JP2002280681A - Method for manufacturing part mounting board and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing parts mounting board capable of mounting parts with high precision, and to provide a printed wiring board. SOLUTION: An exposed region 5 exposed from a solder adhesion part 4 is provided in a land 2 of a printed wiring board 1. Here, as the color of the land 2 is large in contrast to the color of a solder resist 3, it is easy to confirm the exposed region 5 by a camera 20. For this reason, this exposed region 5 is detected by the camera 20, thereby determining a part mounting position with good precision and mounting parts with high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a component mounting board and a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, reflow soldering has been used as a method for mounting an electronic component such as a resistor on the surface of a printed wiring board. This is performed in the following steps, for example.

[0003] First, a cream solder is printed on a land by applying a metal mask to a printed wiring board. Next, the printed wiring board is set in a component mounter, and the position of the land is detected by a camera provided in the component mounter. Then, the electronic component is placed at a predetermined position based on the detected position of the land, and the electronic component is connected to the printed wiring board by performing a reflow process.

[0004]

By the way, in the manufacture of a printed wiring board, a solder resist is formed on a portion excluding a land formation position in order to prevent solder from adhering to an unnecessary portion during a soldering operation. It is common to keep it. On the other hand, cream solder is printed on the land, and the color of the cream solder has a small contrast with the color of the solder resist. For this reason, it is difficult to detect the position of the land by the camera, and it may be difficult to mount the component at a correct position. In particular, in the case of a manual mounting machine, this problem becomes remarkable.

The present invention has been made in view of the above circumstances, and has as its object to provide a method of manufacturing a component mounting board on which components can be mounted with high accuracy, and a printed wiring board. .

[0006]

According to a first aspect of the present invention, there is provided a method of manufacturing a component mounting board.
A step of forming a solder-attached portion by attaching solder to a component connection portion provided on a printed wiring board; a step of detecting a position of the component connection portion; and the electronic device based on position information of the component connection portion. A method for manufacturing a component mounting board, comprising: a step of placing a component at a predetermined position on the printed wiring board; and a step of soldering the component connection portion and the connection portion by heating and melting the solder. Then, the solder is attached onto the component connection part so as to expose a part of the component connection part, and the position of the component connection part is detected by detecting the exposed area with an imaging device. And

According to a second aspect of the present invention, there is provided a component connecting portion provided on at least one of the front and back surfaces of the insulating layer and connected to a terminal portion of an electronic component, and the terminal portion formed on the component connecting portion. And a solder attachment portion that can be fixed to the component connection portion, wherein the component connection portion is provided with an exposed region exposed from the solder attachment portion.

Here, the exposed region may be provided, for example, by forming the solder attachment portion smaller than the component connection portion, and form a protruding portion which is not covered by the solder attachment portion on the periphery of the component connection portion. May be provided.

[0009]

According to the first aspect of the present invention, the solder is attached to the component connection portion so as to expose a part of the component connection portion, and the exposed area is detected by the imaging device. Thus, the position of the component connection part is detected. Therefore, the component mounting position can be accurately determined. In addition, even when the position is shifted from the component connection portion when the solder attachment portion is formed, the component can be placed in accordance with the position of the component connection portion. Therefore, components can be mounted with high accuracy.

According to the second aspect of the present invention, the component connection portion is provided with the exposed region exposed from the solder attachment portion. Here, since the color of the component connection part has a large contrast with the color of the solder resist, this exposed area can be easily detected by a camera or the like. For this reason, a component mounting position can be determined accurately, and a printed wiring board on which components can be mounted with high accuracy can be provided.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> A first embodiment of the present invention will be described below in detail with reference to FIGS.

First, a process of forming the solder attachment portion 4 on the land 2 of the printed wiring board 1 will be described with reference to FIG. 1 (side view) and FIG. 3 (plan view). In the printed wiring board 1, on the surface of an insulating substrate 1A (corresponding to the insulating layer of the present invention), balls serving as external connection terminals of ball grid array type electronic components 9 mounted on the printed wiring board 1 are provided. A land 2 (corresponding to a component connecting portion of the present invention) for electrically connecting to a connecting portion 10 (corresponding to a connecting portion of the present invention) is formed in a rectangular shape. Also, the entire surface of the insulating substrate 1A is covered with the solder resist 3 except for the portion where the lands 2 are formed (FIG. 1A).
And FIG. 3a).

A metal mask 12 is superimposed on the printed wiring board 1 (see FIGS. 1B and 3B). In the metal mask 12, a circular opening 13 having a circumference in contact with each side of the land 2 is formed at a position corresponding to the land 2 of the printed wiring board 1. And metal mask 1
The cream solder 14 (corresponding to the solder of the present invention) is screen-printed from above 2 and a squeegee (not shown) is slid to fill the cream solder 14 into the opening 13 (see FIGS. 1C and 3C). Thereafter, when the metal mask 12 is removed, the cream solder 14 is printed on the land 2 in a circular shape, and a circular solder attachment portion 4 having a circumference in contact with each side of the land 2 is formed. Corner 6 of land 2
The periphery of A, 6B, 6C, and 6D is exposed from the solder attachment portion 4, and this portion is an exposed region 5 that can be visually recognized from above (see FIGS. 1D and 3D).

Next, electronic components 9 are attached to the printed wiring board 1.
About the method of manufacturing the component mounting board 11 by mounting
This will be described with reference to FIG.

The printed wiring board 1 is set in an automatic mounting machine (not shown), and a camera 20 provided in the automatic mounting machine is provided.
(Corresponding to the imaging device of the present invention), the printed wiring board 1 is imaged from above (see FIG. 2e). The captured image is sent to a controller (not shown) provided in the automatic mounting machine and processed, and the position of the land 2 is detected. At this time, the solder-attached portion 4 is formed on the land 2, and the color of the solder-attached portion 4 has a small contrast with the color of the solder resist 3. However, a part of the land 2 is an exposed region 5 that is not covered with the solder adhering portion 4, and the color of the land 2 has a large contrast with the color of the solder resist 3. Therefore, the exposure area 5 can be easily detected by the camera 20.

The land 2 is formed in a rectangular shape, and the four corners 6A, 6B, 6C, 6D of the land 2 are formed.
Are exposed from the solder attachment portion 4. Therefore, the center position 8 can be easily determined by using the position information of these corners 6A, 6B, 6C, 6D as data for determining the center position 8 of the land. More specifically, corners 6A and 6C and 6B and 6
By determining the intersection of the virtual lines 7A and 7B connecting D, the center position 8 of the land 2 can be easily determined (see FIG. 3D). Further, at this stage, the position shift inspection of the solder attachment portion 4 may be performed at the same time. That is, when the corners 6A, 6B, 6C, and 6D are not detected by the camera 20, it is considered that the corners 6A, 6B, 6C, and 6D have been covered by the solder-attached portion 4, and It can be determined that the displacement from the land 2 is large.

Based on the position information of the land 2 thus confirmed, the suction nozzle 2 provided in the automatic mounting machine is used.
1 is operated, and the electronic component 9 is placed at a predetermined position on the printed wiring board 1 (see FIG. 2f). At this time, even if the solder attachment portion 4 is formed to be shifted from the land 2,
Based on the position information of the center position 8 of the land 2, the electronic component 9
The ball 10 and the land 2 are placed so as to be aligned.

Thereafter, the printed wiring board 1 is heated by an infrared reflow oven to perform a reflow process, and the lands 2 and the balls 10 of the electronic components 9 are connected to complete the component mounting board 11 (see FIG. 2g). . Here, when the solder attachment portion 4 is formed so as to be shifted from the land 2,
If the ball 10 of the electronic component 9 is placed so as to be aligned with the solder attachment portion 4 and the reflow process is performed, there is a possibility that a short circuit may occur between an adjacent conductor circuit and the electronic component. However, if the reflow process is performed in a state where the ball 10 and the land 2 are placed so as to be aligned, the displaced solder adhering portion 4 can be returned to the original position by utilizing a so-called self-alignment effect. This makes it possible to prevent a short circuit with an adjacent conductor circuit or the like.

As described above, according to the present embodiment, the lands 2 of the printed wiring board 1 are provided with the exposed regions 5 exposed from the solder attachment portions 4. Here, since the color of the land 2 has a large contrast with the color of the solder resist 3, the exposure area 5 can be easily detected by the camera 20. For this reason, by detecting the exposed area 5 with the camera 20, the component mounting position can be determined with high accuracy, and the component mounting can be performed with high accuracy.

Further, by detecting the exposed region 5, it is also possible to perform a position shift inspection of the solder adhesion portion. Further, even when the solder attachment portion 4 is formed so as to be shifted from the land 2, the electronic component 9 can be placed in accordance with the position of the land 2. If the reflow process is performed in this state, the displaced solder adhering portion 4 is returned to its original position by a so-called self-alignment effect. This makes it possible to prevent a short circuit with an adjacent conductor circuit or the like.

<Other Embodiments> FIGS. 4 and 5 show the structures of the lands 30, 40 and the solder attachment portions 33, 42 in another embodiment of the present invention.

In the embodiment shown in FIG.
Reference numeral 0 denotes a circular solder mounting area 31 and protrusions 32A, 32B,
32C and 32D (corresponding to the exposed area of the present invention) (see FIG. 4A). Then, a solder attachment portion 33 is formed on the solder mounting area 31 (see FIG. 4B). At this time, the projections 32A, 32B, 32
Since C and 32D are not covered by the solder attachment portion 33,
It can be easily detected by the camera 20. Also, the protrusion 32
A, 32B, 32C, 32D are the center position 3 of the land 30
4 are provided so as to be located on two virtual lines 35A and 35B passing therethrough. Therefore, the center of the land 30 can be easily estimated. Thus, the same operation and effect as those of the first embodiment can be obtained.

In the embodiment shown in FIG. 5, the land 40 is formed in a circular shape (see FIG. 5A), and on this land 40, a solder attachment portion concentric with the land 40 and having a smaller diameter than the land 40 is formed. 42 are formed (see FIG. 5b). That is, in the land 40, the solder attachment portion 42
The portion outside the peripheral edge 43 is an exposed area 41 that is not covered by the solder attachment portion 42, and the exposed area 41 can be easily detected by the camera 20. Thereby, the same operation and effect as those of the first embodiment can be obtained.

Note that the technical scope of the present invention is not limited by the above-described embodiment, and for example, those described below are also included in the technical scope of the present invention.
In addition, the technical scope of the present invention extends to an equivalent range. (1) In each of the above embodiments, the solder attachment portions 4, 33, 4
2 is formed by printing the cream solder 14, but according to the present invention, the method of forming the solder attachment portion is not limited to the above embodiments, and may be formed by, for example, solder plating. (2) In each of the above embodiments, the electronic component 9 is mounted on the printed wiring board 1 by an automatic mounting machine. However, the type of the mounting device of the electronic component is not limited to this embodiment, and is, for example, a manual mounting machine. Is also good.

[Brief description of the drawings]

FIG. 1 is a diagram (side view) showing a method for manufacturing a printed wiring board according to a first embodiment.

FIG. 2 is a diagram (side view) of mounting components on the printed wiring board according to the first embodiment;

FIG. 3 is a view (plan view) showing a method for manufacturing a printed wiring board according to the first embodiment.

FIG. 4 is a view showing lands and solder attachment portions formed on a printed wiring board according to another embodiment.

FIG. 5 is a view showing lands and solder attachment portions formed on a printed wiring board according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed wiring board 1A ... Insulating board (insulating layer) 2 ... Land (component connection part) 4, 33, 42 ... Solder attachment part 5, 41 ... Exposed area 9 ... Electronic component 10 ... Ball (terminal part) 11 ... Component mounting board 14: cream solder (solder) 20: camera (imaging device) 32A, 32B, 32C, 32D ... protrusion (exposed area)

Claims (2)

[Claims] 1. A step of forming a solder-attached portion by attaching solder to a component connecting portion provided on a printed wiring board, a step of detecting a position of the component connecting portion, and positional information of the component connecting portion. Mounting the electronic component at a predetermined position on the printed wiring board based on the following, and soldering the component connection portion and the connection portion by heating and melting the solder. The method according to claim 1, wherein the solder is adhered onto the component connecting portion so as to expose a part of the component connecting portion, and the position of the component connecting portion is detected by detecting the exposed area with an imaging device. A method for manufacturing a component mounting board, characterized by detecting. 2. A component connection portion provided on at least one of the front and back surfaces of an insulating layer and connected to a terminal portion of an electronic component, and the terminal portion formed on the component connection portion and connecting the terminal portion to the component connection portion. A printed wiring board comprising: a solder adhering portion that can be fixed to the printed wiring board; wherein the component connection portion is provided with an exposed region exposed from the solder adhering portion.