CN204244568U - A kind of multi-layer PCB printed substrate - Google Patents
A kind of multi-layer PCB printed substrate Download PDFInfo
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- CN204244568U CN204244568U CN201420744912.5U CN201420744912U CN204244568U CN 204244568 U CN204244568 U CN 204244568U CN 201420744912 U CN201420744912 U CN 201420744912U CN 204244568 U CN204244568 U CN 204244568U
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- copper foil
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Abstract
The utility model relates to a kind of multi-layer PCB printed substrate, it comprises two-layer copper foil layer, some pieces of central layers and some tack coats, be arranged at intervals with some pieces of central layers and some tack coats between described two-layer copper foil layer, the surrounding of described some pieces of central layers is surrounded respectively and is provided with edges of boards.Described edges of boards are provided with several regular hexagon choked flow limits, described regular hexagon choked flow limit close-packed arrays.The utility model structure is simple, designs ingenious, and orthohexagonal design makes that interval between the Copper Foil on edges of boards is little and without tomography, central layer has been not easy nonlinear deformation, and residual copper rate is high, therefore on a horizontal clamp is less likely to occur.
Description
Technical field
The utility model relates to a kind of PCB multilayer printed circuit board, belongs to wiring board design technical field.
Background technology
PCB can add working edge when making, and the object of working edge is convenient artificial and machine operation.Edges of boards another one function for multi-layer PCB printed substrate core material stops gummosis.The tack coat meeting gummosis of plank plank in bonding processes, if gummosis too many plank pressing thickness can be partially thin, so internal layer plank working edge can add choked flow limit.At present, the design on choked flow limit mainly comprises two kinds:
1, choked flow limit is designed to grid or circle beans shape;
2. choked flow limit is designed to copper billet+flow-guiding mouth.
But when choked flow limit is designed to grid or circle beans shape, residual copper rate is low, and the interval between copper sheet and copper sheet is too large, and plank has nonlinear deformation after press, and if core material is thin, walk internal layer horizontal line and clamp understood by brown line; When choked flow limit is designed to copper billet+flow-guiding mouth, in pressing vacuum, because copper sheet interval is very little, the solvent in tack coat like this is not easy to take away, easily pressing bubble occurs.
Summary of the invention
The purpose of this utility model is the bad shortcoming of the working edge resistance flowing effect in order to solve multi-layer PCB printed substrate in prior art, provides a kind of structure simple, the multi-layer PCB printed substrate with regular hexagon choked flow limit easy to use.
The utility model adopts following technical scheme: a kind of multi-layer PCB printed substrate, comprise two-layer copper foil layer, some pieces of central layers and some tack coats, be arranged at intervals with some pieces of central layers and some tack coats between described two-layer copper foil layer, the surrounding of described some pieces of central layers is surrounded respectively and is provided with edges of boards.
Further, described edges of boards are provided with several regular hexagon choked flow limits, described regular hexagon choked flow limit close-packed arrays.
Further, described multi-layer PCB printed substrate comprises the first copper foil layer and the second copper foil layer, the first central layer and the second central layer is provided with between first copper foil layer and the second copper foil layer, the first tack coat is provided with between first central layer and the first copper foil layer, the second tack coat is provided with between second central layer and the second copper foil layer, the 3rd tack coat is provided with between first central layer and the second central layer, the surrounding of the first central layer and the second central layer is surrounded respectively and is provided with edges of boards, edges of boards are provided with several regular hexagon choked flow limits, regular hexagon choked flow limit close-packed arrays.
The utility model structure is simple, designs ingenious, and the design of orthohexagonal choked flow limit makes that interval between the Copper Foil on edges of boards is little and without tomography, central layer has been not easy nonlinear deformation, and residual copper rate is high, therefore on a horizontal clamp is less likely to occur.
Accompanying drawing explanation
Fig. 1 is the structural representation of multi-layer PCB printed substrate.
Fig. 2 is core plate structure schematic diagram of the present utility model.
Fig. 3 is edges of boards schematic diagram of the present utility model.
Reference numeral: the first copper foil layer 1, first tack coat 2, first central layer 3, the 3rd tack coat 4, second central layer 5, second tack coat 6, second copper foil layer 7, edges of boards 8.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As Figure 1-3, a kind of multi-layer PCB printed substrate, this multi-layer PCB printed substrate is by seven-layer structure, comprise the first copper foil layer 1 and the second copper foil layer 7, the first central layer 3 and the second central layer 5 is provided with between first copper foil layer 1 and the second copper foil layer 7, be provided with between first central layer 3 and the first copper foil layer 1 to be provided with between the second tack coat 6, first central layer 3 and the second central layer 5 between first tack coat 2, second central layer 5 and the second copper foil layer 7 and be provided with the 3rd tack coat 4.The upper and lower surface of the first central layer 3 is respectively arranged with copper foil circuit, the upper and lower surface of the second central layer 5 is provided with copper foil circuit.The surrounding of the first central layer 3 and the second central layer 5 is surrounded respectively and is provided with edges of boards 8, edges of boards 8 are provided with several regular hexagon choked flow limits, regular hexagon choked flow limit close-packed arrays, the gummosis that can prevent multi-layer PCB printed substrate from occurring in pressing process also makes central layer not easily deform simultaneously.
Claims (3)
1. a multi-layer PCB printed substrate, it is characterized in that: comprise two-layer copper foil layer, some pieces of central layers and some tack coats, be arranged at intervals with some pieces of central layers and some tack coats between described two-layer copper foil layer, the surrounding of described some pieces of central layers is surrounded respectively and is provided with edges of boards.
2. multi-layer PCB printed substrate as claimed in claim 1, it is characterized in that: described multi-layer PCB printed substrate comprises the first copper foil layer (1) and the second copper foil layer (7), the first central layer (3) and the second central layer (5) is provided with between first copper foil layer (1) and the second copper foil layer (7), the first tack coat (2) is provided with between first central layer (3) and the first copper foil layer (1), the second tack coat (6) is provided with between second central layer (5) and the second copper foil layer (7), the 3rd tack coat (4) is provided with between first central layer (3) and the second central layer (5), the surrounding of the first central layer (3) and the second central layer (5) is surrounded respectively and is provided with edges of boards (8).
3. multi-layer PCB printed substrate as claimed in claim 1 or 2, is characterized in that: described edges of boards are provided with several regular hexagon choked flow limits, described regular hexagon choked flow limit close-packed arrays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420744912.5U CN204244568U (en) | 2014-12-02 | 2014-12-02 | A kind of multi-layer PCB printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420744912.5U CN204244568U (en) | 2014-12-02 | 2014-12-02 | A kind of multi-layer PCB printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204244568U true CN204244568U (en) | 2015-04-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420744912.5U Active CN204244568U (en) | 2014-12-02 | 2014-12-02 | A kind of multi-layer PCB printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204244568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363696A (en) * | 2014-12-02 | 2015-02-18 | 高德（无锡）电子有限公司 | Multi-layer PCB (printed circuit board) |
-
2014
- 2014-12-02 CN CN201420744912.5U patent/CN204244568U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363696A (en) * | 2014-12-02 | 2015-02-18 | 高德（无锡）电子有限公司 | Multi-layer PCB (printed circuit board) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |