CN207410593U - A kind of circuit board and electronic equipment - Google Patents
A kind of circuit board and electronic equipment Download PDFInfo
- Publication number
- CN207410593U CN207410593U CN201721435010.3U CN201721435010U CN207410593U CN 207410593 U CN207410593 U CN 207410593U CN 201721435010 U CN201721435010 U CN 201721435010U CN 207410593 U CN207410593 U CN 207410593U
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- Prior art keywords
- circuit board
- fixed area
- electronic component
- pressure head
- fixed
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Abstract
The utility model discloses a kind of circuit board and electronic equipments, are related to electronic device field.Circuit board includes：Circuit board substrate, circuit board substrate include at least one first fixed area；At least one electronic component, electronic component are placed in the first fixed area；Wherein, electronic component is pressed by least one pressure head in the first fixed area, electronic component is made to be fixed on the first fixed area；The summation of the size of at least one pressure head is less than or equal to the size of the first fixed area.Solve the problem of that circuit board utilization ratio of spaces is not high in circuit board bonding multiple electronic components through the above scheme.
Description
Technical field
The utility model is related to electronic device field, more particularly to a kind of circuit board and electronic equipment.
Background technology
In existing LCD (Liquid Crystal Display, liquid crystal display) product, COF usually can be all used
(Chip On Flex, or, Chip On Film, often claim chip on film) technology.That is, IC (integrated will be driven
Circuit, integrated circuit) it is fixed on the crystal grain mantle structure on FPC (Flexible Printed Circuit, flexible circuit board)
Dress technology is the technology for engaging chip with flexible base plate circuit with soft additional circuit boards work encapsulation chip carrier.Then
Obtained finished product COF is solid by bonding (bonding) flow and PCB (Printed Circuit Board, printed circuit board)
Determine and realize COF and be electrically connected with PCB.
When COF and PCB carries out bonding, generally use whole piece thermal head presses the bonding of more COF and PCB
Technique.In such technique, the more regions between COF and PCB can not be used for placing element, so as to which the PCB spaces of a whole page be caused to utilize
Rate is low.
Utility model content
The utility model can solve PCB mainly solving the technical problems that provide a kind of circuit board and electronic equipment
The problem of utilization ratio of spaces is low.
In order to solve the above technical problems, the technical solution that the utility model uses is：A kind of circuit board, circuit are provided
Plate includes circuit board substrate, and circuit board substrate includes at least one first fixed area；At least one electronic component, is placed on
In first fixed area；Wherein, electronic component is pressed by least one pressure head in the first fixed area, makes electricity
Sub- component is fixed on the first fixed area；The summation of the size of at least one pressure head is less than or equal to the ruler of the first fixed area
It is very little.
In order to solve the above technical problems, another technical solution that the utility model uses is：A kind of electronic equipment is provided,
Wherein electronic equipment includes previously described circuit board.
The beneficial effects of the utility model are：The situation of the prior art is different from, the utility model is by providing a kind of electricity
Road plate and electronic equipment, circuit board include：Circuit board substrate, circuit board substrate include at least one first fixed area；Extremely
A few electronic component, electronic component are placed in the first fixed area；Wherein, by least in the first fixed area
One pressure head presses electronic component, and electronic component is made to be fixed on the first fixed area, the ruler of at least one pressure head
Very little summation is less than or equal to the size of the first fixed area.Control the size of pressure head that it is made to be less than or wait through the above scheme
In the first fixed area of circuit board, so as to improve the area utilization of circuit board.
Description of the drawings
Fig. 1 is a kind of flow diagram of one embodiment of manufacturing method of circuit board of the utility model；
Fig. 2 is a kind of structure diagram of one embodiment of circuit board of the utility model；
Fig. 3 is a kind of structure diagram of display panel in the utility model a kind of electronic equipment；
Fig. 4 is the structure diagram of the PCB circuit board of display panel shown in Fig. 3.
Specific embodiment
The technical issues of to solve the utility model, the technical solution used and the technique effect reached are clearer,
The technical solution of the utility model embodiment is described in further detail below in conjunction with attached drawing.
Refering to Fig. 1, Fig. 1 is a kind of flow diagram of one embodiment of manufacturing method of circuit board of the utility model.Wherein
The production method idiographic flow of circuit board is as follows：
Step S101：A circuit board substrate is provided, circuit board substrate includes at least one first fixed area.
Wherein, circuit board substrate can be PCB or FPC.Circuit board substrate includes at least one first in this step
Fixed area, wherein the first fixed area, for fixing electronic component, electronic component is needed when fixing through pressure head pressure
Conjunction makes its fixation more secured.Such as IC or FPC is fixed by bonding techniques in the first fixed area.By IC or FPC
It is fixed on behind the first fixed position of circuit board and also IC or FPC is pressed by thermal head.
Wherein, circuit board substrate can also include two or more spaced first fixed area；Two
The second fixed area is further included between a spaced first fixed area.Wherein, the second fixed area can be used for setting
Put electronic component.It can include resistance, capacitance, connector, inductance, processing in the electronic component that the second fixed area is set
Device, switch, LED light IC or FPC.Electronic component in second fixed area can be fixed by welding in circuit board substrate
On, it can also be by glue on circuit board substrate.
It is further included in this step and the first fixed area of circuit board is cleaned, is cleaned and drying and processing, effect
It is the oxide layer on the pad for remove circuit board substrate, prevents oxide layer from being had an impact to the fixation of electronic component, make electronics
Component can be with circuit board substrate fixing-stable.
Step S102：At least one electronic component is placed in the first fixed area.
Wherein, electronic component includes PCB, FPC or IC.Electronic component can be pasted by glue in this step
In first fixed area, such as anisotropic conductive film (Anisotropic Conductive Film can be used；ACF) by electricity
Sub- component is pasted onto on the predeterminated position in the first fixed area, makes electronic component and circuit board electrical connection.
Step S103：In the first fixed area, electronic component is pressed by least one pressure head, makes electronics
Component is fixed on the first fixed area, wherein, the summation of the size of at least one pressure head is less than or equal to the first fixed area
Size.
After completing step S102 and at least one electronic component is fixed on the first fixed area, pass through at least one pressure
Head presses electronic component, electronic component is enable closely to be pasted together with circuit board, it is ensured that electronics member device
Part can firmly be pasted on circuit boards.
Wherein, the summation of the size of at least one pressure head is less than or equal to the size of the first fixed area.Need what is illustrated
It is when pressure head quantity is one, the size of pressure head is less than or equal to the size of the first fixed area；When pressure head quantity is one
More than when, the summation of the size of all pressure heads is less than or equal to the size of the first fixed area.So ensure that pressure head will not surpass
Go out the first fixed area.
The prior art is different from, the utility model proposes a kind of manufacturing methods of circuit board, are carried out to electronic component
During pressing, make pressure head without departing from the first fixed area by adjusting the quantity and size of pressure head, so that pressure head will not be done
It disturbs to the region beyond the first fixed area, therefore can electronic component be set in the position beyond the first fixed area, from
And the utilization ratio of spaces of circuit board is improved, while the size of circuit board can also be reduced, save the cost of material of circuit board.
In another embodiment, a kind of circuit board is proposed.With reference to figure 2, Fig. 2 is that a kind of circuit board one of the utility model is real
Apply the structure diagram of example.Circuit board 20 includes circuit board substrate 21, and it is solid that at least one first is provided on circuit board substrate 21
Determine region 211, electronic component 22 is set in the first fixed area 211.Wherein, it is solid to first by least one pressure head 23
The electronic component 22 determined in region 211 is pressed, and electronic component 22 is made to be fixed in the first fixed area 211, wherein
The summation of the size of at least one pressure head 23 is less than or equal to the size of the first fixed area 211.
Through the above scheme, it can be ensured that pressure head 23 is without departing from the first fixed area 211 so that pressure head 23 is to electronics member device
When part 22 is pressed, the region beyond the first fixed area 211 is not interfered with, therefore can be in the first fixed area 211
Other electronic components are arranged in region in addition, improve the utilization ratio of spaces of circuit board substrate.
In the present embodiment, the summation of the size of at least one pressure head 23 is less than or equal to the ruler of the first fixed area 211
It is very little.Wherein, it is necessary to which explanation is when 23 quantity of pressure head is one, the size of pressure head 23 is less than or equal to the first fixed area
211 size；When 23 quantity of pressure head is more than one, the summation of the size of all pressure heads 23 is less than or equal to the first fixed area
The size in domain 211.I other words pressure head 23 is when pressing the electronic component 22 in the first fixed area 211, it is all
Pressure head 23 is all without departing from the first fixed area 211.
In the present embodiment, circuit board substrate 21 can also include first fixed area 211 at least two intervals, each
Electronic component 22 in a first fixed area 211 is pressed respectively by least one pressure head 23.Wherein, two it is adjacent
The first fixed area 211 between region for the second fixed area 212, the second fixed area 212 can be used for setting electricity
Sub- component.By the way that electronic component is arranged in the second fixed area, the utilization ratio of spaces of circuit board substrate 21 is improved,
Production cost can be reduced.The electronic component of other positions on circuit board substrate can also be set simultaneously to the second fixed area
Domain 212 can reduce the size of whole circuit board 20, save design space.
Electronic component 22 in the present embodiment can be by glue in the first fixed area 211.For example, electronics is first
Device 22 can be fixed to by bonding techniques in the first fixed area 211.The idiographic flow of Bonding techniques is, to electricity
Road plate substrate 21 cleaned, is cleaned and drying and processing, removes the oxide layer of golden finger (pin) in the first fixed area 211；
Then golden finger surface be coated with ACF glue after by electronic component 22 be placed on ACF glue and make its golden finger with first fixation
Golden finger corresponds in region 211, finally by thermal head pressing electronic component 22 electronic component 22 is made to be fixed on the
In one fixed area 211.Wherein, electronic component 22 includes printed circuit board, flexible circuit board or integrated circuit.
In the present embodiment, electronic component is pressed using at least one pressure head 23, further, wherein arbitrarily
One pressure head 23 can include another pressure head being oppositely arranged with it, so as to form a press head group on circuit board
Electronic component pressed.By taking one of press head group as an example, this press head group to the electronic component on circuit board into
During row pressing, pressure head 23 presses electronic component on the surface of electronic component, another pressure head is arranged on circuit board and electricity
The back side of sub- component faying face, i.e. between circuit board 21 and electronic component 22 are arranged on the two pressure heads, pass through two
A pressure head squeezes circuit board and electronic component respectively, achievees the effect that fix electronic component on circuit boards.
The prior art is distinguished, the present embodiment proposes a kind of circuit board, and wherein circuit board includes circuit board substrate, circuit board base
Plate includes at least one first fixed area；At least one electronic component, electronic component are placed in the first fixed area；
Wherein, electronic component is pressed by least one pressure head in the first fixed area, is fixed on electronic component
First fixed area；The summation of the size of at least one pressure head is less than or equal to the size of the first fixed area.By adjusting pressure
The size and number of head so that pressure head when being pressed to electronic component without departing from the first fixed area, therefore will not be to the
Place beyond one fixed area has an impact, so as to set electronic component to the position around the first fixed area
It puts, improves the utilization ratio of spaces of circuit board.
The utility model embodiment also provides a kind of electronic equipment, and wherein electronic equipment includes circuit board described previously.By
In the utilization ratio of spaces for improving circuit board, the size of circuit board can be reduced, therefore structure design is being carried out to electronic equipment
When can also reduce the design space of circuit board, more spaces can be reserved, other components of electronic equipment are set
It puts.
Electronic equipment in the present embodiment can be a kind of display device, and display device includes display panel.Refer to Fig. 3
And Fig. 4, Fig. 3 are a kind of structure diagrams of display panel in the present embodiment, Fig. 4 is the PCB electricity of display panel shown in Fig. 3
The structure diagram of road plate.Display panel 30 includes display portion 31, be connected in display portion 31 3 FPC32 and with 3
The PCB circuit board 33 that FPC32 is connected.Wherein PCB circuit board 33 can be realized by this 3 FPC32 with display portion 31
Electrical connection.The quantity of FPC32 is not construed as limiting in the present embodiment, in other embodiments the quantity of FPC32 or 1,2
It is a or 3 or more.
PCB circuit board 33 includes 3 the first fixed area 331 in the present embodiment, wherein each first fixed area 331
There are one FPC32 for middle fixation.The first fixed area that method as previously described is fixed to PCB circuit board 33 may be employed in FPC32
In domain 331.That is, a PCB circuit board 33 is provided, 3 first that then 3 FPC32 are respectively fixed in PCB circuit board 33 consolidate
Determine the predeterminated position in region 331, this 3 FPC32 are pressed respectively by 3 pressure heads 34.Wherein all pressure heads 34
Corresponding first fixed area 331 in position is pressed without departing from it.Further, two adjacent the first fixed area 331
Between and the first fixed area 331 and the edge of PCB circuit board 33 between also there is the second fixed area 332, it is solid with first
Determine the component placing region 333 that region 331 is in beyond the same face the first fixed area 31 of removing and the second fixed area 32.Its
In the second fixed area 332 and component placing region 333 may be used to putting electronic device, the type of electronic component can
To include resistance, capacitance, connector, inductance, processor, switch, LED light IC or FPC.
Therefore, this programme is by controlling the size of pressure head 34 and making pressure head 34 without departing from the first fixed area 331, so that
Pressure head 34 do not interfere with the second fixed area 332, can cause originally can not putting electronic device the second fixed area
332 can also be used to set electronic component, therefore improve the utilization ratio of spaces of PCB circuit board 33.Further, in PCB
In the case that the electronic component quantity and species that are set on circuit board 33 are constant, component placing region will can be originally arranged on
Electronic component in 333 is set into the second fixed area 332, reduces the electronics member device set in component placing region 333
The number of part, and then the size of component placing region 333 can be reduced, so that the size of entire PCB circuit board 33 can be reduced,
Therefore the utilization ratio of spaces of PCB circuit board 33 can be further improved.Meanwhile also may be used when carrying out structure design to display device
To reduce the design headspace of PCB circuit board 33, therefore other components of more spaces to display device can be reserved
It is configured.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is directly or indirectly used in
Other related technical areas are equally included in the patent within the scope of the utility model.
Claims (10)
1. a kind of circuit board, which is characterized in that including：
Circuit board substrate, the circuit board substrate include at least one first fixed area；
At least one electronic component, the electronic component are placed in first fixed area；
Wherein, the electronic component is pressed by least one pressure head in first fixed area, made described
Electronic component is fixed on first fixed area, and the summation of the size of at least one pressure head is less than or equal to described the
The size of one fixed area.
2. circuit board according to claim 1, which is characterized in that the circuit board substrate further includes at least two intervals
First fixed area；
Electronic component in each described first fixed area is pressed respectively by least one pressure head.
3. circuit board according to claim 2, which is characterized in that
The circuit board substrate further includes the second fixed area between two adjacent first fixed area；
Wherein, it is provided with electronic component in second fixed area.
4. circuit board according to claim 1, it is characterised in that：
The electronic component is by glue in first fixed area.
5. circuit board according to claim 1, it is characterised in that：
The electronic component includes printed circuit board, flexible circuit board or integrated circuit.
6. a kind of electronic equipment, which is characterized in that the electronic equipment includes an at least circuit board, wherein the circuit board bag
It includes：
Circuit board substrate, the circuit board substrate include at least one first fixed area；
At least one electronic component, the electronic component are placed in first fixed area；
Wherein, the electronic component is pressed by least one pressure head in first fixed area, made described
Electronic component is fixed on first fixed area, and the summation of the size of at least one pressure head is less than or equal to described the
The size of one fixed area.
7. electronic equipment according to claim 6, which is characterized in that the circuit board substrate further includes at least two intervals
First fixed area；
Electronic component in each described first fixed area is pressed respectively by least one pressure head.
8. electronic equipment according to claim 7, which is characterized in that
The circuit board substrate further includes the second fixed area between two adjacent first fixed area；
Wherein, it is provided with electronic component in second fixed area.
9. electronic equipment according to claim 6, it is characterised in that：
The electronic component is by glue in first fixed area.
10. electronic equipment according to claim 6, it is characterised in that：
The electronic component includes printed circuit board, flexible circuit board or integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721435010.3U CN207410593U (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721435010.3U CN207410593U (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207410593U true CN207410593U (en) | 2018-05-25 |
Family
ID=62409353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721435010.3U Active CN207410593U (en) | 2017-10-31 | 2017-10-31 | A kind of circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207410593U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864570A (en) * | 2017-10-31 | 2018-03-30 | 惠州市华星光电技术有限公司 | A kind of circuit board and its manufacture method, electronic equipment |
-
2017
- 2017-10-31 CN CN201721435010.3U patent/CN207410593U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864570A (en) * | 2017-10-31 | 2018-03-30 | 惠州市华星光电技术有限公司 | A kind of circuit board and its manufacture method, electronic equipment |
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