JPS63157076A - Chip test post - Google Patents

Chip test post

Info

Publication number
JPS63157076A
JPS63157076A JP61305749A JP30574986A JPS63157076A JP S63157076 A JPS63157076 A JP S63157076A JP 61305749 A JP61305749 A JP 61305749A JP 30574986 A JP30574986 A JP 30574986A JP S63157076 A JPS63157076 A JP S63157076A
Authority
JP
Japan
Prior art keywords
electrode
test post
post
1a
boring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61305749A
Inventor
Masataka Saito
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP61305749A priority Critical patent/JPS63157076A/en
Publication of JPS63157076A publication Critical patent/JPS63157076A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Abstract

PURPOSE: To enable packaging without boring any hole in a printed wiring board by providing an electrode with solder which can be surface-packaged.
CONSTITUTION: A test post 1 consists of the electrode 1a with solder, a test post electrode 1b, and a suction surface 1c. Then the electrodes 1a and 1b and suction surface 1c are made of conductors with good conductivity and the electrode 1a is soldered to a circuit whose potential is to be measured to provide the post 1 without boring any hole in the printed wiring board.
COPYRIGHT: (C)1988,JPO&Japio
JP61305749A 1986-12-22 1986-12-22 Chip test post Pending JPS63157076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61305749A JPS63157076A (en) 1986-12-22 1986-12-22 Chip test post

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61305749A JPS63157076A (en) 1986-12-22 1986-12-22 Chip test post

Publications (1)

Publication Number Publication Date
JPS63157076A true JPS63157076A (en) 1988-06-30

Family

ID=17948881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61305749A Pending JPS63157076A (en) 1986-12-22 1986-12-22 Chip test post

Country Status (1)

Country Link
JP (1) JPS63157076A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995013632A1 (en) * 1993-11-08 1995-05-18 Nicomatic Passive conductor component for surface mounting on a printed circuit board
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
US8760185B2 (en) 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042658A (en) * 1983-08-18 1985-03-06 Olympus Optical Co Ltd Connecting device for circuit inspection
JPS6149987B2 (en) * 1979-08-27 1986-10-31 Daiichi Shokai Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149987B2 (en) * 1979-08-27 1986-10-31 Daiichi Shokai Kk
JPS6042658A (en) * 1983-08-18 1985-03-06 Olympus Optical Co Ltd Connecting device for circuit inspection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995013632A1 (en) * 1993-11-08 1995-05-18 Nicomatic Passive conductor component for surface mounting on a printed circuit board
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
US8760185B2 (en) 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly

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