CN102548251B - Printed circuit board (PCB) vacuum lamination hole-plugging process - Google Patents
Printed circuit board (PCB) vacuum lamination hole-plugging process Download PDFInfo
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- CN102548251B CN102548251B CN201110412438.7A CN201110412438A CN102548251B CN 102548251 B CN102548251 B CN 102548251B CN 201110412438 A CN201110412438 A CN 201110412438A CN 102548251 B CN102548251 B CN 102548251B
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Abstract
The invention discloses a printed circuit board (PCB) vacuum lamination hole-plugging process, which includes steps: A, a layer of protective film is attached to a circuit board with a hole required to be plugged; B, windowing film-removing processing is conducted at the positions of a via hole and a blind hole on the circuit board, and the via hole and the blind hole are exposed; C, a propene polymer (PP) glue film for plugging holes is adhered to the protective film after windowing and film removing processing; D, the circuit is placed in a vacuum pressing machine, and the PP glue film melts and flows into the via hole and the blind hole to fill the via hole and the blind hole; and E, the protective film and the PP glue film are torn down, and protruding PP resin on the surfaces of the via hole and the blind hole is rubbed down through a scrubbing machine. Compared with the prior art, a hole-plugging tool, special printing ink and devices are not required to be manufactured. Only hole-filling PP and the vacuum pressing machine of a pressing procedure are required to finish the hole plugging, quality problems of bubbles, holes, recess and the like caused by the fact that the existing resin printing oil is used to plug the hole is thoroughly solved, and simultaneously a problem that holes of an inner layer plate with the thickness larger than 0.8 mm can not be plugged is solved, too.
Description
Technical field:
The invention belongs to PCB manufacturing technology field, what be specifically related to is a kind of PCB vacuum pressing-combining jack process.
Background technology:
Along with the universal and extensive use of electronic product, the production of pcb board and manufacturing technology are also constantly updated and are developed.For adapting to produce the demand of different electronic products, the pcb board of designed manufacture develops into doubling plate or multi-layer sheet by lamina.
When general manufacture bilayer or multi-layer PCB board, Dou You isolating metal basic unit carries out the requirement of circuit connection.Relative clearance hole need to be set for this reason on metal-based layer and carry out consent, circuit isolating metal basic unit on each layer circuit board is connected and form relative switching road.
In industry, pcb board clearance hole is carried out to consent at present and mainly adopt following three kinds of modes: one, common screen printer printing resin ink plugging, this consent mode need to be made half tone and the backing plate of consent, buy plug socket resin ink and screen printer, in its consent process, the quality problem such as bubble, cavity, depression can be produced, and blind hole can not be filled in.Two, vacuum taphole machine silk-screen resin ink plugging, if this mode does not adopt consent half tone and backing plate instrument, can only whole plate consent, can not selectivity consent, ink waste is high; If adopt consent half tone and backing plate instrument, can selectivity consent, also can fill in blind hole, but apparatus expensive needs to buy plug socket resin ink and vacuum screen printer, and still can produce the quality problem such as cavity, depression when consent.Three, the direct consent of PP pressing, this mode does not need consent half tone, backing plate instrument, resin ink and screen printing device, and there is no the quality problem such as bubble, cavity, depression when consent yet, but can only fill in the buried via hole of internal layer, can not fill in outer field through hole and blind hole, and be subject to the thickness of dielectric layers restriction that client designs, and can only fill in internal layer thin plate (thickness of slab≤0.8mm), range of application is minimum.
Summary of the invention:
For this reason, the object of the present invention is to provide a kind of PCB vacuum pressing-combining jack process, to solve in current industry quality problem such as the clearance hole employing existing easy generation of resin ink plugging cavity, depressions, and adopt that PP pressing direct consent is existing can only fill in internal layer buried via hole, can not be beyond the Great Wall layer through hole and blind hole, and inner plating problem that can not the thick > 0.8mm of seben.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of PCB vacuum pressing-combining jack process, specifically comprises step:
A, the layer protecting film of fitting on the wiring board that needs consent;
B, to the striping processing of windowing of via on wiring board and blind hole present position, via and blind hole are exposed;
C, the PP glued membrane for consent is attached to through the striping of windowing diaphragm after treatment;
D, above-mentioned wiring board is positioned in vacuum press, PP glued membrane is melted and flow in above-mentioned via and blind hole, described via and blind hole are filled up;
E, the said protection film of tearing and PP glued membrane, polish the protruding PP resin on above-mentioned via and blind hole surface by Plate grinder.
Wherein before steps A, also comprise:
Wiring board is carried out to electroplating processes, make its surperficial copper layer thickness reach the pre-provisioning request of client.
Wherein steps A specifically comprises:
At the wiring board upper and lower surface that the needs consent layer protecting film of respectively fitting, the via on this wiring board and blind hole are blocked to covering, and said protection film is carried out to pressing, itself and wiring board are fitted tightly, and do not produce bubble.
Wherein step B specifically comprises:
Pass through CO
2or the radium-shine mode of UV is processed the diaphragm that needs consent position on wiring board; the diaphragm that needs to cover in the via of consent and blind hole is removed; retain the diaphragm of other position, and clean the above-mentioned via exposing and blind hole by chemical medicinal liquid, ultrasonic wave or high-pressure washing mode.
Wherein between step B and step C, also include:
The via exposing and blind hole surface are carried out to roughening treatment, and cover one deck brown film, then remove the aqueous vapor in via and blind hole.
Wherein step C specifically comprises:
PP glued membrane for consent is attached to through the striping of windowing diaphragm after treatment, and the via after windowing and blind hole are blocked to covering.
Wherein step D specifically comprises:
Above-mentioned wiring board is positioned in vacuum press, regulates the temperature and pressure of vacuum press, PP glued membrane is melted under high temperature, High Pressure, and flow in above-mentioned via and blind hole, described via and blind hole are filled up.
Wherein between step B and step C, also include:
The via exposing and blind hole surface are carried out to electroplating processes, copper layer thickness is increased, afterwards this copper layer is carried out to roughening treatment, and cover one deck brown film, then remove the aqueous vapor in via and blind hole.
The present invention is by pasting protective film in the circuit board, and to the processing of windowing of needs consent position, then on diaphragm, pastes PP glued membrane; pass through vacuum press; PP glued membrane is melted, flow in the via or blind hole that needs consent, complete the consent processing of whole wiring board.Compared with prior art, the present invention is without making consent instrument, ink special and equipment; Only need to use the vacuum press of filling perforation PP, pressing working procedure to complete, thoroughly solve current employing resin ink plugging and easily produced the quality problem such as bubble, cavity, depression, simultaneously also solved the problem that thickness of slab > 0.8mm inner plating can not consent.
Brief description of the drawings:
Fig. 1 is the pcb board vacuum pressing-combining process flow for filling holes figure of electric plating of whole board of the present invention.
Fig. 2 is the pcb board vacuum pressing-combining process flow for filling holes figure that the present invention plates hole.
Embodiment:
For setting forth thought of the present invention and object, below in conjunction with the drawings and specific embodiments, the present invention is described further.
The present invention is to provide a kind of PCB vacuum pressing-combining jack process, be mainly used in solving the quality problem such as the existing easy generation bubble of current employing resin ink plugging, cavity, depression, and adopt that PP pressing direct consent is existing can only fill in internal layer buried via hole, can not be beyond the Great Wall layer through hole and blind hole, and inner plating problem that can not the thick > 0.8mm of seben.
Wherein concrete technology of the present invention is as follows: A, at the wiring board upper and lower surface that the needs consent layer protecting film of respectively fitting; via on this wiring board and blind hole are blocked to covering; and said protection film is carried out to pressing, itself and wiring board are fitted tightly, and do not produce bubble.B, pass through CO
2or the radium-shine mode of UV is processed the diaphragm that needs consent position on wiring board; the diaphragm that needs to cover in the via of consent and blind hole is removed; retain the diaphragm of other position, and clean the above-mentioned via exposing and blind hole by chemical medicinal liquid, ultrasonic wave or high-pressure washing mode.C, the via exposing and blind hole surface are carried out to roughening treatment, and cover one deck brown film, then remove the aqueous vapor in via and blind hole.D, above-mentioned wiring board is positioned in vacuum press, regulates the temperature and pressure of vacuum press, PP glued membrane is melted under high temperature, High Pressure, and flow in above-mentioned via and blind hole, described via and blind hole are filled up.E, the said protection film of tearing and PP glued membrane, polish the protruding PP resin on above-mentioned via and blind hole surface by Plate grinder.
Below by respectively by reference to the accompanying drawings the concrete technology of pcb board consent in the pcb board of 1,2 pair of electric plating of whole board of the present invention and plating hole be described.
Pcb board vacuum pressing-combining process flow for filling holes figure shown in Figure 1, Fig. 1 is electric plating of whole board of the present invention.Wherein carry out the concrete technology of consent for the pcb board of electric plating of whole board as follows: first the method by electroless plating is by the thick thickness that is plating to customer requirement of copper in the plate face of wiring board and hole, then at the pcb board upper and lower surface of the electric plating of whole board layer protecting film of respectively fitting, for the via on this wiring board and blind hole are blocked to covering, and said protection film is carried out to pressing, itself and wiring board are fitted tightly, and do not produce bubble; Pass through afterwards CO
2or the radium-shine mode of UV is processed the diaphragm that needs consent position on wiring board, the diaphragm that needs to cover in the via of consent and blind hole is removed, retain the diaphragm of other position, and clean the above-mentioned via exposing and blind hole by chemical medicinal liquid, ultrasonic wave or high-pressure washing mode; Then the via exposing and blind hole surface are carried out to roughening treatment, and cover one deck brown film, remove the aqueous vapor in via and blind hole; Afterwards above-mentioned wiring board is positioned in vacuum press, regulates the temperature and pressure of vacuum press, PP glued membrane is melted under high temperature, High Pressure, and flow in above-mentioned via and blind hole, described via and blind hole are filled up; The said protection film of finally tearing and PP glued membrane, polish the protruding PP resin on above-mentioned via and blind hole surface by Plate grinder, completes the process of whole consent.
Shown in Figure 2, Fig. 2 is the pcb board vacuum pressing-combining process flow for filling holes figure that the present invention plates hole.Wherein carry out the concrete technology of consent for the pcb board in plating hole as follows: first pcb board is carried out to electroless plating processing, make more than copper layer thickness reaches the cladding thickness of customer requirement, then at the pcb board upper and lower surface of the electric plating of whole board layer protecting film of respectively fitting, for the via on this wiring board and blind hole are blocked to covering, and said protection film is carried out to pressing, itself and wiring board are fitted tightly, and do not produce bubble; Pass through afterwards CO
2or the radium-shine mode of UV is processed the diaphragm that needs consent position on wiring board, the diaphragm that needs to cover in the via of consent and blind hole is removed, retain the diaphragm of other position, and clean the above-mentioned via exposing and blind hole by chemical medicinal liquid, ultrasonic wave or high-pressure washing mode; And then by the mode of electroless plating, electroplating processes is carried out in the surface of the via exposing and blind hole, and copper layer thickness is increased, again this copper layer is carried out to roughening treatment afterwards, and cover one deck brown film, remove the aqueous vapor in via and blind hole; Afterwards above-mentioned wiring board is positioned in vacuum press, regulates the temperature and pressure of vacuum press, PP glued membrane is melted under high temperature, High Pressure, and flow in above-mentioned via and blind hole, described via and blind hole are filled up; The said protection film of finally tearing and PP glued membrane, polish the protruding PP resin on above-mentioned via and blind hole surface by Plate grinder, completes the process of whole consent.
More than that a kind of PCB vacuum pressing-combining jack process provided by the present invention is described in detail, applied specific case herein structural principle of the present invention and execution mode are set forth, above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (1)
1. a PCB vacuum pressing-combining jack process, is characterized in that specifically comprising step:
A, wiring board is carried out to electroplating processes, make its surperficial copper layer thickness reach pre-provisioning request, then at the wiring board upper and lower surface that the needs consent layer protecting film of respectively fitting, via on this wiring board and blind hole are blocked to covering, and said protection film is carried out to pressing, itself and wiring board are fitted tightly, and do not produce bubble;
B, pass through CO
2or the radium-shine mode of UV is processed the diaphragm that needs consent position on wiring board, the diaphragm that needs to cover in the via of consent and blind hole is removed, retain the diaphragm of other position, and clean the above-mentioned via exposing and blind hole by chemical medicinal liquid, ultrasonic wave or high-pressure washing mode, and then by the mode of electroless plating, electroplating processes is carried out in the surface of the via exposing and blind hole, copper layer thickness is increased, again this copper layer is carried out to roughening treatment afterwards, and cover one deck brown film, remove the aqueous vapor in via and blind hole;
C, the PP glued membrane for consent is attached to through the striping of windowing diaphragm after treatment, and the via after windowing and blind hole are blocked to covering;
D, above-mentioned wiring board is positioned in vacuum press, regulates the temperature and pressure of vacuum press, PP glued membrane is melted under high temperature, High Pressure, and flow in above-mentioned via and blind hole, described via and blind hole are filled up;
E, the said protection film of tearing and PP glued membrane, polish the protruding PP resin on above-mentioned via and blind hole surface by Plate grinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110412438.7A CN102548251B (en) | 2011-12-12 | 2011-12-12 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110412438.7A CN102548251B (en) | 2011-12-12 | 2011-12-12 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102548251A CN102548251A (en) | 2012-07-04 |
| CN102548251B true CN102548251B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110412438.7A Expired - Fee Related CN102548251B (en) | 2011-12-12 | 2011-12-12 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
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| CN104349589B (en) * | 2013-08-02 | 2017-09-26 | 北大方正集团有限公司 | The preparation method of printed circuit board (PCB) and printed circuit board (PCB) and its disk mesopore |
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| CN103687335A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Manufacturing method for circuit board holes being selectively plugged with resin |
| CN103732009B (en) * | 2013-12-24 | 2017-10-17 | 广州兴森快捷电路科技有限公司 | The filling holes with resin method of circuit board disc mesopore and the preparation method of disk mesopore |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| WO2016095076A1 (en) * | 2014-12-15 | 2016-06-23 | 李林涛 | Circuit board vacuum hole-plugging process |
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
| CN104883827A (en) * | 2015-06-05 | 2015-09-02 | 成都航天通信设备有限责任公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| US10524366B2 (en) * | 2015-07-15 | 2019-12-31 | Printed Circuits, Llc | Methods of manufacturing printed circuit boards |
| CN105451451A (en) * | 2015-12-18 | 2016-03-30 | 景旺电子科技(龙川)有限公司 | Hole plugging method for blind hole in circuit board |
| CN105657993A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Improved ladder-shaped circuit board production process |
| CN105722329A (en) * | 2016-04-18 | 2016-06-29 | 四会富士电子科技有限公司 | Method for plugging hole with resin |
| CN108243563A (en) * | 2016-12-23 | 2018-07-03 | 无锡深南电路有限公司 | A kind of IC support plates filling holes with resin method |
| CN106982513A (en) * | 2017-05-23 | 2017-07-25 | 四会富士电子科技有限公司 | A kind of method of selective resin consent |
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| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN110121240A (en) * | 2019-04-30 | 2019-08-13 | 胜宏科技（惠州）股份有限公司 | A kind of full glue compression method of aluminum substrate substituting filling holes with resin |
| CN112188733A (en) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | Vacuum hole plugging method |
| CN110430689B (en) * | 2019-07-18 | 2022-08-19 | 宁波华远电子科技有限公司 | Manufacturing method of double-sided ink for through hole of thin plate |
| CN110621118B (en) * | 2019-09-12 | 2022-09-16 | 深圳市华升鑫电路有限公司 | Circuit board hole plugging method and circuit board |
| CN112351587A (en) * | 2020-10-20 | 2021-02-09 | 江西强达电路科技有限公司 | Grinding-free resin plug hole PCB manufacturing process |
| CN112654160A (en) * | 2020-12-14 | 2021-04-13 | 定颖电子（昆山）有限公司 | PCB processing technology |
| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
| CN113811087A (en) * | 2021-08-31 | 2021-12-17 | 深圳市众阳电路科技有限公司 | Production method of PCB blind hole applying PP rubber plug |
| CN113973436A (en) * | 2021-10-26 | 2022-01-25 | 广州添利电子科技有限公司 | Method for protecting PCB surface in resin plug hole and PCB resin plug hole process |
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| CN102548251A (en) | 2012-07-04 |
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