1272048 九、發明說明： 【發明所屬之技術領域】 • 本發明係相關於一種被動元件的接合結構，特別是指一 w 種其中電路板可限制被動元件位移的被動元件接合結構9。 【先前技術】 隨著工業技術的發展，為了提高一運算晶片的性能， 在此運算晶片的封裝結構中，晶粒載板上除了配置有^粒 電阻專）’晶粒會透過晶粒載板與被動元件產生電性連接。 其包括日日粒載板10、一晶粒11、一被動元件12、封裝 . .. , ... .. .. .. .. . 晶粒載板(Substrate)lO，上表面與下表面皆具有電路佈 的連接端子，並至少有兩個銲墊1〇1，是做為與被動元件 , 接备之鮮塾。 上表面p透過打線接合(Wire Bonding)之方式，以導線連揍 晶粒11與晶粒載板忉’進而使晶粒丨丨與晶粒載板忉產 - .............. . -,.. .......: 121電性連接於銲墊ιοί。而後，再以封裝膠體13包覆住 前述的晶粒、導線、被動元件，防止此些元件受到破壞以 及外界濕氣侵入。 複數個錫球14則製作在晶粒載板1〇的下表面，作為 此封裝結構的外部連接端子。 而在此要特別說明的是，被動元件12固定在晶粒载板 10上的接合結構。 一般而言，是藉由模板印刷(Stencil printing)的方式， •將一具有多個穿孔的鋼板，置放在銲墊101上，使穿孔正 對於銲墊101上方，再以刮刀填入錫膏102，使錫膏1〇2 填滿穿孔並附著在鮮塾101表面。而後，移除鋼板。 .... .. '.. 再者，將被動元件12壓合在晶粒載板10上，藉由錫 膏102所具有的黏性，使被動元件丨2兩側的電極端子121 暫時固定在銲墊101上方。 ： ' ； . ·. -. . · · . . 最後’將此晶粒載板10與被動元件12同時進行迴焊 (Reflowing) ’使錫膏1〇2固化成焊塊，將被動元件12固 定在晶粒載板10上。 • ： ：: : : ....... . 請參閱第二A周，再行說明的是，若是在模板印刷的 過程中，可能因鋼板穿孔堵塞、錫膏劣化、基板氣曲、刮 刀不潔等各項因素，造成轉印至銲墊表面的錫膏量不夠均 勻。而如第二A圖所示，當被爽元件12壓合在晶粒載板 1〇上時，兩侧的電極端子121所接觸的錫膏102是不等量 的。 如第二B圖所示，當此晶粒載板1〇與被動元件12進 行迴焊時，兩侧的錫貧102在加熱到其共晶溫度時發生熔 1272048 融，而附著在被動元件12的外側。 而如第二c圖所示，當迴焊完成後，錫膏102冷卻後 會產生固化。但由於被動元件12的兩侧附著有不同量的錫 膏102 ’會造成兩側冷卻後產生的拉力不同。在錫膏1〇2 附著量較低的那一側，容易勉起而脫離晶粒載板1〇表面， 發生登碑現象(Tombstone)，造成被動元件接合時的缺陷。 再者，如第三圖所示，被動元件12在接合過程中，尚 有偏移的問題。-般而言，為了增加銲墊1〇1的焊接性能 以及保護銲墊101的表面。在電路板1〇製作完成後，在& 塾101表岭 預錫層會固化為錫塊1〇3。直到要與被動元件12接合時, 才再以模版印刷的方式，將足量的錫膏轉印土該些錫塊 103 上。 • . ...... ； 然而，當以被動元件12以其電極端子121向下壓合在 銲塾101上時，電極端子121可會穿透過錫膏脱 到已固化的錫塊103。而此些錫塊1〇3的表面^ 時，則可能會使被動元件12在壓合時發生如箭頭所示城 的滑動，造成偏移的情況發生。 再更進-步說，在胃知技術巾，由於被動元件的偏移 問題，其解財法，錢藉鱗_塊⑽關在_個極薄 的厚度下(不厚於10_，以減少被動元件⑽^ 103而滑動的機會。 題，必須限制銲墊101上的已固化的錫塊厚度，以免被動 元件12壓觸到錫塊，產生滑動。 因此在實務製作上，即使電路板供應商具有精度較高 的錫貧fcp刷設備，也難以由電路板供應商在製作錫塊103 後’再繼續填入足量的錫膏102作為被動元件接合之用， 因若填入足量的錫膏後，此些錫膏1〇2在固化後，即會帶 來被動元件12定位上的困難。 也因此，是由封裝業者，在欲進行接合被動元件時， 才繼續在錫塊103上填入足量錫膏102，在將被動元件壓 合於錫膏102上。若欲以較高精度的錫膏印刷設備進行模 板印刷’無法直接運用電路板供應商所具有的高精度錫膏 •印刷設備，而需另行購置，徒增成本。 而錫膏印刷設備的精度，則會直接影響到填入在海:一 銲墊上的錫貧102厚度，當兩個銲墊101上錫膏102厚度 相異太多，則會造成拉力不均，發生前述的豎碑現象。 ^因此’如何有效解決前述被動元件翹立與偏移的問 題’增進被動元件接合時的良率，係A熟悉此項技藝者所 致力之方向。 :......‘. , . . :V. ' -'V :. . .. ..... - . - - - . . . .. . . 【發明内容】 為此，本發明提出一種被動兑件之接合結構，盆包括 H板與—被動树。其中的電路板，可有效改i被動 牛勉立與偏移的_，義更可提升騎厚度的精度。 電路板具有—凹槽以及複數個銲墊，該等銲塾係位於 1272048 該凹槽底部，在每-銲墊表面皆會設有錫膏層。 摘讀具有贿鱗動目_量之電極端子。 ' 虽欲將被動70件接合在電路板上時，係將被動元件嵌 ， 入^凹槽内’以兩侧的電極端子係與兩鲜塾相接。而後， 再藉由迴焊方式使被動元件固著在電路板上。 其中，藉由凹槽的設置，可限制“動元件的位移，防 止豎碑現象的發生。 卜為使本發明之優點及精神能更進-步的被揭示，兹配 合圖式作一詳細說明如後。 明參閱第四圖’.其係為本發明之被動元件之接合結構 2 —實施例之示意圖。如圖所示，其包括一電路板2〇、一 被動元件21。 --，. ... . ..-· - ... . ’ · . ， . ......... . .... ... . 電路板20，可供一被動元件以迴焊方式焊接於其上， 此電路201表面包私了臺屬層2011與防烊層2012，透過 ..: '.''.'.； .. . ”·. 電路板20並具有一凹槽202以及複數個銲墊203。凹 槽202的大小形狀係與被動元件21外形相符，該等銲墊 203係位於該凹槽202底部，並在每一銲墊203表面已製 有等厚的錫膏層2031。 1272048 更進-步的說’此凹槽2⑴是設於電路表面2〇ι的防 焊層2012中的，可藉由在防焊層繼中製作開口护 成此-凹槽2G2。當被動树21尚未接合在電路板如上 時，在此⑽202的底部，會裸露出預定與被動元件 接合的銲塾203 ’以及大小形狀係與被動元件2外二相 符的區域八 ^ ^ ^ 丨々相 被動元件21，具減前述銲墊2G3_數量之電極端 = 21^ -般用於封裝結構中者’電極端子2ii係位於被 元件讓1接合在電雜2σ鄭係將被動 ^ 2!嵌入於凹槽202内’以兩側的電極端子2ιι雜 如3上的錫膏層贿相接。· 被動元件21固著在電路板2〇上。 移，防止豎碑現象的發生。 -.. . . ... 之接五圖’如晴示，即使在本發明之被動元件 被動元件21的一端，在迴焊後兩侧拉力不 _發生滅的叙。但㈣元件21略她㈣，即會抵 的側壁，限制了其位移而不會_，甚或是 件明的是’凹槽202的設置不僅可防止魏 生麟的舰，其更定位上的功效，可改 知被動元件21所可能發生的偏移問題。 在本發明中’由於被動元件21在接合時，是嵌入在凹 1272048 槽202内’以其電極端子211與銲墊203相連接，且此凹 槽202的外翠與被動元件21相配合，一旦有所偏移，被動 7G件21即無法順利嵌入在凹槽2〇2巾。藉此，不僅可在製 造過ft，㈣的加以定位配置，在後續的撿舰程中Γ ’ 也可簡便的檢測出其是否有偏移。 ' · - 並且，在去除了被航件在偏耻賴錢，本發 明可更進一步的改善印刷精度的問題。 如如所述’由於習知技術中，擔心被動元件壓合於電 的問^，因此無法由電路供應商以較高精度的錫膏印刷設 備先行在銲墊上印製足量的鎬膏形成錫塊。 錫膏印刷設備，直接在銲墊203上繼續填入足夠進行迴$ 對此些錫膏層2031所形成的錫塊喷灑助焊劑，即可藉由迴 烊’使錫膏2031熔融後附著固化在被動元件21的兩侧， 使被動元件21固著在電路板20·上。 如此一來，可將硬體資源做最有效的分配運用，封裂 業者毋須再行購置額外的高精度錫膏印刷設備；並且，又 同時對銲墊203提高了在模板印刷時的精度’使每一輝塾 11 1272048 、·、τ、觀以上所述’在本發明中，不僅可藉由凹槽的設置， 限，了被動70件她起，更_可提供定位上的功效，又 可藉此來提升㈣在印刷上的精度問題。本發明實有長足 之逸舟〇 、以上所述係利用一較佳實施例以詳細說明本發明，其 ，非用以限制本發明之實施範圍，並且熟習該項技藝者皆 能明瞭’適當做些微的修改仍不脫離本發明之精神及範圍。 【圖式簡單說明】 :八八 第一圖，係為一球格陣列封裝結構之剖面圖。 ; 、-. ' ..... .· · . - · * V-: \-· " " ·' .-； ·..- . . .. _ 第二Α圖〜第二C圖，係為一被動元件生豎碑現象之 ::寫 ... . _ ....... . / : 第三圖，係為一被動元件可能發生偏移之狀態示意圖。 · . · . * τ . 第四圖，係為本發明之被動元件之接合結構一實施例之 示意圖。 . .... _. - . • · ； ..... .... - · . · ' · 、 . .... * . · '. ； ： .；；. ^ . ；· ,/..：： ,； . ;：； . ' ·' ν ' :；··：. -；'： ：·, ' 弟五圖’係為本發明之被動元件之接合結構，其中被動 元件發生翹立時的示意圖。 .... 【主要元件符號說明】 2被動元件之接合結構 錫塊 12 1272048 10晶粒載板 121電極端子 11晶粒 201電路表面 12被動元件 202凹槽 13封裝膠體 203銲墊 14錫球 211電極端子 20電路板 2011金屬層 21被動元件 2012防焊層 101銲墊 102錫膏 2031錫膏層 131272048 IX. Description of the Invention: [Technical Field] The present invention relates to a joint structure of a passive component, and more particularly to a passive component joint structure 9 in which a circuit board can restrict displacement of a passive component. [Prior Art] With the development of industrial technology, in order to improve the performance of a computing wafer, in the package structure of the operational wafer, the die carrier is not only provided with a grain resistor, but the die will pass through the die carrier. Electrical connection to passive components. It includes a daily grain carrier 10, a die 11, a passive component 12, a package, . . . , . . . . . . . . . . . . . . Substrate 10, upper and lower surfaces All have the connection terminals of the circuit cloth, and at least two solder pads 1〇1 are used as the interface with the passive components. The upper surface p is connected by wire bonding (wire bonding) to the die 11 and the die carrier 忉', thereby causing the die and the die carrier to be produced. ..... . -,.. .......: 121 is electrically connected to the pad ιοί. Then, the above-mentioned crystal grains, wires, and passive components are covered with the encapsulant 13 to prevent damage of such components and intrusion of external moisture. A plurality of solder balls 14 are formed on the lower surface of the die carrier 1 as an external connection terminal of the package structure. Specifically, the bonding structure of the passive component 12 to the die carrier 10 is specifically described herein. In general, by means of stencil printing, a steel plate having a plurality of perforations is placed on the bonding pad 101 so that the perforation is directed over the bonding pad 101, and then the solder paste is filled in with a doctor blade. 102, the solder paste 1 〇 2 fills the perforation and adheres to the surface of the fresh enamel 101. Then, remove the steel plate. Further, the passive component 12 is pressed onto the die carrier 10, and the electrode terminals 121 on both sides of the passive component 丨2 are temporarily fixed by the adhesiveness of the solder paste 102. Above the pad 101. : ' ; . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On the die carrier 10 . • : :: : : ....... . Please refer to the second week A. It is explained that if the template is printed, it may be blocked by the perforation of the steel plate, the solder paste is deteriorated, the substrate is eccentric, and the blade is scraped. Unclean and other factors, the amount of solder paste transferred to the surface of the pad is not uniform enough. As shown in Fig. 2A, when the refreshed component 12 is pressed against the die carrier 1 , the solder pastes 102 contacted by the electrode terminals 121 on both sides are not equal. As shown in FIG. 2B, when the die carrier 1〇 is reflowed with the passive component 12, the tin-depleted 102 on both sides melts and smelts 1272048 when heated to its eutectic temperature, and adheres to the passive component 12 The outside. As shown in the second c-graph, after the reflow is completed, the solder paste 102 is solidified after being cooled. However, since different amounts of solder paste 102' are attached to both sides of the passive component 12, the tension generated by cooling on both sides is different. On the side where the amount of solder paste 1〇2 is low, it is easy to pick up and leave the surface of the die carrier, and the phenomenon of tombstone (Tombstone) occurs, causing defects in the bonding of passive components. Furthermore, as shown in the third figure, the passive component 12 has a problem of offset during the bonding process. In general, in order to increase the soldering performance of the pad 1〇1 and to protect the surface of the pad 101. After the board 1 is fabricated, the pre-tin layer will solidify into a tin block 1〇3 in the & Until the passive component 12 is to be bonded, a sufficient amount of solder paste is transferred to the tin blocks 103 by stencil printing. However, when the passive element 12 is pressed down on the pad 101 with its electrode terminal 121, the electrode terminal 121 may penetrate the solder paste to the cured tin block 103. On the other hand, the surface of the tin block 1〇3 may cause the passive element 12 to slide as shown by the arrow when pressing, causing an offset. Further step-by-step, in the stomach knows the technical towel, due to the offset problem of the passive component, its solution to the wealth, the money to scale _ block (10) is closed at a very thin thickness (not thicker than 10_, to reduce passive The opportunity to slide the component (10)^103. The thickness of the cured tin on the pad 101 must be limited to prevent the passive component 12 from pressing against the tin block, resulting in slippage. Therefore, in practical fabrication, even the board supplier has The high-precision tin-poor fcp brushing device is also difficult for the board supplier to continue to fill in a sufficient amount of solder paste 102 as a passive component after making the solder block 103, because if a sufficient amount of solder paste is filled in, After the solder paste 1〇2 is cured, the positioning of the passive component 12 is difficult. Therefore, it is the packaging manufacturer who continues to fill the tin block 103 when the passive component is to be bonded. A sufficient amount of solder paste 102 is used to press the passive component onto the solder paste 102. If you want to perform stencil printing with a high-precision solder paste printing device, you cannot directly use the high-precision solder paste and printing equipment that the board supplier has. , but need to purchase separately, increase costs. And tin The accuracy of the printing equipment will directly affect the thickness of the tin-poor 102 filled in the sea: a solder pad. When the thickness of the solder paste 102 on the two pads 101 is too different, the tension will be uneven, and the aforementioned The phenomenon of tombstoning. ^ So 'how to effectively solve the problem of the above-mentioned passive component erection and offset' to improve the yield of passive components when joining, is familiar with the direction of the skill of the artist. :...' . . . :V. '-'V :. . . . . . . - - - - - - - - - - - - - - - - - - - - - - - - The basin includes an H-board and a passive tree. The circuit board can effectively change the passive yoke and the offset _, and the yoke can improve the accuracy of riding thickness. The circuit board has a groove and a plurality of pads, and the like The soldering system is located at the bottom of the groove at 1272048. A solder paste layer is provided on the surface of each pad. Read the electrode terminals with a bribe scale. 'Although you want to bond the passive 70 pieces to the board. The passive component is embedded in the groove, and the electrode terminals on both sides are connected to the two fresh sputums. Then, by reflowing The passive component is fixed on the circuit board. Among them, by the arrangement of the groove, the displacement of the movable component can be restricted to prevent the occurrence of the tombstoning phenomenon. In order to make the advantages and spirit of the present invention more advanced It is to be noted that the detailed description of the drawings is as follows. Referring to the fourth figure, it is a schematic diagram of an embodiment of the passive structure of the passive component of the present invention. As shown, it includes a circuit board 2 〇, a passive component 21. --,. ... ..-- - ... . . . . , . . . . . . . . . A passive component can be soldered thereto by reflow soldering. The surface of the circuit 201 is covered with a layer of the genus layer 2011 and the tamper layer 2012, through: .. '.''.'.; .. . The circuit board 20 has a recess 202 and a plurality of pads 203. The size of the recess 202 is matched to the shape of the passive component 21, and the pads 203 are located at the bottom of the recess 202, and an equal thickness of the solder paste layer 2031 is formed on the surface of each of the pads 203. 1272048 Further step-by-step 'This recess 2(1) is provided in the solder resist layer 2012 of the circuit surface 2〇, which can be protected by making an opening in the solder resist layer. When the passive tree 21 is not yet bonded to the circuit board as above, at the bottom of the (10) 202, the solder 塾 203 ' intended to be bonded to the passive component and the area where the size and shape correspond to the outer two of the passive component 2 are exposed. ^ ^ ^ 丨々 Passive component 21, with the electrode pad of the number of pads 2G3_ = 21^ - generally used in the package structure 'electrode terminal 2ii is located by the component let 1 joint in the electrical hybrid 2σ Zheng system will passive ^ 2! In the groove 202, the solder paste on both sides of the electrode terminal 2 is mixed with the solder paste. • The passive component 21 is attached to the circuit board 2 。. Move to prevent the occurrence of the monument. The five-figure diagram is as shown in the figure, even at the end of the passive component passive component 21 of the present invention, the tension on both sides after the reflow is not extinguished. But (4) element 21 slightly her (four), that is, the side wall that will reach, restricting its displacement without _, or even the fact that the 'groove 202 setting can not only prevent Wei Shenglin's ship, its more positioning effect, can The offset problem that may occur with the passive component 21 is known. In the present invention, 'because the passive component 21 is embedded in the recess 1272048 in the slot 202 when it is joined, its electrode terminal 211 is connected to the pad 203, and the outer portion of the recess 202 cooperates with the passive component 21 once Some offset, the passive 7G piece 21 can not be smoothly embedded in the groove 2〇2 towel. In this way, not only the ft, (4) can be positioned and configured, but in the subsequent stern Γ ’ can also be easily detected whether there is an offset. '· - Also, the present invention can further improve the printing accuracy when the smuggled parts are removed. As mentioned above, due to the fear of passive components being pressed into electricity in the prior art, it is not possible for the circuit supplier to print a sufficient amount of paste on the pad to form a tin with a higher precision solder paste printing device. Piece. The solder paste printing device directly fills the soldering pad 203 to fill the tin soldering flux formed by the solder paste layer 2031, and the solder paste 2031 is melted and adhered and cured. On both sides of the passive component 21, the passive component 21 is attached to the circuit board 20·. In this way, the hardware resources can be distributed and utilized most effectively, and the cracking industry does not need to purchase additional high-precision solder paste printing equipment; and at the same time, the solder pad 203 is improved in precision in stencil printing. Each of the illuminating 11 1272048, ·, τ, and the above described 'in the present invention, not only by the setting of the groove, but also the passive 70 pieces, she can provide the positioning effect, and can borrow This will improve (4) the accuracy of the printing problem. The present invention has been described in detail with reference to a preferred embodiment, which is not intended to limit the scope of the present invention, and those skilled in the art will be able to Minor modifications may be made without departing from the spirit and scope of the invention. [Simple diagram of the diagram]: Eighth The first diagram is a sectional view of a grid array package structure. ; -. ' ..... .. · . - · * V-: \-· "" ·' .-; ·..- . . . . _ second map ~ second C map Is a passive component of the phenomenon of the monument:: write ... . _ ....... / / The third diagram is a schematic diagram of the state of a passive component may be offset. The fourth figure is a schematic view of an embodiment of the joint structure of the passive component of the present invention. .. _. - . • · ; ..... .... - · . · ' · , . . . * . · '. ; : .;;. ^ . ;· , / ..:: ,; . ;:; . ' ·' ν ' :;··:. -;': :·, 'The five figures of the brother' is the joint structure of the passive components of the invention, in which the passive components are warped A schematic diagram of the moment. .... [Main component symbol description] 2 Passive component bonding structure Tin block 12 1272048 10 die carrier 121 electrode terminal 11 die 201 circuit surface 12 passive component 202 groove 13 package colloid 203 pad 14 solder ball 211 Electrode terminal 20 circuit board 2011 metal layer 21 passive component 2012 solder mask 101 solder pad 102 solder paste 2031 solder paste layer 13