CN201967237U - Four-layer PCB (printed circuit board) - Google Patents
Four-layer PCB (printed circuit board) Download PDFInfo
- Publication number
- CN201967237U CN201967237U CN2010207002274U CN201020700227U CN201967237U CN 201967237 U CN201967237 U CN 201967237U CN 2010207002274 U CN2010207002274 U CN 2010207002274U CN 201020700227 U CN201020700227 U CN 201020700227U CN 201967237 U CN201967237 U CN 201967237U
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer pcb
- pcb board
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a four-layer PCB (printed circuit board) which comprises two base plates, wherein a prepreg is arranged between the base plates which are provided with bind holes, and the base plates are pressed by rivets. The four-layer PCB has the benefits of having more reasonable structural design and greatly reducing the fault rate.
Description
Technical field
The utility model relates to pcb board, specifically is a kind of four layers of pcb board.
Background technology
In the prior art, when making multi-layer PCB board, because design is reasonable inadequately, pressing defective tightness between the substrate causes line short or loose contact easily.
The utility model content
The purpose of this utility model is, overcomes the deficiencies in the prior art, proposes a kind of four layers of novel pcb board.
The technical solution adopted in the utility model is as follows: a kind of four layers of pcb board, comprise two substrates, and be provided with prepreg between substrate, substrate is provided with blind hole, and substrate adopts the rivet pressing.
Preferably, pcb board comprises that also one runs through the through hole of substrate and prepreg.
Preferably, the blind hole on the two substrates is asymmetrical setting.
The beneficial effects of the utility model are that structural design is more reasonable, adopt rivet pressing substrate, and it is tightr to make it contact, are difficult for loosening the separation, greatly reduce the failure rate of pcb board.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment pcb board.
Embodiment
Four layers of pcb board structure are referring to Fig. 1, comprise two substrates 1 with the rivet pressing, accompany prepreg 2 between the substrate, on two substrates, respectively be provided with some blind holes 3, be positioned at the top layer and the bottom surface of printed substrate, have certain depth, be used for being connected of top layer circuit and following internal layer circuit, the blind hole on the two substrates is asymmetrical setting.At the edge of plate, also be provided with the through hole 4 that runs through substrate and prepreg.
Claims (3)
1. four layers of pcb board is characterized in that, comprise two substrates, are provided with prepreg between substrate, and substrate is provided with blind hole, and substrate adopts the rivet pressing.
2. four layers of pcb board as claimed in claim 1 is characterized in that, comprise that also one runs through the through hole of substrate and prepreg.
3. four layers of pcb board as claimed in claim 1 is characterized in that the blind hole on the two substrates is asymmetrical setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010207002274U CN201967237U (en) | 2010-12-31 | 2010-12-31 | Four-layer PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010207002274U CN201967237U (en) | 2010-12-31 | 2010-12-31 | Four-layer PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201967237U true CN201967237U (en) | 2011-09-07 |
Family
ID=44529789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010207002274U Expired - Fee Related CN201967237U (en) | 2010-12-31 | 2010-12-31 | Four-layer PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201967237U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142329A (en) * | 2015-07-28 | 2015-12-09 | 电子科技大学 | Multi-layer circuit board riveting structure, and suspended line circuit constituted by same, and realization method for suspended line circuit |
-
2010
- 2010-12-31 CN CN2010207002274U patent/CN201967237U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142329A (en) * | 2015-07-28 | 2015-12-09 | 电子科技大学 | Multi-layer circuit board riveting structure, and suspended line circuit constituted by same, and realization method for suspended line circuit |
| CN105142329B (en) * | 2015-07-28 | 2018-05-08 | 电子科技大学 | The suspended substrate stripline circuit and its implementation of multilayer circuit board riveted structure and its composition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |