CN205946358U - Copper base plate consent pressfitting structure - Google Patents
Copper base plate consent pressfitting structure Download PDFInfo
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- CN205946358U CN205946358U CN201620968606.9U CN201620968606U CN205946358U CN 205946358 U CN205946358 U CN 205946358U CN 201620968606 U CN201620968606 U CN 201620968606U CN 205946358 U CN205946358 U CN 205946358U
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- consent
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- copper base
- copper
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Abstract
The utility model provides a copper base plate consent pressfitting structure. Copper base plate consent pressfitting structure includes the base plate layer, locates PP resin layer, the copper foil layer of base plate layer both sides in proper order, be equipped with the consent material layer between base plate layer and the PP resin layer. The consent material layer is PP prepreg. Compared with the prior art, the utility model discloses a produce the prepreg one shot forming that the line is commonly used and can replace traditional resin syrup consent production of copper base plate, do not need manual filler to the filler is intact after guaranteeing the pressfitting, regional the nos white point of filler, hickie phenomenon, the while also great improvement production efficiency the cost is reduced.
Description
Technical field
This utility model is related to board production technical field.
Background technology
In prior art, the pressing working procedure that wiring board makes is to fill out the good copper base of brown using the paste resin of flowing
Hole, then pressed with prepreg.Defect in this operation is as follows：（1）In the hole filler is stir-in resin glue, with hole face pressing
Prepreg easily with reference to bad and white point, white macula occur；（2）Brown film is easily wiped flower and is easily occurred to rear operation that plate face is bad to be led to
Scrap；（3）Production efficiency lowly leads to production cost high.
Utility model content
For the problems referred to above, this utility model provides a kind of copper base consent pressing structure.
Described copper base consent pressing structure, including substrate layer and be sequentially arranged in the PP resin bed of substrate layer both sides, Copper Foil
Layer, is provided with consent material layer between described substrate layer and PP resin bed.
Specifically, described consent material layer is PP prepreg.
Preferably, described copper foil layer adopts the Copper Foil of HOZ thickness.
Preferably, described PP prepreg be glue content 99%, thickness be 4-5MIL PP prepreg.
Preferably, described substrate layer adopts the copper base that thickness is 1mm.
Compared with prior art, the beneficial effects of the utility model are：This utility model adopts conventional partly the consolidating of producing line
Changing piece one-shot forming can replace traditional paste resin consent to produce copper base it is not necessary to manual filler, and ensures filler after pressing
Intact, filler region no white point, white macula phenomenon, also greatly improve production efficiency simultaneously and reduce cost.
Brief description
Fig. 1 is pressing structure schematic diagram described in the utility model.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that doing further to this utility model below in conjunction with specific embodiment
Describe in detail.
Refer to Fig. 1, copper base consent pressing structure includes substrate layer 1 and the PP resin bed being sequentially arranged in substrate layer both sides
2nd, consent material layer 3, copper foil layer 4.
When being embodied as, substrate layer 1 typically adopts the copper base that thickness is 1mm；It is glue that consent material layer 2 adopts glue content
Content 99%, thickness are the pure glue PP prepreg of 4-5MIL；Copper foil layer 4 adopts the Copper Foil of HOZ thickness.During making, first root
Need boring, surface brown on copper base according to design, then by copper base 1, pure glue PP prepreg 3, PP resin bed 2, Copper Foil
Para-position arranges layer 4 successively, is placed into and is pressed on hot press, after melting in wherein pure glue PP prepreg 3 bonding processes
The in the hole that copper base can be packed into realizes consent, and remaining glue can be good at forming entirety with PP resin layers and making Copper Foil and copper
Substrate combines.
This utility model adopts the pure glue prepreg one step press molding of glue content 99%, replaces traditional paste resin
Consent produces copper base, saves manual filler operation, improves work efficiency；And filler is intact after can ensureing pressing, filler area
Domain no white point, white macula phenomenon, greatly improve production efficiency and reduce cost simultaneously.
It is specific implementation of the present utility model above, its description is more concrete and detailed, but can not therefore manage
Solution is the restriction to this utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, not
On the premise of departing from this utility model design, some deformation can also be made and improve, these obvious alternative forms are equal
Belong to protection domain of the present utility model.
Claims (5)
1. copper base consent pressing structure, including substrate layer and be sequentially arranged in the PP resin bed of substrate layer both sides, copper foil layer, it is special
Levy and be；It is provided with consent material layer between described substrate layer and PP resin bed.
2. copper base consent pressing structure according to claim 1 it is characterised in that：Described consent material layer is that PP half is solid
Change piece.
3. copper base consent pressing structure according to claim 1 it is characterised in that：Described copper foil layer adopts HOZ thickness
Copper Foil.
4. copper base consent pressing structure according to claim 2 it is characterised in that：Described PP prepreg is glue content
99%th, thickness is the PP prepreg of 4-5MIL.
5. copper base consent pressing structure according to claim 1 it is characterised in that：Described substrate layer using thickness is
The copper base of 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620968606.9U CN205946358U (en) | 2016-08-30 | 2016-08-30 | Copper base plate consent pressfitting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620968606.9U CN205946358U (en) | 2016-08-30 | 2016-08-30 | Copper base plate consent pressfitting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205946358U true CN205946358U (en) | 2017-02-08 |
Family
ID=57953448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620968606.9U Active CN205946358U (en) | 2016-08-30 | 2016-08-30 | Copper base plate consent pressfitting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205946358U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN107949171A (en) * | 2017-11-15 | 2018-04-20 | 奥士康科技股份有限公司 | A kind of printed circuit board (PCB) and manufacture method |
| CN111885833A (en) * | 2020-07-28 | 2020-11-03 | 深圳市迅捷兴科技股份有限公司 | Through hole blind hole pressing glue filling method |
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
-
2016
- 2016-08-30 CN CN201620968606.9U patent/CN205946358U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN107949171A (en) * | 2017-11-15 | 2018-04-20 | 奥士康科技股份有限公司 | A kind of printed circuit board (PCB) and manufacture method |
| CN111885833A (en) * | 2020-07-28 | 2020-11-03 | 深圳市迅捷兴科技股份有限公司 | Through hole blind hole pressing glue filling method |
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
| CN116156741B (en) * | 2023-04-23 | 2023-07-04 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20181204 Granted publication date: 20170208 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20190604 Granted publication date: 20170208 |
|
| PD01 | Discharge of preservation of patent | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20190604 Granted publication date: 20170208 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20191204 Granted publication date: 20170208 |
|
| PD01 | Discharge of preservation of patent |