CN203086841U - A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure - Google Patents
A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure Download PDFInfo
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- CN203086841U CN203086841U CN 201320019030 CN201320019030U CN203086841U CN 203086841 U CN203086841 U CN 203086841U CN 201320019030 CN201320019030 CN 201320019030 CN 201320019030 U CN201320019030 U CN 201320019030U CN 203086841 U CN203086841 U CN 203086841U
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- printed circuit
- circuit board
- copper foil
- multilayer printed
- choked flow
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Abstract
The utility model provides a board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure. The board edge structure of a thick-copper multilayer printed circuit board comprises multiple copper foil layers which are disposed relatively at intervals and insulating layers disposed between adjacent copper foil layers. Multiple pieces of flow choking strips which are mutually staggered and which are discontinuous are disposed on the edge areas of the copper foil surfaces close to an insulating layer, wherein the copper foil surfaces are on two adjacent copper foil layers at two sides of the insulating layer. Glue flowing grooves are disposed between adjacent flow choking strips. The board edge structure effectively prevents problems of uneven thickness, layering, and bad soldering effects which arise from glue loss in a thermo compression process. In addition, the board edge structure is beneficial to air exhaust and effectively prevents problems of resin cavity and white edges and corners which are caused by lack of pressure on adjacent non-copper areas.
Description
Technical field
The utility model relate to printed circuit board (Printed Circuit Board, PCB) technical field, particularly, the printed circuit board that relates to a kind of thick copper multilayer printed circuit board edges of boards structure and have this structure.
Background technology
Nowadays, the cost of multilayer printed circuit board reduces gradually, and integrated level progressively improves, and has numerous advantages such as more portable and general simultaneously, and therefore, multilayer printed circuit board has occupied numerous products highland in industrialization epoch at present.
At present, the thick copper multilayer printed circuit board generally includes the copper foil layer more than at least two layers and is sandwiched in insulating barrier (epoxy resin layer, modified epoxy layer) between the described copper foil layer.Described insulating barrier is located in respectively between the per two adjacent copper foil layers, and bonding described copper foil layer forms multilayer printed circuit board.The multilayer printed circuit board of this structure is when making, the copper foil surface fringe region of contiguous insulating barrier one side forms discontinuous bulk of a plurality of interruptions or strip structure through etching, as shown in Figure 1, this discontinuous bulk or strip structure are choked flow bar 31, zone between adjacent choked flow bar 31, form groove, be spew groove 32.
In the hot pressing process, the glue of insulating barrier is melt into flow-like under high pressure, high temperature, and fluid is because of being squeezed along the spew groove diffusion, and the choked flow bar reduces the flowing velocity of fluid, stops it to flow to the wiring board outside.
At present, the shape of choked flow bar on each of multilayer circuit board layer Copper Foil and spew groove is provided with all identical with the position.A kind of multilayer printed circuit board and electronic equipment are provided as Chinese patent literature CN202231943U, wherein, in two layers of Copper Foil of contiguous described hot pressing layer, at least one deck copper foil layer is provided with many choked flow bars in the marginal surface zone of contiguous described hot pressing layer, and groove (being equivalent to spew groove) is set between the adjacent choked flow bar.In this patent, on each layer Copper Foil, the choked flow bar of setting and the shape of spew groove are all identical with the position.Chinese patent literature CN102458033A provides a kind of thick copper printed circuit board internal layer edges of boards structure, comprise a plurality of square choked flow copper billets, square choked flow copper billet all becomes unified angle with the edges of boards structure, between each square choked flow copper billet all gapped (being equivalent to spew groove).In this patent, in the edges of boards structure on each layer Copper Foil, the shape of choked flow bar and spew groove is all identical with the position.Such edges of boards structure can produce synergistic effect in the hot pressing process, thereby causes the Wu Tong district between choked flow bar and the line unit zone under-voltage, defectives such as resin cavity, the white angle of white edge occur, and these defectives all can cause the wiring board layering, reduces welding effect.
On the other hand, the relative Wu Tong district, Hou Tong district of thick copper multilayer printed circuit board is higher, causes synergistic effect during pressing plate easily, is easy to generate under-voltagely, occurs various defectives easily.
The utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of thick copper multilayer printed circuit board edges of boards structure, it is at two adjacent copper foil surface fringe regions of contiguous insulating barrier, the stream bar of design mutual dislocation and discontinuous resistance, thus the problems such as the under-voltage resin cavity that causes, the white angle of white edge in contiguous Wu Tong district effectively prevented.
The utility model also provides the printed circuit board with described thick copper multilayer printed circuit board edges of boards structure, and described printed circuit plate thickness is even, has to be difficult for under-voltage, as not to be prone to white angle of white edge and resin cavity characteristic.
The technical solution of the utility model is as follows: a kind of thick copper multilayer printed circuit board edges of boards structure, comprise a plurality of copper foil layers of relative spacing setting and be located in insulating barrier between the adjacent copper foil layer, two adjacent copper foil layers of described insulating barrier both sides are provided with mutual dislocation and discontinuous many choked flow bars at the copper foil surface fringe region of contiguous described insulating barrier one side, and the zone between the adjacent choked flow bar is a spew groove.The design of choked flow bar mutual dislocation, in the hot pressing process, the fluid that the glue of insulating barrier is melt into evenly distributes, reduce tired folded effect, being convenient to pressure evenly distributes, thereby avoided the Wu Tong district between choked flow bar and the line unit zone under-voltage, defectives such as resin cavity, the white angle of white edge occurred, also avoided the defective of wiring board lamination and reduction welding effect.
Particularly, described copper thickness is at least 3OZ, the thick copper coin that 3OZ is above, and copper thickness is about 105um.
Preferably, be provided with the choked flow interspace between adjacent described choked flow bar on the same horizontal line on the same copper foil layer.The choked flow interspace is communicated with spew groove, helps the even distribution of fluid.
Particularly, the width of described choked flow interspace is 1～10mm.
Particularly, the width of described choked flow bar is 1～10mm.
Preferably, the choked flow bar on one of them copper foil layer overlaps with the orthographic projection of spew groove on described insulating barrier on another copper foil layer.After the pressing, choked flow bar on the copper foil layer and the spew groove on another copper foil layer are coincided, thereby make the edges of boards structural thickness even, avoided lamination.
Described choked flow bar is that rectangle, square, circle, ellipse, some shape or other are irregularly shaped.
A kind of printed circuit board, this printed circuit board comprise above-mentioned thick copper multilayer printed circuit board edges of boards structure.
The beneficial effects of the utility model are: a kind of thick copper multilayer printed circuit board edges of boards structure described in the utility model and the printed circuit board with this structure, it is at two adjacent copper foil surfaces of contiguous insulating barrier, design mutual dislocation and discontinuous choked flow bar, thereby effectively prevent in the hot pressing process, problems such as plate thickness inequality, layering and the welding effect that the solation mistake causes is not good, also help exhaust, effectively prevent the problems such as the under-voltage resin cavity that causes, the white angle of white edge in contiguous Wu Tong district.
Description of drawings
Fig. 1 is the side structure schematic diagram of thick copper multilayer printed circuit board edges of boards structure in the prior art.
Fig. 2 is the planar structure schematic diagram of the edges of boards structure on the thick copper multilayer printed circuit board one side Copper Foil described in the utility model.
Fig. 3 is the side structure schematic diagram of thick copper multilayer printed circuit board edges of boards structure described in the utility model.
Fig. 4 is the side structure schematic diagram of another embodiment of thick copper multilayer printed circuit board edges of boards structure described in the utility model.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is further specified and elaborates.
With reference to Fig. 2, Fig. 3 and Fig. 4, an embodiment according to a kind of thick copper multilayer printed circuit board of the utility model edges of boards structure, described thick copper multilayer printed circuit board edges of boards structure comprises a plurality of copper foil layers 1 of relative spacing setting and is located in insulating barrier 2 between the adjacent copper foil layer, two adjacent copper foil layers 1 of the both sides of contiguous described insulating barrier 2 are provided with mutual dislocation, discontinuous many choked flow bars 11 in the copper foil layer 1 marginal surface zone of contiguous described insulating barrier 2 one sides.Zone between adjacent choked flow bar 11 forms groove, is spew groove 12.11 adjacent of described choked flow bars on same copper foil layer 1 on the same horizontal line are provided with choked flow interspace 13.Described choked flow interspace 13 is communicated with spew groove 12.
With reference to Fig. 3 and Fig. 4, the choked flow bar 11 on one of them copper foil layer 1 overlaps with the orthographic projection of spew groove 12 on described insulating barrier 2 on another copper foil layer 11.
The width of described choked flow interspace 13 is 1～10mm.The width of described choked flow bar 11 is 1～10mm.
Described copper thickness is at least 3OZ.
The shape of described choked flow bar is not limited to the rectangle that is that Fig. 1 shows, also can be that square, circular, oval, some shape or other are irregularly shaped.
The number of plies that the number of plies of described thick copper multilayer printed circuit board also is not limited to Fig. 3 and Fig. 4 is showed.
The utility model also provides a kind of printed circuit board (figure does not show), this printed circuit board comprises a plurality of copper foil layers 1 of relative spacing setting and is located in insulating barrier 2 between the adjacent copper foil layer, two adjacent copper foil layers 1 of contiguous described insulating barrier 2 are provided with mutual dislocation and discontinuous many choked flow bars 11 in the copper foil layer 1 marginal surface zone of contiguous described insulating barrier 2 one sides, and the zone between the adjacent choked flow bar 11 is a spew groove 12.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, its framework form can be flexible and changeable, can the subseries product.Just make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the utility model is determined by claims of being submitted to.
Claims (8)
1. thick copper multilayer printed circuit board edges of boards structure, comprise a plurality of copper foil layers of relative spacing setting and be located in insulating barrier between the adjacent copper foil layer, it is characterized in that, two adjacent copper foil layers of described insulating barrier both sides are provided with discontinuous many choked flow bars of mutual dislocation in the copper foil layer marginal surface zone of contiguous described insulating barrier one side, and the zone between the adjacent choked flow bar is a spew groove.
2. thick copper multilayer printed circuit board edges of boards structure as claimed in claim 1 is characterized in that described copper thickness is at least 3OZ.
3. thick copper multilayer printed circuit board edges of boards structure as claimed in claim 1 is characterized in that, is provided with the choked flow interspace between adjacent described choked flow bar on the same horizontal line on the same copper foil layer.
4. thick copper multilayer printed circuit board edges of boards structure as claimed in claim 3 is characterized in that the width of described choked flow interspace is 1～10mm.
5. as each described thick copper multilayer printed circuit board edges of boards structure of claim 1 to 4, it is characterized in that the width of described choked flow bar is 1～10mm.
6. as each described thick copper multilayer printed circuit board edges of boards structure of claim 1 to 4, it is characterized in that the choked flow bar on one of them copper foil layer overlaps with the orthographic projection of spew groove on described insulating barrier on another copper foil layer.
7. as each described thick copper multilayer printed circuit board edges of boards structure of claim 1 to 4, it is characterized in that described choked flow bar is that rectangle, square, circle, ellipse, some shape or other are irregularly shaped.
8. a printed circuit board is characterized in that, this printed circuit board comprises each described thick copper multilayer printed circuit board edges of boards structure of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320019030 CN203086841U (en) | 2013-01-14 | 2013-01-14 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320019030 CN203086841U (en) | 2013-01-14 | 2013-01-14 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203086841U true CN203086841U (en) | 2013-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320019030 Expired - Lifetime CN203086841U (en) | 2013-01-14 | 2013-01-14 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
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| Country | Link |
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| CN (1) | CN203086841U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596361A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Flow choking strip for printed circuit board |
| CN105491787A (en) * | 2016-01-01 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN108012469A (en) * | 2017-12-25 | 2018-05-08 | 大连崇达电路有限公司 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
| CN109152218A (en) * | 2018-08-23 | 2019-01-04 | 鹤山市中富兴业电路有限公司 | The low gummosis filler technique of a kind of thickness copper PCB and using PCB made of the technique |
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN112291950A (en) * | 2020-10-20 | 2021-01-29 | 江西强达电路科技有限公司 | Multilayer board prevent flowing and glue shift structure |
-
2013
- 2013-01-14 CN CN 201320019030 patent/CN203086841U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596361A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Flow choking strip for printed circuit board |
| CN105491787A (en) * | 2016-01-01 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN108012469A (en) * | 2017-12-25 | 2018-05-08 | 大连崇达电路有限公司 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
| CN109152218A (en) * | 2018-08-23 | 2019-01-04 | 鹤山市中富兴业电路有限公司 | The low gummosis filler technique of a kind of thickness copper PCB and using PCB made of the technique |
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN109348612B (en) * | 2018-09-30 | 2020-02-21 | 深圳市景旺电子股份有限公司 | Manufacturing method of multilayer PCB and multilayer PCB |
| CN112291950A (en) * | 2020-10-20 | 2021-01-29 | 江西强达电路科技有限公司 | Multilayer board prevent flowing and glue shift structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160701 Address after: 211300, Feng Shan Road, Gaochun Economic Development Zone, Jiangsu, Nanjing, 5-1 Patentee after: NANJING HONGRUIPULIN MICROWAVE TECHNOLOGY CO.,LTD. Address before: Industrial Road, Songshan Lake high tech Industrial Development Zone of Guangdong Province, Dongguan City, No. 5, 523808 Patentee before: SHENGYI TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130724 |