the periphery 211 of the described mainboard 21 of described PCB substrate 20.Described periphery 211 does not arrange described work pad 22, thus interference can not be caused to follow-up identification step.It is worth mentioning that, capture pad 23 described in each can be made into has larger size, and described in each, shape of capture pad 23 is unrestricted, and it can be triangle, circle, ellipse, square and other polygons.
It is worth mentioning that, described one group of capture pad 23 comprises two or more described capture pad 23.Such as, when described one group of capture pad 23 comprises two described capture pad 23, two described capture pad 23 can be arranged on two diagonal angles of described PCB substrate 20, and are positioned on described periphery 211.When described PCB substrate 20 is roughly rectangular and when having two diagonal, two described capture pad 23 can be arranged on two diagonal angles place with longer cornerwise correspondence.Described one group of capture pad 23 also can comprise three corners that three described capture pad, 23, three described capture pad 23 can be arranged on the described periphery 211 of described PCB substrate 20, thus three described capture pad 23 are arranged in substantially L-shaped.Described one group of capture pad 23 also can comprise four corners that four described capture pad, 23, four described capture pad 23 can be arranged on the described periphery 211 of described PCB substrate 20.
Correspondingly, when described one group of capture pad 23 comprises two, three or four described capture pad 23 respectively, corresponding described identification icon 24 can be formed in the position of two diagonal angles of the described PCB substrate 20 after print steps, three corners, four corners.
It is worth mentioning that, as required, described capture pad 23 also can be arranged on the local location in the described mainboard 21 of described PCB substrate 20.That is, the nonclient area of described PCB substrate 20 also can be the local location in the service area of described mainboard 21, thus the described identification icon 24 formed in subsequent step can be not only the neighboring area of the outside of the described mainboard 21 being formed in described PCB substrate 20, also can be formed in by paracentral regional area.Thus reinforcement positioning precision, when multiple described PCB substrate 20 needs assembled, the effect of location calibration also suitably can be provided as required.
Correspondingly, as shown in figure 13, the invention provides a kind of attaching method dynamically adjusting mounting position, at least one mount components 10 is mounted in a PCB substrate 20 by described method, and described method comprises the steps:
A () arranges at least one group of capture pad 23 in described PCB substrate 20;
B () arranges positioning through hole 33 in the corresponding position of capture pad 23 described in each of Printing screen 30;
C () by superimposed with described Printing screen 30 for described PCB substrate 20, and performs print steps, capture pad 23 described in each is printed with identification icon 24; And
D () control centre 60 carries out optical alignment using the described identification icon 24 of existing system as datum mark, and perform paster step, and described mount components 10 is mounted in the described PCB substrate 20 after performing described print steps by chip mounter 50.
Particularly, with reference to shown in Fig. 6, in described step (a), described one group of capture pad 23 is molded on the periphery 211 in described PCB substrate 20.That is, capture pad 23 described in each can be arranged on the vacant nonclient area, outside of described PCB substrate 20.It is worth mentioning that, capture pad 23 described in each can have predetermined distance from the outward flange of described PCB substrate 20.Described one group of capture pad 23 comprises two or more described capture pad 23, and can be arranged on two diagonal angles of described PCB substrate 20 or the position of multiple corner.Namely described PCB substrate 20 with described capture pad 23 can arrange the position of described capture pad 23 in original design, thus has the described PCB substrate 20 of described work pad 22 and described capture pad 23 in one-step molding manufacturing.Also can be only there is the PCB substrate 20 of described work pad 22 again via a welding step, only to have in the PCB substrate 20 of described work pad 22 described in described capture pad 23 is welded in.
With reference to shown in Fig. 7 and Fig. 8, in described step (b), described Printing screen 30 is formed with multiple work through hole 32 and positioning through hole 33.The position of described work through hole 32 and described positioning through hole 33 is corresponding with the described work pad 22 of described PCB substrate 20 and the position of described capture pad 23 respectively.It is worth mentioning that, the described positioning through hole of described Printing screen 30 33 keeps immobilizing with the distance of the through hole 32 that works described in each, thus is that precise positioning in follow-up described paster step provides safeguard.
It will be appreciated by persons skilled in the art that in this preferred embodiment of the present invention, described step (a) and described step (b) be sequencing not, can carry out simultaneously, also can a step front, another step is rear.
It is worth mentioning that, described Printing screen 30 can be made up of suitable material, and the present invention is unrestricted in this regard.Such as, can be printed steel mesh of the prior art, it can be a thin type steel disc, and described steel disc is formed with multiple perforate.Unlike, in this preferred embodiment of the present invention, described printed steel mesh is also formed with the described positioning through hole 23 for the formation of described identification icon 24.
It is worth mentioning that, the size of positioning through hole 33 described in each is less than the size of corresponding described capture pad 23, thus after the described print steps of execution, in described capture pad 23, completely not printed material is coated.That is, capture pad 23 described in each comprises a central area 231 and neighboring area 232.Described identification icon 24 is printed on the described central area 231 of corresponding described capture pad 23, be equivalent to define depletion region like this around described identification icon 24, the described image collecting device 61 being convenient to described control centre 60 like this carries out the collection of data and image, shown in Fig. 9 and Figure 10.
Correspondingly, described in each, capture pad 23 is made up of the first material, and described identification icon 24 is made up of the second material, and namely described printing material is described second material.And when performing the described print steps in described step (c), can use existing various glue, this respect of the present invention is unrestricted.Described first material and described second material are different materials, and it is selected suitable material separately and can distinguish with described identification icon 24 to make the described neighboring area 232 of described capture pad 23.
Described first material is the material used in the common PCB process of surface treatment of the pad of described PCB substrate 20, as as described in the first material can be selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in film (OSP, Organic Solderability Preservatives) material.As a preferred example, described first material can be copper.And the printing material used in described print steps can be the various materials for printing class attachment, such as described second material is conventional tin cream material, that is, in described print steps, tin cream material is located on the described central area 231 of corresponding described capture pad 23 via described positioning through hole 33 plating.Certainly, described second material also can other suitable materials, as nickel etc., as long as it makes the described image collecting device 61 of described control centre 60 can distinguish described identification icon 24 and described capture pad 23, the selection of the first material described in the present invention and described second material is unrestricted.
It is worth mentioning that, described in each, the shape of positioning through hole 33 can be various shape, as triangle, circle, ellipse, square or other polygons.Such as in this embodiment in accordance with the invention, the shape of positioning through hole 33 described in each is circular.Correspondingly, the described identification icon 24 of formation is also circular.The shape of corresponding described capture pad 23 also can be circular, can certainly be other shapes.Like this, described capture pad 23 has larger diameter, and corresponding described positioning through hole 33 has less diameter, thus after the described print steps of execution, can form depletion region around described identification icon 24.It is worth mentioning that, those skilled in the art can adjust the diameter of described capture pad 23 and corresponding described positioning through hole 33, reach suitable ratio with the area of the described neighboring area 232 making the described capture pad 23 of described identification icon 24 and surrounding, thus make the described image collecting device 61 of described control centre 60 more easily can recognize described identification icon 24.
It is worth mentioning that, the described identification icon 24 being used for carrying out optical alignment in described step (d) is in real time, field fabrication.Thus, follow-up described paster step is being carried out again after the optical alignment in described step (d), the impact of the harmomegathus of the sheet material of PCB substrate 20 described in preceding step can not be considered, and the impact of printing precision in described print steps in described step (c).That is, before carrying out the described paster step in described step (d), first carry out one-time positioning calibration steps, make in follow-up described paster step like this, described mount components 10 is positioned on the described work pad 22 scribbling tin cream or other printing materials of corresponding described PCB substrate 20 accurately.
Particularly, in the prior art, be use fixing optical locating point to position calibration before existing paster step, and ignore the impact that the harmomegathus of sheet material in front and continued operation and printing deviation bring.In existing paster step, paster coordinate is the design coordinate of each work pad in using original document as Gerber file, unavoidable like this after paster step, cause the skew of more serious mount components, thus in Reflow Soldering, cause " setting up a monument " phenomenon further.
And in the present invention, before carrying out the described paster step in described step (d), described control centre 60 positions calibration using the described identification icon 24 of existing system as it on schedule, and the described positioning through hole 33 of described Printing screen 30 and the position relationship of the through hole 32 that works described in each are determined, thus described identification icon 24 and the position relationship being printed with the printing points of tin cream or other printing materials after performing described print steps are determined.Like this, the coordinate that the paster coordinate transformation that described paster step uses is the position of the through hole 32 that works described in each, that is to say be converted into perform described print steps after the position coordinates being printed with tin cream or other printing material printing points roughly corresponding.Like this, in described paster step in described step (d), described mount components 10 be positioned at exactly be printed with tin cream or other printing material printing points position on, two welding end faces 11 of described mount components 10 are roughly the same with the contact area of tin cream or other printing materials with 12, as shown in Figure 11.
As shown in Figure 12, in follow-up reflow step, because two welding end faces 11 of described mount components 10 are roughly the same with the contact area of tin cream or other printing materials with 12, adaptation function in described reflow step is played, two welding end faces 11 and 12 of described mount components 10 can be melted roughly simultaneously, and it is roughly the same with the viscous force of the tin cream in described PCB substrate or other printing materials, thus the pulling force that described mount components 10 two ends are subject to is uniform, is so effectively prevented " setting up a monument " phenomenon.
Thus this attaching method of the present invention is particularly suitable for the attachment of the less described mount components 10 of size, it effectively can prevent the Component Displacement that occurs in existing technique and set up a monument bad.As a concrete example, described mount components 10 can be 01005 element known in the industry.Certainly it will be appreciated by persons skilled in the art that described attaching method of the present invention also can be applied to the attachment process of other mount components.
It is worth mentioning that, the advantage of described attaching method of the present invention is, in optical alignment before described paster step in described step (d), be not with in advance in described PCB substrate 20 shaping datum mark position calibration, but using the described identification icon of existing system as datum mark, thus the superposition that the precision caused in preceding step adds up can not produce serious influence to described paster step, especially the impact of the harmomegathus of the sheet material of described PCB substrate can not be subject to, can effectively prevent like this because each step precision accumulation superposition and setting up a monument of causing is bad.
Correspondingly, the invention provides a kind of method dynamically making identification icon in surface mount process, described identification icon be used for before described attachment process as datum mark to carry out optical alignment, described method comprises the steps:
(i) capture pad 23 and positioning through hole 33 are set respectively at the correspondence position of PCB substrate 20 and Printing screen 30; And
By the described capture pad 23 of described PCB substrate 20 with and corresponding described Printing screen 30 described positioning through hole 33 aligned in position arrange, and performing print steps, described capture pad 23 is printed with the described identification icon 24 formed by printing material.
Similarly, the number of described capture pad can be two or more, and it can be arranged on described PCB substrate diagonal angle or multiple angle position place.The shape of described positioning through hole 33 can be various shape, as triangle, circle, ellipse, square or other polygons.The size of described positioning through hole 33 is less than the size of corresponding described capture pad 23, thus after the described print steps of execution, in described capture pad 23, completely not printed material is coated.Thus, described capture pad 23 comprises central area 231 and neighboring area 232, on the described central area 231 of the described capture pad 23 that described identification icon 24 is formed, and described identification icon 24 surrounding forms depletion region, is convenient to described image collecting device 61 image data and image.
It is worth mentioning that, described attaching method of the present invention can be integrated with attachment process of the prior art.In the prior art, locate with fixing datum mark, and be all with same datum mark to carry out optical alignment in printing and paster step, and in the present invention, positioning action in described paster step can be converted to using the described identification icon 24 of existing system as datum mark.That is, in the present invention, in the control method of described control centre 60 by be not as in prior art with single datum mark to carry out optical alignment and calibration.
As shown in Figure 6, described PCB substrate 20 of the present invention can be preset with one group of first identification icon 25, and described first identification icon 25 can be similar optical locating point of the prior art, or claims Mark point.Correspondingly, described first identification icon 25 is arranged on the slitter edge district of described PCB substrate 20, as neighboring area, and can be arranged in two or more corner location of described PCB substrate 20.
Like this, in described step (c) in described attaching method of the present invention, described control centre 60 first carries out first step optical alignment using described first identification icon 25 as datum mark, then described print steps is performed, to be printed on respectively in corresponding described work pad 22 and described capture pad 23 by described work through hole 32 and described positioning through hole 33 by printing material.Thus after described print steps, form described identification icon 24.
Then, described identification icon 24 of the present invention defines the second identification icon 24 of existing system, and described control centre 60 carries out second step optical alignment using described second identification icon 24 of existing system as datum mark, then performs described paster step.
That is, in whole attaching method, provide the switch process of optical locating point.That is, before described second optical alignment step is carried out, the optical locating point of described control centre 60 is switched to described second identification icon 24 of existing system.By the mode that optical locating point is changed, dynamically adjust mounting position.
Correspondingly, the invention provides a kind of control method of carrying out optical alignment in surface mount process, described control method comprises the steps:
(A) carry out first step optical alignment based on one group of first identification icon 25, wherein said first identification icon 25 is on the pcb substrate 20 preshaped, after described first step optical alignment, performs print steps; And
(B) optical locating point is converted to one group of second identification icon 24 now made, described second identification icon 24 based on existing system carries out second step optical alignment, after described second step optical alignment, perform paster step, wherein described second identification icon 24 of existing system is formed after the described print steps of described step (A).
Correspondingly, in the above-mentioned methods, described second identification icon 24 of existing system obtains by the following method: arrange capture pad 23 and positioning through hole 33 respectively at the correspondence position of PCB substrate 20 and Printing screen 30; And by the described capture pad 23 of described PCB substrate 20 with and corresponding described Printing screen 30 described positioning through hole 33 aligned in position arrange, and performing print steps, described capture pad 23 is printed with described second identification icon 24 formed by printing material.
Like this, being equivalent to two step optical alignments in prior art is all using fixing described first identification icon 25 as datum mark, thus the deviation caused in preceding step is had a strong impact on subsequent step generation, finally cause described mount components 10 being mounted on the skew that after in described PCB substrate 20, formation is larger, and cause " setting up a monument " phenomenon in reflow step.
And in the present invention, front and back two step optical alignments are using different identification icons as datum mark, more specifically, in described second step optical alignment, optical locating point switches to the second identification icon 24 described in a group of existing system from the first identification icon 25 described in integrated a group in advance.Like this, in described second step optical alignment, the impact that the deviation being equivalent to the described print steps generation after eliminating described first step optical alignment is brought to subsequent step, thus the deviation that the expansion-contraction degree of described PCB substrate 20 and described print steps produce can not produce cumulative effects.That is, described second step optical alignment is more suitable for the needs of actual conditions, after described second step optical alignment, described mount components can be mounted in front and continued print steps during mount components 10 described in Placement on the printing position with tin cream or other printing materials of the correspondence in the described PCB substrate formed, so effectively prevented the generation of " setting up a monument " phenomenon, improved product yield.
One skilled in the art will understand that the embodiments of the invention shown in foregoing description and accompanying drawing only limit the present invention as an example and not.Object of the present invention is complete and effectively realize.Function of the present invention and structural principle are shown in an embodiment and are illustrated, do not deviating under described principle, embodiments of the present invention can have any distortion or amendment.
Claims (33)
1. dynamically adjust an attaching method for mounting position, at least one mount components is mounted in a PCB substrate by described method, it is characterized in that, described method comprises the steps:
A () arranges at least one group of capture pad in described PCB substrate;
B () arranges positioning through hole in the corresponding position of capture pad described in each of Printing screen;
(c) by described PCB substrate and described Printing screen superimposed, and perform print steps, capture pad described in each be printed with identification icon; And
D () control centre carries out optical alignment using the described identification icon of existing system as datum mark, and perform paster step, and described mount components is mounted in the described PCB substrate after performing described print steps by chip mounter.
2. the method for claim 1, is characterized in that, described one group of capture pad comprises two or more described capture pad, and correspondingly, described Printing screen has two or more positioning through hole.
3. method as claimed in claim 1 or 2, it is characterized in that, capture pad described in each is arranged at the periphery nonclient area of described PCB substrate.
4. method as claimed in claim 3, it is characterized in that, described one group of capture pad comprises two described capture pad, and lays respectively at two diagonal zones of described PCB substrate.
5. method as claimed in claim 4, it is characterized in that, described PCB substrate is roughly rectangular, two described capture pad lay respectively at described PCB substrate compared with in two diagonal zones of long-diagonal.
6. method as claimed in claim 3, it is characterized in that, described mount components is 01005 components and parts.
7. method as claimed in claim 3, is characterized in that, the size of described positioning through hole is less than the size of corresponding described capture pad.
8. method as claimed in claim 7, is characterized in that, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon.
9. method as claimed in claim 8, is characterized in that, the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
10. method as claimed in claim 3, it is characterized in that, described capture pad is made up of the first material, and corresponding described identification icon is made up of the second material, and described first material and described second material make described capture pad can distinguish with corresponding described identification icon.
11. methods as claimed in claim 10, is characterized in that, described first material is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and described second material of correspondence is selected from the one in tin and nickel.
12. 1 kinds of methods dynamically making identification icon in surface mount process, described identification icon to be used for before described attachment process as datum mark to carry out optical alignment, and it is characterized in that, described method comprises the steps:
I () arranges capture pad and positioning through hole respectively at the correspondence position of PCB substrate and Printing screen; And
(ii) by the described capture pad of described PCB substrate with and corresponding described Printing screen described positioning through hole aligned in position arrange, and perform print steps, described capture pad is printed with the described identification icon formed by printing material.
13. methods as claimed in claim 12, it is characterized in that, capture pad described in each comprises central area and neighboring area, and corresponding described identification icon is formed on the described central area of described capture pad.
14. methods as claimed in claim 12, it is characterized in that, the number of described capture pad is two or more, and capture pad described in each is positioned at the region of its corner of vicinity on the periphery of described PCB substrate.
15. methods as claimed in claim 12, it is characterized in that, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon, and the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
16. as the method as described in arbitrary in claim 12 to 15, it is characterized in that, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described identification icon is selected from the one in tin and nickel.
17. 1 kinds of control methods of carrying out optical alignment in surface mount process, it is characterized in that, described control method comprises the steps:
(A) carry out first step optical alignment based on one group of first identification icon, wherein said first identification icon is preshaped in PCB substrate, after described first step optical alignment, performs print steps; And
(B) optical locating point is converted to one group of second identification icon now made, described second identification icon based on existing system carries out second step optical alignment, after described second step optical alignment, perform paster step, wherein described second identification icon of existing system is formed after the described print steps of described step (A).
18. methods as described in claim 17, is characterized in that, the preparation method of described second identification icon of existing system comprises the steps: to arrange capture pad and positioning through hole respectively at the correspondence position of described PCB substrate and described Printing screen; And by the described capture pad of described PCB substrate with and corresponding described Printing screen described positioning through hole aligned in position arrange, and perform described print steps, described capture pad is printed with described second identification icon formed by printing material.
19. methods as claimed in claim 18, it is characterized in that, capture pad described in each comprises central area and neighboring area, and corresponding described second identification icon is formed on the described central area of described capture pad.
20. methods as claimed in claim 18, it is characterized in that, the number of described capture pad is two or more, and capture pad described in each is positioned at the region of its corner of vicinity on the periphery of described PCB substrate.
21. methods as claimed in claim 18, it is characterized in that, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon, and the shape of capture pad described in each is selected from the one in triangle, circle, ellipse, square and polygon.
22. as the method as described in arbitrary in claim 18 to 21, it is characterized in that, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described second identification icon is selected from the one in tin and nickel.
23. 1 kinds for the PCB substrate of surface mount process, is characterized in that, comprising:
Be positioned at multiple work pads of service area, and
Be positioned at least one group of capture pad of nonclient area, wherein said capture pad is used in print steps, form the identification icon with optical alignment effect, thus in paster step, mount components is mounted on described multiple work pad exactly.
24. PCB substrate as claimed in claim 23, it is characterized in that, described nonclient area is the neighboring area of described PCB substrate, and capture pad described in each is positioned at the corner area of the described neighboring area of described PCB substrate.
25. PCB substrate as claimed in claim 23, is characterized in that, described one group of capture pad comprises two or more described capture pad.
26. PCB substrate as claimed in claim 23, is characterized in that, described one group of capture pad comprises two described capture pad, and lay respectively at two diagonal zones of described capture pad.
27. PCB substrate as claimed in claim 23, is characterized in that, described capture pad and described work pad are molded in described PCB substrate simultaneously.
28. PCB substrate as claimed in claim 23, is characterized in that, described PCB substrate is one-body molded described work pad, then in the described PCB substrate with described work pad, forms exposed described capture pad.
29. as the PCB substrate as described in arbitrary in claim 23 to 28, it is characterized in that, the material of described capture pad is selected from copper, change one or more that golden, gold-plated, the zinc-plated and organic guarantor of nickel welds in membrane material, and the material of described identification icon is selected from the one in tin and nickel.
30. 1 kinds of Printing screen tools for surface mount process, described Printing screen tool comprises a web plate main body, and is positioned at the periphery around described web plate main body, it is characterized in that, described Printing screen tool has:
Be formed at multiple work through holes of described web plate main body; And
Be formed at least one group of positioning through hole of described periphery, described positioning through hole for forming recognizable identification icon after the printing process in PCB substrate, for in paster step with described identification icon for datum mark carries out optical alignment, thus the paster coordinate transformation in described paster step is the coordinate of described work through hole.
31. Printing screen tools as claimed in claim 30, it is characterized in that, the number of described positioning through hole is two or more.
32. Printing screen tools as claimed in claim 30, is characterized in that, described one group of positioning through hole comprises two described positioning through hole, and lay respectively at two diagonal zones on the described periphery of described Printing screen tool.
33., as the Printing screen tool as described in arbitrary in claim 30 to 32, is characterized in that, the shape of positioning through hole described in each is selected from the one in triangle, circle, ellipse, square and polygon.
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Application publication date: 20150708 |