JPH03297190A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03297190A JPH03297190A JP2100065A JP10006590A JPH03297190A JP H03297190 A JPH03297190 A JP H03297190A JP 2100065 A JP2100065 A JP 2100065A JP 10006590 A JP10006590 A JP 10006590A JP H03297190 A JPH03297190 A JP H03297190A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land
- meter
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 238000001514 detection method Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ビデオテープレコーダやビデオカメラ等の電
気部品の高密度実装を必要とする機器に用いることがで
きるプリント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board that can be used in devices such as video tape recorders and video cameras that require high-density mounting of electrical components.
従来の技術
近年、ビデオテープレコーダやビデオカメラ等の電子機
器の分野では、機器の小型化が促進され、それらを支え
る回路実装技術としては、電子部品の小型化、電子回路
のモノリシックＩＣ化およびハイブリッドＩＣ化、プリ
ント配線板のパターン設計ルールの微細化があり、そし
てこれら小型の電気部品を高密度実装するだめの自動機
械化技術が注目されている。Conventional technology In recent years, in the field of electronic devices such as video tape recorders and video cameras, the miniaturization of devices has been promoted, and the circuit mounting technologies that support this are miniaturization of electronic components, monolithic IC of electronic circuits, and hybridization. With the trend towards ICs and miniaturization of pattern design rules for printed wiring boards, automatic mechanization technology for high-density mounting of these small electrical components is attracting attention.
以下、従来のプリント配線板の一例を、アルミナ基板を
用いたプリント配線板について説明する。Hereinafter, a printed wiring board using an alumina substrate will be described as an example of a conventional printed wiring board.
第３図および第４図は従来のプリント配線板の構成を示
すものであり、図において、１および２は検針ランド部
、３および４は厚膜抵抗、６は検針ランド部１および２
の表面に設けられた半田、６は絶縁基板、７はオーバコ
ートガラス、８は絶縁基板θ上に形成された電気回路部
、９は検針ピンである。通常、アルミナ基板を用いたプ
リント配線板においては、高密度実装を行うため、また
は製造コストを低く抑えるために、第３図に示したよう
な厚膜抵抗３，４がよく用いられる。そしてこれら厚膜
抵抗３，４は、回路構成上の固定抵抗として用いられた
り、回路特性を調整するだめの可変抵抗として用いられ
たりする。またこれら厚膜抵抗３．４は、−射的には印
刷法または描画法により抵抗ペーストを塗布し、乾燥、
焼成することにより形成されるが、そのままでは非常に
抵抗値精度が悪い。したがって、最後に抵抗値調整を行
う必要があり、第３図に示す検針ランド部１゜２は、抵
抗値調整を行うために検針ピン９を接触するためのラン
ドとして用いられる。またこの検針ランド部１．２は、
他の可変抵抗を調整する際の回路の出力レベルを測定す
るだめのランドも兼ねている。3 and 4 show the structure of a conventional printed wiring board. In the figures, 1 and 2 are needle detection lands, 3 and 4 are thick film resistors, and 6 are needle detection lands 1 and 2.
6 is an insulating substrate, 7 is an overcoat glass, 8 is an electric circuit portion formed on the insulating substrate θ, and 9 is a needle detection pin. Usually, in printed wiring boards using an alumina substrate, thick film resistors 3 and 4 as shown in FIG. 3 are often used in order to perform high-density mounting or to keep manufacturing costs low. These thick film resistors 3 and 4 are used as fixed resistors in a circuit configuration, or as variable resistors for adjusting circuit characteristics. In addition, these thick film resistors 3.4 are made by applying a resistor paste using a printing or drawing method, drying it,
Although it is formed by firing, the accuracy of the resistance value is extremely poor if left as is. Therefore, it is necessary to finally adjust the resistance value, and the meter-reading land portion 1.degree. 2 shown in FIG. 3 is used as a land for contacting the meter-reading pin 9 in order to adjust the resistance value. In addition, this meter reading land part 1.2 is
It also serves as a land for measuring the output level of the circuit when adjusting other variable resistors.
また第４図に示すように検針ランド部１，２上には検針
ピン９との接触抵抗を低く抑えるために半田６を設けて
おシ、測定時には半田５の上に検針ピン９の先端が接触
する。厚膜抵抗３，４の抵抗値は、このように検針ラン
ド部１，２に検針ピン９を接触して抵抗値を測定しなが
ら必要とする抵抗値になるように調整されるものである
。In addition, as shown in Fig. 4, solder 6 is provided on the detection lands 1 and 2 in order to reduce the contact resistance with the detection pin 9, and the tip of the detection pin 9 is placed on the solder 5 during measurement. Contact. The resistance values of the thick film resistors 3 and 4 are thus adjusted to the required resistance values by contacting the needle detection pins 9 to the needle detection lands 1 and 2 and measuring the resistance values.
発明が解決しようとする課題
しかしながら、上記のような構成では、第４図から明ら
かなように、検針ピン９と半田５との接触の信頼性は、
半田６が半球上になっているため非常に悪く、場合によ
っては、検針ピン９が半田６の表面をすべり落ちて、接
触しなかったり、接触不十分になるといった課題がある
。Problems to be Solved by the Invention However, in the above configuration, as is clear from FIG. 4, the reliability of the contact between the needle detection pin 9 and the solder 5 is
This is very bad because the solder 6 is hemispherical, and in some cases there is a problem that the probe pin 9 may slide down the surface of the solder 6, resulting in no contact or insufficient contact.
本発明は上記課題を解決するものであり、接触信頼性に
優れた検針ランド部を有するプリント配線板を提供する
ことを目的とする。The present invention solves the above problems, and aims to provide a printed wiring board having a meter-reading land portion with excellent contact reliability.
課題を解決するだめの手段
本発明は上記目的を達成するために、プリント配線板上
の検針ランド部の全面に、ランドの中央部を除いて半田
を設けることにより、検針ランド部の中央部を凹状また
は平坦状に形成したものである。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides solder on the entire surface of the meter-reading land on a printed wiring board, except for the center of the land. It is formed into a concave or flat shape.
作用
本発明は、上記した構成とすることによって、検針ピン
と検針ランド部上の半田との接触信頼性を向上できるも
のである。Function The present invention can improve the reliability of contact between the needle detection pin and the solder on the needle detection land by having the above-described configuration.
実施例
以下、本発明の一実施例について、第１図、第２図とと
もに第３図、第４図と同一部分については同一番号を付
して詳しい説明を省略し、相違する点について説明する
。Embodiment Hereinafter, regarding an embodiment of the present invention, parts that are the same as those in FIGS. 1 and 2 as well as FIGS. 3 and 4 will be given the same reference numerals, detailed explanations will be omitted, and differences will be explained. .
第１図（＆）および（ｂ）にその拡大した形状を示すよ
うに、検針ランド部１，２の中央部を除いて半田６をス
クリーン印刷により塗布する。同図（ａ）はスクリーン
として用いられる製版材にメツシュ状スクリーンを用い
た場合、同図（ｂ）は同製版材にメタルスクリーンを用
いた場合の印刷パターン形状である。このようにして半
田ペーストをスクリーン印刷により塗布した後にリフロ
ーソルダリング法により半田６を溶融して形成する。As shown in an enlarged view in FIGS. 1(&) and 1(b), solder 6 is applied by screen printing except for the central portions of the meter-reading lands 1 and 2. The figure (a) shows the print pattern shape when a mesh screen is used as the plate making material used as the screen, and the figure (b) shows the print pattern shape when the same plate making material is used as a metal screen. After applying the solder paste by screen printing in this manner, the solder 6 is melted and formed by the reflow soldering method.
第２図は本実施例の要部の構成を示すものであり、図か
ら明らかなように半田６の断面形状はランドの中央部で
凹状または平坦状となり、検針ピン９の先端が半田６の
表面をすべり落ちるようなことはなくなる。なお、図に
おいて１０は電気部品である。FIG. 2 shows the configuration of the main part of this embodiment. As is clear from the figure, the cross-sectional shape of the solder 6 is concave or flat at the center of the land, and the tip of the needle detection pin 9 is connected to the solder 6. No more sliding off surfaces. In addition, in the figure, 10 is an electrical component.
発明の効果
以上のように本発明のプリント配線板によれば、検針ピ
ンの先端が検針ランド部の半田に接触する時、半田の表
面が凹状または平坦状となっているために、確実に接触
することができ極めて安定して検針ピンと検針ランド部
との接触を行うことができ、優れた接触信頼性が得られ
、したがって精度の高い抵抗値測定を行うことができる
ものである。Effects of the Invention As described above, according to the printed wiring board of the present invention, when the tip of the needle detection pin contacts the solder on the detection land, the solder surface is concave or flat, so that the contact is ensured. Therefore, the contact between the needle detection pin and the needle detection land can be made extremely stably, and excellent contact reliability can be obtained, so that highly accurate resistance value measurement can be performed.
第１図（５Ｌ） 、 （ｂ）は本発明の一実施例におけ
る検針ランド部および半田の拡大平面図、第２図は同実
施例におけるプリント配線板および検針ピンの要部断面
図、第３図は従来のプリント配線板の部分平面図、第４
図は同従来例のプリント配線板および検針ピンの要部断
面図である。
１．２・・・・・・検針ランド部、３，４・・・・・厚
膜抵抗、６・・・・・・半田、６・・・・・・絶縁基板
、８・・・・・・電気回路部、１ｏ・・・・・・電気部
品。Figures 1 (5L) and (b) are enlarged plan views of the needle detection land and solder in one embodiment of the present invention, Figure 2 is a sectional view of the main parts of the printed wiring board and needle detection pin in the same embodiment, and Figure 3 The figure is a partial plan view of a conventional printed wiring board.
The figure is a sectional view of essential parts of the conventional printed wiring board and needle detection pin. 1.2...Meter detection land part, 3,4...Thick film resistor, 6...Solder, 6...Insulating substrate, 8...・Electrical circuit section, 1o... Electrical parts.
Claims (1)
た電気部品と、印刷塗布された厚膜抵抗等からなる印刷
電気部品と、検針ランド部とから構成され、前記検針ラ
ンド部の全面にその中央部を除いて半田を設けることに
より検針ランド部の中央部を凹状または平坦状に形成し
たプリント配線板。It consists of an electrical circuit section formed on the surface of an insulating substrate, mounted electrical components, printed electrical components consisting of printed and coated thick film resistors, etc., and a meter detection land section. A printed wiring board in which the central part of the meter-reading land part is formed into a concave or flat shape by providing solder except for the central part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2100065A JPH03297190A (en) | 1990-04-16 | 1990-04-16 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2100065A JPH03297190A (en) | 1990-04-16 | 1990-04-16 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03297190A true JPH03297190A (en) | 1991-12-27 |
Family
ID=14264068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2100065A Pending JPH03297190A (en) | 1990-04-16 | 1990-04-16 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03297190A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2003080364A (en) * | 2001-09-06 | 2003-03-18 | Ricoh Co Ltd | Assembling inspection method of electronic parts and electronic circuit board and electronic appliance manufactured by using the same method |
-
1990
- 1990-04-16 JP JP2100065A patent/JPH03297190A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2003080364A (en) * | 2001-09-06 | 2003-03-18 | Ricoh Co Ltd | Assembling inspection method of electronic parts and electronic circuit board and electronic appliance manufactured by using the same method |
| JP4544798B2 (en) * | 2001-09-06 | 2010-09-15 | 株式会社リコー | Electronic component assembly inspection method, electronic circuit board and electronic equipment manufactured using the method |
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