CN104735906B - A kind of golden finger wiring board - Google Patents
A kind of golden finger wiring board Download PDFInfo
- Publication number
- CN104735906B CN104735906B CN201310724230.8A CN201310724230A CN104735906B CN 104735906 B CN104735906 B CN 104735906B CN 201310724230 A CN201310724230 A CN 201310724230A CN 104735906 B CN104735906 B CN 104735906B
- Authority
- CN
- China
- Prior art keywords
- wiring board
- golden finger
- copper
- hot melt
- copper billet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
Abstract
The invention provides a kind of golden finger wiring board, multiple wiring board subelements including wiring board frame and inside wiring board frame, multiple hot melt areas are provided with the wiring board frame, the wiring board subelement includes golden finger, the golden finger sets assist side subelement on the side in plate, the internal layer of the golden finger is equipped with copper billet without copper area, and the copper billet side is provided with projection.The present invention designs on the wiring board subelement side containing golden finger in plate so that golden finger is away from hot melt area, copper billet is laid without copper area in golden finger internal layer and projection is set on copper billet side to reduce insulating cement flowing velocity, avoid golden finger from producing starved fold in pressing.
Description
Technical field
The present invention relates to printed substrate technical field, and in particular to a kind of golden finger wiring board.
Background technology
Assist side field, golden finger are often arranged on the wiring board that memory bar, video card, network interface card etc. clamp electronic component
On, as the connection member between such wiring board and slot.Golden finger is made up of numerous golden yellow conductive contact blades, Yin Qibiao
Face is gold-plated and conductive contact blade arranges in finger-shaped, so turning into " golden finger ".And the wiring board provided with golden finger is referred to as gold
Finger wiring board.
With the demand of electronic product multifunction, multilayer circuit board turns into the trend of following wiring board development.Currently, it is more
The internal layer of sandwich circuit board golden finger is without steel structure, and golden finger designs close to wiring board edges of boards, when such wiring board is pressed
During conjunction, the golden finger close to edges of boards hot melt area can produce fold because internal layer gummosis is excessive, cause wiring board to scrap.
The content of the invention
The purpose of the present invention is to overcome weak point of the prior art, there is provided a kind of golden finger wiring board, passes through structure
Improve, avoid golden finger wiring board from producing fold.
The purpose of the present invention is achieved through the following technical solutions：
A kind of golden finger wiring board, including wiring board frame and multiple circuit plank lists inside wiring board frame
Member, multiple hot melt areas is provided with the wiring board frame, the wiring board subelement includes golden finger, the golden finger
Setting assist side subelement, the internal layer of the golden finger is equipped with copper billet, the copper billet side without copper area on the side in plate
Provided with projection.
As the common knowledge of this area, in bonding processes, the circuit plate insulating layer near hot melt area can be compared with it
The insulating barrier gummosis amount in his region will it is more, in order to prevent golden finger because gummosis excessively and caused by fold, it is remote that inventor will heat area
Designed from golden finger.
As concrete technical scheme, wiring board frame can be widened, hot melt area is moved to edges of boards.More specifically, hot melt
The distance of area and golden finger is at least provided with more than 2cm.
As further technical scheme, golden finger position is in that one end away from hot melt area on wiring board subelement.
As further improved technology scheme, other figures are independent relative to internal layer for the copper billet, avoid damage to wiring board
Original conductance general character.
Specifically, in order to ensure the uniformity of gummosis, copper billet can be multiple nahlocks equidistantly arranged, or more
The individual copper cash equidistantly arranged.
In addition, causing its neighboring area starved because of excessive without copper area to reduce hot melt area, improved as further
Technical scheme, the grid that the laying of hot melt area is staggered to form by inventor by copper bar.
The present invention has advantages below and beneficial effect compared with prior art：
（1）On assist side composing structure of the present invention, the wiring board subelement side containing golden finger is designed in plate,
Golden finger is set to avoid golden finger internal layer from producing starved fold because influenceing heated melting zone in pressing away from hot melt area；
（2）The present invention lays copper billet in golden finger internal layer without copper area, and it is to reduce golden hand to set projection on copper billet side
Refer to internal layer without copper area insulating cement flowing velocity, further reduce the risk that golden finger produces starved fold；
（3）The present invention further reduces golden finger and produces starved fold by the way that hot melt area is set away from golden finger
Risk；
（4）The present invention have selected regular figure in the design of copper billet shape, and copper billet is uniformly arranged, and improve absolutely
The uniformity of edge glue flowing, avoid wiring board thickness of slab uneven.
（5）The present invention does not destroy the original conductance general character of wiring board while golden finger fold is improved, and simple easy
Realize.
Brief description of the drawings
Fig. 1 is golden finger circuit board structure schematic diagram of the present invention.
Fig. 2 is golden finger endothecium structure schematic diagram of the present invention.
Embodiment
With reference to embodiment and accompanying drawing, the present invention is described in further detail, but the embodiment of the invention
Not limited to this.
Embodiment
As shown in figure 1, present embodiments provide a kind of golden finger wiring board, including wiring board frame 1 and positioned at wiring board
Multiple wiring board subelements 2 inside frame 1, multiple hot melt areas 3 are provided with wiring board frame, hot melt area 3 is laid by copper bar
The grid being staggered to form, wiring board subelement 2 includes golden finger 4；In long side direction, golden finger 4 sets assist side
Unit is on the side 5 in plate；In short side direction, golden finger 4 is located at that one end 6 away from hot melt area on wiring board subelement；
Area 3 is heated with the distance of golden finger 4 at least provided with more than 2cm.
As shown in Fig. 2 the internal layer of golden finger 4 is equipped with multiple copper cash 41 equidistantly arranged without copper area
The edge of copper cash 41 is provided with multiple raised 42, and other figures are independent relative to internal layer for copper cash 41, do not destroy wiring board
Original conductance general character.
Embodiment described above only expresses embodiments of the present invention, and its description is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Under the premise of not departing from the present invention, various modifications and improvements can be made, these belong to protection scope of the present invention.Cause
This, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. a kind of golden finger wiring board, including wiring board frame and multiple wiring board subelements inside wiring board frame,
Multiple hot melt areas are provided with the wiring board frame, the wiring board subelement includes golden finger, and the golden finger is set
Assist side subelement is put on the side in plate, the internal layer of the golden finger is equipped with copper billet without copper area, and the copper billet side is set
There is projection；It is characterized in that：The distance of the hot melt area and golden finger is at least 2cm；The golden finger position is in circuit plank list
That one end away from hot melt area in member；Other figures are independent relative to internal layer for the copper billet.
2. the golden finger wiring board according to claim 1, it is characterised in that：The copper billet includes multiple equidistantly arrangements
Nahlock.
3. the golden finger wiring board according to claim 2, it is characterised in that：The copper billet includes multiple equidistantly arrangements
Copper cash.
4. the golden finger wiring board according to claim 3, it is characterised in that：The hot melt area is equipped with copper bar grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310724230.8A CN104735906B (en) | 2013-12-24 | 2013-12-24 | A kind of golden finger wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310724230.8A CN104735906B (en) | 2013-12-24 | 2013-12-24 | A kind of golden finger wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104735906A CN104735906A (en) | 2015-06-24 |
| CN104735906B true CN104735906B (en) | 2017-11-17 |
Family
ID=53459209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310724230.8A Expired - Fee Related CN104735906B (en) | 2013-12-24 | 2013-12-24 | A kind of golden finger wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104735906B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107155267B (en) * | 2017-06-29 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Circuit board filler method, equipment, system and computer storage medium |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN108012469A (en) * | 2017-12-25 | 2018-05-08 | 大连崇达电路有限公司 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
| CN108323041A (en) * | 2018-03-15 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of edges of boards design method of multiple pressing HDI plates |
| CN108617076A (en) * | 2018-04-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | The setting method of position is fused on a kind of wiring board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6469258B1 (en) * | 1999-08-24 | 2002-10-22 | Amkor Technology, Inc. | Circuit board for semiconductor package |
| JP3482850B2 (en) * | 1997-12-08 | 2004-01-06 | セイコーエプソン株式会社 | Semiconductor device and its manufacturing method, circuit board, and electronic equipment |
| CN201022241Y (en) * | 2006-12-31 | 2008-02-13 | 比亚迪股份有限公司 | Gold finger and flexible printed circuit board with this gold finger structure |
| CN202310294U (en) * | 2011-11-08 | 2012-07-04 | 宏俐（汕头）电子科技有限公司 | Golden finger board provided with special golden finger position |
-
2013
- 2013-12-24 CN CN201310724230.8A patent/CN104735906B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3482850B2 (en) * | 1997-12-08 | 2004-01-06 | セイコーエプソン株式会社 | Semiconductor device and its manufacturing method, circuit board, and electronic equipment |
| US6469258B1 (en) * | 1999-08-24 | 2002-10-22 | Amkor Technology, Inc. | Circuit board for semiconductor package |
| CN201022241Y (en) * | 2006-12-31 | 2008-02-13 | 比亚迪股份有限公司 | Gold finger and flexible printed circuit board with this gold finger structure |
| CN202310294U (en) * | 2011-11-08 | 2012-07-04 | 宏俐（汕头）电子科技有限公司 | Golden finger board provided with special golden finger position |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104735906A (en) | 2015-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104735906B (en) | A kind of golden finger wiring board | |
| CN101626660B (en) | Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures | |
| CN105430941B (en) | A kind of technique for improving thick copper coin pressing white edge | |
| CN102223763A (en) | Manufacturing method of connecting sheet circuit board | |
| CN206332913U (en) | A kind of printed circuit board internal layer edge structure | |
| CN103188874B (en) | The dark milling localization method of a kind of control and printed circuit board (PCB) | |
| CN203086841U (en) | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure | |
| CN105792547A (en) | Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB | |
| CN206713158U (en) | A kind of anti-anti- flexible PCB stuck up | |
| CN205305222U (en) | Impedance arrangement structure | |
| CN103517574B (en) | Bearing fixture and the manufacture method of Rigid Flex | |
| CN102673049B (en) | A kind of super Material cladding plate and processing method | |
| CN104865765B (en) | Array substrate and production method, display panel and production method and display device | |
| CN103092447A (en) | Graphical circuit structure, manufacturing method thereof and application thereof | |
| CN206042520U (en) | Pressfitting circuit board | |
| CN108093557A (en) | A kind of circuit board and PCIE boards | |
| CN204721711U (en) | A kind of multilayer circuit board | |
| CN108112157A (en) | A kind of flexible PCB yoke plate structure | |
| CN203046460U (en) | Splicing type thermal print head | |
| CN204408753U (en) | A kind of touch-screen FPC golden finger of multirow distribution | |
| CN104113996B (en) | A kind of method improving double-sided copper-clad core substrate interlayer harmomegathus and a kind of double-sided copper-clad core substrate | |
| CN203433483U (en) | Binding position | |
| CN207802525U (en) | A kind of pcb board in homogeneous thickness | |
| TW201218884A (en) | Method for partially stripping a defined area of a conductive layer | |
| CN100461982C (en) | Circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180726 Address after: 516000 Guangdong Huizhou Zhongkai hi tech Zone, Dongjiang hi tech Industrial Park, 1 East floor, No. 1 Dongxiang South Road, Dongxing district (2 plant). Patentee after: Huizhou City Federation of pressing Electronics Co. Ltd. Address before: 516006 Guangdong Huizhou Zhongkai hi tech Zone, Chen Jiang Street, Huifeng West Three Road 108 building, two floor, A Patentee before: Zhang Yi |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171117 Termination date: 20181224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |