CN203120276U - Bonding type multilayer circuit board structure - Google Patents
Bonding type multilayer circuit board structure Download PDFInfo
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- CN203120276U CN203120276U CN 201320069982 CN201320069982U CN203120276U CN 203120276 U CN203120276 U CN 203120276U CN 201320069982 CN201320069982 CN 201320069982 CN 201320069982 U CN201320069982 U CN 201320069982U CN 203120276 U CN203120276 U CN 203120276U
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- layer
- line layer
- type multilayer
- multilayer circuit
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Abstract
The utility model discloses a bonding type multilayer circuit board structure, which comprises first line layer. A first bonding layer, a second line layer, a first core plate, a third line layer, a second bonding layer, a fourth line layer, a second core plate, a fifth line layer, a third bonding layer and a sixth line layer are successively arranged from top to bottom under the first line layer. The bonding type multilayer circuit board structure can satisfy design and wiring requirements for complex circuits, and eliminates wiring difficulty caused by too complex circuits, thereby being helpful for circuit design of engineers; is high in integrated level, and can produce products in small sizes; and can be widely applied to electronic circuit design.
Description
Technical field
The utility model relates to the board structure of circuit technology, relates in particular to a kind of bonded type multilayer circuit plate structure.
Background technology
For the product of electronic circuit, the engineer usually can utilize double-sided PCB and then realize design and the manufacturing of electronic circuit product.Yet, because double-sided PCB can only carry out double-sided wiring, therefore when the circuit of design is comparatively complicated, so then produce the problem of difficult wiring, in addition, utilize design and the manufacturing of double-sided PCB and then realization electronic circuit product, its integrated level is low, and often need to use the polylith double-sided PCB could satisfy the needs that the electronic circuit product design is made, so then can cause the volume of product big, and account for placing space.
The utility model content
In order to solve the problems of the technologies described above, the purpose of this utility model provides a kind of integrated level height, the simple in structure and bonded type multilayer circuit plate structure that is easy to produce.
The technical scheme that the utility model adopts is: a kind of bonded type multilayer circuit plate structure, comprise first line layer, the lower surface of described first line layer is disposed with first adhesive layer, second line layer, first central layer, tertiary circuit layer, second adhesive layer, the 4th line layer, second central layer, the 5th line layer, the 3rd adhesive layer and the 6th line layer from top to bottom.
Further, the upper surface of described first line layer is disposed with first nickel coating, first Gold plated Layer, first solder mask and first character layer from bottom to up.
Further, the lower surface of described the 6th line layer is disposed with second nickel coating, second Gold plated Layer, second solder mask and second character layer from top to bottom.
Further, the upper surface of described first line layer is disposed with first from bottom to up organizational security weldering rete, the 3rd solder mask and three-character doctrine layer.
Further, the lower surface of described the 6th line layer is disposed with second from top to bottom organizational security weldering rete, the 4th solder mask and the 4th character layer.
Further, the thickness of described first line layer, second line layer, tertiary circuit layer, the 4th line layer, the 5th line layer and the 6th line layer is 35 microns.
Further, the thickness of described first central layer and second chip is 0.4 millimeter.
Further, the thickness of described first adhesive layer, second adhesive layer and the 3rd adhesive layer is 0.2 millimeter.
The beneficial effects of the utility model are: owing to the utlity model has two central layers and six layers of line layer, therefore can satisfy designing requirement and the cabling requirement of complicated circuit, elimination designs comparatively complicated circuit because of the too complicated difficult wiring of bringing of circuit thereby be convenient to the engineer.In addition, therefore integrated level height of the present utility model only need utilize a utility model, just can satisfy the production requirement with complex electronic circuit design basically, so then can reduce the volume of product, saves placing space.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described further:
Fig. 1 is the schematic diagram of a kind of bonded type multilayer circuit of the utility model plate structure;
Fig. 2 is a specific embodiment schematic diagram of a kind of bonded type multilayer circuit of the utility model plate structure;
Fig. 3 is another specific embodiment schematic diagram of a kind of bonded type multilayer circuit board of the utility model mechanism.
Embodiment
By shown in Figure 1, a kind of bonded type multilayer circuit plate structure, comprise first line layer, the lower surface of described first line layer is disposed with first adhesive layer, second line layer, first central layer, tertiary circuit layer, second adhesive layer, the 4th line layer, second central layer, the 5th line layer, the 3rd adhesive layer and the 6th line layer from top to bottom.
Be further used as preferred embodiment, the thickness of described first line layer, second line layer, tertiary circuit layer, the 4th line layer, the 5th line layer and the 6th line layer is 35 microns.
Be further used as preferred embodiment, the thickness of described first central layer and second chip is 0.4 millimeter.
Be further used as preferred embodiment, the thickness of described first adhesive layer, second adhesive layer and the 3rd adhesive layer is 0.2 millimeter.
By shown in Figure 2, in a specific embodiment of the present utility model, can get, the lower surface of the upper surface of described first line layer and the 6th line layer is equipped with nickel coating, Gold plated Layer, solder mask and character layer, its concrete structure is: the upper surface of described first line layer is disposed with first nickel coating, first Gold plated Layer, first solder mask and first character layer from bottom to up, and the lower surface of described the 6th line layer is disposed with second nickel coating, second Gold plated Layer, second solder mask and second character layer from top to bottom.
Be further used as preferred embodiment, the thickness of described first solder mask and second solder mask is 15 microns.
By shown in Figure 3, in another specific embodiment of the present utility model, can get, the lower surface of the upper surface of described first line layer and the 6th line layer has been equipped with organizational security weldering rete, solder mask and character layer, its concrete structure is: the upper surface of described first line layer is disposed with first from bottom to up organizational security weldering rete, the 3rd solder mask and three-character doctrine layer, and the lower surface of described the 6th line layer is disposed with second from top to bottom organizational security weldering rete, the 4th solder mask and the 4th character layer are arranged.
Be further used as preferred embodiment, the thickness of described the 3rd solder mask and the 4th solder mask is 15 microns, and described first thickness range that has organizational security weldering rete and second to have organizational security to weld rete is 0.15 micron-0.3 micron.
Got by above-mentioned, the utility model can satisfy designing requirement and the cabling requirement of complicated circuit, eliminates because of the too complicated difficult wiring of bringing of circuit, thereby is conducive to engineer's design circuit.And integrated level height of the present utility model, therefore only need utilize a utility model, just can satisfy the production requirement with complex electronic circuit design basically, so then can reduce the volume of product, save placing space.Also have, the utility model not only extensibility is strong, and durable anti-oxidation.
More than be that preferable enforcement of the present utility model is specified, but the utility model is created and is not limited to described embodiment, those of ordinary skill in the art make all equivalent variations or replacement also can doing under the prerequisite of the utility model spirit, the distortion that these are equal to or replace all is included in the application's claim institute restricted portion.
Claims (8)
1. bonded type multilayer circuit plate structure, it is characterized in that: comprise first line layer, the lower surface of described first line layer is disposed with first adhesive layer, second line layer, first central layer, tertiary circuit layer, second adhesive layer, the 4th line layer, second central layer, the 5th line layer, the 3rd adhesive layer and the 6th line layer from top to bottom.
2. according to the described a kind of bonded type multilayer circuit plate structure of claim 1, it is characterized in that: the upper surface of described first line layer is disposed with first nickel coating, first Gold plated Layer, first solder mask and first character layer from bottom to up.
3. according to claim 1 or 2 described a kind of bonded type multilayer circuit plate structures, it is characterized in that: the lower surface of described the 6th line layer is disposed with second nickel coating, second Gold plated Layer, second solder mask and second character layer from top to bottom.
4. according to the described a kind of bonded type multilayer circuit plate structure of claim 1, it is characterized in that: the upper surface of described first line layer is disposed with first from bottom to up organizational security weldering rete, the 3rd solder mask and three-character doctrine layer.
5. according to claim 1 or 4 described a kind of bonded type multilayer circuit plate structures, it is characterized in that: the lower surface of described the 6th line layer is disposed with second from top to bottom organizational security weldering rete, the 4th solder mask and the 4th character layer.
6. according to the described a kind of bonded type multilayer circuit plate structure of claim 1, it is characterized in that: the thickness of described first line layer, second line layer, tertiary circuit layer, the 4th line layer, the 5th line layer and the 6th line layer is 35 microns.
7. according to the described a kind of bonded type multilayer circuit plate structure of claim 1, it is characterized in that: the thickness of described first central layer and second chip is 0.4 millimeter.
8. according to the described a kind of bonded type multilayer circuit plate structure of claim 1, it is characterized in that: the thickness of described first adhesive layer, second adhesive layer and the 3rd adhesive layer is 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320069982 CN203120276U (en) | 2013-02-06 | 2013-02-06 | Bonding type multilayer circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320069982 CN203120276U (en) | 2013-02-06 | 2013-02-06 | Bonding type multilayer circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203120276U true CN203120276U (en) | 2013-08-07 |
Family
ID=48900582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320069982 Expired - Fee Related CN203120276U (en) | 2013-02-06 | 2013-02-06 | Bonding type multilayer circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203120276U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
-
2013
- 2013-02-06 CN CN 201320069982 patent/CN203120276U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 Termination date: 20160206 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |