CN103547087B - Vacuum adhesive pressing hole plugging method for high-depth buried holes - Google Patents
Vacuum adhesive pressing hole plugging method for high-depth buried holes Download PDFInfo
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- CN103547087B CN103547087B CN201310408656.2A CN201310408656A CN103547087B CN 103547087 B CN103547087 B CN 103547087B CN 201310408656 A CN201310408656 A CN 201310408656A CN 103547087 B CN103547087 B CN 103547087B
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Abstract
The invention relates to a vacuum adhesive pressing hole plugging method for high-depth buried holes. The existing vacuum lamination equipment is utilized, a plated hole film and a special adhesive pressing structure and program are designed, and PP lamination is used to filling adhesives to the high-depth buried holes in a vacuum manner. Due to the fact that PP semi-curing pieces are used for pressing and adhesive filling, process compatibility and product reliability are increased. The vacuum lamination equipment is used for vacuum adhesive pressing, hold plugging capability and production efficiency of the high-depth buried holes are improved. By the design of the plated hole film and the special and the adhesive pressing structure and program, hole filling is facilitated, and PP adhesive on board surface can be removed favorably.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, particularly to a kind of vacuum moulding method for plugging of the blind buried via hole of high depth.
Background technology
With electronic product further to short, little, light, thin trend development, the wiring density more and more higher of PCB, the product with the design of blind buried via hole therefore arises at the historic moment.For the design of blind buried via hole, such as depth≤0.8mm, nature filler can be carried out using normal laminate structure；But for the blind buried via hole of high depth of depth ＞ 0.8 mm, insert blind buried via hole by PP nature gummosis then relatively difficult, during especially with the prepreg with filler, often produce bubble or cavity because PP filler is not enough, cause the quality hidden danger such as blind buried via hole plate bursting layering or Kong Wutong.
Naturally generation bubble or starved problem are pressed for the blind buried via hole of high depth, the usual way in industry is first to carry out filling holes with resin to blind buried via hole before pressing, is filled up blind buried via hole with liquid resin glue in advance, such plug-hole has following two ways at present：
One kind is silk screen printing plug-hole, that is, using liquid resin glue as consent material, makes special plug-hole half tone and carries out plug-hole by the way of tradition is bitten.This kind of mode plug-hole has following deficiency：1st, special plug-hole half tone need to be made, model production operation is loaded down with trivial details, time and effort consuming；2nd, with liquid resin for consent material, because liquid resin retention cycle is short（≤ 24 hours）, material consumption is difficult controlled；3rd, deep hole needs multitool plug to print, and easily produces empty bubble in the hole, affects quality；4th, liquid resin needs long-time hot setting（4 to 6 hours）, long the production cycle；5th, cannot take into account it is impossible to process ultra-large aperture for multiple aperture distribution（≥1.0 mm）.
Another kind is vacuum taphole machine plug-hole, that is, adopt new-type Special vacuum hole plugging equipment, carry out plug-hole using liquid resin glue as consent material.This kind of mode plug-hole has following deficiency：1st, vacuum taphole special equipment, expensive（100 to 200 ten thousand/platforms）, need the second investment；2nd, with liquid resin for consent material, because liquid resin retention cycle is short（≤ 24 hours）, material consumption is difficult controlled；3rd, cannot take into account it is impossible to process ultra-large aperture for multiple aperture distribution（≥1.0 mm）.
Content of the invention
The invention aims to the one kind solving the deficiencies in the prior art and providing utilizes existing laminating apparatus, the mode of vacuum pressing-combining PP prepreg, take into account the vacuum moulding method for plugging of the blind buried via hole of high depth of multiple aperture distribution simultaneously.
The invention discloses a kind of vacuum moulding method for plugging of the blind buried via hole of high depth, it is that using PP laminar manner, to high depth, blind buried via hole carries out vacuum filler, and the method comprises the steps using existing vacuum laminating apparatus：
A, after the heavy copper of blind buried via hole boring, make plated hole figure, the design specialized plated hole film, a plated hole does not plate plate face, make beneficial to fine-line；
B, using figure electrically blind buried via hole is electroplated onto properly（Required for client）Hole copper thickness；
Do not move back film after c, figure electroplating hole, filler process is carried out to blind buried via hole using direct moulding method, so only have in the hole filler, plate face copper sheet has dry film protection not have glue；
D, design specialized blind hole moulding structure and moulding program, it is ensured that PP glue amount can be sufficient filling with blind buried via hole, no starved cavity produces design specialized moulding structure, design specialized moulding program, beneficial to PP filler, is also beneficial to removing of plate face PP glue and follow-up glass cloth simultaneously；
E, tear glue, remove plate face cull it is ensured that plate face does not stay glass woven design and cull；
F, it is ground using abrasive band, grinds off aperture and plate face cull, make beneficial to circuit；
G, the blind buried via hole internal layer circuit of making, subsequently routinely flow process produces.
Filler material described in above-mentioned steps is PP prepreg, and its retention cycle is long（3 months）, flexible and convenient operation compatible with existing lamination process.
Filler mode described in above-mentioned steps is vacuum pressing-combining filler, will not crack or bubble in the hole, and the blind buried via hole of high depth beyond conventional machining ability also can effectively be filled, filling capacity can accomplish more than 4.0mm, and in the hole filler is full, bubble will not be cracked.
The vacuum moulding method for plugging of the blind buried via hole of the high depth of the present invention, using existing vacuum laminating apparatus, is filled with blind buried via hole, this technical scheme has the advantages that by the way of vacuum pressing-combining PP：
1st, utilize existing laminating apparatus, the second investment need not be increased, cost-effective；
2nd, consent principal goods material is PP prepreg, and its retention cycle is long（3 months）, flexible and convenient operation compatible with existing lamination process；
3rd, adopt vacuum pressing-combining filler, the no empty bubble of in the hole, product quality is high；
4th, blind buried via hole vacuum moulding flow process, with short production cycle, can the model of compatible different size size and small quantities of template simultaneously, that is, sizes plate can press with machine, production efficiency is greatly improved, and is very beneficial for the processing of allegro；
5th, more than 4.0mm can be accomplished using the method porefilling capability, and in the hole filler is full, be greatly improved the high depth working ability of blind buried via hole.
Specific embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with specific embodiment, the structural principle of the present invention is described in further detail.
A kind of vacuum moulding method for plugging of the blind buried via hole of high depth, it is that using PP laminar manner, to high depth, blind buried via hole carries out vacuum filler, and the method comprises the steps using existing vacuum laminating apparatus：
A, after the heavy copper of blind buried via hole boring, make plated hole figure, the design specialized plated hole film, a plated hole does not plate plate face, make beneficial to fine-line；
B, blind buried via hole is electrically electroplated onto by hole copper thickness required for client using figure；
Do not move back film after c, figure electroplating hole, filler process is carried out to blind buried via hole using direct moulding method, so only have in the hole filler, plate face copper sheet has dry film protection not have glue；
D, design specialized blind hole moulding structure and moulding program, it is ensured that PP glue amount can be sufficient filling with blind buried via hole, no starved cavity produces design specialized moulding structure, design specialized moulding program, beneficial to PP filler, is also beneficial to removing of plate face PP glue and follow-up glass cloth simultaneously；
E, tear glue, remove plate face cull it is ensured that plate face does not stay glass woven design and cull；
F, it is ground using abrasive band, grinds off aperture and plate face cull, make beneficial to circuit；
G, the blind buried via hole internal layer circuit of making, subsequently routinely flow process produces.
Filler material described in above-mentioned steps is PP prepreg, and its retention cycle is long（3 months）, flexible and convenient operation compatible with existing lamination process.
Filler mode described in above-mentioned steps is vacuum pressing-combining filler, will not crack or bubble in the hole, and the blind buried via hole of high depth beyond conventional machining ability also can effectively be filled, filling capacity can accomplish more than 4.0mm, and in the hole filler is full, bubble will not be cracked.
Above-mentioned specific embodiment is the preferred embodiments of the present invention, and not the present invention is made with any pro forma restriction；The those of ordinary skill of all industry all can swimmingly be implemented the present invention by the above；But, all those skilled in the art in the range of without departing from technical solution of the present invention, available disclosed above technology contents and make some change, modify and develop equivalent variations, be the Equivalent embodiments of the present invention；Meanwhile, all substantial technological according to the present invention are made to above example other any changes made without departing from technical scheme or other equivalent substitute modes, are all contained within protection scope of the present invention.
Claims (1)
1. it is characterised in that it is to utilize vacuum laminating apparatus, using PP laminar manner, to high depth, blind buried via hole carries out vacuum filler to a kind of vacuum moulding method for plugging of the blind buried via hole of high depth, and the method comprises the steps：
A, after the heavy copper of blind buried via hole boring, make plated hole figure, the design specialized plated hole film, a plated hole does not plate plate face；
B, using figure electrically blind buried via hole is electroplated onto suitable hole copper thickness；
Do not move back film after c, plated hole, filler process is carried out to blind buried via hole using direct moulding method；
D, design specialized blind hole moulding structure and moulding program；
E, tear glue；
F, it is ground using abrasive band；
G, the blind buried via hole internal layer circuit of making, subsequently routinely flow process produces.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310408656.2A CN103547087B (en) | 2013-09-10 | 2013-09-10 | Vacuum adhesive pressing hole plugging method for high-depth buried holes |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310408656.2A CN103547087B (en) | 2013-09-10 | 2013-09-10 | Vacuum adhesive pressing hole plugging method for high-depth buried holes |
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| CN103547087A CN103547087A (en) | 2014-01-29 |
| CN103547087B true CN103547087B (en) | 2017-02-08 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039093B (en) * | 2014-06-25 | 2017-01-25 | 惠州市金百泽电路科技有限公司 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN108200735A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Blind buried via hole circuit board machining process |
| CN110099524A (en) * | 2019-04-30 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of pressing production method of multilayer circuit board |
| CN111885833A (en) * | 2020-07-28 | 2020-11-03 | 深圳市迅捷兴科技股份有限公司 | Through hole blind hole pressing glue filling method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7225536B2 (en) * | 2005-04-07 | 2007-06-05 | Ho-Ching Yang | Precasting multi-layer PCB process |
| KR101174374B1 (en) * | 2010-10-22 | 2012-08-16 | 이옥균 | Manufacturing device of pcb backup board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
Non-Patent Citations (1)
| Title |
|---|
| 真空压胶替代传统树脂塞孔工艺研究;杜露倩等;《印制电路信息》;20130410;第192页-196页 * |
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Inventor after: Chen Chun Inventor after: Tang Honghua Inventor after: Wu Shoukun Inventor after: Lin Yingsheng Inventor after: Liu Min Inventor after: He Dagang Inventor before: Tang Honghua Inventor before: Wu Shoukun Inventor before: Deng Weihong Inventor before: He Dagang Inventor before: Chen Yutao Inventor before: Liu Min |
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