CN107135612A - The positioning auxiliary device and localization method of a kind of pcb board - Google Patents

The positioning auxiliary device and localization method of a kind of pcb board Download PDF

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Publication number
CN107135612A
CN107135612A CN201710398794.5A CN201710398794A CN107135612A CN 107135612 A CN107135612 A CN 107135612A CN 201710398794 A CN201710398794 A CN 201710398794A CN 107135612 A CN107135612 A CN 107135612A
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CN
China
Prior art keywords
hole
positioning
pcb board
area
auxiliary device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710398794.5A
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Chinese (zh)
Inventor
齐志远
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhengzhou Yunhai Information Technology Co Ltd
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Zhengzhou Yunhai Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhengzhou Yunhai Information Technology Co Ltd filed Critical Zhengzhou Yunhai Information Technology Co Ltd
Priority to CN201710398794.5A priority Critical patent/CN107135612A/en
Publication of CN107135612A publication Critical patent/CN107135612A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention provides a kind of positioning auxiliary device and localization method of pcb board, and the device includes the body matched with pcb board;Wherein, at least provided with first area and second area, the depletion region that without electronic component is distributed of the first area with the second area to be determined according to the design document of pcb board on the body;First through hole is provided with the first area, the second through hole is provided with the second area, the first through hole and second through hole are used to set positioning tin welding spot on PCB.Positioning tin welding spot can be defined on pcb board by the positioning auxiliary device, because positioning tin welding spot is distributed in different zones on pcb board, interference is effectively prevent, improve positioning precision;Moreover, can once be completed in print solder paste, it is not necessary to reserved pad, so as to improve welding quality, it is ensured that the reliability of product.

Description

The positioning auxiliary device and localization method of a kind of pcb board
Technical field
The present invention relates to technical field of electronic products, the positioning auxiliary device of more particularly to a kind of pcb board and positioning side Method.
Background technology
Printed circuit board (PCB) assembles finished product(English:Printed Circuit Board Assembly, referred to as:PCBA), need By electronic components such as resistance, electric capacity, crystal oscillator and transformers, printed circuit board (PCB) is assembled into by paster technique(English: Printed Circuit Board, referred to as:PCB)On, form finished product.Wherein, it is to ensure electronics member device positioning to be carried out to pcb board The key of part accurate placement.
In actual production process, it will usually run into the situation that positioning mark is not provided with pcb board, this is positioned to pcb board Bring larger difficulty.And pad is usually provided with pcb board at present, for placing soldering so as to connecting wire and electronic component Pin, can be from the pad on pcb board as datum mark so for the PCB for being not provided with positioning mark, chip mounter passes through Optical identification to datum mark realizes that pcb board is positioned.
However, inventor is had found by studying, the bond pad shapes on pcb board are similar, especially more than the pad on pcb board and When close, it is easy to cause erroneous judgement of the chip mounter to pad, so as to cause paster precision to be forbidden.Moreover, using pad as fixed During the datum mark of position, it usually needs reserve the not upper tin of several pads, after having been pasted etc. patch device, point tin crosses stove manually, so very Easily cause tin amount uneven, or even cause electronic component short circuit, have a strong impact on the reliability of product.
Therefore, how to improve the positioning precision of pcb board, and then ensure the reliability of product, be those skilled in the art urgently The technical problem that need to be solved.
The content of the invention
The shortcoming of prior art, dress is aided in it is an object of the invention to provide a kind of positioning of pcb board in view of the above Put and localization method, for solving the problem of pcb board positioning precision in the prior art is poor, product reliability is poor.
In order to achieve the above objects and other related objects, according to the first aspect of the invention, the embodiment of the present invention provides one The positioning auxiliary device of pcb board is planted, the device includes:Including the body matched with pcb board, wherein:
At least provided with first area and second area on the body, according to the first area and the second area The depletion region being distributed without electronic component that the design document of pcb board is determined;
First through hole is provided with the first area, the second through hole is provided with the second area, described first leads to Hole and second through hole are used to set positioning tin welding spot on PCB.
Alternatively, the first area is located remotely from each other with the second area.
Alternatively, the first through hole is different with the shape of second through hole.
Alternatively, the first through hole and the shape of second through hole include circle, triangle, it is oval and square in Any one.
Alternatively, the first through hole and second through hole are manhole, and the first through hole and described the The diameter of two through holes is different.
Alternatively, the first through hole and second through hole are manhole, and the first through hole and described The diameter of two through holes is between 0.5mm between 2mm.
Alternatively, with adjacent electronic component there is spacing in the first area and the edge of the second area.
Alternatively, the first through hole number in the first area, the number with the second through hole in the second area It is different.
According to the second aspect of the invention, the embodiment of the present invention also provides a kind of localization method, is aided in using above-mentioned positioning The localization method of device comprises the following steps:
By positioning auxiliary device matching assembling on PCB;
Tin cream is coated on the positioning auxiliary device, and fills first through hole and the second through hole;
The positioning auxiliary device is removed, first is formed on the pcb and positions tin welding spot and the second positioning tin welding spot;
Using the first positioning tin welding spot described in chip mounter optical identification and the second positioning tin welding spot, pcb board is positioned.
Alternatively, this method also includes:
Remove the first positioning tin welding spot and the second positioning tin welding spot.
As described above, the positioning auxiliary device and localization method of the pcb board of the present invention, have the advantages that:This is determined Positioning auxiliary device includes the body matched with pcb board;Wherein, at least provided with first area and the secondth area on the body Domain, the first area and the sky being distributed without electronic component that the second area is according to the determination of the design document of pcb board Spacious region;First through hole is provided with the first area, the second through hole, described first are provided with the second area Through hole and second through hole are used to set positioning tin welding spot on PCB.It can be determined by the positioning auxiliary device on pcb board Justice goes out to position tin welding spot, because positioning tin welding spot is distributed in different zones on pcb board, effectively prevent interference, improves positioning accurate Degree;Moreover, can once be completed in print solder paste, it is not necessary to reserved pad, so as to improve welding quality, it is ensured that product Reliability.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the positioning auxiliary device of pcb board provided in an embodiment of the present invention.
Fig. 2 is the structural representation of the positioning auxiliary device of another pcb board provided in an embodiment of the present invention.
Fig. 3 is a kind of schematic flow sheet of the localization method of pcb board provided in an embodiment of the present invention.
Fig. 4 is a kind of assembling schematic diagram of pcb board positioning auxiliary device provided in an embodiment of the present invention.
Fig. 5 is smearing tin cream process schematic representation on a kind of pcb board provided in an embodiment of the present invention.
Fig. 6 is a kind of structural representation of pcb board for being provided with positioning tin welding spot provided in an embodiment of the present invention.
Fig. 1 to Fig. 6 symbol is expressed as:
1- bodies, 21- first areas, 22- second areas, 31- first through hole, 32,321, the through holes of 322- second, 4-PCB domains, 5-PCB plates, 6- scrapers, 7- tin creams, the positioning tin welding spots of 81- first, the positioning tin welding spots of 82- second.
Embodiment
In order that those skilled in the art more fully understand the technical scheme in the present invention, below in conjunction with of the invention real The accompanying drawing in example is applied, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described implementation Example only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common The every other embodiment that technical staff is obtained under the premise of creative work is not made, should all belong to protection of the present invention Scope.
Fig. 1 is referred to Fig. 6.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way The basic conception of invention, only display is with relevant component in the present invention rather than according to package count during actual implement in illustrating then Mesh, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation, and its Assembly layout kenel may also be increasingly complex.
Embodiment one
It is a kind of structural representation of the positioning auxiliary device of pcb board provided in an embodiment of the present invention referring to Fig. 1.Such as Fig. 1 institutes Show, the positioning auxiliary device includes body 1, the first area 21 being arranged on the body 1 and second area 22, Yi Jishe Put the first through hole 31 in first area 21 and the second through hole 32 being arranged in second area 22.
Wherein, the body 1 can be steel mesh, and the body 1 can also be provided with perforate according to pad distribution, this Sample is while using the body 1 definition positioning tin welding spot, additionally it is possible to define tin welding spot on corresponding pad.Specific During implementation, the body 1 can also not limited in embodiments of the present invention from plastics or the body of other any materials It is fixed.In one is preferable to carry out, the body 1 matches with the pcb board for needing to carry out paster, and such body 1 can conveniently fit Or be fastened on pcb board.
First area 21 and second area 22 are provided with the body 1.The first area 21 and second area 22 It is the depletion region being distributed without electronic component determined according to the design document of pcb board;In the specific implementation, can be by The corresponding PCB domains of design document of pcb board are projected on body 1, so that it is determined that the sky being distributed on body 1 without electronic component Spacious region is used as first area 21 and second area 22;Certainly, it is necessary to illustrate, according to specific location requirement, this area Technical staff can also determine multiple depletion regions, such as can also determine the 3rd region, the 4th region, in present invention implementation Do not limited in example.
In order to ensure the accuracy of positioning, interference, in one exemplary embodiment, the first area 21 and described are prevented Second area 22 is located remotely from each other, and such as first area 21 can be distributed in the side of body 1, and second area 22 can be distributed in this Opposite side of body 1 etc., can so ensure the first through hole 31 in first area 21 and the phase of the second through hole 32 in second area It is mutually remote, prevent the interference positioned between tin welding spot defined respectively by the through hole 32 of first through hole 31 and second, it is ensured that light Learn the accuracy of positioning.
Moreover, in order to prevent influence of the positioning tin welding spot defined by positioning auxiliary device to soldering on PCB circuits, During the present invention is implemented, there is spacing in the edge of the first area 21 and the second area 22 with adjacent electronic component. As shown in figure 1, by the way that PCB domains 4 are projected on body 1, the phase in the first area 21 and PCB domains 4 determined on body 1 Adjacent electronic component exists adjacent in space D, second area 22 and PCB domains 4 in horizontal and vertical both direction Electronic component there is space D in the horizontal.In the specific implementation, the space D can be set as any number, for example institute State space D and could be arranged to 5mm to 10mm etc..
It is provided with the first area 21 in first through hole 31, the second area 22 and is provided with the second through hole 32, institute State first through hole 31 and second through hole 32 can be used for setting positioning tin welding spot on PCB.In embodiments of the present invention, institute Stating first through hole 31 can be with identical, the shape of the first through hole 31 and second through hole 32 with the shape of the second through hole 32 Can for circle, triangle, it is oval and square in any one;And the first through hole 31 and second through hole 32 Size it is also identical.In positioning auxiliary device as shown in Figure 1, the first through hole 31 and second through hole 32 can be Manhole, and the first through hole 31 is identical with the diameter of second through hole 32;The first through hole 31 and described the The diameter of two through holes 32 is between 0.5mm between 2mm, and in a preferred embodiment, the first through hole 31 is led to described second The diameter in hole 32 can elect 1mm as.
Under the first performance, the quantity of the first through hole 31 set in the first area 21, with described second The quantity of the second through hole 32 set in region 22 is identical.1 first through hole 31, Yi Ji is for example set in first area 21 1 the second through hole 32 is set in second area 22;Or, 2 first through hole 31 are set in first area 21, and second 2 second through holes 32 etc. are set in region 22.Certainly, the setting quantity of the through hole 32 of first through hole 31 and second above is only one Exemplary embodiment, the first area 21 can set any number of first through hole 31, and in the second area 22 Any number of second through hole 32 can be set.
Under second of performance, the quantity of the first through hole 31 set in the first area 21, with described second The quantity of the second through hole 32 set in region 22 is different.As shown in Figure 1 is provided with 1 first through hole in first area 21 31,2 the second through holes 32, i.e. the second through hole 321 and the second through hole 322 are provided with second area 22, so, by The through hole of varying number is set in one region 21 and second area 22, and different zones difference that can be on PCB defines positioning Tin welding spot, so as to facilitate chip mounter identification positioning tin welding spot, improves positioning precision.Certainly, it is necessary to which explanation, above-mentioned first leads to The set-up mode of the through hole 32 of hole 31 and second is also only an exemplary embodiment, the first through hole 31 and second through hole 32 Quantity can be other any numerical value, such as setting 2 first through hole 31 and 3 the second through holes 32, of the invention real Apply in example and do not limit.
During the use of positioning auxiliary device, by the way that the positioning auxiliary device Matching installation on PCB, is smeared Tin cream fills the through hole 32 of first through hole 31 and second, and positioning tin welding spot, further, paster function can be defined on pcb board Tin welding spot is positioned described in enough optical identifications, so as to complete the positioning of pcb board.
From the description of above-described embodiment, a kind of positioning auxiliary device of pcb board provided in an embodiment of the present invention, including The body matched with pcb board;Wherein, at least provided with first area and second area on the body, the first area It is the depletion region being distributed without electronic component according to the determination of the design document of pcb board with the second area;Described First through hole is provided with one region, the second through hole, the first through hole and described second are provided with the second area Through hole is used to set positioning tin welding spot on PCB.Positioning soldering can be defined on pcb board by the positioning auxiliary device Point, because positioning tin welding spot is distributed in different zones on pcb board, effectively prevent interference, improves positioning precision;Moreover, in print Can once it be completed during brush tin cream, it is not necessary to reserved pad, so as to improve welding quality, it is ensured that the reliability of product.
Embodiment two
It is the structural representation of the positioning auxiliary device of another pcb board provided in an embodiment of the present invention referring to Fig. 2.Such as Fig. 2 institutes Show, the positioning auxiliary device includes the body 1 matched with pcb board;First area 21 and second is provided with the body 1 Region 22;First through hole 31 is provided with the first area 21, the second through hole 32 is provided with the second area 22; The quantity of first through hole 31 in 21 in the first area is different from the quantity of the second through hole 32 in the second area 22, In one exemplary embodiment, it is provided with 1 first through hole 31, the second area 22 and is provided with the first area 21 2 the second through holes 32, i.e. the second through hole 321 and the second through hole 322.The embodiment of the present invention is in the difference of embodiment one In the first through hole 31 in the first area 21 is different from the shape of the second through hole in the second area 22.
Under the first performance, as shown in Fig. 2 the first through hole 31 in the first area 21 can be circular logical The second through hole 321 in hole, the second area 22 can be the second through hole in triangle through hole, the second area 22 322 can be square through hole.Certainly, it is necessary to which explanation, the first through hole 31 and second through hole 32 can be any The through hole of other shapes, as long as first through hole 31 is different from the shape of the second through hole 32, all should belong to protection scope of the present invention, It will not be repeated here.
Under second of performance, the first through hole 31, second through hole 321 and second through hole 322 can With the through hole of same type shape, still, the size of the first through hole 31, second through hole 321 and second through hole 322 It is different.In one exemplary embodiment, the first through hole 31, second through hole 321 and second through hole 322 can be equal For manhole, however, the first through hole 31, second through hole 321 are different with the size of second through hole 322, institute The diameter for stating first through hole 31, second through hole 321 and second through hole 322 can be between 0.5mm between 2mm.When So, it is necessary to which explanation, the first through hole 31, second through hole 321 and second through hole 322 can be any for other The through hole of shape, such as being square, triangle, the length of side differences different by setting define different through holes, in this hair Do not limited in bright embodiment.
The something in common of the embodiment of the present invention and embodiment one, reference can be made to the description of embodiment one, will not be repeated here.
From the description of above-described embodiment, the positioning auxiliary device of pcb board provided in an embodiment of the present invention, by setting The through hole 32 of first through hole 31 and second of different shapes, can so define different positioning tin welding spots, chip mounter being capable of pin Positioning tin welding spot of different shapes is identified, positioning precision and efficiency is effectively improved.
On the basis of the positioning auxiliary device of pcb board provided in an embodiment of the present invention, the embodiment of the present invention also provides one Plant the localization method of pcb board.
It is a kind of schematic flow sheet of the localization method of pcb board provided in an embodiment of the present invention referring to Fig. 3.Such as Fig. 3 institutes Show, the localization method includes:
Step S101:By positioning auxiliary device matching assembling on pcb board.
It is a kind of assembling schematic diagram of pcb board positioning auxiliary device provided in an embodiment of the present invention referring to Fig. 4.Such as Fig. 4 institutes Show, by the positioning auxiliary device Matching installation described by above-described embodiment on the pcb board 5 for treating paster, on such body 1 One through hole 31 and the second through hole 32 can correspond to the depletion region being distributed on pcb board 5 without electronic component.
Step S102:Tin cream is coated on the positioning auxiliary device, and fills first through hole and the second through hole.
Referring also to Fig. 5, is smearing tin cream process schematic representation on a kind of pcb board provided in an embodiment of the present invention.Such as Fig. 4 and Shown in Fig. 5, by using scraper 6, the one end that can smear tin cream 7 from the body 1 of positioning auxiliary device is moved to the other end, made Obtain tin cream 7 and fill up the through hole 32 of first through hole 31 and second, obtain the first positioning tin welding spot 81 and the second positioning tin welding spot 82.Its In, the first positioning tin welding spot 81 correspondence first through hole 31, the second positioning the second through hole 32 of correspondence of tin welding spot 82.
Step S103:The positioning auxiliary device is removed, first is formed on the pcb and positions tin welding spot and the second positioning Tin welding spot.
It is a kind of structural representation of pcb board for being provided with positioning tin welding spot provided in an embodiment of the present invention referring to Fig. 6. As shown in fig. 6, by previous step, removing after positioning auxiliary device, the first positioning positioning tin welding spot 82 of tin welding spot 81 and second It is retained on pcb board.
Step S104:Using the first positioning tin welding spot described in chip mounter optical identification and the second positioning tin welding spot, to pcb board Positioned.
Further, chip mounter positions tin welding spot 82 by the first positioning tin welding spot 81 and described second described in optical identification, Pcb board can be positioned.
In addition, in order to prevent positioning tin welding spot to pcb board line and the influence of soldering, after step S104 is performed, It can also include, remove the first positioning tin welding spot 81 and the second positioning tin welding spot 82.The first positioning tin welding spot 81 and it is described second positioning tin welding spot 82 removing method can be carried out by the way of physically or chemically, in the embodiment of the present invention In repeat no more.
From the description of above-described embodiment, a kind of localization method of pcb board provided in an embodiment of the present invention, by that will determine Positioning auxiliary device Matching installation is on pcb board;Tin cream is coated on the positioning auxiliary device, and fills first through hole and Two through holes;The positioning auxiliary device is removed, first is formed on the pcb board and positions tin welding spot and the second positioning tin welding spot; Using the first positioning tin welding spot described in chip mounter optical identification and the second positioning tin welding spot, pcb board is positioned.It is fixed by this Positioning auxiliary device can define positioning tin welding spot on pcb board, because positioning tin welding spot is distributed in different zones on pcb board, Interference is effectively prevent, positioning precision is improved;Moreover, can once be completed in print solder paste, it is not necessary to reserved pad, so that Improve welding quality, it is ensured that the reliability of product.
Each embodiment in this specification is described by the way of progressive, identical similar portion between each embodiment Divide mutually referring to what each embodiment was stressed is the difference with other embodiment.Especially for device or For system embodiment, because it is substantially similar to embodiment of the method, so describing fairly simple, related part is referring to method The part explanation of embodiment.Apparatus and system embodiment described above is only schematical, wherein the conduct The unit that separating component illustrates can be or may not be it is physically separate, the part shown as unit can be or Person may not be physical location, you can with positioned at a place, or can also be distributed on multiple NEs.Can root Some or all of module therein is factually selected to realize the purpose of this embodiment scheme the need for border.Ordinary skill Personnel are without creative efforts, you can to understand and implement.
It should be noted that herein, the relational terms of such as " first " and " second " or the like are used merely to one Individual entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operate it Between there is any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to Cover including for nonexcludability, so that process, method, article or equipment including a series of key elements not only include those Key element, but also other key elements including being not expressly set out, or also include for this process, method, article or set Standby intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that Also there is other identical element in the process including the key element, method, article or equipment.
Described above is only the embodiment of the present invention, is made skilled artisans appreciate that or realizing this hair It is bright.A variety of modifications to these embodiments will be apparent to one skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one The most wide scope caused.

Claims (10)

1. a kind of positioning auxiliary device of pcb board, it is characterised in that including the body matched with pcb board, wherein:
At least provided with first area and second area on the body, according to the first area and the second area The depletion region being distributed without electronic component that the design document of pcb board is determined;
First through hole is provided with the first area, the second through hole is provided with the second area, described first leads to Hole and second through hole are used to set positioning tin welding spot on PCB.
2. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first area and described the Two regions are located remotely from each other.
3. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first through hole and described The shape of two through holes is different.
4. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first through hole and described The shape of two through holes include circle, triangle, it is oval and square in any one.
5. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first through hole and described Two through holes are manhole, and the first through hole is different from the diameter of second through hole.
6. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first through hole and described Two through holes are manhole, and the first through hole and second through hole diameter between 0.5mm between 2mm.
7. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that the first area and described There is spacing with adjacent electronic component in the edge in two regions.
8. the positioning auxiliary device of pcb board according to claim 1, it is characterised in that first in the first area Through hole number is different from the number of the second through hole in the second area.
9. the localization method of the positioning auxiliary device using the pcb board as described in any one of claim 1 to 8, it is characterised in that Comprise the following steps:
By positioning auxiliary device matching assembling on PCB;
Tin cream is coated on the positioning auxiliary device, and fills first through hole and the second through hole;
The positioning auxiliary device is removed, first is formed on the pcb and positions tin welding spot and the second positioning tin welding spot;
Using the first positioning tin welding spot described in chip mounter optical identification and the second positioning tin welding spot, pcb board is positioned.
10. localization method according to claim 9, it is characterised in that also include:
Remove the first positioning tin welding spot and the second positioning tin welding spot.
CN201710398794.5A 2017-05-31 2017-05-31 The positioning auxiliary device and localization method of a kind of pcb board Pending CN107135612A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108052771A (en) * 2017-12-29 2018-05-18 上海望友信息科技有限公司 The recognition methods of optical reference point, system, computer readable storage medium and equipment

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Publication number Priority date Publication date Assignee Title
CN1392762A (en) * 2001-06-01 2003-01-22 日本电气株式会社 Printing soldering tin paste on soldering area of printed circuit board and having rised printing mask with through hole
CN202721899U (en) * 2012-06-27 2013-02-06 淳华科技(昆山)有限公司 Flexible printed circuit board reinforcing sheet bonding device
CN104768334A (en) * 2014-01-06 2015-07-08 宁波舜宇光电信息有限公司 Surface mounting method for dynamically adjusting surface mounting position and device thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1392762A (en) * 2001-06-01 2003-01-22 日本电气株式会社 Printing soldering tin paste on soldering area of printed circuit board and having rised printing mask with through hole
CN202721899U (en) * 2012-06-27 2013-02-06 淳华科技(昆山)有限公司 Flexible printed circuit board reinforcing sheet bonding device
CN104768334A (en) * 2014-01-06 2015-07-08 宁波舜宇光电信息有限公司 Surface mounting method for dynamically adjusting surface mounting position and device thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108052771A (en) * 2017-12-29 2018-05-18 上海望友信息科技有限公司 The recognition methods of optical reference point, system, computer readable storage medium and equipment
CN108052771B (en) * 2017-12-29 2021-04-13 上海望友信息科技有限公司 Optical reference point recognition method, system, computer-readable storage medium and apparatus

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