CN201022241Y - Gold finger and flexible printed circuit board with this gold finger structure - Google Patents
Gold finger and flexible printed circuit board with this gold finger structure Download PDFInfo
- Publication number
- CN201022241Y CN201022241Y CNU2006201445643U CN200620144564U CN201022241Y CN 201022241 Y CN201022241 Y CN 201022241Y CN U2006201445643 U CNU2006201445643 U CN U2006201445643U CN 200620144564 U CN200620144564 U CN 200620144564U CN 201022241 Y CN201022241 Y CN 201022241Y
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- CN
- China
- Prior art keywords
- golden finger
- adhesive tape
- copper foil
- foil layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a golden finger and a flexible printed circuit board which is provided with the golden. The golden finger comprises a copper foil layer and a substrate which is adhered to the back of the copper foil layer. The substrate on the back of the golden finger is provided with a tape on the surface and the tape completely covers the whole back of the golden finger. The utility model could efficiently avoid the cockle and tilt or the like problems of the golden finger and ensure the appearance and the characteristic of the flexible printed circuit board.
Description
Technical field
The flexible print circuit board that the utility model relates to a kind of golden finger and has this golden finger structure.
Background technology
Flexible print circuit board (hereinafter to be referred as FPC) golden finger is that itself can be regarded the part of FPC as with being commonly called as of the interconnective edge connector of FPC, and is that copper foil layer one end by FPC extends and forms.Along with developing rapidly of FPC industry, also more and more higher to the outward appearance and the performance requirement of FPC product, wherein also strict further for the requirement at FPC golden finger position.The FPC product very thin concerning product itself, that golden finger is very thin, in manufacturing process, be easy to cause wrinkle, the perk of golden finger, cause product bad.And how adopting effective method to prevent the wrinkle and the perk of the golden finger of product, the quality of assurance product satisfies the requirement in market better, all is a difficult problem all the time.In the face of wrinkle, the perk of golden finger, the method that we take is at present: take the hot pressing leveling or the levelling process of colding pressing that the finger on the wiring board is flattened, perhaps adopt the electric iron pen that it is repaired leveling.Above method is to find that doing some after golden finger problem occurred repairs, and can not occurs preventing before wrinkle and the perk at golden finger after all.
Summary of the invention
The flexible print circuit board that the utility model provides a kind of golden finger and had this golden finger structure can effectively prevent wrinkle, the perk of golden finger.
To achieve these goals, the utility model structure is as follows:
A kind of golden finger comprises copper foil layer and the base material that is bonded in the copper foil layer back side, and the substrate surface at the golden finger back side posts adhesive tape, and adhesive tape covers the whole back side of golden finger fully.
A kind of flexible print circuit board with this golden finger structure comprises copper foil layer and the epiphragma that sticks on the base material of copper foil layer inner surface and stick to the copper foil layer outer surface, and described copper foil layer one end forms golden finger, and the substrate surface of the described golden finger back of the body posts adhesive tape.
Described adhesive tape area is more than or equal to the golden finger area.
Described adhesive tape is the adhesive tape of microviscosity, the viscosity scope of adhesive tape at 0.8N/CM between the 2N/CM.
The material of described adhesive tape substrate is a polyethylene terephthalate, and the glue material that adhesive tape is used above is polypropylene acid.
At flexible print circuit board golden finger back side applying adhesive tape, utilize adhesive tape to support its intensity, convenient and practical, can reduce the harmful effect that wrinkle and perk because of golden finger cause effectively, the adhesive tape of microviscosity does not have the residual influence that causes the FPC quality yet after tearing, better guaranteed the outward appearance and the performance of flexible print circuit board.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is further specified.
Fig. 1 is the schematic diagram of taping in the single golden finger back side;
Fig. 2 is a FPC schematic cross-section of the present utility model;
Fig. 3 is whole row's flexible printed wiring golden finger back side figure that tapes.
Among the figure: A is that flexible printed wiring golden finger, B are that adhesive tape, 1 is that FPC product surface epiphragma, 2 is that copper foil layer, 3 is that base material, 4 is golden finger in the FPC product.
Embodiment
Golden finger A as shown in Figure 1, the substrate surface at its back side posts adhesive tape B.
FPC as shown in Figure 2, this FPC comprises surperficial epiphragma 1, two copper foil layers 2 and base material 3 between Copper Foil 2 and two surface insulation layers 1, the copper foil layer in left side, FPC upper end is higher than the copper foil layer on right side, the upper end of left side copper foil layer extends to form golden finger 4, golden finger 4 comprises copper foil layer and is bonded in the base material at the copper foil layer back side that base material posts adhesive tape B on 3 surfaces.
Above-mentioned adhesive tape B has covered the back side of whole golden finger 4 fully, and adhesive tape B area equals or is slightly larger than the golden finger area.Adhesive tape B is the adhesive tape of microviscosity, the viscosity scope of adhesive tape at 0.8N/CM between the 2N/CM.The material of adhesive tape B substrate can adopt polyethylene terephthalate, and the glue material that adhesive tape is used above can adopt polypropylene acid, guarantees the adhesive tape softness, and fillibility is good, takes off easily.
In FPC production process, behind the intact epiphragma of FPC product hot pressing, stick adhesive tape B at the FPC golden finger A back side, adhesive tape will cover the whole back side of whole FPC golden finger, but adhesive tape A can not cover product and paste the position that will print after pad that epiphragma exposes, the FPC and the position of product lamination reinforcement, again the FPC product develop finish after, the adhesive tape of tearing, because adhesive tape is the microviscosity adhesive tape, so can not exert an influence to the subsequent step that FPC makes because of problems such as culls.
Whole row FPC golden finger as shown in Figure 3, for the space of a whole page is that whole the FPC product that the golden finger with each FPC product comes on the same straight line comes, one whole piece adhesive tape can be attached to the golden finger back side of every row's product, but adhesive tape can not cover the position that pad, the golden finger of FPC are wanted later printing position and product lamination reinforcement.
After adhesive tape posts, can utilize adhesive tape to support its intensity, needn't take technology to make adhesive tape again attached to above the product preferably attached to above the product, convenient and simple.
Adopt the product before the FPC golden finger of the present utility model, when the product of shipment is carried out bad statistics, the product that the wrinkle of golden finger and perk occur account for product sum 9.4%, outward appearance and the performance of FPC had a significant impact.And adopt after the FPC golden finger of the present utility model, the product of shipment is carried out bad statistics, the product that the wrinkle of golden finger and perk occur account for product sum 1.1%, effectively prevented the wrinkle and the perk of golden finger, guaranteed outward appearance and the performance of FPC.
Claims (6)
1. a golden finger comprises copper foil layer and the base material that is bonded in the copper foil layer back side, and it is characterized in that: the substrate surface at the described golden finger back side posts adhesive tape, and adhesive tape covers the whole back side of golden finger fully.
2. golden finger as claimed in claim 1 is characterized in that: described adhesive tape area is more than or equal to the golden finger area.
3. golden finger as claimed in claim 1 is characterized in that: described adhesive tape is the adhesive tape of microviscosity, the viscosity scope of adhesive tape at 0.8N CM between the 2N CM.
4. flexible print circuit board, comprise copper foil layer and the epiphragma that sticks on the base material of copper foil layer inner surface and stick to the copper foil layer outer surface, described copper foil layer one end extends to form golden finger, it is characterized in that: the substrate surface at the described golden finger back side posts adhesive tape, and described adhesive tape covers the whole back side of golden finger fully.
5. flexible print circuit board as claimed in claim 4 is characterized in that: described adhesive tape area is more than or equal to the golden finger area.
6. flexible print circuit board as claimed in claim 4 is characterized in that: described adhesive tape is the adhesive tape of microviscosity, the viscosity scope of adhesive tape at 0.8N CM between the 2N CM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201445643U CN201022241Y (en) | 2006-12-31 | 2006-12-31 | Gold finger and flexible printed circuit board with this gold finger structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201445643U CN201022241Y (en) | 2006-12-31 | 2006-12-31 | Gold finger and flexible printed circuit board with this gold finger structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201022241Y true CN201022241Y (en) | 2008-02-13 |
Family
ID=39089657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201445643U Expired - Lifetime CN201022241Y (en) | 2006-12-31 | 2006-12-31 | Gold finger and flexible printed circuit board with this gold finger structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201022241Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427680A (en) * | 2011-11-16 | 2012-04-25 | 博罗县精汇电子科技有限公司 | Manufacturing process of single panel gold finger |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN113597090A (en) * | 2021-07-28 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel and display device |
-
2006
- 2006-12-31 CN CNU2006201445643U patent/CN201022241Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427680A (en) * | 2011-11-16 | 2012-04-25 | 博罗县精汇电子科技有限公司 | Manufacturing process of single panel gold finger |
| CN102427680B (en) * | 2011-11-16 | 2013-12-18 | 博罗县精汇电子科技有限公司 | Manufacturing process of single panel gold finger |
| CN104735906A (en) * | 2013-12-24 | 2015-06-24 | 张逸 | Golden finger circuit board |
| CN104735906B (en) * | 2013-12-24 | 2017-11-17 | 张逸 | A kind of golden finger wiring board |
| CN113597090A (en) * | 2021-07-28 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of utility model: Gold finger and flexible printed circuit board with this gold finger structure Granted publication date: 20080213 License type: Exclusive license Record date: 20080504 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150906 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150906 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20080213 |
|
| EXPY | Termination of patent right or utility model |