TWI596718B - A circuit module package structure and packaging method thereof - Google Patents

Description

Circuit module package structure and packaging method thereof

The invention relates to a circuit module package structure and a packaging method thereof, in particular to a package structure and a packaging method thereof for packaging a surface-mounting technology (SMT) circuit substrate into a module.

In view of the miniaturization of electronic devices, semiconductors, electronic components, or electronic circuits therein are packaged into modules, and current packaging technologies are steadily developing toward high density, miniaturization, and high performance. Among them, the most common ones include the molding technology of the molding resin type and the technology of the metal cover sealing. The cost of sealing the metal cover is too high and is not favored by the industry. The encapsulation resin type encapsulation technology is a resin module that encapsulates a semiconductor, an electronic component, and a circuit board into a circuit module using a resin material such as epoxy resin (Epoxy), which uses a resin molding process or transfer molding ( The transfer molding process heats and melts the epoxy resin and the like, and seals it into a mold, waiting for the resin to harden and form a circuit module.

Generally, the packaged circuit module will use SMT technology substrate and SMD (Surface-mount Devices) components, such as SMD resistors, SMD capacitors, SMD inductors or integrated circuits (IC), and the top surface of the packaged circuit module. Will be flat, to facilitate the client to circuit the module The group is mounted on the main circuit substrate of its product.

However, whether it is a molding method using a molding resin or a metal cover, it is necessary to use a resin such as an epoxy resin, such as a metal cover and a plastic outer surface. When together, use a resin material as an adhesive. In the process of using the mold-sealing resin material for hot-melt packaging, it is necessary to use a variety of different molds, and it is necessary to wait for a long time to wait for the sealing resin material to cool and shape, so the conventional packaging method has high manufacturing cost.

In addition, as shown in the first drawing, the SMT circuit board 10 and the SMD component of the conventional mold-molding resin module are shown in a side view. When the mold material 16 is used for packaging or as an adhesive, the mold material 16 needs to be heated. Injecting into the circuit substrate 10, the solder 17 of the electrical contact 11 on the circuit substrate 10 is often re-melted by heating, and a tinning occurs between the adjacent electrical contacts 11 to cause a short circuit, as shown in FIG. It is shown that the solder 17 flows along the periphery of the SMD element 13 and the IC element 14 due to heating and melting, and forms a short circuit with the adjacent electrical pin or electrical contact.

Therefore, in view of the above-mentioned disadvantages of the high cost of the packaging technology of the conventional SMT circuit module and the occurrence of a short circuit of the tin, the main object of the present invention is to provide a circuit module package structure and a packaging method thereof, which are low in cost and easy to package. The packaging process time can be greatly shortened, and there is no problem of solder overflow.

In order to achieve the above object, the main technical feature of the present invention is to provide a circuit module package structure, including a circuit substrate, at least one surface of which is distributed with a plurality of electronic components; at least one insulating cover covers the electronic components a top portion; and at least one thermosetting adhesive layer adhered to the surface of the insulating cover facing the electronic components, and the thermosetting adhesive layer is heated to fix the insulating cover to the top of the electronic components. Forming a package module with a top surface in a planar shape.

In order to achieve the above object, a second technical feature of the present invention is to provide a circuit module packaging method, the method comprising: preparing a circuit substrate, distributing a plurality of electronic components on at least one surface; and preparing at least one insulating cover plate on a surface Adhering a heat-fixing adhesive layer; covering the insulating cover on the top of the electronic components, and adhering the surface of the thermosetting adhesive layer to the electronic components; and heating the thermosetting adhesive layer to make the insulating The cover plate is fixed on the top of the electronic components to form a package module with a top surface in a planar shape.

In order to achieve the above object, another technical feature of the present invention is to provide the above-mentioned circuit module package structure and a packaging method thereof, wherein an electronic component is disposed on both sides of the circuit substrate, so that another adhesive layer having a thermosetting type is adhered. The insulating cover is placed on the top of the electronic component on the other side, and the thermosetting adhesive layer is heated to fix the other insulating cover to the top of the other electronic component to form a package module having a planar shape on both sides.

10‧‧‧SMT circuit board

11‧‧‧Electrical contacts

13‧‧‧SMD components

14‧‧‧IC components

16‧‧‧Clade material

17‧‧‧ 溢锡

20‧‧‧ circuit board

21‧‧‧Circuit pattern layer

22‧‧‧Electrical contacts

30‧‧‧Electronic components

31‧‧‧Electric pins

40‧‧‧Insulation cover

41‧‧‧Heat-fixed adhesive layer

Fig. 1 is a side elevational view showing an SMT circuit board and an SMD element of a conventional overmolded resin type module.

Figure 2 is a perspective exploded view of the first embodiment of the circuit module package structure of the present invention schematic diagram.

Fig. 3 is a side elevational view showing the first embodiment of the circuit module package structure of the present invention.

Figure 4 is a side elevational view showing a second embodiment of the circuit module package structure of the present invention.

In order to enable the reviewing committee to further understand the techniques, means, and effects of the present invention in order to achieve the intended purpose, refer to the following detailed description of the invention and the accompanying drawings. The invention is to be understood as being limited and not limited by the scope of the invention.

2 is a perspective exploded view of the first embodiment of the circuit module package structure of the present invention, and FIG. 3 is a side view of the first embodiment of the circuit module package structure of the present invention. See the schematic. In the embodiment of the present invention, the circuit module includes a circuit board 20, and a plurality of electronic components 30 are disposed on a surface of the circuit board 20. The material of the circuit board 20 of the present invention may include a FR-4 substrate material. The FR-5 substrate material or the BT flip chip substrate material. In the first embodiment of the present invention, the circuit substrate 20 has electronic components on only a single surface, but the circuit substrate 20 may be a single-sided printed circuit board. The double-sided printed circuit board may alternatively be a multilayer printed circuit.

A metal layer (not shown) is disposed on at least one surface of the circuit substrate 20 of the present invention. After the etching process, a circuit pattern layer (not shown) and a plurality of electrical contacts 22 are formed (eg, FIG. 3). The electrical pin 31 of the electronic component 30 is electrically soldered to the circuit substrate 20, and then an insulating layer 23 (shown in FIG. 3) is applied over the circuit pattern layer and the circuit substrate 20. Bare table On the surface, but the electrical contacts 22 are exposed, the insulating layer 23 allows the solder to stay only on the electrical contacts 22 and the electrical pins 31 of the electronic component 30 to solder both. The electronic component 30 of the present invention may be an electronic component such as a resistor, a capacitor, an inductor or an integrated circuit (IC) of a surface-mounting device (SMD), and uses a surface-mounting technique (Surface-mount Technology). , SMT) soldering the electrical pins of the SMD components to the electrical contacts of the circuit substrate.

As shown in FIG. 2 and FIG. 3 , the package structure of the present invention further includes an insulating cover 40 , such as a cover plate of plastic material, and a heat is adhered to a surface of the insulating cover 40 . The cured adhesive layer 41 has a sheet-like shape and is heat-cured. The material may be a thermosetting PU adhesive or a thermosetting epoxy resin (Epoxy). The insulating cover 40 covers the top of the electronic components 30, and the surface to which the thermosetting adhesive layer 31 is adhered faces the electronic components 30, and the thermosetting adhesive layer 31 is heated to insulate. The cover plate 30 can be fixedly attached to the top of the electronic components 30 to form a package module having a top surface in a planar shape.

As is well known, the appearance of a general circuit package module is flat at the top or the bottom, so that the manufacturer of the circuit module can install the circuit module on the main circuit board of the product, so the present invention utilizes the planar insulating cover 40. The bottom of the circuit board 20 is fixed on the top of the electronic component 30 of the circuit board 20, and the bottom of the circuit board 20 is also planar. Therefore, the package method of the present invention also makes the top and bottom of the circuit module planar, so as to use the manufacturer to install the circuit mode. group. In order to allow the thermosetting adhesive layer 41 to be firmly adhered to the top of the electronic component 31 and in a planar shape, the present invention configures the circuit layout to average the height of the electronic component 30 so that the height of the electronic component 30 is It is distributed on the circuit substrate 20 at a substantially high level.

Please refer to FIG. 4, which is a side view showing a second embodiment of the circuit module package structure of the present invention. In the second embodiment of the present invention, the circuit substrate 20 is distributed on both sides. The electronic component 30 is such that the first surface and the second surface of the circuit substrate 20 are distributed with the electronic component 30. Therefore, in the embodiment, two insulating cover plates 40 are required, and one surface of the two insulating cover plates 40 is adhered with a thermosetting adhesive layer 41. In this embodiment, the first insulating cover 40 covers the top of the electronic component 30 on the first surface of the circuit substrate 20. The second insulating cover 40 covers the top of the electronic component 30 on the second surface of the circuit substrate 20, and is adhered with heat. The surface of the solid adhesive layer 41 faces the electronic component 30, and then the thermosetting adhesive layer 41 on the two insulating cover sheets is heated to fix the first insulating cover 40 to the top of the electronic component 30 of the first surface. The second insulating cover 40 is fixed on the top of the electronic component 30 on the second surface, so that a package module having a planar shape on both sides can be formed.

The method for packaging the circuit module by using the insulating cover 40 and the thermosetting adhesive layer 41 can save about 10% to 15% of the cost compared with the conventional Molding resin material and metal cover sealing. Moreover, the present invention is fixed on the top of the electronic component 30 by using the thermosetting adhesive layer 41. Therefore, the heating is far away from the solder on the electrical contact 22, and the heat does not cause the solder to melt, so that the conventional overflow tin is not caused. Moreover, the packaging process using the invention does not require the use of expensive mold equipment, and the process time is reduced by more than 60% compared with the conventional one. Therefore, the package structure and the packaging method of the present invention can completely replace the conventional packaging method.

In summary, the circuit module package structure and the package method thereof provided by the present invention have the advantages and advantages of low cost and high efficiency that cannot be achieved by the conventional package structure. Therefore, the present invention is quite different from the design of the prior art. To improve the overall use value, and before the application is not seen in the publication or public use, Cheng has already met the requirements of the invention patent, and filed an invention patent application according to law.

20‧‧‧ circuit board

22‧‧‧Electrical contacts

23‧‧‧Insulation

30‧‧‧Electronic components

31‧‧‧Electric pins

40‧‧‧Insulation cover

41‧‧‧Heat-fixed adhesive layer

Claims (18)

A circuit module package structure comprising at least: a circuit substrate having at least one surface on which a plurality of electronic components are distributed; at least one insulating cover covering the top of the electronic components; and at least one thermosetting adhesive layer having heat curing The sheet is adhered to a surface of the insulating cover facing the electronic components, and heats the thermosetting adhesive layer to fix the insulating cover to the top of the electronic components to form a top The surface of the package module is flat; wherein the insulating cover is in the form of a flat plate, and is placed only on the top of the electronic component without covering the side. The circuit module package structure of claim 1, wherein the surface of the circuit substrate further comprises: at least one metal layer, which is etched to form a circuit pattern layer and a plurality of electrical contacts for the electronic The electrical pins of the component are electrically soldered to the electrical contacts; and an insulating layer covers the circuit pattern layer and the exposed surface of the circuit substrate, but the electrical contacts are exposed. The circuit module package structure according to claim 1, wherein the electronic components are distributed on the circuit substrate substantially equally. The circuit module package structure according to claim 2, wherein the electronic components are SMD (Surface-mount Devices) components, and the SMD components are used by SMT technology (Surface-mount Technology) Electrical pins including resistors, capacitors, inductors, or integrated circuits (ICs) are soldered to the electrical contacts of the circuit substrate. The circuit module package structure according to the first aspect of the invention, wherein the material of the circuit substrate comprises an FR-4 substrate material, an FR-5 substrate material or a BT flip chip substrate material. The circuit module package structure according to claim 1, wherein the circuit substrate is a single-sided printed circuit board, a double-sided printed circuit board or a multilayer printed circuit board. The circuit module package structure according to claim 1, wherein the insulating cover is made of plastic. The circuit module package structure according to claim 1, wherein the thermosetting adhesive layer is a thermosetting PU adhesive or a thermosetting epoxy resin (Epoxy). According to the circuit module package structure of claim 1, wherein a second surface of the circuit substrate is also distributed with a plurality of electronic components, and a second insulating cover plate to which the thermosetting adhesive layer is adhered is The tops of the electronic components covering the second surface are fixed by heating to form a package module having a planar shape on both sides. A circuit module packaging method includes at least the following steps: preparing a circuit substrate, distributing a plurality of electronic components on at least one surface; preparing at least one insulating cover plate, and adhering a sheet-shaped thermosetting adhesive layer on a surface; Covering the insulating cover on the top of the electronic components, and adhering the surface of the thermosetting adhesive layer to the electronic components; and heating the thermosetting adhesive layer to fix the insulating cover to the electronic components The top of the component forms a package module having a top surface in a planar shape; wherein the insulating cover plate has a flat shape and is disposed only on the top of the electronic component without covering the side portion. The circuit module packaging method of claim 10, wherein the step of preparing the circuit substrate further comprises: etching at least one metal layer of the circuit substrate to form a circuit pattern layer and the electrical contacts On the surface of the circuit substrate; and coating an insulating layer to cover the circuit pattern layer and the exposed surface of the circuit substrate, but exposing the electrical contacts, and electrically connecting the electrical pins of the electronic components to the On the electrical contact. The circuit module packaging method according to claim 10, wherein the material of the circuit substrate comprises an FR-4 substrate material, an FR-5 substrate material or a BT flip chip substrate material. The circuit module packaging method according to claim 10, wherein the circuit substrate is a single-sided printed circuit board, a double-sided printed circuit board or a multilayer printed circuit board. The circuit module packaging method according to claim 10, wherein the electronic components are distributed on the circuit substrate in a substantially equal manner. The circuit module packaging method according to claim 10, wherein the electronic components are SMD components, and the SMD components (including resistors, capacitors, inductors, or integrated circuits (ICs)) are used by SMT technology. The electrical pins are soldered to the electrical contacts of the circuit substrate. The circuit module packaging method according to claim 10, wherein the insulating cover is made of a plastic material. The circuit module packaging method according to claim 10, wherein the thermosetting adhesive layer is a thermosetting PU adhesive or a thermosetting epoxy resin (Epoxy). According to the circuit module packaging method of claim 10, wherein the circuit substrate is distributed on both sides of the electronic component, the packaging method further comprises: providing a second piece of insulating cover, and a thermosetting adhesive layer is adhered to a surface of the two insulating cover sheets; the second insulating cover is overlaid on the top surface of the electronic components on the other surface of the circuit substrate, and the thermosetting type is adhered to The surface of the layer faces the electronic components; and the thermosetting adhesive layer of the second insulating cover is heated to fix the second insulating cover to the top of the electronic components to form a double-sided A planar package module.