CN207927005U - A kind of wiring board consent pressing structure - Google Patents
A kind of wiring board consent pressing structure Download PDFInfo
- Publication number
- CN207927005U CN207927005U CN201721515189.3U CN201721515189U CN207927005U CN 207927005 U CN207927005 U CN 207927005U CN 201721515189 U CN201721515189 U CN 201721515189U CN 207927005 U CN207927005 U CN 207927005U
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- China
- Prior art keywords
- consent
- substrate
- pressing
- wiring board
- resin sheets
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Abstract
The utility model provides a kind of wiring board consent pressing structure.The wiring board consent pressing structure includes substrate layer, is sequentially arranged in PP resin layers, the copper foil layer of substrate layer both sides, and consent material layer is equipped between the substrate layer and PP resin layers.The consent material layer is PP prepregs.Increase steps of exhausting when above-mentioned pressing, ensures pressing quality.Compared with prior art, the utility model replaces paste resin consent to make substrate using PP resin sheets so that when substrate is closed with the lamination of other internal layer circuits, the PP resin sheets that pressing uses can be agreed with, phenomena such as the two performance is consistent, and two panels PP resin sheets are combined, effectively avoid hickie in bonding processes.
Description
Technical field
The utility model is related to board production technical fields.
Background technology
Pressing working procedure in wiring board production process is to match the same substrate of each inner plating, the outer copper foil of making circuit
PP resin sheet laminations are closed to press to form multilayer circuit board again.It is needed before pressing by substrate and internal layer circuit plate using the paste resin flowed
Filling perforation, then pressed with PP pieces.In pressing working procedure, since the PP piece ingredients that the stir-in resin glue of use is pressed with hole face are matched
Than different, the performances such as melt flow are also different, both be susceptible to after pressing in conjunction with bad phenomenon for example occur white point,
Hickie influences subsequent production；Bonding processes have bubble or wrinkling to go out also due to copper foil is relatively thin and presses out-of-flatness simultaneously
It is existing, cause wiring board quality problems.
Invention content
In view of the above-mentioned problems, the utility model provides a kind of wiring board consent pressing structure.
Wiring board consent pressing structure described in the utility model, including substrate and be sequentially arranged in substrate both sides it is multiple in
Pressing is arranged with first in sandwich circuit board, the outer copper foil being set on the outside of internal layer circuit plate between the internal layer circuit plate and substrate
PP resin sheets, the substrate both sides also set up the 2nd PP resin sheets for consent, the 2nd PP resin sheets and the first PP
Resin sheet performance parameter is consistent.
Preferably, the 2nd PP resin sheet content glue 60-70%.
Preferably, the 2nd PP resin sheet thickness is 6-7MIL.
Preferably, the substrate thickness is 1mm.
Compared with prior art, the beneficial effects of the utility model are：The utility model replaces tree using PP resin sheets
Fat starches consent and makes substrate so that when the lamination of substrate and other internal layer circuits is closed, the PP resin sheets that pressing uses can be agreed with, two
Phenomena such as person's performance is consistent, and two panels PP resin sheets are combined, effectively avoid hickie in bonding processes, on the other hand, bonding processes
Middle increase steps of exhausting further improves pressing quality, and the two, which combines, ensures that product quality improves production efficiency simultaneously.
Description of the drawings
Fig. 1 is the wiring board consent pressing structure schematic diagram.
Specific implementation mode
In order to facilitate the understanding of those skilled in the art, below in conjunction with the accompanying drawings and the specific embodiments to the utility model do into
The detailed description of one step.
As shown, the copper base consent pressing structure includes substrate layer 1 and is sequentially arranged in the second of substrate layer both sides
PP resin sheets 2, internal layer circuit plate 3, outer copper foil 4, wherein internal layer circuit plate 3 include the first PP resin sheets and copper foil layer.
When specific pressing, substrate layer 1 generally uses thickness for the copper base of 1mm；Consent material layer 2 use glue content for
60-70%, the PP resin sheets that thickness is 6-7MIL.Compression method is as follows：（1）Lamination, according to wiring board design demand, by outer layer
Copper foil one, the first PP resin sheets of lower section internal layer circuit plate and cooperation, the 2nd PP resin sheets one, substrate, the 2nd PP resin sheets two,
Top internal layer circuit plate and the first PP resin sheets, the outer copper foil two of cooperation stack successively from bottom to up；
（2）Will pressing steel plate two be placed on one side on outer copper foil two, by outer copper foil two to two side stretchings squeeze out its with
Air bubble between PP resin sheets slowly puts down pressing steel plate two；
（3）Positioning positions the above-mentioned wiring board stacked using pin；
（4）The wiring board that lamination is had good positioning integrally is overturn, outer copper foil one is arranged, pressing steel plate one is placed on outer on one side
On layer copper foil one, outer copper foil one is squeezed out into its air bubble between PP resin sheets to two side stretchings, slowly puts down pressing
Steel plate one；
（5）It is sent into pressing machine pressing.
It is above the specific implementation of the utility model, the description thereof is more specific and detailed, but can not therefore manage
Solution is the limitation to the utility model patent range.It should be pointed out that for those of ordinary skill in the art, not
Under the premise of being detached from the utility model design, various modifications and improvements can be made, these obvious alternative forms are equal
Belong to the scope of protection of the utility model.
Claims (3)
1. wiring board consent pressing structure, including substrate and the multiple internal layer circuit plates for being sequentially arranged in substrate both sides are set to internal layer
Outer copper foil on the outside of wiring board, the first PP resin sheets of setting pressing, feature exist between the internal layer circuit plate and substrate
In；The substrate both sides also set up the 2nd PP resin sheets for consent, the 2nd PP resin sheets and the first PP resin sheets
Performance parameter is consistent.
2. wiring board consent pressing structure according to claim 1, it is characterised in that：The 2nd PP resin sheet thickness is
6-7MIL。
3. wiring board consent pressing structure according to claim 1, it is characterised in that：The substrate thickness is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721515189.3U CN207927005U (en) | 2017-11-14 | 2017-11-14 | A kind of wiring board consent pressing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721515189.3U CN207927005U (en) | 2017-11-14 | 2017-11-14 | A kind of wiring board consent pressing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207927005U true CN207927005U (en) | 2018-09-28 |
Family
ID=63612086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721515189.3U Active CN207927005U (en) | 2017-11-14 | 2017-11-14 | A kind of wiring board consent pressing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207927005U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
-
2017
- 2017-11-14 CN CN201721515189.3U patent/CN207927005U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
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