JPH0745346A - Socket for chip part - Google Patents

Socket for chip part

Info

Publication number
JPH0745346A
JPH0745346A JP5208378A JP20837893A JPH0745346A JP H0745346 A JPH0745346 A JP H0745346A JP 5208378 A JP5208378 A JP 5208378A JP 20837893 A JP20837893 A JP 20837893A JP H0745346 A JPH0745346 A JP H0745346A
Authority
JP
Japan
Prior art keywords
chip
parts
socket
plate
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5208378A
Other languages
Japanese (ja)
Inventor
Teruo Nakamura
輝生 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5208378A priority Critical patent/JPH0745346A/en
Publication of JPH0745346A publication Critical patent/JPH0745346A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connecting Device With Holders (AREA)
  • Details Of Resistors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE:To mount chip parts in through-holes and at the same time exchange the chip parts and positioning them easily without damaging a circuit pattern and the chip parts by forming a fixed plate having a shoulder plate and a holding plate. CONSTITUTION:A socket part 20 is composed of a fixed plate on which a terminal part 41 of a chip part 40 is to be mounted and holding plates 22, 22 which are stood in both side edges of the plate 21 and have shoulder plate 22b at one ends to hold the part 41. In the case the part 40 is mounted, at first lead parts 30, 30 are soldered with through holes 50, 50 to fix sockets 11, 12 for chip parts on a printed circuit board and parts 41, 41 of the part 40 are set between the plates 22, 22 by pressure and the part 40 is positioned by the plate 22b. Next, the parts 41, 41 are held through the projected parts 22a, 22a and thus the part 40 is mounted while being connected electrically with the circuit of the printed circuit board and at the same time the part can be detached easily. Consequently, the part 40 is exchanged easily and positioning of the part can be done and the part and the plate 22 are brought into contact in optimum condition.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リード線を有しないコ
ンデンサ,抵抗,トランジスタ等のチップ型電子部品
(以下、チップ部品という)の実装に用いるソケットに
関し、特に、スルーホールにチップ部品を実装すること
ができ、回路パターン及びチップ部品を破損することな
く、簡単にチップ部品を交換できるチップ部品用ソケッ
トに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for mounting a chip type electronic component (hereinafter referred to as a chip component) such as a capacitor, a resistor and a transistor having no lead wire, and more particularly to mounting a chip component in a through hole. The present invention relates to a chip component socket that can be easily replaced without damaging the circuit pattern and the chip component.

【0002】[0002]

【従来の技術】従来から、電子機器の小型化とプリント
配線板の実装密度を高めるために、コンデンサ,抵抗,
トランジスタ等の部品を従来のリード線付きのものから
リード線の無いものへの切り替え、いわゆる電子部品の
チップ化が進められている。このようなチップ部品は、
その両端部をAgあるはAg−Pdメッキした端子部を
有し、これら端子部を平らなチップランド上に直接半田
付けすることによって、プリント配線板上に実装されて
いた。しかし、回路構成上、ときとして、チップランド
を有しないスルーホールのみを形成したプリント配線板
上にチップ部品を実装しなければならない場合があっ
た。このような場合、従来は、スルーホール上に銅メッ
キの蓋をした構成のブラインドバイアホールを形成し、
この銅メッキ上にチップ部品の端子部を直接半田付けす
ることによって、スルーホール上にチップ部品を実装し
ていた。
2. Description of the Related Art Conventionally, in order to miniaturize electronic devices and increase the mounting density of printed wiring boards, capacitors, resistors,
Switching of conventional components such as transistors from those with lead wires to those without lead wires, so-called electronic component chips are being promoted. Such chip parts are
It has a terminal portion whose both ends are plated with Ag or Ag-Pd, and is mounted on a printed wiring board by directly soldering these terminal portions onto a flat chip land. However, due to the circuit configuration, it is sometimes necessary to mount a chip component on a printed wiring board having only through holes having no chip land. In such a case, conventionally, a blind via hole having a copper-plated lid is formed on the through hole,
The chip parts were mounted on the through holes by directly soldering the terminal parts of the chip parts onto the copper plating.

【0003】[0003]

【発明が解決しようとする課題】ここで、プリント配線
板の試作等の段階においては、回路の電気特性確認後、
チップ部品を交換しなければならない場合がある。とこ
ろが、上述した従来のブラインドバイアホールを用いた
チップ部品の実装方法では、チップ部品の端子部を取付
ランド上に直接半田付けしていたので、チップ部品の交
換時における半田ごての局部的な熱によってプリント配
線板上の回路パターン(銅メッキの蓋)及びチップ部品
の端子部が破損してしまうという問題があった。
At the stage of trial production of a printed wiring board, after confirming the electrical characteristics of the circuit,
It may be necessary to replace the chip component. However, in the above-described conventional method for mounting a chip component using the blind via hole, the terminal portion of the chip component is directly soldered onto the mounting land, so that the soldering iron is locally localized when the chip component is replaced. There is a problem that the circuit pattern (copper-plated lid) on the printed wiring board and the terminal portion of the chip component are damaged by heat.

【0004】本発明は、上記問題点にかんがみてなされ
たものであり、スルーホールにチップ部品を実装するこ
とができ、回路パターン及びチップ部品を破損すること
なく、簡単にチップ部品を交換できるチップ部品用ソケ
ットの提供を目的とする。
The present invention has been made in view of the above problems, and it is possible to mount a chip component in a through hole and to easily replace the chip component without damaging the circuit pattern and the chip component. The purpose is to provide a socket for parts.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明のチップ部品用ソケットは、チップ部品をプ
リント配線板上のスルーホールに実装するためのソケッ
トであって、前記チップ部品を載置する固定板と、この
固定板の両側縁に位置し、前記チップ部品の端子部を把
持するとともに、前記チップ部品を電気的に接続する把
持板とからなるソケット部、このソケット部から垂下し
て設け、前記スルーホールに半田付けされるリード部を
備えた構成としてある。
In order to achieve the above object, a socket for chip parts of the present invention is a socket for mounting a chip part in a through hole on a printed wiring board. A socket portion including a fixed plate to be placed and gripping plates that are located on both side edges of the fixed plate and that grip the terminal portion of the chip component and electrically connect the chip component, and hang down from the socket portion. And a lead portion to be soldered to the through hole.

【0006】[0006]

【作用】上記構成からなる本発明のチップ部品用ソケッ
トによれば、チップ部品の両方の端子部に対応する二個
一対の本チップ部品用ソケットの各リード部をスルーホ
ールに半田付けし、これらチップ部品用ソケットの各ソ
ケット部にチップ部品の各端子部を圧入することによっ
て、チップ部品を着脱可能にプリント配線板上(スルー
ホール)に実装する。
According to the chip part socket of the present invention having the above-mentioned structure, the lead parts of the pair of two chip part sockets corresponding to both terminal parts of the chip part are soldered to the through holes, The chip parts are detachably mounted on the printed wiring board (through holes) by press-fitting the terminal parts of the chip parts into the socket parts of the chip part socket.

【0007】[0007]

【実施例】以下、本発明のチップ部品用ソケットの実施
例について、図面を参照しつつ説明する。図1は、本実
施例に係るチップ部品用ソケットを示す斜視図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip component socket of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a chip component socket according to this embodiment.

【0008】同図において、11,12は二個で一対を
なすチップ部品用ソケットであり、導電性を有する金属
性の板部材をほぼU字状に折り曲げて形成したソケット
部20と、このソケット部20から垂下して設けた二本
のリード部30,30からなっている。ソケット部20
は、チップ部品40の端子部41を載置する固定板21
と、この固定板21の両側縁に立設してあり、端子部4
1を把持する把持板22からなっている。この把持板2
2には、チップ部品40の着脱を行なえ、チップ部品を
把持しているときにはチップ部品が容易に外れない程度
の弾性をもたせてある。また、把持板22の中央の横方
向には、端子部41との接点となる突起22aが形成し
てある。さらに、一方のチップ部品用ソケット11側の
ソケット部20には、チップ部品40の長手方向の移動
ずれを防止し、位置決めをするための肩板22bが設け
てある。このようなソケット部20の固定板21から
は、上述した二本のリード部30,30が一体的に垂下
して設けてあり、これらリード部30,30の間隔はプ
リント配線板上のスルーホール50,50の間隔と対応
させてある。
In the figure, reference numerals 11 and 12 denote two pairs of sockets for chip parts, which are a socket portion 20 formed by bending a conductive metal plate member into a substantially U shape, and this socket. It is composed of two lead portions 30 and 30 that are provided so as to hang down from the portion 20. Socket part 20
Is the fixing plate 21 on which the terminal portion 41 of the chip component 40 is placed.
And the terminal portions 4 are erected on both side edges of the fixing plate 21.
It is composed of a grip plate 22 for gripping 1. This grip plate 2
2, the chip component 40 can be attached and detached, and the chip component 40 has elasticity to such an extent that the chip component cannot be easily detached while gripping the chip component. In addition, a protrusion 22 a that serves as a contact point with the terminal portion 41 is formed in the lateral direction at the center of the grip plate 22. Further, the socket portion 20 on the side of the one chip component socket 11 is provided with a shoulder plate 22b for preventing displacement of the chip component 40 in the longitudinal direction and for positioning. The two lead portions 30 and 30 described above are integrally provided so as to hang down from the fixing plate 21 of the socket portion 20 as described above. The distance between the lead portions 30 and 30 is a through hole on the printed wiring board. It corresponds to the interval of 50, 50.

【0009】次に、上記構成からなる本実施例のチップ
部品用ソケットの作用について、図1を参照しつつ説明
する。まず、リード部30,30をスルーホール50,
50に半田付けしてチップ部品用ソケット11,12を
プリント配線板上に固定する。次いで、ソケット部2
0,20の把持板22,22,22,22の間にチップ
部品40の端子部41,41を圧入し、肩板22bによ
ってチップ部品40を位置決めすると、端子部41,4
1が突起22a,22a,22a,22aを介して把持
される。これにより、チップ部品40はプリント配線板
上の回路と電気的に接続された状態で実装される。ま
た、このような本チップ部品用ソケット11,12によ
って実装されたチップ部品40は、上方に引張ることに
より簡単にソケット部20,20から取り外すことがで
きる。
Next, the operation of the chip component socket of the present embodiment having the above structure will be described with reference to FIG. First, the lead portions 30, 30 are connected to the through holes 50,
The chip component sockets 11 and 12 are fixed to the printed wiring board by soldering to the chip 50. Next, the socket part 2
When the terminal parts 41, 41 of the chip part 40 are press-fitted between the grip plates 22, 22, 22, 22 of 0, 20 and the chip part 40 is positioned by the shoulder plate 22b, the terminal parts 41, 4 are formed.
1 is gripped via the protrusions 22a, 22a, 22a, 22a. As a result, the chip component 40 is mounted in a state of being electrically connected to the circuit on the printed wiring board. Further, the chip component 40 mounted by the sockets 11 and 12 for the present chip component can be easily removed from the socket portions 20 and 20 by pulling upward.

【0010】本実施例のチップ部品用ソケットによれ
ば、スルーホール50,50上にチップ部品40を実装
することができ、スルーホールを形成したプリント配線
板上において、回路パターン及びチップ部品40を破損
することなく、チップ部品の交換を簡単に行なうことが
できる。
According to the chip component socket of this embodiment, the chip component 40 can be mounted on the through holes 50, 50, and the circuit pattern and the chip component 40 can be formed on the printed wiring board having the through holes. The chip parts can be easily replaced without damage.

【0011】なお、本発明のチップ部品用ソケットは、
上記実施例に限定されるものではない。例えば、ソケッ
ト部20,20の形状は図面のものに限らず、チップ部
品40の端子部41,41を強固に把持でき、かつ、チ
ップ部品40を簡単に着脱できるものであれば他の形状
に変更してもよい。また、上記実施例では、各チップ部
品用ソケット11,12にそれぞれ二本のリード部3
0,30を形成した構成としたが、リード部の数をそれ
ぞれ一本ずつにすると、チップ部品40の実装面積を小
さくすることができる。
The chip component socket of the present invention is
The invention is not limited to the above embodiment. For example, the shapes of the sockets 20 and 20 are not limited to those shown in the drawings, and other shapes can be used as long as the terminals 41 and 41 of the chip component 40 can be firmly gripped and the chip component 40 can be easily attached and detached. You may change it. In addition, in the above-described embodiment, each of the chip component sockets 11 and 12 has two lead portions 3.
Although 0 and 30 are formed, the mounting area of the chip component 40 can be reduced by using one lead portion each.

【0012】[0012]

【発明の効果】以上、説明したように本発明のチップ部
品用ソケットによれば、スルーホール上にチップ部品を
実装することができ、回路パターン及びチップ部品を破
損することなく簡単にチップ部品を交換できる。
As described above, according to the chip component socket of the present invention, the chip component can be mounted on the through hole, and the chip component can be easily mounted without damaging the circuit pattern and the chip component. Can be exchanged.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例に係るチップ部品用ソケットの
使用状態を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing a usage state of a chip component socket according to an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

11,12 チップ部品用ソケット 20 ソケット部 21 固定板 22 把持板 22a 突起 22b 肩板 30 リード部 40 チップ部品 41 端子部 50 スルーホール 11, 12 Chip part socket 20 Socket part 21 Fixing plate 22 Grip plate 22a Protrusion 22b Shoulder plate 30 Lead part 40 Chip part 41 Terminal part 50 Through hole

【手続補正書】[Procedure amendment]

【提出日】平成5年11月24日[Submission date] November 24, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Name of item to be amended] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【特許請求の範囲】[Claims]

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0005[Name of item to be corrected] 0005

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明のチップ部品用ソケットは、チップ部品をプ
リント配線板上のスルーホールに実装するためのソケッ
トであって、前記チップ部品を載置する固定板と、この
固定板の両側縁に位置し、前記チップ部品の端子部を把
持するとともに、前記チップ部品と電気的に接続する把
持板とからなるソケット部、このソケット部から垂下し
て設け、前記スルーホールに半田付けされるリード部を
備えた構成としてあり、好ましくは、ソケット部の固定
板一端部に、チップ部品を位置決めするための肩板を備
えた構成、又は、把持板に、突起を形成した構成する。
In order to achieve the above object, a socket for chip parts of the present invention is a socket for mounting a chip part in a through hole on a printed wiring board. A socket portion including a fixed plate to be placed and gripping plates located on both side edges of the fixed plate for holding the terminal portion of the chip component and electrically connecting to the chip component, and hanging from the socket portion And a lead portion to be soldered to the through hole, and preferably the socket portion is fixed.
A shoulder plate for positioning the chip parts is provided at one end of the plate.
Alternatively, the holding plate may be provided with a protrusion.

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0010[Correction target item name] 0010

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0010】本実施例のチップ部品用ソケットによれ
ば、スルーホール50,50上にチップ部品40を実装
することができ、スルーホールを形成したプリント配線
板上において、回路パターン及びチップ部品40を破損
することなく、チップ部品の交換を簡単に行なうことが
できる。また、チップ部品用ソケット11側のソケット
部20に肩板部22bを設けたことにより、チップ部品
40の位置決めが可能となり、チップ部品40の端子部
41,41と把持板22,22,22,22の最適な接
触状態が得られる。
According to the chip component socket of this embodiment, the chip component 40 can be mounted on the through holes 50, 50, and the circuit pattern and the chip component 40 can be formed on the printed wiring board having the through holes. The chip parts can be easily replaced without damage. Also, the socket on the side of the chip component socket 11
By providing the shoulder plate portion 22b on the portion 20, the chip component
40 can be positioned, and the terminal part of the chip component 40
41, 41 and grip plate 22, 22, 22, 22 optimal contact
A touch state is obtained.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01R 9/09 A 6901−5E H05K 1/18 U 7128−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location H01R 9/09 A 6901-5E H05K 1/18 U 7128-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 チップ部品をプリント配線板上のスルー
ホールに実装するためのソケットであって、 前記チップ部品を載置する固定板と、この固定板の両側
縁に位置し、前記チップ部品の端子部を把持するととも
に、前記チップ部品と電気的に接続する把持板とからな
るソケット部、 このソケット部から垂下して設け、前記スルーホールに
半田付けされるリード部を備えたことを特徴とするチッ
プ部品用ソケット。
1. A socket for mounting a chip component in a through hole on a printed wiring board, comprising: a fixing plate on which the chip component is placed; and a fixing plate located on both side edges of the fixing plate. A socket portion formed of a holding plate for holding the terminal portion and electrically connecting to the chip component; and a lead portion provided so as to hang down from the socket portion and soldered to the through hole. Sockets for chip parts.
JP5208378A 1993-07-30 1993-07-30 Socket for chip part Pending JPH0745346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5208378A JPH0745346A (en) 1993-07-30 1993-07-30 Socket for chip part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5208378A JPH0745346A (en) 1993-07-30 1993-07-30 Socket for chip part

Publications (1)

Publication Number Publication Date
JPH0745346A true JPH0745346A (en) 1995-02-14

Family

ID=16555290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5208378A Pending JPH0745346A (en) 1993-07-30 1993-07-30 Socket for chip part

Country Status (1)

Country Link
JP (1) JPH0745346A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007017938A1 (en) * 2005-08-10 2007-02-15 Fujitsu Limited Chip part mounting member
JP2008193046A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
JP2008193048A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
JP2008193044A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
WO2009025078A1 (en) * 2007-08-23 2009-02-26 The Furukawa Electric Co., Ltd. Connection structure and connection method
JP2009272174A (en) * 2008-05-08 2009-11-19 Furukawa Electric Co Ltd:The Connection structure
JP2009283756A (en) * 2008-05-23 2009-12-03 Toyota Boshoku Corp Connection structure
US8254146B2 (en) 2009-02-26 2012-08-28 Asustek Computer Inc. Detachable capacitor device
CN104064881A (en) * 2014-06-05 2014-09-24 东莞建冠塑胶电子有限公司 Novel capacitor structure and manufacturing method thereof
TWI563525B (en) * 2014-07-04 2016-12-21 Ud Electronic Corp Capacitor structure and the method for making the sam
EP2791951B1 (en) * 2011-12-13 2020-07-08 Kemet Electronics Corporation High aspect ratio stacked mlcc design

Citations (2)

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Publication number Priority date Publication date Assignee Title
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JPS63225482A (en) * 1986-10-24 1988-09-20 株式会社 ハイベック Line form lamp device

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WO2007017938A1 (en) * 2005-08-10 2007-02-15 Fujitsu Limited Chip part mounting member
JP2008193046A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
JP2008193048A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
JP2008193044A (en) * 2007-01-10 2008-08-21 Furukawa Electric Co Ltd:The Connection structure and connection method
WO2009025078A1 (en) * 2007-08-23 2009-02-26 The Furukawa Electric Co., Ltd. Connection structure and connection method
JP2009272174A (en) * 2008-05-08 2009-11-19 Furukawa Electric Co Ltd:The Connection structure
JP2009283756A (en) * 2008-05-23 2009-12-03 Toyota Boshoku Corp Connection structure
US8254146B2 (en) 2009-02-26 2012-08-28 Asustek Computer Inc. Detachable capacitor device
EP2791951B1 (en) * 2011-12-13 2020-07-08 Kemet Electronics Corporation High aspect ratio stacked mlcc design
CN104064881A (en) * 2014-06-05 2014-09-24 东莞建冠塑胶电子有限公司 Novel capacitor structure and manufacturing method thereof
TWI563525B (en) * 2014-07-04 2016-12-21 Ud Electronic Corp Capacitor structure and the method for making the sam

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