CN101336052A - Jack process of printed circuit board - Google Patents
Jack process of printed circuit board Download PDFInfo
- Publication number
- CN101336052A CN101336052A CNA2008100299427A CN200810029942A CN101336052A CN 101336052 A CN101336052 A CN 101336052A CN A2008100299427 A CNA2008100299427 A CN A2008100299427A CN 200810029942 A CN200810029942 A CN 200810029942A CN 101336052 A CN101336052 A CN 101336052A
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- epoxy resin
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- pcb board
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Abstract
The invention discloses plug hole technology of a printed circuit board, namely PCB, wherein the implement method comprises: performing oxidation treatment on the plug hole PCB, drying the PCB which is performed with oxidation treatment; then fetching epoxy resin Prepreg slice with corresponding size of the plug hole PCB to pile on the plug hole PCB; laying out on a mould of a vacuum pressing machine according to interval laying sequence of the Prepreg slice and the plug hole PCB; inputting the epoxy resin Prepreg slice and the plug hole PCB which have been laid into the vacuum pressing machine for clipping the plate, wherein epoxy resin flow in the epoxy resin Prepreg slice flows into the hole of the plug hole PCB to complete the plug hole in plate clip. The invention adopts the method of filling glue into the plug hole after hot pressing the epoxy resin Prepreg slice, meanwhile, the plug hole method has shorter time consumption, higher efficiency and lower cost compared with prior art.
Description
Technical field
The present invention relates to pcb board manufacturing technology field.
Background technology
Along with popularizing and extensive use of electronic product, the production of printed circuit board (Printed Circuit Board is called for short pcb board) and manufacturing technology are also brought in constant renewal in and are developed.For producing the demand of different electronic products, the pcb board of designed manufacturing develops into doubling plate or multiple-plate design and application by lamina.
When general manufacturing bilayer or multiple layer metal pcb board, all there is isolating metal basic unit to carry out the requirement that circuit connects.To be provided with relative clearance hole and carry out consent at metal-based layer for this reason.Make circuit isolating metal basic unit on each layer circuit board connect and form relative switching road.
The present invention can also be applied to the buried via hole consent of the pcb board large aperture of multilayer FR-4 simultaneously.Pcb board is to generate circuit through etching in process of production, suffers that for the electric conducting material on the hole wall that prevents conduction buried via hole made on the multi-layer sheet etch of etching solution destroys, and the conductive hole on each layer pcb board must be covered or clogs with the protection conductive hole for this reason.
Consent method used in the prior art mainly is to fill printing ink by similar mode of printing in conductive hole, makes the material of inserting corrosion-resisting function in conductive hole, with this electric conducting material that prevents conductive hole not etched liquid destroyed.Disclosed consent method realizes by inject printing ink in conductive hole among the Chinese patent application for a patent for invention CN 101098593A.
The existing consent method of injecting printing ink in conductive hole all must use vacuum screen printer and corollary equipment could effectively avoid air bubble problem; And the employed corollary equipment of this class consent method costs an arm and a leg, and the production cost height can't be applied.
Summary of the invention
Technical problem to be solved by this invention provides a kind of jack process of printed circuit board that can effectively avoid bubble, reduce production costs.
For solving the problems of the technologies described above, the step that pcb board jack process of the present invention is realized is as follows:
(1) treats consent pcb board oxidation processes, and the pcb board after the oxidation is dried;
(2) stack main encapsulating epoxy resin PP sheet successively earlier in the PCB both sides, stack auxiliary encapsulating epoxy resin PP sheet again;
(3) on the auxiliary encapsulating epoxy resin PP sheet of PCB both sides, respectively be covered with a Copper Foil or adhesive block film, with protection pressing machine mould;
(4) with the epoxy resin PP sheet that stacks and treat that the consent pcb board sets type on true hole pressing machine mould;
(5) set type on pressing machine mould epoxy resin PP sheet and treat that the consent pcb board is input to and carry out pressing plate in the vacuum pressing-combining machine, the epoxy resin in the epoxy resin PP sheet is flowed in the hole for the treatment of the consent pcb board comes consent;
(6) peel off residual epoxy resin PP sheet and residual glue mark on the pcb board behind the pressing plate.
Jack process of the present invention has following remarkable result compared to existing technology:
The present invention with the hot pressing of epoxy resin PP sheet after the encapsulating consent do not produce bubble, adopt PP sheet consent consuming time shorter simultaneously than existing insulating resin ink plugging, efficient height, cost are low.This jack process can fundamentally solve present jack process to similar sandwich high electric current, power supply and multiple predicament aluminium base, that copper base pcb board not can manufacture, meanwhile can also effectively reduce the cost of jack process, obtain abundant economic benefit and social benefit.
Description of drawings
Fig. 1: in this jack process epoxy resin PP sheet and pcb board in vacuum pressing-combining machine by the schematic diagram of pressing consent.
Reference numeral:
1, treats the consent pcb board;
2, oxide layer;
3, epoxy resin PP sheet;
4, Copper Foil or adhesive block film;
5, pressing machine;
11, treat hole on the consent pcb board;
Embodiment
Below in conjunction with accompanying drawing pcb board jack process of the present invention is elaborated.
At first carry out oxidation processes to preparing consent processing pcb board 1; Pcb board is handled the alligatoring that hole 11 walls for the treatment of on the consent pcb board are obtained on the microcosmic by liquid medicine form oxide layer 2, to strengthen the adhesion of hole wall and molten resin.Oxidation liquid medicine can be in the existing PCB production process general oxidation liquid medicine, can be black oxidation or brown oxidationization according to the difference of pcb board.
After treating that consent printed circuit board (PCB) 1 carries out surface treatment, the more residual water marks of possibility for fear of the harmful effect that moisture produces subsequent handling, adopt drying mode to remove the residual moisture of hole wall.Moisture on the oven dry pcb board need toast 30 minutes under 105 ℃ of conditions usually.
After the baking pcb board, carry out next step stacks epoxy resin PP sheet 3 in the pcb board both sides operation.The described epoxy resin PP of this technology sheet is meant epoxy resin Prepreg sheet, soaks epoxy resin by glass cloth and makes.The method that stacks epoxy resin PP sheet in the pcb board both sides is, stacks main encapsulating epoxy resin PP sheet successively earlier in the PCB both sides, stacks auxiliary encapsulating epoxy resin PP sheet again.On the auxiliary encapsulating PP sheet of PCB both sides, respectively be covered with a Copper Foil or adhesive block film 4, with protection pressing machine mould.
The selection of epoxy resin PP sheet is decided by hole shape on the printed circuit board (PCB) for the treatment of consent, and the main encapsulating epoxy resin PP sheet of this technology is the low epoxy resin PP sheet of thread count, and that can select for use has 7629 epoxy resin PP sheets, 7628 epoxy resin PP sheets etc.; And auxiliary encapsulating epoxy resin PP sheet is the high relatively epoxy resin PP sheet of thread count height and content, and available have 2116 epoxy resin PP sheets, 1080 epoxy resin PP sheets and 106 epoxy resin PP sheets etc.
At present domestic FR-4PP sheet kind is a lot, as 7630,7629,7628,1506,2116,3313,2313,1080,108,106 or the like.They are to wait with the kind of glass cloth, density, through weft yarn line, gel content to classify; In same unit are, it is few through weft yarn, and then density is little; Will deposit many by machine at interstitial relative resin so.The combination of this jack process preferred 7628 and 1080 glass cloth can be satisfied the demand of encapsulating in the hole to greatest extent.Because 7628 have 9um greatly through weft yarn footpath, density is moderate to be 31 * 44/inch, the glass cloth fracture cull that is produced in the time of can effectively preventing to peel off behind the pressing plate remaining Prepreg sheet on the pcb board.And 1080 can effectively see through 7628 auxiliary encapsulatings through the moderate 60 * 47/inch content of the little 5um density in weft yarn footpath height.
With the epoxy resin PP sheet that stacks in the above-mentioned technology and treat that the consent pcb board sets type on true hole pressing machine mould, mould in company with the good epoxy resin PP sheet of row's plate and treat that the consent pcb board is input to and carry out pressing plate in the vacuum pressing-combining machine 5.The pressing plate process can referring to epoxy resin PP sheet shown in Figure 1 and pcb board in vacuum pressing-combining machine by the schematic diagram of pressing consent.
During pressing plate, in the middle of the arbitrary layer of module on maximum temperature≤195 in the vacuum pressing-combining machine ℃, the same module of pressing plate with the module limit temperature difference≤15 ℃, when the design temperature of PP sheet arrives 80-120 ℃ heating rate require 3-4 ℃/min, total head 350-400PSI in the pressing when material temperature that overlays the epoxy resin PP sheet on the pcb board arrives 70 ℃, utilize the HTHP of pressing machine that the epoxy resin in the PP sheet is flowed in the hole for the treatment of the consent pcb board and come consent.Pressure in the pressing machine is to assist encapsulating between the 350-400PSI.
Tear glue and inspection: earlier the pcb board after the pressing is removed adhesive block film or Copper Foil 4 behind the pressing plate, the glass fabric and the cull of only surplus a little cull are disposed, be beneficial to do follow-up circuit making.To the pcb board check criteria behind the consent be, no-sundries in the no bubble in the consent, consent, resin does not have disengaging or fills out discontented in the hole.If above-mentioned phenomenon and the no effect of repairing repeat above consent flow process after adding two brills (two borings are than treating the monolateral little 6-8mils in consent footpath).
Jack process of the present invention adopts the epoxy resin in the common FR-4PP sheet to replace similar Japanese UC-3000 series insulating resin printing ink to do the jack process of PCB, can finish Metal Substrate (aluminium, copper etc.) the hole mesopore jack process of plate and the jack process of common buried via hole plate.The present invention can effectively reduce the cost of jack process, and can save time widely, enhances productivity.
Following table can illustrate that jack process of the present invention compares the advantage that existing Japanese UC-3000 series insulating resin printing ink is done the jack process of PCB.
Table one: the every unfailing performance contrast that is epoxy resin Prepreg sheet consent of the present invention and Japanese UC-3000 series insulating resin ink plugging.
Table two: the cost that is epoxy resin Prepreg sheet consent of the present invention and Japanese UC-3000 series insulating resin ink plugging compares.
Table three: the production efficiency that is epoxy resin Prepreg sheet consent of the present invention and Japanese UC-3000 series insulating resin ink plugging compares.
Table one
Table two
| Project | Japan UC-3000 series insulating resin ink plugging | Epoxy resin Prepreg sheet consent | Remarks |
| Material Cost | 30 yuan/Ft 2(the every pnl of 45 yuan/pnl is with 1.5Ft 2Meter) | 9.6 unit/Ft 2 | Copper and PP are with 1.6 yuan/Ft 2Meter |
| Work flow | System net → vacuum silk-screen → leave standstill → bake plate → ceramic polish-brush nog plate → examine entirely | Melanism → row's plate → pressing plate → tear glue → common polish-brush nog plate → full inspection | Flow process is suitable substantially, because of its processing cost also basic identical, so do not make detailed calculated |
| Add up to cost and result | 30 yuan/Ft 2 | 9.6 unit/Ft 2 | Adopt FR-4PP sheet consent than insulating resin ink plugging cost savings 20.4 yuan/Ft 2 |
Table three
Claims (3)
1, a kind of jack process of printed circuit board may further comprise the steps:
(1) treats consent pcb board oxidation processes, and the pcb board after the oxidation is dried;
(2) stack main encapsulating epoxy resin PP sheet successively earlier in the PCB both sides, stack auxiliary encapsulating epoxy resin PP sheet again;
(3) on the auxiliary encapsulating epoxy resin PP sheet of PCB both sides, respectively be covered with a Copper Foil or adhesive block film, with protection pressing machine mould;
(4) with the epoxy resin PP sheet that stacks and treat that the consent pcb board sets type on true hole pressing machine mould;
(5) set type on pressing machine mould epoxy resin PP sheet and treat that the consent pcb board is input to and carry out pressing plate in the vacuum pressing-combining machine, the epoxy resin in the epoxy resin PP sheet is flowed in the hole for the treatment of the consent pcb board comes consent;
(6) peel off residual epoxy resin PP sheet and residual glue mark on the pcb board behind the pressing plate.
2, jack process of printed circuit board according to claim 1, it is characterized in that: the selection of described epoxy resin PP sheet is decided by hole shape on the pcb board for the treatment of consent, described main encapsulating epoxy resin PP sheet is the low epoxy resin PP sheet of thread count, includes 7629 epoxy resin PP sheets, 7628 epoxy resin PP sheets; Described auxiliary encapsulating epoxy resin PP sheet is the high relatively epoxy resin PP sheet of thread count height and resin content, includes 2116 epoxy resin PP sheets, 1080 epoxy resin PP sheets and 106 epoxy resin PP sheets.
3, jack process of printed circuit board according to claim 1, it is characterized in that: the parameter condition of carrying out pressing plate in the described vacuum pressing-combining machine is: pressing plate maximum temperature≤195 ℃, pressing plate are with the temperature difference≤15 of one deck ℃, and heating rate required 3-4 ℃/min when temperature arrived 80-120 ℃, the pressure the when material temperature that overlays the epoxy resin PP sheet on the pcb board arrives 70 ℃ in the pressing machine is to assist encapsulating between the 350-400PSI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100299427A CN100556249C (en) | 2008-07-30 | 2008-07-30 | Jack process of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100299427A CN100556249C (en) | 2008-07-30 | 2008-07-30 | Jack process of printed circuit board |
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|---|---|
| CN101336052A true CN101336052A (en) | 2008-12-31 |
| CN100556249C CN100556249C (en) | 2009-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2008100299427A Expired - Fee Related CN100556249C (en) | 2008-07-30 | 2008-07-30 | Jack process of printed circuit board |
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| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN102281724A (en) * | 2011-08-26 | 2011-12-14 | 广州杰赛科技股份有限公司 | Method for machining double-sided windowed plug hole |
| CN102316679A (en) * | 2011-09-16 | 2012-01-11 | 深圳市万泰伟业科技有限公司 | Manufacture method for double-side aluminum circuit board |
| CN102421242A (en) * | 2011-08-08 | 2012-04-18 | 慈溪市永旭丰泰电子科技有限公司 | Flanged brass circuit board |
| CN102427665A (en) * | 2011-09-16 | 2012-04-25 | 深圳市万泰伟业科技有限公司 | Manufacturing technology of three-dimensional double-face aluminium substrate |
| CN101720167B (en) * | 2009-11-20 | 2012-06-06 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
| CN103167746A (en) * | 2011-12-12 | 2013-06-19 | 深南电路有限公司 | Depth control hole filling mould and method |
| CN103547087A (en) * | 2013-09-10 | 2014-01-29 | 西安金百泽电路科技有限公司 | Vacuum adhesive pressing hole plugging method for high-depth buried holes |
| CN103648242A (en) * | 2013-12-27 | 2014-03-19 | 惠州中京电子科技股份有限公司 | Vacuum glue filling method of blind buried hole with high aspect ratio |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN104486913A (en) * | 2014-12-23 | 2015-04-01 | 深圳市五株科技股份有限公司 | Printing ink hole plugging process method for circuit boards |
| CN105101676A (en) * | 2014-05-16 | 2015-11-25 | 上海嘉捷通信息科技有限公司 | PCB resin hole plugging method |
| CN106413263A (en) * | 2016-11-16 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Circuit board pressing process without resin plug hole |
| CN106455330A (en) * | 2016-11-04 | 2017-02-22 | 深圳市深联电路有限公司 | PP (polypropylene) glue filling method for large-diameter shaped hole of metal copper substrate |
| CN106470524A (en) * | 2015-08-21 | 2017-03-01 | 味之素株式会社 | Resin sheet with supporter |
| CN106784854A (en) * | 2016-11-21 | 2017-05-31 | 深圳市五株科技股份有限公司 | The processing method of metal substrate |
| CN106973509A (en) * | 2017-04-27 | 2017-07-21 | 柏承科技(昆山)股份有限公司 | PCB film filler increasing layer methods |
| CN107148151A (en) * | 2017-07-14 | 2017-09-08 | 四会富士电子科技有限公司 | A kind of method of figure filling holes with resin after |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN110785024A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
| CN115181450A (en) * | 2022-09-08 | 2022-10-14 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
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| CN102421242A (en) * | 2011-08-08 | 2012-04-18 | 慈溪市永旭丰泰电子科技有限公司 | Flanged brass circuit board |
| CN102281724A (en) * | 2011-08-26 | 2011-12-14 | 广州杰赛科技股份有限公司 | Method for machining double-sided windowed plug hole |
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| CN103547087A (en) * | 2013-09-10 | 2014-01-29 | 西安金百泽电路科技有限公司 | Vacuum adhesive pressing hole plugging method for high-depth buried holes |
| CN103547087B (en) * | 2013-09-10 | 2017-02-08 | 西安金百泽电路科技有限公司 | Vacuum adhesive pressing hole plugging method for high-depth buried holes |
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| CN106413263A (en) * | 2016-11-16 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Circuit board pressing process without resin plug hole |
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| CN106973509A (en) * | 2017-04-27 | 2017-07-21 | 柏承科技(昆山)股份有限公司 | PCB film filler increasing layer methods |
| CN107148151A (en) * | 2017-07-14 | 2017-09-08 | 四会富士电子科技有限公司 | A kind of method of figure filling holes with resin after |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN110785024A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
| CN110785024B (en) * | 2019-10-31 | 2021-05-07 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
| WO2023123903A1 (en) * | 2021-12-29 | 2023-07-06 | 生益电子股份有限公司 | Process for filling holes with flowing adhesives during lamination, and pcb |
| CN115181450A (en) * | 2022-09-08 | 2022-10-14 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
| CN115181450B (en) * | 2022-09-08 | 2022-11-25 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
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|---|---|
| CN100556249C (en) | 2009-10-28 |
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Address after: Eling road 516008 in Guangdong province Huizhou city Huicheng District No. three, Lane seven, Beijing Science and Technology Park Patentee after: HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: Eling road 516008 in Guangdong province Huizhou city Huicheng District No. three, Lane seven, Beijing Science and Technology Park Patentee before: HUIZHOU ZHONGJING ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CB03 | Change of inventor or designer information |
Inventor after: Wang Youlin Inventor after: Tang Qiandong Inventor before: Wang Youlin |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170526 Address after: Guangdong city of Huizhou province Dayawan Petrochemical Xiangshui River Industrial Park Road West No. 18 Patentee after: HUIZHOU WEIJIAN CIRCUIT BOARD INDUSTRIAL CO.,LTD. Address before: Eling road 516008 in Guangdong province Huizhou city Huicheng District No. three, Lane seven, Beijing Science and Technology Park Patentee before: HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20091028 Termination date: 20210730 |