CN203015288U - Anti-shedding structure for pad of electronic product - Google Patents
Anti-shedding structure for pad of electronic product Download PDFInfo
- Publication number
- CN203015288U CN203015288U CN 201220727811 CN201220727811U CN203015288U CN 203015288 U CN203015288 U CN 203015288U CN 201220727811 CN201220727811 CN 201220727811 CN 201220727811 U CN201220727811 U CN 201220727811U CN 203015288 U CN203015288 U CN 203015288U
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- China
- Prior art keywords
- pad
- layer
- electronic product
- metal forming
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses an anti-shedding structure for a pad of an electronic product. The anti-shedding structure comprises a PCB of a multi-layer structure. A surface layer of the PCB is provided with the pad. Via holes are formed between the surface layer and a second layer of the PCB, wherein the second layer is under the surface layer and fixed with a metal foil at a position corresponding to the position of the pad. The pad is connected with the metal foil through the via holes. Due to the fixing effect of the metal foil, the stress structure of the pad at the surface layer is reinforced, so that the pad at the surface layer is not easy to pull up and drop, and thus the installation firmness of components is further increased, and the reliability of the electronic product is improved.
Description
Technical field
The utility model relates to hardware electronic, particularly relates to a kind of electronic product pad anti-drop structure.
Background technology
As shown in Figure 1, the PCB(printed circuit board (PCB)) multi-layer H DI(high density interconnect for example on) structural detail 5 on plate or large force-summing element, under tension, gravity or effect of stress, or weld time is excessively of a specified duration, pad 3 easily is pulled up and comes off, and causes element to come off.Some element can be by playing glue or fixed structure is fixed, but some element cannot be by playing glue or fixed structure is fixed, and this just needs to seek a kind of new solution.
The utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of electronic product pad anti-drop structure is provided, and prevents that element from coming off.
For achieving the above object, the utility model is by the following technical solutions:
A kind of electronic product pad anti-drop structure, the pcb board that comprises sandwich construction, the top layer of described pcb board is provided with pad, offer through hole between the top layer of described pcb board and the second layer under the top layer, on the described second layer, the position of corresponding described pad is fixed with metal forming, and described pad links together by described through hole and described metal forming.
Can further adopt following technical schemes:
The structure that metal forming on metal forming on the described second layer and described pad forms as one.
Metal forming on metal forming on the described second layer and described pad is Copper Foil.
Copper Foil on Copper Foil on the described second layer and described pad is onesize.
Described through hole is the laser forming hole.
Described pcb board is the HDI plate.
Useful technique effect of the present utility model:
The position of corresponding top layer pad is fixedly installed metal forming on the second layer of pcb board, the pad on top layer is connected with metal forming by the through hole between top layer and the second layer, fixation due to this metal forming, strengthened the force structure of top layer pad, make the top layer pad be not easy to be pulled up and come off, and then increased the firmness that element is installed, improved the reliability of electronic product.
Description of drawings
Fig. 1 is the structural representation of traditional HDI PCB;
Fig. 2 is the structural representation of an embodiment of the utility model.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated.Should be emphasized that, following explanation is only exemplary, rather than in order to limit scope of the present utility model and application thereof.
Consult Fig. 2, in an embodiment, electronic product pad anti-drop structure comprises the HDI pcb board of sandwich construction, described pcb board comprises top layer 1 and the second layer 2 at least, the top layer 1 of described pcb board is provided with pad 3, and the leg 6 of element 5 is connected on pad 3, the top layer 1 of described pcb board and offer through hole between the second layer 2 under top layer 1, on the described second layer 2, the position of corresponding described pad 3 is fixed with metal forming 4, and described pad 3 links together by described through hole and described metal forming 4.In preferred embodiment, the structure that the metal forming on the described second layer 2 and the metal forming on described pad 3 form as one.
Described through hole is preferably being offered over against the position of described pad 3, and this is not to be necessary certainly.
Described through hole can be the hole of laser forming.The pad 3 on top layer 1 is by laser hole and the second layer
2 Copper Foils are pulled in together, have so just strengthened the force structure of top layer pad.
On the second layer 2 and pad 3, metal forming is generally Copper Foil.Copper Foil size on the second layer 2 is decided by actual conditions, can be for example with pad 3 on Copper Foil onesize, or compare biggerly or smaller with the latter, the network attribute of the Copper Foil on the second layer 2 is defined as the network attribute of respective pad.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (6)
1. electronic product pad anti-drop structure, the pcb board that comprises sandwich construction, the top layer of described pcb board is provided with pad, it is characterized in that, offer through hole between the top layer of described pcb board and the second layer under the top layer, on the described second layer, the position of corresponding described pad is fixed with metal forming, and described pad links together by described through hole and described metal forming.
2. electronic product pad anti-drop structure as claimed in claim 1, is characterized in that, the structure that the metal forming on the metal forming on the described second layer and described pad forms as one.
3. electronic product pad anti-drop structure as claimed in claim 2, is characterized in that, the metal forming on the metal forming on the described second layer and described pad is Copper Foil.
4. electronic product pad anti-drop structure as claimed in claim 3, is characterized in that, the Copper Foil on the Copper Foil on the described second layer and described pad is onesize.
5. electronic product pad anti-drop structure as claimed in claim 1, is characterized in that, described through hole is the laser forming hole.
6. electronic product pad anti-drop structure as described in claim 1 to 5 any one, is characterized in that, described pcb board is the HDI plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220727811 CN203015288U (en) | 2012-12-26 | 2012-12-26 | Anti-shedding structure for pad of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220727811 CN203015288U (en) | 2012-12-26 | 2012-12-26 | Anti-shedding structure for pad of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203015288U true CN203015288U (en) | 2013-06-19 |
Family
ID=48606839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220727811 Expired - Lifetime CN203015288U (en) | 2012-12-26 | 2012-12-26 | Anti-shedding structure for pad of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203015288U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
| CN106879173A (en) * | 2017-03-21 | 2017-06-20 | 新华三技术有限公司 | A kind of printed circuit board processing method and printed circuit board |
| CN107548229A (en) * | 2016-06-27 | 2018-01-05 | 中兴通讯股份有限公司 | PCB and its manufacture method |
| CN107979914A (en) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | A kind of circuit board and terminal |
| CN112867240A (en) * | 2019-11-27 | 2021-05-28 | 三星电机株式会社 | Printed circuit board |
-
2012
- 2012-12-26 CN CN 201220727811 patent/CN203015288U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
| CN107548229A (en) * | 2016-06-27 | 2018-01-05 | 中兴通讯股份有限公司 | PCB and its manufacture method |
| CN107548229B (en) * | 2016-06-27 | 2022-01-28 | 中兴通讯股份有限公司 | PCB and manufacturing method thereof |
| CN106879173A (en) * | 2017-03-21 | 2017-06-20 | 新华三技术有限公司 | A kind of printed circuit board processing method and printed circuit board |
| CN107979914A (en) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | A kind of circuit board and terminal |
| CN112867240A (en) * | 2019-11-27 | 2021-05-28 | 三星电机株式会社 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130619 |