CN205305229U - Forming device of production HDI board - Google Patents
Forming device of production HDI board Download PDFInfo
- Publication number
- CN205305229U CN205305229U CN201520995736.7U CN201520995736U CN205305229U CN 205305229 U CN205305229 U CN 205305229U CN 201520995736 U CN201520995736 U CN 201520995736U CN 205305229 U CN205305229 U CN 205305229U
- Authority
- CN
- China
- Prior art keywords
- die station
- mould platform
- upper die
- plate
- jacking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
The utility model provides a forming device of production HDI board, it includes mould platform and lower mould platform, and the central authorities of lower mould platform are provided with opening lower mould platform recess up, and the bottom of lower mould platform recess is provided with the backing board, and the bottom of backing board is the lower part zone of heating, and the bottom of backing board is provided with and is fixed with the jacking post, and the jacking post pierces through the bottom of stretching out the lower mould platform behind the zone of heating of lower part downwards, the central authorities of going up the mould platform are provided with opening last mould platform recess down, and the top of going up mould platform recess is provided with a layer board, and the upper portion of top layer board is the upper portion zone of heating, has seted up vacuum tubularis on the layer board of top, and vacuum tubularis's bottom opening sets up in the bottom of a layer board, and vacuum tubularis's top is stretched out the top surface of mould platform and is linked to each other with the vacuum pump. This forming device has solved the high problem of make -up machine defective goods rate among the prior art.
Description
Technical field
This utility model relates to the processing unit (plant) of a kind of HDI plate.
Background technology
HDI is the abbreviation of high density interconnection, is a kind of technology producing printed board, and HDI plate is the circuit board that a kind of circuit distribution density is higher. Typically require when producing HDI substrate and two-layer substrate is bonded together by dielectric film, the forming machine of prior art defective goods rate when carrying out upper and lower base plate overlapping is high, it is that monoblock substrate is carried out when main reason is that and execute stressed, this damage being easy for causing substrate.
Utility model content
In order to solve Problems existing in background technology, this utility model provides a kind of shaped device producing HDI plate, and this shaped device solves the problem that in prior art, forming machine defective goods rate is high.
For reaching above-mentioned purpose, this utility model adopts the following technical scheme that
A kind of shaped device producing HDI plate, including upper die station and lower die station, the side of described lower die station is provided with hole, location, the opposite side contrary with hole, location is provided with fixing hole, the central authorities of lower die station are provided with opening up lower die station groove, lower die station groove is for shelving the underlying substrate of HDI plate, the bottom of lower die station groove is provided with backing board, backing board adopts hard material to make, the bottom of backing board is lower heater zone, the bottom of backing board is provided with and is fixed with jacking post, and jacking post stretches out the bottom of lower die station after penetrating downwards lower heater zone, the position that the hole, location of described upper die station up and down die station is corresponding is provided with alignment pin, the position that the fixing hole of upper die station up and down die station is corresponding is provided with fixed bolt, the central authorities of upper die station are provided with downward opening upper die station groove, upper die station groove is for shelving the top substrate layer of HDI plate, the top of upper die station groove is provided with jacking plate, jacking plate adopts soft material to make, the top of jacking plate is the thermal treatment zone, top, jacking plate offers vaccum suction pipe, the bottom opening of vaccum suction pipe is arranged on the bottom of jacking plate, the top of vaccum suction pipe is stretched out the end face of die station and is connected with vacuum pump.
Described lower heater zone and the thermal treatment zone, top are provided with electrical heating wire.
The beneficial effects of the utility model are: act solely on adhesive film region by jacking post, it is to avoid area extrudes the substrate damage caused, and decreases defective goods, improves production efficiency.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, this utility model is further illustrated
Fig. 1 is the structural representation of shaped device described in the utility model;
Detailed description of the invention
Illustrate with detailed description of the invention, this utility model to be further described below in conjunction with accompanying drawing:
Embodiment 1
As shown in Figure 1, a kind of shaped device producing HDI plate, including upper die station 2 and lower die station 1, the side of lower die station 1 is provided with hole 15, location, the opposite side contrary with hole 15, location is provided with fixing hole 14, the central authorities of lower die station arrange opening up lower die station groove, lower die station groove is for shelving the underlying substrate 3 of HDI plate, the bottom of lower die station groove is provided with backing board 13, backing board 13 adopts hard material to make, the bottom of backing board 13 is lower heater zone 11, lower heater zone is provided with electrical heating wire, for lower die station 1 is heated, the bottom of backing board 13 is provided with and is fixed with jacking post 12, jacking post 12 penetrates downwards lower heater zone 11 and stretches out the bottom of lower die station and be connected with hydraulic mechanism (not shown).
The position of hole 15, the location correspondence of upper die station 2 up and down die station is provided with alignment pin 25, the position of fixing hole 14 correspondence of upper die station 2 up and down die station is provided with fixed bolt 24, the central authorities of upper die station are provided with downward opening upper die station groove, upper die station groove is for shelving the top substrate layer 5 of HDI plate, the top of upper die station groove is provided with jacking plate 22, jacking plate 22 adopts soft material to make, the top of jacking plate is the thermal treatment zone, top 21, top is provided with electrical heating wire in the thermal treatment zone, for upper die station 1 is heated, jacking plate 22 offers vaccum suction pipe 23, the bottom opening of vaccum suction pipe 23 is arranged on the bottom of jacking plate 22, the top of vaccum suction pipe 23 is stretched out the end face of die station and is connected with vacuum pump.
The work process of this shaped device: first the underlying substrate 3 of HDI plate is arranged in lower die station groove, adhesive film 4 is shelved on underlying substrate 3, then the top substrate layer 5 of HDI plate is inhaled jacking plate 22 times by vaccum suction pipe 23, then upper die station 2 is shelved in lower die station 1, alignment pin 25 extend in hole 15, location, fixed bolt 24 is screwed in fixing hole 14 and upper die station 2 and lower die station 1 is tightened together, then heating lower heater zone 11 and the thermal treatment zone, top 21, jacking post 12 ramps up simultaneously, under the pressure of jacking post 12, HDI top substrate layer 5 and HDI underlying substrate 3 are fixed together formation HDI substrate.
It will be recognized by those skilled in the art, under the premise not necessarily departing from protection scope of the present invention, it is possible to above-mentioned embodiment is carried out various amendment, change and combination, and thinks that this amendment, change and combination are within the scope of originality thought.
Claims (2)
1. produce a shaped device for HDI plate, including upper die station and lower die station, it is characterised in that:
The side of described lower die station is provided with hole, location, the opposite side contrary with hole, location is provided with fixing hole, the central authorities of lower die station are provided with opening up lower die station groove, lower die station groove is for shelving the underlying substrate of HDI plate, the bottom of lower die station groove is provided with backing board, and backing board adopts hard material to make, and the bottom of backing board is lower heater zone, the bottom of backing board is provided with and is fixed with jacking post, and jacking post stretches out the bottom of lower die station after penetrating downwards lower heater zone;
The position that the hole, location of described upper die station up and down die station is corresponding is provided with alignment pin, the position that the fixing hole of upper die station up and down die station is corresponding is provided with fixed bolt, the central authorities of upper die station are provided with downward opening upper die station groove, upper die station groove is for shelving the top substrate layer of HDI plate, the top of upper die station groove is provided with jacking plate, jacking plate adopts soft material to make, the top of jacking plate is the thermal treatment zone, top, jacking plate offers vaccum suction pipe, the bottom opening of vaccum suction pipe is arranged on the bottom of jacking plate, the top of vaccum suction pipe is stretched out the end face of die station and is connected with vacuum pump.
2. a kind of shaped device producing HDI plate as claimed in claim 1, it is characterised in that described lower heater zone and be provided with electrical heating wire in the thermal treatment zone, top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520995736.7U CN205305229U (en) | 2015-12-03 | 2015-12-03 | Forming device of production HDI board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520995736.7U CN205305229U (en) | 2015-12-03 | 2015-12-03 | Forming device of production HDI board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205305229U true CN205305229U (en) | 2016-06-08 |
Family
ID=56436642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520995736.7U Active CN205305229U (en) | 2015-12-03 | 2015-12-03 | Forming device of production HDI board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205305229U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110614706A (en) * | 2019-11-21 | 2019-12-27 | 湖南三一快而居住宅工业有限公司 | Double-skin wall production equipment and production line thereof |
-
2015
- 2015-12-03 CN CN201520995736.7U patent/CN205305229U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110614706A (en) * | 2019-11-21 | 2019-12-27 | 湖南三一快而居住宅工业有限公司 | Double-skin wall production equipment and production line thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100556249C (en) | Jack process of printed circuit board | |
| WO2017028430A1 (en) | Process method for refining photoconverter to bond-package led and refinement equipment system | |
| CN205946358U (en) | Copper base plate consent pressfitting structure | |
| CN205305229U (en) | Forming device of production HDI board | |
| CN201215804Y (en) | Four-row double-column transistor lead frame plate piece | |
| CN206481510U (en) | A kind of presser device of multi-layer PCB board | |
| CN205902213U (en) | Take anti -static function's circuit board drilling apron | |
| CN108054419A (en) | A kind of anti-battery core of hot press is adhered equipment | |
| US20200251607A1 (en) | Method for producing solar cell module | |
| CN103258933B (en) | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating | |
| CN103963372A (en) | LED pattern glass and manufacturing method | |
| CN201413828Y (en) | Solar cell core plate laminating packaging typesetting die | |
| CN106469767B (en) | A kind of change system of the organic siliconresin light conversion body fitting encapsulation LED based on series connection rolling | |
| CN205905289U (en) | A equipment for processing pressure transmitter | |
| US20180248085A1 (en) | Equipment System Using Thermoplastic Resin Photoconverter to Bond-Package Led by Rolling | |
| CN207474599U (en) | It is melted into the adjustable chemical conversion laminate of pcb board | |
| CN208241978U (en) | Suppress the jig of the strong class product of Mangnolia officinalis | |
| CN207250503U (en) | A kind of lead frame that can improve stock utilization | |
| CN207274040U (en) | LED television backlight covers copper aluminum substrate with high pressure resistant high heat conduction | |
| CN204687382U (en) | A kind of building decorative composite board presser device | |
| CN201563291U (en) | Internal layer structure for circuit board | |
| CN204244568U (en) | A kind of multi-layer PCB printed substrate | |
| CN207415600U (en) | A kind of fiber extrusion molding machine | |
| CN204081361U (en) | For the paster apparatus that wall surface paster manufactures | |
| CN206205697U (en) | A kind of caash bar of the rack glass door with glue groove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |