JPH09298351A - Circuit pattern converting subprinted board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit pattern converting subprinted board wherein mismatching of a circuit wiring which is generated relative to the connection between an electronic circuit board and a mounted IC is easily corrected, and correction to a surface mount type flat package IC having different terminal arrangement is also easily enabled. SOLUTION: A subprinted board 11 is used in order to mediate electrical connection between connection pads 13a of an electronic circuit board 13 for surface mounting and connection leads 12a of a flat package IC 12 for surface mounting which is mounted on the board. A circuit pattern which connects the pads 13a and the leads 12a in a specified relation, in order to convert an initial circuit pattern built in the electronic circuit board 13, is formed in the subprinted board 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit correction technique for an electronic circuit board, and more particularly to a circuit correction sub-printed circuit board of a surface mount device (hereinafter referred to as SMD) flat package IC (hereinafter referred to as FIC).

[0002]

2. Description of the Related Art The first method is a method for correcting the mismatch of circuit wiring that occurs in connection with the connection between this type of electronic circuit board and the semiconductor device mounted on the electronic circuit board which has been conventionally used. There is a method of redesigning and remanufacturing an electronic circuit board to be corrected. Secondly, a mechanical method is used for removing a part or the whole of a circuit to be corrected existing on or inside the electronic circuit board. After disconnecting the electrical connection by means such as the above, the electrodes of the FIC and the normal circuit are connected by soldering using a strap wire or the like to correct the circuit and reproduce it.

FIG. 4 is a schematic perspective view showing an FIC and an electronic circuit board corrected by mechanical removal in a conventional example. Reference numeral 42 is an FIC, 42a is a lead (connection terminal), and 43 is a correction. Electronic circuit board, 43a is a pad, 43b is a circuit, 43c is a circuit gap after mechanical removal, and 44a is a strap wire.

In order to correct the circuit mismatch between the circuit 43a of the electronic circuit board 43 and the lead 42a of the mounted FIC 42, a part 43 of the circuit 43b of the electronic circuit board 43.
c is removed by a mechanical method or the like, the FIC 43 is turned upside down and fixed to the electronic circuit board 43, and the pads 43a of the electronic circuit board 43 aligned from the leads 42a separated from the surface of the electronic circuit board 43 and the strap wire to the terminal of the component. Wired at 44. In addition to this, the FIC 42 is not turned upside down, the lead 42a whose electrical connection to the pad 43a is cut off is bent upward, and a predetermined pad 4 is formed by a strap wire 44 or the like.
There is also a method of fixing the modified portion with an adhesive after connection wiring to 3a.

[0005]

SUMMARY OF THE INVENTION The above-mentioned first method for redesigning an electronic circuit board of the prior art requires a redesign period and a remanufacturing period for circuit correction of the electronic circuit board, and There is a problem in that the product cost increases because of the manufacturing cost.

Further, in the method of disconnecting the electrical connection by the second mechanical removal and newly connecting a predetermined pad and connection wiring with a strap wire, the above-mentioned work becomes a manual work of the worker, and the skill of the worker is required. However, there is a problem that the quality is deteriorated due to the uncertainties of disconnection and the influence of heating of reconnection on the electronic circuit board.

It is an object of the present invention to easily correct a mismatch of circuit wiring caused by connection between an electronic circuit board and an IC to be mounted, and to easily correct SMD having different terminal arrangements. It is to provide a pattern conversion sub-printed circuit board.

[0008]

A circuit pattern conversion sub-printed circuit board of the present invention provides electrical connection between connection pads of a surface mounting electronic board and connection terminals of a surface mounting flat package IC mounted on the board. An intermediary sub-printed circuit board, in which a circuit pattern for connecting the connection pad and the connection terminal in a predetermined relationship is converted inside the sub-printed circuit board in order to convert the initial circuit pattern incorporated in the surface mounting electronic board. Be prepared for.

[0009] Further, the contact surface of the sub-printed board with the surface mounting flat package IC has lands for contacting each of the connection terminals of the IC, and the opposite surface of the connection pad of the surface mounting electronic board. It is preferable to have lands that come into contact with each other, and to have a wiring and a through hole for connecting a connection terminal to be connected and a connection pad between the lands.

Furthermore, on the side surface of the sub-printed circuit board, a through hole having a half-divided shape is provided so as to be connected to the land contacting the connection pad, and the connection terminal and the connection pad corresponding to each other in position are to be connected. Sometimes the corresponding IC
The pad that abuts on and the through hole having a half-divided shape at the same position may be connected.

In the sub-printed circuit board of the present invention, the lands connected to the leads of the mounted FIC and the lands connected to the pads of the electronic circuit board can be connected in any desired relationship within the sub-printed circuit board. By sandwiching the sub-printed circuit board having the circuit between the electronic circuit board and the FIC and soldering the leads and pads to the connection lands, the circuit of the mismatched electronic circuit board is cut or the strap wire between the FIC lead and the pad is used. The electric circuit can be corrected without making circuit connection.

The land for connecting to the lead of the mounted FIC and the land for connecting to the pad of the electronic circuit board can be easily provided by aligning the lead of the mounted FIC and the pad of the electronic circuit board. Can be assembled (soldered).

[0013]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view showing the relationship among a sub-printed circuit board, an FIC, and an electronic circuit board according to an embodiment of the present invention, and FIG. 2 is a schematic partial perspective view showing the structure of the sub-printed circuit board. 3 is a schematic partial perspective view showing details of the connection land portion of the sub-printed circuit board. In the figure, reference numeral 11 is a sub-printed circuit board, and 11a is F.
IC lead connection land, 11b electronic circuit board pad connection land, 11c through hole portion of electronic circuit board pad connection land, 11d wiring, 11e through hole, 12 FIC, 12a lead, 12b FIC
Mark indicating the 1st pin, 13 is an electronic circuit board, 13a
Is a pad, and 13b is a mark indicating the first pin of the pad.

As shown in FIG. 2, the sub-printed circuit board 11 has an FIC lead connection land 11a on one side.
The lead 12a of the IC 12 is disposed at a position where it can be directly soldered to the lead 12a, and the electronic circuit board pad connecting land 11b is disposed at a position where it can be directly soldered to the pad 13a of the electronic circuit substrate 13 on the opposite surface. As shown in FIG. 3, the electronic circuit board pad connecting land 11b is connected to the through hole portion 11c of the half-divided shape provided on the side surface of the sub print board 11.

The FIC lead connecting land 11a and the electronic circuit board pad connecting land 11b are at the same position of the FIC.
When the lead connection lands 11a and the electronic circuit board pad connection lands 11b are aligned with each other, they are routed through the side half-hole through holes 11c, and when they are not aligned, the wiring 11d and the through holes in the sub-printed board are formed. By mutually connecting with the matching partner via the hole 11e,
Converted to the correct circuit pattern.

For example, in FIG. 1, the mark 13b indicating the 1st pin of the electronic circuit board 13 is shown at the end of the pad row. On this electronic circuit board 13, a mark indicating the 1st pin is located in the center of the pad row according to the instruction of the assembly drawing.
Suppose 12 is given. This electronic circuit board 1
Since the circuit of No. 3 is different from the drawing in which the FIC 12 is indicated, if it is directly connected as it is, the electronic circuit does not operate even after assembly.

Therefore, the matching FIC lead connecting lands 11a and electronic circuit board pad connecting lands 11b are connected to the internal wiring 11d and through holes 11c and 11e, and the sub-printed circuit board 11 having the converted circuit pattern is converted into an electronic circuit. A normal electronic circuit can be obtained by inserting the board 13 and the FIC 12 and connecting them by soldering.

Thus, the sub-printed circuit board of the present invention is L
Since it has a CC (Leadless ChipCarrier, small size and high density package without leads), the conventional soldering standard can be used as it is.
It has the same visual inspection and solderability as other electronic components.

[0019]

As described above, according to the present invention, a sub-printed circuit board having a circuit conversion function is inserted and connected between an FIC having an inconsistent circuit pattern and an electronic circuit board, thereby easily and stably. The effect is that the circuit can be corrected, and manual work such as mechanical removal processing becomes unnecessary.

Further, the sub-printed circuit board of the present invention is FI
Since the size is similar to C and the connection position of the circuit can be matched, it can be used without changing the electronic circuit board, there is no need to remanufacture the electronic circuit board, the design change cost can be reduced, and the product The effect is that the delivery time of can be shortened.

[Brief description of drawings]

1 is a sub-printed circuit board according to an embodiment of the present invention;
It is a typical perspective view which shows the relationship between IC and an electronic circuit board.

FIG. 2 is a schematic partial perspective view showing the structure of a sub-printed circuit board.

FIG. 3 is a schematic partial perspective view showing details of a connection land portion of a sub-printed circuit board.

FIG. 4 is a schematic perspective view showing an FIC and an electronic circuit board corrected by mechanical removal in a conventional example.

[Explanation of symbols]

11 Sub Printed Circuit Board 11a FIC Lead Connection Land 11b Electronic Circuit Board Pad Connection Land 11c Electronic Circuit Board Pad Connection Land Through Hole 11d Wiring 11e Through Hole 12, 42 FIC 12a, 42a Lead 12b FIC Pin 1 Pin Mark 13 Electronic circuit board 13a, 43a Pad 13b Mark showing pin 1 of pad 43 Electronic circuit board to be corrected 43b Circuit 43c Circuit gap after mechanical removal 44a Strap wire

Claims (3)

[Claims] 1. A sub-printed board for mediating electrical connection between a connection pad of a surface mounting electronic substrate and a connection terminal of a surface mounting flat package IC mounted on the substrate, the surface mounting electronic substrate In order to convert the original circuit pattern incorporated in the sub-circuit board, a circuit pattern for connecting the connection pad and the connection terminal in a predetermined relationship is provided inside the sub-printed circuit board. Sub printed circuit board. 2. The surface of the sub-printed board, which comes into contact with the surface-mounting flat package IC, has lands that come into contact with the respective connection terminals of the IC, and the opposite surface has the land of the electronic board for surface-mounting. The circuit pattern conversion according to claim 1, further comprising a land that contacts each of the connection pads, and a wiring and a through hole for connecting the connection terminal to be connected to the connection pad and a land between the lands. Sub printed circuit board. 3. A side surface of the sub-printed circuit board is provided with a through hole having a half-divided shape that is connected to the land contacting the connection pad, and the connection terminal and the connection pad corresponding to each other in position are connected to each other. 3. When in a power relationship, the pad that abuts a corresponding IC is connected to the half-hole shaped through hole located at the same position.
The circuit pattern conversion sub-printed circuit board according to.