JP6298630B2 - Component mounting module and component mounting method - Google Patents

Description

  The present invention relates to a component mounting module in which various components including a semiconductor device and countermeasure components are mounted on a printed circuit board, and a component mounting method thereof.

  If the result of various general tests including EMI (Electro-Magnetic Interference) test is not expected after the production of a product or prototype component mounting module is completed, a capacitor can be used as a countermeasure component. Consider a case where countermeasures are taken by additionally mounting various electronic components including a ferrite bead, a damping resistor, a common mode noise filter, etc. on a printed circuit board.

  First, at the stage of mounting countermeasure parts experimentally, it is usually necessary to manually mount the countermeasure parts on the printed circuit board and confirm the countermeasure effect by manually processing the printed circuit board in the laboratory. It is normal.

  At this time, in the case of a shunt component mounted between a power supply line or a signal line and a ground line such as a capacitor, a pad for connecting a capacitor already existing on a printed board is usually used. In many cases, additional mounting is possible relatively easily.

On the other hand, in the case of series parts inserted into the power line or signal line such as ferrite beads, if there is no dedicated pad on the printed circuit board, cut a part of the power line and insert the countermeasure parts there Additional mounting is possible, but there are many cases where it is difficult or impossible depending on the layout of the printed circuit board.
Also, in the case of series parts that are inserted into signal lines, such as damping resistors and common mode noise filters, as with ferrite beads, if there is no dedicated pad on the printed circuit board, a part of the signal line is cut. In some cases, additional mounting is possible by inserting countermeasure parts there. However, since the wiring width of the signal line is usually thin, processing is extremely difficult, and in many cases, mounting is impossible.

Also, series components such as damping resistors and common mode noise filters are desirably mounted as close to the signal output side as possible, that is, as close as possible to the package pins. From this point of view, for example, the QFP (Quad Flat Package) type package pins are lifted and the series components are mounted between the package pins and the corresponding pads on the printed circuit board. Then it is possible.
However, in recent years, the pin pitch of the package has become narrower and the thickness of the package itself has also become thinner, so it may be impossible to mount experimentally even if it is a fairly small electronic component and does not match the pin pitch of the package. Many.

  In addition, it is possible to actually change the layout of the printed circuit board to confirm the effect of the countermeasure component and create a new one, but this method is completely useless if the countermeasure effect is not seen. .

Next, after mounting the countermeasure parts by performing the above processing and confirming the countermeasure effect, there are several possible countermeasures when mounting the countermeasure parts on the product.
The most common method is to change the layout of the printed circuit board so that a desired countermeasure component can be mounted. However, in this case, it is obvious that it naturally takes time and cost.
In addition, as disclosed in Patent Document 1, there is also a method of embedding countermeasure parts inside the package, but this method cannot be applied to series parts, and is limited to shunt parts, and the cost of the package is drastically increased. There is no doubt that it will increase.

  On the other hand, if there is room in the layout space, there is also a method in which a printed circuit board is created so that the countermeasure component can be mounted from the beginning in anticipation of using the countermeasure component. However, if no countermeasure effect is seen, it is only necessary to remove the shunt component such as a capacitor. However, in the case of a series component, a 0Ω resistor or the like must be mounted instead. For this reason, when the countermeasure component is not used, the number of components such as a 0Ω resistor increases with respect to the printed circuit board that is not prepared in anticipation of using the countermeasure component, resulting in an increase in cost.

  In addition, there is Patent Document 2 as a prior art document relevant to the present invention.

  In Patent Document 2, an adhesive film tape mixed with conductive particles is attached to the upper surface of a flexible circuit board connected to a liquid crystal display device, and terminal electrodes protrude from the upper surface of the adhesive film tape to the lower surface. A plurality of electronic components used in a liquid crystal display device are mounted in a line along the length of the tape in a row and mounted, and each electronic component is pressure-bonded by pressing against a flexible circuit board. A method for mounting components on a circuit board is described.

  Although a wiring pattern is formed on the upper surface of the flexible circuit board of Patent Document 2, a layout pattern such as pads and wirings is not formed on the lower surface. Therefore, series parts cannot be inserted into the power supply line or signal line.

JP 2004-158753 A JP 2000-195902 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting module and a component mounting method that can solve the problems of the prior art and can additionally mount countermeasure components without changing the layout of the printed circuit board.

In order to achieve the above object, the present invention is a component mounting module on which one or more components including a semiconductor device are mounted,
A printed circuit board on which a conductive first pad corresponding to a first pin which is a part of a pin of the package of the semiconductor device is formed;
Countermeasure parts for improving the operation of the component mounting module;
A conductive material disposed between the first pin of the package and the first pad and connected to one surface of a flexible insulating substrate by soldering with the first pad. A second pad is formed, and on the other surface of the insulating substrate, a conductive third pad connected by soldering to the first pin of the package, and a first and a corresponding one of the countermeasure component, respectively. A first flexible film on which conductive fourth and fifth pads connected with a second terminal and solder are formed;
The semiconductor device is mounted on the printed circuit board,
The second and fifth pads include a conductive first via formed in the insulating substrate and a conductive first formed on one surface and the other surface of the insulating substrate. A component connected via a wiring, wherein the third and fourth pads are connected via a conductive second wiring formed on the other surface of the insulating substrate. A mounting module is provided.

  Here, the first flexible film has two second pads connected to each of the two pads of the printed circuit board by solder on one surface of the insulating substrate, The other surface of the insulating substrate is connected to the two third pads connected by soldering to each of the two pins of the package and the four corresponding terminals of the countermeasure component of four terminals by soldering Preferably, the two formed fourth pads and the two fifth pads are formed.

  The first flexible film has two or more second pads connected to each of the two or more pads of the printed circuit board by solder on one surface of the insulating substrate, Two or more third pads connected to each of two or more pins of the package by solder on the other surface of the insulating substrate, and two or more of the countermeasure components, It is preferable that two or more fourth and fifth pads connected to the first and second terminals with solder are formed.

The package is a QFP type package,
Further, each of the pins of the package to which the countermeasure component is not connected is arranged to be inserted between each of the pins of the package to which the countermeasure component is not connected and the corresponding pad of the printed circuit board, and the insulating substrate A conductive sixth pad connected to the corresponding pad of the printed circuit board by solder is formed on one surface of the printed circuit board, and connected to the corresponding pin of the package by solder on the other surface of the insulating substrate. Conductive seventh pads are formed, and the sixth and seventh pads are formed as conductive second vias opened in the insulating substrate and one surface of the insulating substrate and the other. It is preferable to include a second flexible film connected via a conductive third wiring formed on the surface.

  In addition, for the pins of the package to which the countermeasure component is not connected, one or more layout patterns of the second flexible film are formed instead of the second flexible film, and the second flexible film is formed. It is preferable to provide the 4th flexible film comprised combining the 2nd or more 3rd flexible film from which the number of layout patterns of a property film differs.

The package is a BGA type package,
The first flexible film further includes, for each pin of the package to which the countermeasure component is not connected, between each of the package pin to which the countermeasure component is not connected and a corresponding pad of the printed circuit board. A conductive sixth pad connected to the corresponding pad of the printed circuit board by solder is formed on one surface of the insulating substrate, and is disposed on the other surface of the insulating substrate. A conductive seventh pad connected by solder to a corresponding pin of the package is formed, and the sixth and seventh pads are connected via a conductive second via opened in the insulating substrate. It is preferable that they are connected.

The present invention is a component mounting module on which one or more components including a semiconductor device are mounted,
A printed circuit board on which conductive first and second pads corresponding to the first and second pins, which are pins of a part of the package of the semiconductor device, are formed;
Countermeasure parts for improving the operation of the component mounting module;
The first and second pins are inserted between the first and second pins of the package and the first and second pads, respectively, and correspond to the first and second surfaces of the flexible insulating substrate, respectively. Conductive third and fourth pads connected to the two pads by solder are formed and connected to the other surface of the insulating substrate by soldering to the corresponding first and second pins of the package, respectively. Conductive fifth and sixth pads, and first and second conductive pads connected by soldering to the corresponding first and second terminals of the countermeasure component, respectively, are formed. A flexible film,
The semiconductor device is mounted on the printed circuit board,
The third, fifth, and seventh pads are conductive first vias formed in the insulating substrate and conductive formed on one surface and the other surface of the insulating substrate. And the fourth, sixth and eighth pads are connected to one of the conductive second via and the insulating substrate opened in the insulating substrate. Provided is a component mounting module characterized by being connected via a conductive second wiring formed on the surface and the other surface.

Further, the present invention is a component mounting method for mounting the semiconductor device and the countermeasure component on the printed board using the first flexible film according to any one of the above,
Positioning the first flexible film on the printed circuit board by aligning a pad of the printed circuit board and a corresponding pad on one side of the first flexible film;
Reflowing and melting a first solder formed on a pad on one side of the first flexible film;
Cooling and solidifying the molten first solder, and connecting the pad of the printed circuit board and the corresponding pad on one surface of the first flexible film with the first solder;
The pad on the other surface of the first flexible film is aligned with the corresponding pin of the package and the corresponding terminal of the countermeasure component, and the semiconductor device is placed on the first flexible film. And arranging the countermeasure parts,
The second solder formed on the pad on the other surface of the first flexible film and having a melting point lower than that of the first solder is melted and the second solder is melted. Reflowing and melting at a temperature at which the material is not melted;
The melted second solder is cooled and solidified, and the pads on the other surface of the first flexible film, the corresponding pins of the package and the corresponding terminals of the countermeasure component are connected to the second A component mounting method including a step of connecting with solder.

  According to the present invention, a flexible film is inserted between a pin of a package of a semiconductor device and a corresponding pad of the printed circuit board, thereby arranging the countermeasure parts without changing the layout of the printed circuit board. Additional mounting is possible with (series) connection or shunt (parallel) connection.

(A) And (B) is the side view of one Embodiment showing the structure of the component mounting module of this invention, respectively, and its partial top view. (A) And (B) is a conceptual diagram of 1st Embodiment showing the structure of the layout pattern of the front surface of a flexible film shown in FIG. 1, and a back surface, respectively. FIG. 3 is an example circuit diagram illustrating a connection relationship between the flexible film illustrated in FIG. 2 and a four-terminal common mode noise filter that is a countermeasure component. (A) And (B) is a conceptual diagram of 2nd Embodiment showing the structure of the layout pattern of the front surface and back surface of a flexible film, respectively. FIG. 5 is an exemplary circuit diagram illustrating a connection relationship between the flexible film illustrated in FIG. 4 and a two-terminal damping resistor as a countermeasure component. (A) And (B) is a conceptual diagram of 3rd Embodiment showing the structure of the layout pattern of the front surface and back surface of a flexible film, respectively. It is a circuit diagram of an example showing the connection relation between the flexible film shown in FIG. 6 and a two-terminal capacitor as a countermeasure component. (A) And (B) is a conceptual diagram of 4th Embodiment showing the structure of the layout pattern of the front surface and back surface of a flexible film, respectively. FIG. 9 is a circuit diagram illustrating an example of a connection relationship between the flexible film illustrated in FIG. 8 and a two-terminal capacitor and a two-terminal ferrite bead that are countermeasure parts. It is a side view of an example showing the general dimension of each part of a semiconductor device and a flexible film. (A) And (B) is a conceptual diagram of 5th Embodiment showing the structure of the layout pattern of the front surface and back surface of a flexible film, respectively. It is a conceptual diagram of 6th Embodiment showing the structure of the layout pattern of the front surface of a flexible film. It is a flowchart of an example showing each process of the component mounting method of this invention.

  Hereinafter, a component mounting module and a component mounting method according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  FIGS. 1A and 1B are a side view and a partial top view of an embodiment showing the configuration of the component mounting module of the present invention, respectively. A component mounting module 10 shown in FIG. 1 includes a semiconductor device 12, a printed circuit board 14, a countermeasure component 16, and a flexible film 18. The component mounting module 10 of the present embodiment is one in which one or more components including the semiconductor device 12 are mounted on a printed circuit board 14. As a countermeasure component 16, a four-terminal common mode noise filter is used as a differential signal line. It is an example when inserted.

  The semiconductor device 12 is a component mounted on the printed circuit board 14. The semiconductor device 12 of the present embodiment is sealed in a QFP type package, and the package includes a plurality of pins including two pins 20 and 22 corresponding to the above-described differential signal lines.

In order to mount various components including the semiconductor device 12, the printed circuit board 14 connects conductive pads corresponding to respective pins and terminals of the various components on the insulating substrate, and connects these pads. A layout pattern including conductive wiring, conductive vias (via holes), and the like is formed.
On the insulating substrate of the printed circuit board 14 of this embodiment, two conductive pads 24 and 26 are formed at positions corresponding to the pins 20 and 22 of the package of the semiconductor device 12, respectively.

  The countermeasure component 16 is an electronic component mounted on the flexible film 18 in order to improve the operation of the component mounting module 10 as a system including the semiconductor device 12. As described above, the countermeasure component 16 of the present embodiment is a four-terminal common mode noise filter.

The flexible film (flexible substrate) 18 is inserted and arranged between the package pin of the semiconductor device 12 to which the countermeasure component 16 is connected and the corresponding pad of the printed circuit board 14, and mounts various countermeasure components 16. In order to do so, the respective pins of the package of the semiconductor device 12 to which the countermeasure component 16 is connected, the respective pads of the printed circuit board 14, and the respective countermeasure components 16 are provided on both sides of the flexible insulating substrate. A layout pattern including pads corresponding to terminals, wirings connecting these pads, vias, and the like is formed.
The flexible film 18 of this embodiment is inserted and arranged between the pins 20 and 22 of the package of the semiconductor device 12 to which the countermeasure component 16 is connected and the corresponding pads 24 and 26 of the printed circuit board 14. Yes.

  As shown in FIG. 1A, a 4-terminal common mode noise filter is mounted on the flexible film 18 as a countermeasure component 16. Although details will be described later, the pins 20 and 22 of the package of the semiconductor device 12 are printed on the printed circuit board via the layout pattern formed on the flexible film 18 and the countermeasure component 16 mounted on the flexible film 18. 14 corresponding pads 24 and 26, respectively. That is, the countermeasure component 16 is connected in series to the differential signal line.

  Next, the layout pattern of the flexible film 18 of this embodiment is demonstrated.

  2A and 2B are conceptual diagrams of the first embodiment showing the configuration of the layout pattern of the front surface and the back surface of the flexible film shown in FIG. 1, respectively. FIG. It is a circuit diagram of an example showing the connection relationship between the flexible film shown in 4 and the common mode noise filter of 4 terminals which is a countermeasure component.

  As shown in FIG. 2B, the back surface (one surface) of the insulating substrate of the flexible film 18 of the present embodiment corresponds to the pads 24 and 26 of the differential signal line of the printed circuit board 14, respectively. Two pads 28 and 30 are formed at the positions. The pads 28 and 30 are connected to the corresponding differential signal line pads 24 and 26 of the printed circuit board 14 shown in FIG.

  Further, as shown in FIG. 2A, on the front surface (the other surface) of the insulating substrate, two pads are provided at positions corresponding to the differential signal pins 20 and 22 of the package of the semiconductor device 12, respectively. 32 and 34 are formed, and four pads 36, 38, 40 and 42 are formed at positions corresponding to the four terminals of the four-terminal common mode noise filter which is the countermeasure component 16, respectively. The pads 32 and 34 are connected to the corresponding differential signal pins 20 and 22 of the package of the semiconductor device 12 shown in FIG. As shown in FIG. 3, the pads 36, 38, 40, 42 are connected to the corresponding terminals of the four-terminal common mode noise filter, which is the countermeasure component 16, by solder.

  The pads 32 and 34 are formed at the same position on the front surface with respect to the pads 28 and 30 formed on the back surface of the insulating substrate, but are insulated.

Furthermore, as shown in FIGS. 2 and 3, the pads 28 and 40 are connected via vias 44 formed in the insulating substrate and wirings 48 formed on the back surface and the front surface of the insulating substrate. ing. Similarly, the pads 30 and 42 are connected to each other through vias 46 formed in the insulating substrate and wirings 50 formed on the back surface and the front surface of the insulating substrate.
The pads 32 and 36 are connected via a wiring 52 formed on the front surface of the insulating substrate, and the pads 34 and 38 are connected via a wiring 54 formed on the front surface of the insulating substrate. Connected.

  That is, the differential signal pins 20 and 22 of the package of the semiconductor device 12 include the pads 32 and 34, the wirings 52 and 54, the pads 36 and 38, the four-terminal common mode noise filter that is the countermeasure component 16, the pads 40 and 42, The wirings 48 and 50, the vias 44 and 46, the wirings 48 and 50, and the pads 28 and 30 are connected to the corresponding differential signal line pads 24 and 26 of the printed circuit board 14.

  As described above, the component mounting module 10 is the countermeasure component 16 between the differential signal pins 20 and 22 of the package of the semiconductor device 12 and the corresponding differential signal line pads 24 and 26 of the printed circuit board 14. By inserting and arranging the flexible film 18 on which the 4-terminal common mode noise filter is mounted, the 4-terminal common mode noise filter as the countermeasure component 16 can be connected in series to the differential signal line. .

  Next, the flexible film 18 of the 2nd Embodiment of this invention is demonstrated.

  FIGS. 4A and 4B are conceptual diagrams of the second embodiment showing the configuration of the layout pattern of the front surface and the back surface of the flexible film, respectively. FIG. 5 is a diagram showing the flexibility shown in FIG. It is a circuit diagram of an example showing the connection relationship between a conductive film and a two-terminal damping resistor as a countermeasure component. The flexible film 18 of this embodiment is an example in the case of inserting a two-terminal damping resistor into the signal line as the countermeasure component 16.

  As shown in FIG. 4B, a pad 56 is formed on the back surface of the insulating substrate of the flexible film 18 of the present embodiment at a position corresponding to the signal line pad of the printed circuit board 14. The pads 56 are connected to the corresponding signal line pads of the printed circuit board 14 by soldering.

  Further, as shown in FIG. 4A, a pad 58 is formed on the front surface of the insulating substrate at a position corresponding to the signal pin of the package of the semiconductor device 12, and the countermeasure component 16 2 is further provided. Two pads 60 and 62 are formed at positions corresponding to the two terminals of the terminal damping resistor, respectively. The pad 58 is connected to a corresponding signal pin of the package of the semiconductor device 12 by solder. Further, as shown in FIG. 5, the pads 60 and 62 are connected to the corresponding terminals of the two-terminal damping resistance as the countermeasure component 16 by solder.

  Similarly, the pad 58 is formed at the same position on the front surface with respect to the pad 56 formed on the back surface of the insulating substrate.

Further, as shown in FIGS. 4 and 5, pads 56 and 62 are connected via vias 64 formed in the insulating substrate and wiring 66 formed on the back surface and the front surface of the insulating substrate. ing.
The pads 58 and 60 are connected via a wiring 68 formed on the front surface of the insulating substrate.

  That is, the signal pins of the package of the semiconductor device 12 are connected via the pad 58, the wiring 68, the pad 60, the damping resistance of the two terminals as the countermeasure component 16, the pad 62, the wiring 66, the via 64, the wiring 66, and the pad 56. It is connected to the corresponding signal line pad of the printed circuit board 14.

  Accordingly, the flexible film 18 on which the two-terminal damping resistor as the countermeasure component 16 is mounted is inserted and disposed between the signal pin of the package of the semiconductor device 12 and the corresponding signal line pad of the printed circuit board 14. Thus, a two-terminal damping resistor as the countermeasure component 16 can be connected in series to the signal line.

  Next, the flexible film 18 of the 3rd Embodiment of this invention is demonstrated.

  FIGS. 6A and 6B are conceptual diagrams of the third embodiment showing the layout patterns of the front surface and the back surface of the flexible film, respectively. FIG. 7 is a diagram showing the flexibility shown in FIG. It is a circuit diagram of an example showing the connection relation between a conductive film and a two-terminal capacitor as a countermeasure component. The flexible film 18 of this embodiment is an example in the case where a two-terminal capacitor is inserted between the power supply line and the ground line as the countermeasure component 16.

  As shown in FIG. 6 (B), on the back surface of the insulating substrate of the flexible film 18 of the present embodiment, two pads 70 are provided at positions corresponding to the power line and ground line pads of the printed circuit board 14, respectively. 72 is formed. The pads 70 and 72 are connected to the corresponding power supply line and ground line pads of the printed circuit board 14 by soldering.

  Also, as shown in FIG. 6A, two pads 74 and 76 are formed on the front surface of the insulating substrate at positions corresponding to the power supply pins and the ground pins of the package of the semiconductor device 12, respectively. Further, two pads 78 and 80 are formed at positions corresponding to the two terminals of the two-terminal capacitor as the countermeasure component 16, respectively. The pads 74 and 76 are connected to corresponding power supply pins and ground pins of the package of the semiconductor device 12 by soldering. As shown in FIG. 7, the pads 78 and 80 are connected to corresponding terminals of a two-terminal capacitor as the countermeasure component 16 by solder.

  Similarly, the pads 74 and 76 are formed at the same position on the front surface with respect to the pads 70 and 72 formed on the back surface of the insulating substrate, respectively.

Further, as shown in FIGS. 6 and 7, the pads 70 and 74 are connected through vias 82 opened in the insulating substrate, and the pads 72 and 76 are vias 84 opened in the insulating substrate. Connected through.
The pads 74 and 78 are connected via a wiring 86 formed on the front surface of the insulating substrate, and the pads 76 and 80 are connected via a wiring 88 formed on the front surface of the insulating substrate. Connected.

That is, the power supply pin of the package of the semiconductor device 12 is connected to the pad of the power supply line of the printed circuit board 14 through the pad 74, the via 82, and the pad 70. Similarly, the ground pin of the package of the semiconductor device 12 is connected to the pad of the ground line of the printed circuit board 14 through the pad 76, the via 84, and the pad 72.
One terminal of the two-terminal capacitor as the countermeasure member 16 is connected to the power supply pin of the package of the semiconductor device 12 via the pad 78, the wiring 86, and the pad 74, and the other terminal of the capacitor is connected to the pad 80. The semiconductor device 12 is connected to the ground pin of the package through the wiring 88 and the pad 76.

  Therefore, the flexible film 18 in which the two-terminal capacitor as the countermeasure component 16 is mounted between the power supply pin and ground pin of the package of the semiconductor device 12 and the corresponding power line and ground line pad of the printed circuit board 14, respectively. Therefore, a two-terminal capacitor as the countermeasure component 16 can be shunt-connected between the power supply line and the ground line.

  Next, the flexible film 18 of the 4th Embodiment of this invention is demonstrated.

  FIGS. 8A and 8B are conceptual diagrams of the fourth embodiment showing the configuration of the layout pattern of the front surface and the back surface of the flexible film, respectively. FIG. 9 is a diagram showing the flexibility shown in FIG. It is an example circuit diagram showing the connection relation between a conductive film and a two-terminal capacitor as a countermeasure component and a two-terminal ferrite bead. The flexible film 18 of this embodiment is an example in which a two-terminal capacitor is inserted between the power supply line and the ground line as a countermeasure component 16, and further, a two-terminal ferrite bead is inserted into the power supply line. It is.

  As shown in FIG. 8B, on the back surface of the insulating substrate of the flexible film 18 of the present embodiment, two pads 90, respectively, are provided at positions corresponding to the ground line and power supply line pads of the printed circuit board 14, respectively. 92 is formed. The pads 90 and 92 are connected to the corresponding ground line and power supply line pads of the printed circuit board 14 by soldering.

  Also, as shown in FIG. 8A, two pads 94 and 96 are formed on the front surface of the insulating substrate at positions corresponding to the ground pins and power pins of the package of the semiconductor device 12, respectively. Two pads 98 and 100 are formed at positions corresponding to the two terminals of the two-terminal capacitor as the countermeasure component 16, and further, positions corresponding to the two terminals of the two-terminal ferrite beads as the countermeasure component 16, respectively. Two pads 102 and 104 are formed. The pads 94 and 96 are connected to the corresponding ground pins and power supply pins of the package of the semiconductor device 12 by soldering. Further, as shown in FIG. 9, the pads 98 and 100 are connected to the corresponding terminals of the two-terminal capacitor as the countermeasure component 16 by soldering, and the pads 102 and 104 are the two-terminal ferrite as the countermeasure component 16. Each bead is connected to a corresponding terminal by solder.

  Similarly, the pads 94 and 96 are formed at the same position on the front surface with respect to the pads 90 and 92 formed on the back surface of the insulating substrate, respectively.

  Further, as shown in FIGS. 8 and 9, the pads 90 and 94 are connected via vias 106 formed in the insulating substrate, and the pads 94 and 98 are formed on the front surface of the insulating substrate. Are connected via the connected wiring 108. The pads 92 and 102 are connected via a via 112 opened in the insulating substrate and a wiring 114 formed on the front surface and the back surface of the insulating substrate. The pads 96 and 100 are connected via a wiring 110 formed on the front surface of the insulating substrate, and the pads 100 and 104 are connected via a wiring 116 formed on the front surface of the insulating substrate. Has been.

That is, the power supply pins of the package of the semiconductor device 12 are connected via the pad 96, the wiring 110, the pad 100, the wiring 116, the pad 104, the ferrite beads of the countermeasure component 16, the pad 102, the wiring 114, the via 112, the wiring 114, and the pad 92. And connected to the pad of the power supply line of the printed circuit board 14. Further, the ground pin of the package of the semiconductor device 12 is connected to the pad of the ground line of the printed board 14 through the pad 94, the via 106, and the pad 90.
One terminal of the two-terminal capacitor as the countermeasure member 16 is connected to the power supply pin of the package of the semiconductor device 12 via the pad 98, the wiring 108, and the pad 94, and the other terminal of the capacitor is connected to the pad 100. The semiconductor device 12 is connected to the ground pin of the package through the wiring 110 and the pad 96.
One terminal of the two-terminal ferrite bead that is the countermeasure member 16 is connected to the pad corresponding to the power line of the printed circuit board 14 via the pad 102, the wiring 114, the via 112, the wiring 114, and the pad 92. The other terminal is connected to the power supply pin of the package of the semiconductor device 12 via the pad 104, the wiring 116, the pad 100, the wiring 110, and the pad 96.

  Therefore, a two-terminal capacitor and a two-terminal ferrite bead as the countermeasure component 16 are mounted between the power supply pin and ground pin of the package of the semiconductor device 12 and the corresponding power line and ground line pad of the printed circuit board 14, respectively. By inserting and arranging the flexible film 18, a two-terminal capacitor as the countermeasure component 16 is shunt-connected between the power supply line and the ground line, and the countermeasure component 16 is connected to the power supply line. Two terminal ferrite beads can be connected in series.

  Next, a component mounting method in the manufacturing process of the component mounting module 10 will be described.

  For example, when the flexible film 18 is inserted and arranged between a part of pins of a QFP type package and a corresponding pad of the printed circuit board 14, the pins of the target package are previously placed on the flexible film 18. It needs to be lifted by the thickness. When this is performed in the manufacturing process, it is necessary to add a process such as lifting a part of pins of a target package in advance using a mold or the like.

  FIG. 10 is a side view of an example showing general dimensions of each part of the semiconductor device and the flexible film. As shown in the figure, the general height of the leads (legs) of the QFP type package is about 500 μm, the general thickness of the outer leads (pins) of the package is about 150 μm, and the semiconductor device 12 is mounted on the printed circuit board 14. When mounted above, the typical spacing between the package and the printed circuit board 14 is about 100 μm, and the typical thickness of the flexible film 18 is about 50 μm.

  Therefore, when the flexible film 18 is inserted and disposed, as shown in FIG. 10, it is necessary to lift the outer leads of the target package in advance by the thickness of the flexible film 18 of about 50 μm. is there. The numerical value of 50 μm is about 10% of the package lead height of about 500 μm, so that a high load is not applied even if the outer lead of the target package is lifted. Therefore, there is almost no concern that the strength of the outer lead is reduced due to metal fatigue or the like.

  Thus, in terms of dimensions, for example, it is sufficiently feasible to insert and arrange the flexible film 18 between some pins of the QFP type package and the corresponding pads of the printed circuit board 14.

  On the other hand, there is also a method in which the flexible film 18 is inserted and arranged without lifting some pins of the QFP type package.

  FIGS. 11A and 11B are conceptual diagrams of the fifth embodiment showing the configuration of the layout pattern on the front surface and the back surface of the flexible film, respectively. The flexible film 18 of this embodiment is not for mounting the countermeasure component 16 but between a part of the pins of the QFP type package to which the countermeasure component 16 is connected and the corresponding pad of the printed circuit board 14. When the flexible film 18 is inserted and arranged, it is inserted and arranged between the remaining pins of the package to which the countermeasure component 16 is not connected and the corresponding pads of the printed circuit board 14 so that the height of all the pins is increased. It is for adjusting the thickness.

As shown in FIGS. 11A and 11B, pads 118 connected to the corresponding pads of the printed circuit board 14 by solder are formed on the back surface of the insulating substrate of the flexible film 18 of the present embodiment. On the front surface of the insulating substrate, a pad 120 connected to a corresponding pin of the package of the semiconductor device 12 by solder is formed. The pads 118 and 120 are connected to each other via vias 122 formed in the insulating substrate and wirings 124 formed on the back surface and the front surface of the insulating substrate.
In the flexible film 18 of the present embodiment, a layout pattern including five sets of pads 118 and 120, vias 122, and wirings 124 is formed side by side.

  By inserting and arranging the flexible film 18 of the present embodiment between the five pins of the QFP type package and the corresponding five pads of the printed circuit board 14, the five pins of the package are respectively The corresponding pads 120, wiring 124, vias 122, wiring 124, and pads 118 are connected to the corresponding five pads on the printed circuit board 14.

  Therefore, when the flexible film 18 is inserted and arranged between some pins of the QFP type package and the corresponding pads of the printed circuit board 14, the remaining pins of the package and the corresponding pads of the printed circuit board 14 respectively. By inserting and arranging the flexible film 18 shown in FIG. 11, the heights (mounting surfaces) of all the pins of the QFP type package can be made uniform. Therefore, the process of lifting a part of the pins of the package is not necessary.

  In the case of a QFP type package, one or more layout patterns composed of pads 118, 120, vias 122 and wirings 124 shown in FIG. 11 are formed side by side, and a layout pattern composed of pads 118, 120, vias 122 and wirings 124 is formed. By preparing two or more types of flexible films 18 having different numbers and combining them, it is possible to use them for packages having different numbers of pins.

In addition, although versatility is reduced, as shown in FIG. 12, by using a layout pattern that covers the entire pins of the BGA type package, only the pins on which the countermeasure component 16 is to be mounted are pulled out and the countermeasure component 16 is mounted. It is also possible to provide a pad for this purpose.
FIG. 12 is a conceptual diagram of the sixth embodiment showing the configuration of the layout pattern of the front surface of the flexible film.

The countermeasure film 16 is connected to the front surface of the insulating substrate of the flexible film 18 of the present embodiment, corresponding to each of a total of six pins composed of 2 × 3 in the lower left in the figure. Thus, the same layout pattern as that shown in FIGS. 4A and 4B is formed.
Each of these six pins is pulled out of the region including all the pins of the BGA type package by the wiring 128 and connected to the corresponding layout pattern shown in FIGS. 4 (A) and 4 (B). Has been.

Other layout pins similar to those shown in FIGS. 11A and 11B are formed on the remaining pins of the BGA package to which the countermeasure component 16 is not connected.
That is, for each of the remaining pins, a pad connected to the corresponding pad of the printed circuit board 14 by solder is formed on the back surface of the insulating substrate. A pad 126 is formed on the front surface of the insulating substrate to be connected to the remaining pins of the package by solder.
In addition, for each of the remaining pins, the pad 126 on the front surface of the insulating substrate is connected to the back surface of the insulating substrate via a via (pad-on via) that is opened at the position of its own pad on the insulating substrate. Connected to the pad.

  Therefore, by inserting and arranging the flexible film 18 between all the pins of the BGA type package and the corresponding pads of all the pins of the BGA type package formed on the printed circuit board 14, The height of all the pins of the BGA type package can be made uniform, and the layout pattern formed by pulling out the total of 6 pins consisting of 2 × 3 in the lower left in the figure. The countermeasure component 16 can be mounted using the pads.

  In the case of a BGA type package, two or more types of flexible films 18 (for example, a total of nine pads consisting of 3 × 3 in the vertical direction, 5 × vertical in the vertical direction) are shown in FIG. By preparing a layout pattern including a total of 5 pads consisting of 1), the same correspondence can be achieved.

  Alternatively, in both QFP and BGA type packages, a plurality of types of flexible films 18 in which a plurality of pads are arranged on a flexible roll-shaped insulating substrate in advance are prepared and necessary. There is also a method of cutting and using as many pads as needed.

  Finally, a soldering process when the semiconductor device 12 and the countermeasure component 16 are mounted on the printed circuit board 14 using the flexible film 18 will be described.

The soldering process when mounting the semiconductor device 12 and the countermeasure component 16 can be performed, for example, by a reflow method.
In summary, first, the flexible film 18 is mounted on the printed circuit board 14 by a reflow method. At this time, the semiconductor device 12 and the countermeasure component 16 are not yet mounted. Subsequently, the semiconductor device 12 and the countermeasure component 16 are mounted on the flexible film 18 by a reflow method.

  More specifically, as shown in the flowchart of FIG. 13, first, the pads of the printed circuit board 14 and the corresponding pads on the back surface of the flexible film 18 are aligned, and the flexible film is placed on the printed circuit board 14. 18 is arranged (step S1).

  Subsequently, the solder formed on the pad on the back surface of the flexible film 18 is reflowed and melted (step S2).

  Then, the melted solder is cooled and solidified, and the pads of the printed circuit board 14 and the corresponding pads on the back surface of the flexible film 18 are connected by solder (step S3).

  Through the above steps, the flexible film 18 can be mounted on the printed circuit board 14.

  Subsequently, the pad on the front surface of the flexible film 18 and the corresponding pin of the package of the semiconductor device 12 and the corresponding terminal of the countermeasure component 16 are aligned, and the semiconductor device is placed on the flexible film 18. 12 and countermeasure component 16 are arranged (step S4).

Subsequently, the solder formed on the pad on the front surface of the flexible film 18 is reflowed and melted (step S5).
At this time, the solder used to connect the front surface of the flexible film 18 to the semiconductor device 12 and the countermeasure component 16 is lower than the solder used to connect the printed circuit board 14 and the back surface of the flexible film 18. The one having a melting point is used, the solder used for connecting the front surface of the flexible film 18 to the semiconductor device 12 and the countermeasure component 16 is melted, and the printed circuit board 14 and the back surface of the flexible film 18 are Reflow is performed at a temperature at which the solder used for connection is not melted.
Thereby, when the semiconductor device 12 and the countermeasure component 16 are mounted in the reflow process, the flexible film 18 already mounted on the printed circuit board 14 can be prevented from shifting.

  Finally, the melted solder is cooled and solidified, and the pads on the front surface of the flexible film 18 and the corresponding pins of the package and the corresponding terminals of the countermeasure component 16 are connected by solder (step S6). ).

  Through the above steps, the semiconductor device 12 and the countermeasure component 16 can be mounted on the flexible film 18. That is, the semiconductor device 12 and the countermeasure component 16 can be mounted on the printed circuit board 14.

In the component mounting module 10, the flexible film 18 is inserted and arranged between the pins of the package of the semiconductor device 12 and the corresponding pads of the printed circuit board 14 without changing the layout of the printed circuit board 14. The countermeasure component 16 can be additionally mounted in series connection or shunt connection.
In addition, the effects of the countermeasure component 16 and the like can be easily confirmed from the experimental stage. Further, when the countermeasure component 16 or the like is actually mounted, the flexible film 18 can be mounted in the manufacturing process, and thus can be applied to the product as it is. In this case, it is not necessary to redesign the printed circuit board 14, so that the time and cost for that purpose can be reduced. Alternatively, it is possible to cope with a small number of product lots and to change the design of the printed circuit board 14 during that time. Moreover, since the layout pattern of the flexible film 18 illustrated in each embodiment is versatile to some extent, it can be implemented at a lower cost than a custom product.

  In addition, the layout pattern of the flexible film 18 of each said embodiment is an example, and it is possible to use the flexible film 18 of the various layout patterns which perform the same function for the component mounting module 10 of this invention. it can.

In addition, the layout pattern of the flexible film 18 of each of the above embodiments is an example of the minimum configuration. For example, the layout pattern shown in FIG. Of course it is also possible.
For example, when two layout patterns shown in FIG. 4 are arranged side by side, two pads connected to each of the two pads of the printed circuit board 14 by solder are formed on the back surface of the insulating substrate of the flexible film 18. On the front surface of the insulating substrate, two pads connected to each of the two pins of the package with solder, and each of the two terminals of the countermeasure component 16 for each of the two countermeasure components 16 And two pads connected by solder are formed.

  Further, the present invention can be applied not only to QFP and BGA type packages but also to various types of packages other than this.

  Since the flexible film 18 has a flexible structure, for example, even when parts are already mounted around the pins of the package, the flexible film 18 is bent to avoid the parts already mounted. Therefore, the range of application is wide.

The present invention is basically as described above.
Although the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and it is needless to say that various improvements and modifications may be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 Component mounting module 12 Semiconductor device 14 Printed circuit board 16 Countermeasure component 18 Flexible film 20, 22 Pin 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 56, 58, 60, 62, 70, 72, 74, 76, 78, 80, 90, 92, 94, 96, 98, 100, 102, 104, 118, 120 Pad 44, 46, 64, 82, 84, 106, 112, 122 Via 48, 50, 52, 54, 66, 68, 86, 88, 108, 110, 114, 116, 124 Wiring

Claims (8)

A component mounting module on which one or more components including a semiconductor device are mounted,
A printed circuit board on which a conductive first pad corresponding to a first pin which is a part of a pin of the package of the semiconductor device is formed;
Countermeasure parts for improving the operation of the component mounting module;
A conductive material disposed between the first pin of the package and the first pad and connected to one surface of a flexible insulating substrate by soldering with the first pad. A second pad is formed, and on the other surface of the insulating substrate, a conductive third pad connected by soldering to the first pin of the package, and a first and a corresponding one of the countermeasure component, respectively. A first flexible film on which conductive fourth and fifth pads connected with a second terminal and solder are formed;
The semiconductor device is mounted on the printed circuit board,
The second and fifth pads include a conductive first via formed in the insulating substrate and a conductive first formed on one surface and the other surface of the insulating substrate. A component connected via a wiring, wherein the third and fourth pads are connected via a conductive second wiring formed on the other surface of the insulating substrate. Mounting module.   The first flexible film has two second pads connected to each of the two pads of the printed circuit board by solder on one surface of the insulating substrate, and the insulating substrate. 2, the two third pads connected by soldering to each of the two pins of the package, and the two terminals corresponding to four corresponding terminals of the countermeasure component of the four terminals by soldering The component mounting module according to claim 1, wherein the four fourth pads and the two fifth pads are formed.   In the first flexible film, two or more second pads connected to each of two or more pads of the printed circuit board by solder are formed on one surface of the insulating substrate, and the insulation is performed. The two or more third pads connected to each of the two or more pins of the package by solder and the two or more countermeasure components on the other surface of the conductive substrate, respectively. 2. The component mounting module according to claim 1, wherein two or more fourth and fifth pads connected to each of the second terminals by solder are formed. The package is a QFP type package,
Further, each of the pins of the package to which the countermeasure component is not connected is arranged to be inserted between each of the pins of the package to which the countermeasure component is not connected and the corresponding pad of the printed circuit board, and the insulating substrate A conductive sixth pad connected to the corresponding pad of the printed circuit board by solder is formed on one surface of the printed circuit board, and connected to the corresponding pin of the package by solder on the other surface of the insulating substrate. Conductive seventh pads are formed, and the sixth and seventh pads are formed as conductive second vias opened in the insulating substrate and one surface of the insulating substrate and the other. The component mounting module of any one of Claims 1-3 provided with the 2nd flexible film connected via the electroconductive 3rd wiring formed in the surface.   For the pins of the package to which the countermeasure component is not connected, one or more layout patterns of the second flexible film are formed instead of the second flexible film, and the second flexible film is formed. The component mounting module according to claim 4, further comprising a fourth flexible film configured by combining two or more third flexible films having different numbers of layout patterns. The package is a BGA type package,
The first flexible film further includes, for each pin of the package to which the countermeasure component is not connected, between each of the package pin to which the countermeasure component is not connected and a corresponding pad of the printed circuit board. A conductive sixth pad connected to the corresponding pad of the printed circuit board by solder is formed on one surface of the insulating substrate, and is disposed on the other surface of the insulating substrate. A conductive seventh pad connected by solder to a corresponding pin of the package is formed, and the sixth and seventh pads are connected via a conductive second via opened in the insulating substrate. The component mounting module according to claim 1, wherein the component mounting module is connected. A component mounting module on which one or more components including a semiconductor device are mounted,
A printed circuit board on which conductive first and second pads corresponding to the first and second pins, which are pins of a part of the package of the semiconductor device, are formed;
Countermeasure parts for improving the operation of the component mounting module;
The first and second pins are inserted between the first and second pins of the package and the first and second pads, respectively, and correspond to the first and second surfaces of the flexible insulating substrate, respectively. Conductive third and fourth pads connected to the two pads by solder are formed and connected to the other surface of the insulating substrate by soldering to the corresponding first and second pins of the package, respectively. Conductive fifth and sixth pads, and first and second conductive pads connected by soldering to the corresponding first and second terminals of the countermeasure component, respectively, are formed. A flexible film,
The semiconductor device is mounted on the printed circuit board,
The third, fifth, and seventh pads are conductive first vias formed in the insulating substrate and conductive formed on one surface and the other surface of the insulating substrate. And the fourth, sixth and eighth pads are connected to one of the conductive second via and the insulating substrate opened in the insulating substrate. A component mounting module which is connected via a conductive second wiring formed on the surface and the other surface. A component mounting method for mounting the semiconductor device and the countermeasure component on the printed board using the first flexible film according to any one of claims 1 to 7,
Positioning the first flexible film on the printed circuit board by aligning a pad of the printed circuit board and a corresponding pad on one side of the first flexible film;
Reflowing and melting a first solder formed on a pad on one side of the first flexible film;
Cooling and solidifying the molten first solder, and connecting the pad of the printed circuit board and the corresponding pad on one surface of the first flexible film with the first solder;
The pad on the other surface of the first flexible film is aligned with the corresponding pin of the package and the corresponding terminal of the countermeasure component, and the semiconductor device is placed on the first flexible film. And arranging the countermeasure parts,
The second solder formed on the pad on the other surface of the first flexible film and having a melting point lower than that of the first solder is melted and the second solder is melted. Reflowing and melting at a temperature at which the material is not melted;
The melted second solder is cooled and solidified, and the pads on the other surface of the first flexible film, the corresponding pins of the package and the corresponding terminals of the countermeasure component are connected to the second A component mounting method comprising: connecting with solder.

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