CN203775518U - PCB multilayer board with through hole - Google Patents
PCB multilayer board with through hole Download PDFInfo
- Publication number
- CN203775518U CN203775518U CN201420039246.5U CN201420039246U CN203775518U CN 203775518 U CN203775518 U CN 203775518U CN 201420039246 U CN201420039246 U CN 201420039246U CN 203775518 U CN203775518 U CN 203775518U
- Authority
- CN
- China
- Prior art keywords
- hole
- stratum
- plate
- top plate
- multilayer board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A PCB multilayer board with a through hole comprises a top layer plate, a power supply layer, a stratum and a bottom layer plate. The top layer plate, the power supply layer, the stratum and the bottom layer plate are stacked together from top to bottom. The PCB multilayer board is characterized in that a radial connected through hole is arranged among the top layer plate, the power supply layer, the stratum and the bottom layer plate; an outer edge of the through hole on the top layer plate is provided with a bonding area; an insulation screw is placed in the through hole. The structure of the PCB multilayer board is simple. During stitching, a warped plate phenomenon is not generated.
Description
Technical field
The utility model relates to a kind of pcb board, especially refers to a kind of PCB multi-layer sheet with through hole.
Background technology
Along with the electrical characteristic of modern electronic product is increasingly sophisticated, therefore more and more higher to the requirement of power supply, signal, the number of plies of pcb board is more and more.Traditional PCB multi-layer sheet is all to adopt the mode of welding or pressing to carry out multiple-plate fixing.In the process of pressing, because the structural design of every laminate is not quite similar, asymmetric in structure, when pressing, easily produce the phenomenon of seesaw, and then cause whole pcb board to be scrapped, economic benefit is not high.
Summary of the invention
The purpose of this utility model is to overcome the phenomenon that easily occurs seesaw in prior art in PCB multi-layer sheet pressing process, there will not be the PCB multi-layer sheet with through hole of seesaw phenomenon when a kind of simple in structure, pressing is provided.
For realizing above object, technical solution of the present utility model is: a kind of PCB multi-layer sheet with through hole, comprise top plate, bus plane, stratum and bottom plate, described top plate, bus plane, stratum and bottom plate are stacked together from top to bottom, it is characterized in that: between described top plate, bus plane, stratum and bottom plate, be provided with the through hole radially connecting, on top plate, the outer rim of through hole is provided with bond regions, is placed with insulation screw in through hole.
The number of described through hole is at least one.
Described insulation screw is made of plastics.
The utility model is simple in structure, there will not be seesaw phenomenon when pressing.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model vertical view.
In figure: top plate 1, bus plane 2, stratum 3, bottom plate 4, through hole 5, bond regions 6, insulation screw 7.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Referring to Fig. 1 to Fig. 2, a kind of PCB multi-layer sheet with through hole, comprise top plate 1, bus plane 2, stratum 3 and bottom plate 4, described top plate 1, bus plane 2, stratum 3 and bottom plate 4 are stacked together from top to bottom, between described top plate 1, bus plane 2, stratum 3 and bottom plate 4, be provided with the through hole 5 radially connecting, on top plate 1, the outer rim of through hole 5 is provided with bond regions 6, is placed with insulation screw 7 in through hole 5.
The number of described through hole 5 is at least one.
Described insulation screw 7 is made of plastics.
A kind of PCB multi-layer sheet with through hole, comprise top plate 1, bus plane 2, stratum 3 and bottom plate 4, four laminates from top to bottom stack, between four laminates, be provided with the through hole 5 radially connecting, in the time that four laminates are carried out to pressing, due to the existence of through hole 5, through hole 5 provides extra stressed and release structure for pressure for multi-layer sheet, and in through hole 5, be provided with one insulation screw 7, when pressing, only need carry out to multi-layer sheet the compression of little pressure, realized multiple-plate fixing by insulation screw 7, there will not be the phenomenon of seesaw, economic benefit is improved greatly.In addition, for the screw 7 that prevents from insulating departs from from through hole 5, on top plate 1, the outer rim of through hole 5 is provided with bond regions 6, insulation screw 7 can be fixed on top plate 1 by bond regions 6, has ensured multiple-plate stability.The utility model is simple in structure, there will not be seesaw phenomenon when pressing.
Claims (3)
1. the PCB multi-layer sheet with through hole, comprise top plate (1), bus plane (2), stratum (3) and bottom plate (4), described top plate (1), bus plane (2), stratum (3) and bottom plate (4) are stacked together from top to bottom, it is characterized in that: between described top plate (1), bus plane (2), stratum (3) and bottom plate (4), be provided with the through hole (5) radially connecting, outer rim at the upper through hole (5) of top plate (1) is provided with bond regions (6), is placed with insulation screw (7) in through hole (5).
2. a kind of PCB multi-layer sheet with through hole according to claim 1, is characterized in that: the number of described through hole (5) is at least one.
3. a kind of PCB multi-layer sheet with through hole according to claim 1, is characterized in that: described insulation screw (7) is made of plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039246.5U CN203775518U (en) | 2014-01-22 | 2014-01-22 | PCB multilayer board with through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039246.5U CN203775518U (en) | 2014-01-22 | 2014-01-22 | PCB multilayer board with through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775518U true CN203775518U (en) | 2014-08-13 |
Family
ID=51292658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420039246.5U Expired - Fee Related CN203775518U (en) | 2014-01-22 | 2014-01-22 | PCB multilayer board with through hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775518U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
-
2014
- 2014-01-22 CN CN201420039246.5U patent/CN203775518U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248462A (en) * | 2019-05-08 | 2019-09-17 | 天津大学 | A kind of modular high-power linear transfer line based on stacked structure is from package platforms |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151231 Address after: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Huang Tian Tianjia Industrial District 16 building two floor, A District Patentee after: Shenzhen best Electronics Co., Ltd. Address before: 441300 Shenzhen Industrial Park, Suizhou Economic Development Zone, Hubei Patentee before: Hubei Mei Yadi precision circuit Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20200122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |