CN108990266A - A kind of pcb board - Google Patents
A kind of pcb board Download PDFInfo
- Publication number
- CN108990266A CN108990266A CN201811108531.7A CN201811108531A CN108990266A CN 108990266 A CN108990266 A CN 108990266A CN 201811108531 A CN201811108531 A CN 201811108531A CN 108990266 A CN108990266 A CN 108990266A
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb board
- protective layer
- substrate
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
Abstract
The invention discloses a kind of pcb boards; pad is located at the surface of substrate; and protective layer is similarly positioned in the surface for being provided with pad in substrate; the protective layer can cover the edge of pad; to which the power of a direction substrate can be applied to pad by protective layer; to effectively avoid in second reflow, and when test the occurrence of Pad off.
Description
Technical field
The present invention relates to technical field of integrated circuits, more particularly to a kind of pcb board.
Background technique
As the continuous progress of science and technology, the structure and manufacture craft of PCB (printed circuit board) have been achieved in recent years
Greatly development.In the PCBA (abbreviation of Printed Circuit Board+Assembly, that is to say, that PCB hollow plate passes through SMT
Piece uploading, using the entire processing procedure of DIP plug-in unit) in processing procedure, a procedure is Reflow Soldering, i.e., is welded to electronic component
PCB surface, and the pad between electronic component and PCB is exactly the pad of PCB surface, Reflow Soldering processing procedure particular by
Tin cream is painted on pad, pcb board is being sent into reflow oven, and electronic component is welded on PCB by chip mounter.
Conventionally, as may need that electronic component is arranged on the two sides of pcb board, it is welded accordingly in reflux
Journey generally includes second reflow.But in the prior art when carrying out second reflow, or testing
Cheng Zhong is easy to happen falling off for pcb board surface pads, to influence the yields of PCBA processing procedure.
So how to solve the problems, such as that those skilled in the art are badly in need of solving when pad is easy to fall off in second reflow
The problem of.
Summary of the invention
The object of the present invention is to provide a kind of pcb boards, and falling off for pad can be effectively avoided in second reflow.
In order to solve the above technical problems, the present invention provides a kind of pcb board, comprising:
Substrate；
Positioned at the pad of the substrate surface；
Cover the protective layer that the surface of the pad is provided in the substrate；Wherein, the protective layer covers the weldering
The edge of disk, while the center of the exposed pad.
Optionally, the pcb board includes multiple pads, and multiple pads are evenly distributed on the substrate surface
Predeterminable area.
Optionally, the pad is circular pad.
Optionally, the value range of the diameter of the pad is 8mil to 10mil, including endpoint value.
Optionally, the protective layer is green oil layer.
Optionally, the edge of the pad in a ring, and surrounds the center of the pad, in the protective layer described in covering
The value range of the width of the protection ring of pad edge is 1mil to 3mil, including endpoint value.
A kind of pcb board provided by the present invention, pad is located at the surface of substrate, and is arranged on the surface of substrate setting pad
Matcoveredn, the protective layer can cover the edge of pad, to can apply a direction substrate to pad by protective layer
Power, to effectively avoid in second reflow, and when test the occurrence of Pad off.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of pcb board provided by the embodiment of the present invention；
Fig. 2 is the top view of pcb board in Fig. 1；
Fig. 3 is a kind of structural schematic diagram of specific pcb board provided by the embodiment of the present invention.
In figure: 1. substrates, 2. pads, 3. protective layers.
Specific embodiment
Core of the invention is to provide a kind of pcb board.In the prior art, the pad on PCB substrate surface is completely naked
Dew, matcoveredn is generally filled between pad, but usually there is a certain distance between the protective layer and pad, so that
There is certain gap between protective layer and pad, the substrate of pcb board can be exposed at the gap.In second reflow,
Since the raising pad of temperature is inherently easy to fall off and is bonded in advance in second reflow or test when perhaps testing
Have electronic component pad would generally under, so that electronic component can apply a power under to pad,
To make pad fall off by stretching pad.
And a kind of pcb board provided by the present invention, pad are located at the surface of substrate, and set on the surface of substrate setting pad
It is equipped with protective layer, which can cover the edge of pad, to can apply a direction substrate to pad by protective layer
Power, to effectively avoid the occurrence of the Pad off in second reflow or test.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is a kind of structural schematic diagram of pcb board provided by the embodiment of the present invention；Fig. 2 is figure
The top view of pcb board in 1.
Referring to Fig. 1, in embodiments of the present invention, the pcb board includes substrate 1；Pad 2 positioned at 1 surface of substrate；
Cover the protective layer 3 that the surface of the pad 2 is provided in the substrate 1；Wherein, the protective layer 3 covers the pad 2
Edge, while the center of the exposed pad 2.
Aforesaid substrate 1 is the substrate of pcb board, specific material and the design parameter of the substrate 1 in relation to the substrate 1 etc.
It is not specifically limited in embodiments of the present invention, it is depending on the circumstances.
The surface of substrate 1 is arranged in above-mentioned pad 2.There are two opposite surfaces for the tool of usual situation lower substrate 1, in two phases
Pair surface pad 2 usually can be set, with the two sides of pcb board be arranged electronic component.It would generally be in substrate 1 at this stage
Surface multiple pads 2 are set, preferably, the multiple pad 2 can be evenly distributed on the predeterminable area on 1 surface of substrate.
Predeterminable area on 1 surface of substrate is uniformly distributed multiple pads 2 can form 2 array of pad in the predeterminable area, thus just
BGA (Ball Grid Array, ball grid array) encapsulation is carried out in the pcb board surface provided by the embodiment of the present invention.It is related
The particular content of BGA package can refer to the prior art, no longer be repeated herein.The parameters such as the specific size in relation to pad 2
It will be described in detail in following inventive embodiments.
Above-mentioned protective layer 3 can cover the surface that pad 2 is provided in substrate 1, and the protective layer 3 can cover the side of pad 2
Edge, and the center of exposed pads 2.
In embodiments of the present invention, pad 2 divides for edge and the center region Liang Ge, and wherein the edge of pad 2 is usually in
Annular, and the center of pad 2 is surrounded, and above-mentioned protective layer 3 can cover the edge of pad 2.And protective layer 3 in the embodiment of the present invention
For engraved structure, the center of pad 2 can be exposed.It should be noted that above-mentioned protective layer 3 can not all standing pad 2 edge,
But it can only cover the part edge of pad 2.Certainly, preferably, the protective layer 3 can cover the entire of pad 2
Fringe region, i.e., the part for covering 2 edge of pad in protective layer 3 at this time can constitute a protection ring, which can be covered on weldering
Disk 2 is backwards to 1 one side surface of substrate.
Above-mentioned protective layer 3 can be specially green oil layer, i.e., the material of above-mentioned protective layer 3 can be green oil.Green oil is selected to make
It can play the role of welding resistance while effective protection substrate 1 and pad 2 for protective layer 3, prevent the solder pair in welding
Substrate 1 generates damage.Concrete component in relation to green oil can refer to the prior art, no longer be repeated herein.It needs to illustrate
It is that the thickness of above-mentioned protective layer 3 needs the thickness of slightly more than pad 2, so that making protective layer when protective layer 3 is arranged
3 can cover the edge of pad 2.Certainly, the thickness of above-mentioned protective layer 3 cannot be greater than the thickness of pad 2 and the thickness of solder used
The sum of degree, so that pad 2 can be fixedly connected by solder with electronic component.
A kind of pcb board provided by the embodiment of the present invention, pad 2 is located at the surface of substrate 1, and pad 2 is arranged in substrate 1
Surface matcoveredn 3 is set, which can cover the edge of pad 2, to can be applied to pad 2 by protective layer 3
The power of one direction substrate 1, to effectively avoid in second reflow, and when test 2 dropping situations of pad generation.
Design parameter in relation to pcb board provided by the present invention will be described in detail in following inventive embodiments.
Referring to FIG. 3, Fig. 3 is a kind of structural schematic diagram of specific pcb board provided by the embodiment of the present invention.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
The specific structure of pcb board is specifically limited.Remaining content is described in detail in foregoing invention embodiment, herein
No longer repeated.
Referring to Fig. 3, in embodiments of the present invention, the setting in order to facilitate pad 2 and the preparation convenient for pad 2 are described
Pad 2 is circular pad 2.In embodiments of the present invention, the value range of the diameter of the pad 2 is 8mil to 10mil, including
Endpoint value.The diameter of i.e. above-mentioned pad 2 can be exactly 8mil or 10mil.Preferably, described in embodiments of the present invention
The diameter of pad 2 is usually in 9mil or so.
In embodiments of the present invention, the value range of the width of the protection ring at covering 2 edge of pad is in the protective layer 3
1mil to 3mil, including endpoint value, the i.e. width of the protection ring can be exactly 1mil or 3mil.Preferably, above-mentioned guarantor
The width of retaining ring is usually in 2mil or so, and the diameter at the center exposed in pad 2 at this time is usually in 5mil or so.
During electronic component is welded on pcb board provided by the embodiment of the present invention, it will usually first in pad 2
Solder ball is arranged by exposed region, then solder ball is melted by Reflow Soldering making technology, thus after by being melted by solder ball
Solder electronic component is fixedly connected with pcb board.
A kind of pcb board provided by the embodiment of the present invention, the size to be opened a window by reducing protective layer 3, so that protective layer 3 can
To cover the edge of pad 2, to reduce the risk that pad 2 falls off in pcb board.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of pcb board provided by the present invention is described in detail above.Specific case used herein is to this
The principle and embodiment of invention is expounded, method of the invention that the above embodiments are only used to help understand and
Its core concept.It should be pointed out that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, it can be with several improvements and modifications are made to the present invention, these improvement and modification also fall into the protection of the claims in the present invention
In range.
Claims (6)
1. a kind of pcb board characterized by comprising
Substrate；
Positioned at the pad of the substrate surface；
Cover the protective layer that the surface of the pad is provided in the substrate；Wherein, the protective layer covers the pad
Edge, while the center of the exposed pad.
2. volume pcb board according to claim 1, which is characterized in that the pcb board includes multiple pads, Duo Gesuo
State the predeterminable area that pad is evenly distributed on the substrate surface.
3. pcb board according to claim 2, which is characterized in that the pad is circular pad.
4. pcb board according to claim 2, which is characterized in that the value range of the diameter of the pad be 8mil extremely
10mil, including endpoint value.
5. pcb board according to claim 1, which is characterized in that the protective layer is green oil layer.
6. pcb board according to claim 4, which is characterized in that the edge of the pad in a ring, and surrounds the pad
Center, the value range that the width of the protection ring of the pad edge is covered in the protective layer is 1mil to 3mil, including
Endpoint value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108531.7A CN108990266A (en) | 2018-09-21 | 2018-09-21 | A kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108531.7A CN108990266A (en) | 2018-09-21 | 2018-09-21 | A kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990266A true CN108990266A (en) | 2018-12-11 |
Family
ID=64546512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811108531.7A Pending CN108990266A (en) | 2018-09-21 | 2018-09-21 | A kind of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108990266A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885825A (en) * | 2021-01-21 | 2021-06-01 | Tcl华星光电技术有限公司 | LED panel and preparation method thereof |
| WO2023230923A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Wiring substrate and preparation method therefor, back plate, and display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202262063U (en) * | 2011-09-22 | 2012-05-30 | 捷开通讯科技(上海)有限公司 | Circuit board structure and mobile terminal |
| US9066431B2 (en) * | 2012-07-30 | 2015-06-23 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible |
-
2018
- 2018-09-21 CN CN201811108531.7A patent/CN108990266A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202262063U (en) * | 2011-09-22 | 2012-05-30 | 捷开通讯科技(上海)有限公司 | Circuit board structure and mobile terminal |
| US9066431B2 (en) * | 2012-07-30 | 2015-06-23 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885825A (en) * | 2021-01-21 | 2021-06-01 | Tcl华星光电技术有限公司 | LED panel and preparation method thereof |
| WO2023230923A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Wiring substrate and preparation method therefor, back plate, and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181211 |
|
| RJ01 | Rejection of invention patent application after publication |