JP2023146592A - Electronic device - Google Patents

Abstract

To provide an electronic device capable of preventing malfunctions due to metal foreign objects when using a press-fit terminal.SOLUTION: The electronic device includes a circuit board 4 in which electronic components 7 and 8 are mounted and a hole-shaped electrode 10 is provided through which a press-fit terminal 6 for electrical connection is inserted. A male connector housing is arranged independently from the press-fit terminal 6. Also, a solder 14 that at least partially covers the hole-shaped electrode 10 of the circuit board 4 is included. Since the solder 14 at least partially covers the hole-shaped electrode 10 of the circuit board 4, metal foreign objects 15 can be trapped.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to electronic devices.

An ECU requires a connector structure that allows a large number of connectors to be arranged, and uses terminals called press-fit terminals, for example. ECU is an abbreviation for Electronic Control Unit. When inserting a press-fit terminal into a hole-shaped electrode on a board from above, there is a risk that the plating on the surface of the press-fit terminal will be scraped, and in this case, metal foreign matter may adhere to the top of the board. It is possible to put it away. Furthermore, it is conceivable that metal foreign matter may remain at the lower part of the substrate on the opposite side to the insertion side, due to the metal plating in the hole-shaped electrodes of the substrate being scraped off.

It is a known fact that metal foreign objects can lead to unexpected failures. In order to prevent problems caused by foreign metal objects, it is conceivable to prepare additional parts to catch the foreign metal objects, as in Patent Document 1. As described in Patent Document 1, structures for catching metal foreign matter have been proposed, but these have been limited to dealing with foreign matter generated at the bottom of the substrate.

Furthermore, although it is possible to take protective measures by adding parts or using resin molding, this leads to higher costs and lower packaging density. If regular terminals are used instead of press-fit terminals to prevent problems caused by metal foreign objects, the terminals cannot be held during reflow, and additional parts are likely to be required to hold them.

JP2016-63202A

An object of the present disclosure is to provide an electronic device that can prevent problems caused by foreign metal particles when press-fit terminals are used.

According to the invention described in claim 1, there is provided a circuit board on which electronic components are mounted and a hole-shaped electrode through which a press-fit terminal for electrical connection is inserted, and a casing for fixing the circuit board. and parts. The male connector housing is arranged independently of the press-fit terminals. The circuit board also includes solder that at least partially covers the hole-shaped electrodes of the circuit board. Since the solder at least partially covers the hole-shaped electrodes of the circuit board, it becomes possible to trap metal foreign objects, and when a press-fit terminal is used, problems caused by metal foreign objects can be prevented.

A longitudinal sectional view showing an enlarged view of the assembly structure of the press-fit terminal in the first embodiment in comparison with a comparative example Exploded perspective view of components shown from above Exploded perspective view of components shown from below Perspective view showing the structure after assembly from above Top view of the assembled structure Part 1 of the diagram showing one aspect of the manufacturing process Part 2 of the diagram showing one aspect of the manufacturing process Diagram 3 showing one aspect of the manufacturing process Diagram 4 showing one aspect of the manufacturing process Figure 5 showing one aspect of the manufacturing process Diagram 6 showing one aspect of the manufacturing process Diagram 7 showing one aspect of the manufacturing process Figure 8 showing one aspect of the manufacturing process A vertical cross-sectional view schematically showing one aspect of the manufacturing process and the assembly structure of the press-fit terminal in the second embodiment Perspective view of the structure from above Exploded perspective view of component parts Bottom view of the assembled structure Part 1 of the diagram showing one aspect of the manufacturing process Part 2 of the diagram showing one aspect of the manufacturing process Diagram 3 showing one aspect of the manufacturing process Diagram 4 showing one aspect of the manufacturing process Figure 5 showing one aspect of the manufacturing process Diagram 6 showing one aspect of the manufacturing process Diagram 7 showing one aspect of the manufacturing process Figure 8 showing one aspect of the manufacturing process Exploded perspective view of components in the third embodiment A top view schematically showing a land formation area in the fourth embodiment

Hereinafter, some embodiments of an electronic device will be described with reference to the drawings. In each of the embodiments described below, components that perform the same or similar operations are designated by the same or similar reference numerals, and description thereof will be omitted as necessary.

(First embodiment)
A first embodiment will be described with reference to FIGS. 1 to 13. As shown in FIGS. 2 and 3, the electronic device 1 includes a case 2 and a cover 3 as housing components, and a circuit board 4 is assembled inside the case 2 and the cover 3. A side connector 5 is mounted on the circuit board 4, and a press-fit terminal 6 is fixed to a part of the circuit board 4. Although not shown in FIG. 2, other electronic components 7 and 8 such as chip components and semiconductor components are mounted on the first surface 4a and second surface 4b of the circuit board 4. For the electronic components 7 and 8, see FIGS. 1 and 7 to 13. The case 2 and cover 3 are made of resin or metal.

In this embodiment, the case 2 is made of resin and is integrally molded with the male connector housing 9, and the cover 3 is formed by molding a conductive material into a flat plate shape to maintain grounding. The circuit board 4 is made of a printed circuit board or a ceramic board made of a predetermined material. The circuit board 4 is constructed by providing an insulating base material with wiring (not shown) formed on the surface or inside the base material.

As shown in FIGS. 2 to 4, the circuit board 4 is disposed on the cover 3, and the case 2 is disposed so as to cover the circuit board 4 from above. At this time, as shown in FIGS. 3 to 5, the press-fit terminals 6 are assembled to the circuit board 4, and the male connector housing 9 is constructed in the case 2. Therefore, in this embodiment, the press-fit terminal 6 and the male connector housing 9 are configured independently.

For convenience of explanation, the upper surface of the circuit board 4 in FIG. 2 is referred to as a first surface 4a, and the upper surface in FIG. 3 is referred to as a second surface 4b, a cross section of which is shown in FIG. As shown in FIG. 1, a hole-shaped electrode 10 is provided between both surfaces of the circuit board 4. The hole-shaped electrode 10 is called a through hole, and is constructed by forming a conductive member on the inner surface of the through hole of the circuit board 4. Note that the through hole of the hole-shaped electrode 10 has a circular shape when viewed from above. Thereby, electrical connection can be made between the first surface 4a and the second surface 4b, and circuit connection can be made when electronic components 7 and 8 are mounted on both surfaces, respectively. A press-fit terminal 6 serving as a press-fit terminal is inserted into the hole-shaped electrode 10.

The press-fit terminal 6 has conductive metal plating applied to its exposed surface. The press-fit terminal 6 includes a terminal pin 11 formed into a filament, and a deformable portion 12 connected to the terminal pin 11 and provided at the tip so as to be elastically deformed. Further, the press-fit terminal 6 is integrally provided with a protrusion 13 located in the middle of the terminal pin 11 in the form of a wire and protruding laterally. When assembling the press-fit terminal 6 to the circuit board 4, the protrusion 13 is held by a jig and is inserted and press-fitted into the hole-shaped electrode 10 along the longitudinal direction of the terminal pin 11. The deformable portion 12 has an annular cross-section and includes a circular or elliptical cavity inside the annular shape. The deformed portion 12 has an outer edge and an inner edge both shaped like a circle or an ellipse. The shape of the deformed portion 12 is not limited to the shape of this embodiment. It may be configured into an action pin, U-shape, H-shape, or M-shape.

When the deformable part 12 is inserted into the hole-shaped electrode 10 and press-fitted, the deformed part 12 applies a reaction force to the hole-shaped electrode 10 from the inside, so that the inner cavity of the deformed part 12 is deformed vertically. , the cavity becomes more vertically elongated and has an elliptical cross-section. Accordingly, the deformable portion 12 is deformed into an elliptical shape with both the outer edge and the inner edge thereof being vertically elongated.

The deformable portion 12 presses the hole-shaped electrode 10 outward from the inside through point contact or surface contact. Thereby, the deformed portion 12 can continue to apply force from the inside of the hole-shaped electrode 10 to the outside, and the deformed portion 12 can be held within the hole-shaped electrode 10.

The deformable portion 12 is configured such that the height of the outer edge of the ring-shaped portion is higher than the thickness of the circuit board 4 . When the deformed portion 12 of the press-fit terminal 6 is inserted into the hole-shaped electrode 10 and fixed, the outer edges of the deformed portion 12 protrude outward from both sides of the circuit board 4.

Further, as shown in FIG. 1, the solder 14 at least partially covers the hole-shaped electrode 10 of the circuit board 4. However, in this embodiment, the solder 14 is not printed inside the through hole of the hole-shaped electrode 10 of the circuit board 4, but is printed above the first surface 4a of the circuit board 4 or from the second surface 4b. It is formed so as to be located below and cover the hole-shaped electrode 10. That is, there is no solder 14 below the first surface 4a and above the second surface 4b of the circuit board 4.

When the deformed portion 12 of the press-fit terminal 6 is inserted into the through hole of the hole-shaped electrode 10, the conductive member inside the hole-shaped electrode 10 is scraped, thereby generating metal foreign matter 15 as shown in FIG. The metal foreign matter 15 adheres to the inside and outside of the hole-shaped electrode 10 and to the first surface 4a and second surface 4b of the circuit board 4. Therefore, by configuring the solder 14 to at least partially cover the hole-shaped electrodes 10 of the circuit board 4, the metal foreign matter 15 can be trapped and prevented from falling from the circuit board 4.

The assembly process will be described below with reference to FIGS. 6 to 13. First, as shown in FIG. 6, a circuit board 4 provided with hole-shaped electrodes 10, 10b is prepared, and solder 14a is printed on the surface electrode 14z formed on the second surface 4b of the circuit board 4. Next, as shown in FIG. 7, an electronic component 8 such as a chip component is mounted on the surface electrode 14z of the second surface 4b and fixed by reflow. Next, as shown in FIG. 8, the circuit board 4 is turned upside down, the first surface 4a faces upward, and the solder 14a is printed on the surface electrode 14z formed on the first surface 4a. At this time, as shown in the hole-shaped electrode 10b on the right side of FIG. 8, the solder 14b may also be printed inside the through-hole of the hole-shaped electrode 10b.

Next, as shown in FIG. 9, the press-fit terminal 6 is pushed into the through hole of the hole-shaped electrode 10 and mounted. At this time, the deformed portion 12 is press-fitted into the through hole of the hole-shaped electrode 10 by holding the protrusion 13 provided in the middle of the press-fit terminal 6 with a jig (not shown) and pressing it against the circuit board 4 side. can. At this time, the deformed portion 12 is held exactly at the middle position of the hole-shaped electrode 10. Since the press-fit terminal 6 slides along the inside of the hole-shaped electrode 10, as shown in FIG. It protrudes above and below the second surface 4b.

Next, as shown in FIG. 10, an electronic component 7 such as a chip component is mounted on the first surface 4a, and the terminal 5a of the side connector 5 is inserted into the through hole of the hole-shaped electrode 10b. Although solder 14b is printed on the hole-shaped electrode 10b, since the solder 14b is not fixed, the terminal 5a of the horizontal connector 5 can be inserted into the through hole of the hole-shaped electrode 10b.

Thereafter, as shown in FIG. 11, the electronic component 7 mounted on the first surface 4a of the circuit board 4 and the terminal 5b of the side connector 5 are fixed to the circuit board 4 with solder 14b by reflowing. At this time, even if the metal foreign object 15 protrudes above and below the hole-shaped electrode 10, the solder 14 on the first surface 4a and the second surface 4b melts or remelts and captures the metal foreign object 15, and the press-fit terminal 6 The metal foreign object 15 can be fixed by hardening along the outer edge of the deformed portion 12. In this embodiment, a single-sided reflow has been described, but a double-sided reflow may be used.

Next, as shown in FIG. 12, the assembly of the circuit board 4, on which the electronic components 7, 8 and the side connector 5 are assembled, is assembled into the case 2. At this time, the terminal pin 11 of the press-fit terminal 6 is inserted into the hole 2a formed in the case 2 in advance. At this time, the terminal pins 11 of the press-fit terminals 6 can be protected by the male connector housing 9 provided outside the terminal pins 11. See Figure 13. Further, as shown in FIG. 13, the assembly of the circuit board 4 assembled into the case 2 is covered with the cover 3 and assembled. Thereby, the electronic device 1 can be configured as shown in FIGS. 4 and 5.

<Significance of the structure and manufacturing method of this embodiment>
According to this embodiment, since the male connector housing 9 and the plurality of terminal pins 11 of the press-fit terminals 6 can be configured independently, the configuration can be performed at low cost without affecting the pitch between the terminals. Furthermore, there is no need to make any changes to the conventional manufacturing process. Since the solder 14a is printed on the surface electrode 14z around the part where the terminal pin 11 is inserted and is reflowed together with the electronic components 7 and 8 after the press-fit terminal 6 is inserted, the press-fit terminal 6 can be directly attached to the circuit board 4 by itself. can be done. Further, it is possible to trap metal foreign matter 15 generated from above and below the circuit board 4 and prevent it from falling onto the circuit board 4.

According to the structure or manufacturing method of this embodiment, there is no need to fix the terminal pin 11 of the press-fit terminal 6 with the solder 14, or even if the solder 14 is used, the amount thereof can be reduced. In other words, the amount of solder 14a for reflow may be smaller than the amount of solder 14a for fixing the terminal pin 11 of the normal press-fit terminal 6. Therefore, the surface electrode 14z on which the solder 14a is placed does not need to be as large as the surface electrode for fixing the normal terminal pin 11 with the solder 14. With the configuration of this embodiment, it is possible to prevent the size of the surface electrode 14z from becoming a constraint on the spacing between the terminal pins 11 on the circuit board 4. Since the solder 14 around the hole-shaped electrode 10 in this embodiment is not intended for electrical connection, the through-hole of the hole-shaped electrode 10 does not need to be filled with solder 14 . Further, since the solder 14 is used in the reflow process, the above structure can be realized at low cost.

(Second embodiment)
A second embodiment will be described with reference to FIG. 14. As shown in the vertical cross-sectional view in the upper part of FIG. 14, the solder 14 may be printed inside the through-hole of the hole-shaped electrode 10 of the circuit board 4. As shown in one manufacturing process in the lower part of FIG. 14, when printing the solder 14 on the surface electrode 14z of the first surface 4a, the solder 14 is simultaneously printed on the inside of the hole-shaped electrode 10, thereby forming the through-hole of the hole-shaped electrode 10. The solder 14a can remain inside. Thereafter, as shown in the upper part of FIG. 14, the deformed portion 12 of the press-fit terminal 6 is inserted and press-fitted into the through hole of the hole-shaped electrode 10. Thereby, as shown in the upper part of FIG. 14, the solder 14 can be left inside the hole-shaped electrode 10, and the metal foreign matter 15 can be trapped as in the above-described embodiment. This produces the same effects as the first embodiment.

(Third embodiment)
A third embodiment will be described with reference to FIGS. 15 to 25. Note that portions that are the same as or similar to the constituent elements of the first embodiment will be described with reference numerals that are the same as the reference numerals of the corresponding constituent elements of the first embodiment plus 50. 15 to 17 illustrate the structure of an electronic device 51 including a side-extruding self-supporting press-fit terminal 56. As shown in FIG. 16, a circuit board 54 is housed in the case 52, and an L-shaped press-fit terminal 56 that extends freely from the side is fixed to one end of the circuit board 54.

In this embodiment, the case 52 and the male connector housing 59 of the press-fit terminal 56 are constructed separately. The case 52 has a rectangular box shape with an opening, and a protrusion 52a is integrally formed on the side surface of the rectangular box of the case 52 on the opening side. A boss 52b (see FIGS. 24 and 25) is provided deep inside the case 52, and the circuit board 4 is fixed to the case 52 by fitting the other end of the circuit board 4 to the boss 52b. .

On the other hand, as shown in FIGS. 15 to 17, the male connector housing 59 mainly includes a base portion 53c molded into a U-shaped cross section, and a rectangular frame-shaped male connector housing 59 is integrally molded on the base portion 53c. Holes 53a (see FIG. 25) for inserting the terminal pins 61 of the press-fit terminals 56 are aligned and molded inside the rectangular frame of the male connector housing 59.

As shown in FIG. 16, the male connector housing 59 is provided with rectangular fixing holes 53b in the upper and lower U-shaped flat parts. The fixing hole 53b is configured so that the connector housing 59 can be fixed to the opening side of the case 52 by being fitted into a protrusion 52a provided on the side surface of the case 52. Thereby, the case 52 and the male connector housing 59 can be fixed. At this time, the tips of the terminal pins 61 of the L-shaped press-fit terminals 56 are inserted into the plurality of individual holes 53a (see FIG. 25) inside the rectangular frame of the male connector housing 59. It can be provided to protrude from the opening side of the male connector housing 59.

The assembly process will be described below with reference to FIGS. 18 to 25. First, as shown in FIG. 18, a circuit board 54 provided with hole-shaped electrodes 60 is prepared, and solder 64a is printed on the surface electrode 64z formed on the second surface 54b of the circuit board 54. Next, as shown in FIG. 19, an electronic component 58 such as a chip component is mounted on the surface electrode 64z of the second surface 54b and reflowed. Next, as shown in FIG. 20, the circuit board 54 is turned over, the first surface 54a faces upward, and the solder 64a is printed again on the surface electrode 64z.

Next, as shown in FIG. 21, the deformed portion 62 of the press-fit terminal 56 is pushed into the through hole of the hole-shaped electrode 60 and mounted. At this time, the deformed part 62 can be press-fitted into the hole-shaped electrode 60 by holding the protruding part 63 provided in the middle of the press-fit terminal 56 with a jig (not shown) and pressing it against the circuit board 54 side. At this time, the deformed portion 62 is held exactly at the middle position of the hole-shaped electrode 60. Since the press-fit terminal 56 slides along the inside of the hole-shaped electrode 60, metal foreign matter 65 protrudes above and below the hole-shaped electrode 60 from the portion where the press-fit terminal 56 is sliding, as shown in FIG. Sometimes.

Next, as shown in FIG. 22, an electronic component 57 such as a chip component is mounted on the first surface 54a. Thereafter, as shown in FIG. 23, the electronic component 57 mounted on the first surface 54a is fixed to the circuit board 4 with the solder 14 by reflowing. At this time, even if the metal foreign object 65 protrudes above and below the hole-shaped electrode 60, the solder 64 on the first surface 54a and the second surface 54b melts and remelts and captures the metal foreign object 65, thereby forming the press-fit terminal 56. By hardening along the outer edge of the deformed portion 62, the metal foreign object 65 can be fixed. As shown in FIG. 23, since the main purpose is to fix the foreign metal object 65, the solder 14 does not need to be in contact with the deformed portion 62. In this way, when the purpose is to fix the metal foreign object 65, the amount of solder 14 can be made smaller than when the purpose is also to fix the press-fit terminal 56. Although the solder 64 is shown not to come into contact with the deformed portion 62 in FIG. 23, it may come into contact with the deformed portion 62. In this embodiment, one side reflow is shown, but both sides may be reflowed.

Next, as shown in FIG. 24, the assembly of the circuit board 54, on which the electronic components 57, 58 and the press-fit terminals 56 are assembled, is assembled into the case 52. At this time, the circuit board 54 is fixed by fitting the circuit board 54 into a boss 52b that is pre-processed on the case 52. Further, as shown in FIG. 25, the assembly of the circuit board 54 assembled into the case 52 is covered with a cover 53 and assembled. At this time, the terminal pin 61 of the press-fit terminal 56 can be inserted into the hole 53a while being surrounded and protected by the male connector housing 59. This allows the electronic device 51 to be configured as shown in FIGS. 15 to 17. This embodiment also provides the same effects as the above-mentioned embodiment.

(Fourth embodiment)
A fourth embodiment will be described with reference to FIG. 26. In this embodiment, as shown in FIG. 26, an example is shown in which a case 73 serving as a housing component and a male connector housing 79 are configured separately, and the male connector housing 79 is fixed to a circuit board 74. FIG. 26 shows an exploded perspective view seen from above, and the cover 72 serving as a housing component, the circuit board 74, the sealing member 100, and the case 73 serving as a housing component are arranged in this order from the top. The cover 72 and the case 73 are fixed by screws 101, and the case 73 and the circuit board 74 are also fixed by screws 102.

A male connector housing 79 is mounted on the circuit board 74. The male connector housing 79 has a rectangular frame shape with an opening on the lower side. The press-fit terminal 6 formed into a wire is inserted into the inside of the male connector housing 79 fixed to the circuit board 74, and the terminal pin 11 of the press-fit terminal 6 protrudes downward. In this embodiment, an example is illustrated in which the terminal pins 11 of the male connector housing 79 are constituted by press-fit terminals 6. As shown in this embodiment, the male connector housing 79 may be fixed to the circuit board 74.

(Fifth embodiment)
A fifth embodiment will be described with reference to FIG. 27. In the first to third examples of FIG. 27, as shown in a top view of the circuit board 4, the solder 14 only needs to partially cover the periphery of the through hole of the hole-shaped electrode 10. As shown in FIG. 27 as a comparative example of a conventional structure, a surface electrode 14z is usually formed around a hole-shaped electrode 10 through which a terminal pin 11 of a press-fit terminal 6 is inserted, and the solder 14 is placed on this surface. It is conceivable to trap the metal foreign matter 15 by placing it on the electrode 14z. However, in this example, the formation area of the surface electrode 14z becomes wider, and the amount of solder mounted on the surface electrode 14z also increases.

As shown in the first example of FIG. 27, the surface electrode 14z may be configured to have an elliptical shape in accordance with the area where the metal foreign matter 15 can be trapped. The terminal pin 11 of the press-fit terminal 6 has a rectangular shape when viewed from above. In other words, since the cross-sectional shape is rectangular, portions corresponding to the corners of the rectangle often come into contact with the hole-shaped electrode 10 and generate metal foreign matter 15 . For this reason, the surface electrode 14z on which the solder 14 is placed is configured in an elliptical shape with a major axis along the long side of the rectangle when the press-fit terminal 6 is inserted into the through hole of the hole-shaped electrode 10. Good to have. As a result, the surface electrode 14z can be formed in a concentrated manner at the point where the metal foreign matter 15 is generated, and the area in which the surface electrode 14z is formed can be narrowed compared to the comparative example.

If it is sufficient to trap the metal foreign matter 15, the surface electrode 14z on which the solder 14 is placed may be formed only at the root portion around the hole-shaped electrode 10, as shown in the second example of FIG. For example, the surface electrode 14z on which the solder 14 is placed in a semicircular shape may be provided only immediately beside the rectangular contact point where the terminal pin 11 of the press-fit terminal 6 contacts the hole-shaped electrode 10. Then, the formation area of the surface electrode 14z can be made narrower compared to the comparative example.

Furthermore, if it is sufficient to trap the metal foreign matter 15, as shown in the third example of FIG. It is good if it is partially provided in the part where there is point contact. For example, surface electrodes 14z may be provided on which the solder 14 is placed radially starting from the four-point area where the rectangular contacts of the terminal pins 11 of the press-fit terminal 6 come into contact. Then, the formation area of the surface electrode 14z can be made narrower compared to the comparative example. The first to third examples according to the fifth embodiment are examples that can be realized at low cost, and by reducing the area of the surface electrode 14z on which the solder 14 is placed, it is possible to mount other electronic components 7, 8, etc. A large area can be secured.

(Other embodiments)
The present invention is not limited to the above-mentioned embodiment, and for example, the following modifications or expansions are possible. The electronic devices 1 and 51 can be configured, for example, as a vehicle electronic control device mounted on a vehicle. Although the present disclosure has been described based on the embodiments described above, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also includes various modifications and equivalent modifications. In addition, various combinations and configurations, as well as other combinations and configurations that include only one, more, or fewer elements, are within the scope and scope of the present disclosure.

In the drawings, 1, 51 are electronic devices, 4, 54 are circuit boards, 2, 52, 72 are cases (casing parts), 3, 53, 73 are covers (casing parts), 14 are solder, 6, 56 1 is a press-fit terminal, 9 and 59 are male connector housings, and 11 and 61 are terminal pins.

Claims (10)

a circuit board (4, 54) on which electronic components are mounted and provided with hole-shaped electrodes (10, 60) through which press-fit terminals (6, 56) for electrical connection are inserted;
a housing component (2, 3, 52, 53) for fixing the circuit board;
a male connector housing (9, 59) disposed independently of the press-fit terminal;
An electronic device comprising a solder (14, 64) at least partially covering a hole-like electrode of the circuit board. 2. The electronic device according to claim 1, wherein the solder is also printed inside hole-shaped electrodes of the circuit board. The electronic device according to claim 1 or 2, wherein the housing component and the male connector housing are integrally molded. The housing component and the male connector housing are configured separately,
The electronic device according to claim 1 or 2, wherein the housing component and the male connector housing are fixed. The housing component and the male connector housing are configured separately,
The electronic device according to claim 1 or 2, wherein the male connector housing is fixed to the circuit board. The electronic device according to any one of claims 1 to 5, wherein the solder partially covers the periphery of the through hole of the hole-shaped electrode. The electronic device according to any one of claims 1 to 6, wherein the housing component is made of resin or metal. When the press-fit terminal is rectangular in top view,
8. The electronic device according to claim 1, wherein the surface electrode on which the solder is placed has an elliptical shape with a major axis along the long side of the rectangle of the press-fit terminal. 8. The electronic device according to claim 1, wherein the surface electrode on which the solder is placed is formed only at a root portion around the hole-shaped electrode. The surface electrode on which the solder is placed is
The electronic device according to any one of claims 1 to 7, wherein the electronic device is partially provided around the hole-shaped electrode at a portion where the press-fit terminal and the hole-shaped electrode make point contact.

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