CN103917060A - Method for manufacturing plug holes in printed circuit board - Google Patents
Method for manufacturing plug holes in printed circuit board Download PDFInfo
- Publication number
- CN103917060A CN103917060A CN201310002503.8A CN201310002503A CN103917060A CN 103917060 A CN103917060 A CN 103917060A CN 201310002503 A CN201310002503 A CN 201310002503A CN 103917060 A CN103917060 A CN 103917060A
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- consent
- printed circuit
- circuit board
- plate
- pcb
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Abstract
The invention belongs to the technical field of printed circuit board manufacture and particularly relates to a method for manufacturing plug holes in a printed circuit board. The method comprises the following steps of drilling out all the predetermined holes in the printed circuit board for one time and performing metallization processing on the board according to set requirements; attaching protective films on two surfaces of the whole electroplated board; windowing the protective films on the holes needing plugging to make the holes needing plugging exposed; plugging the holes in the whole board through squeegee after parameters of the plug holes are regulated; performing postcure processing; stripping the protective films of the printed circuit board; grinding the printed circuit board. By means of the method, depths of the plug holes can be ensured while quality problems of size distortion of the board, exposion of base materials to openings of large hole due to abrasion, cracks and sinking of the plug holes and the like during hole plugging through resin of the printed circuit board can be solved. Furthermore, some manufacturing cost on hole plugging tools can be reduced.
Description
Technical field
The invention belongs to print circuit plates making technical field, be specifically related to a kind of printed circuit board (PCB) plate consent manufacture method, be adapted to especially thickness of slab and make at the consent of 0.4mm and following ultra-thin thickness of slab pcb board part.
Background technology
Along with the development of communication product, PCB(printed circuit board (PCB)) plate design also starts towards the development of legerity type aspect, and cabling is more and more intensive, and filling holes with resin design is also impassable increasingly general.In prior art, the filling holes with resin of pcb board part is mainly operated in the following ways: the boring → heavy copper plating → consent → transfer of rear solidify → resin nog plate (resin is evened out) → outer graphics or lower operation.Common resin nog plate mode has: ceramic nog plate, adhesive-bonded fabric nog plate, abrasive belt grinding etc.
Chinese patent application (application number is 200910189371.8) discloses a kind of PCB processing method, mainly comprises the following steps: (1) filling holes with resin is full by stopple predetermined on PCB with resin; (2) even resin out, the resin of the consent position that remains in described PCB surface is rooted out totally; (3) paste dry film: stick dry film in the predetermined non-described filling holes with resin region that is etched to Wu Tong district, described PCB surface; (4) resist layer is set: at the described PCB surface non-dry film region printing including described filling holes with resin region or plating one deck resist layer; (5) striping etching: remove described dry film and carry out etching on described PCB surface; (6) remove resist layer: after etching, remove described resist layer.
Chinese patent application (application number is 201010212899.5) discloses the jack process of a kind of PCB, mainly comprises the following steps: (1) consent processing, stopple is lived with insulating material, and the consent degree of depth is the degree of depth that is not less than hole; (2) abrasive band is evened out, and the insulating material of emerging is rooted out.
In prior art, most of pcb board part is adopting after conventional filling holes with resin manufacture method processing, owing to adopting the cutting way nog plate of the hard power of exterior mechanical, tend to cause overall plate size distortion, macropore aperture mill to reveal base material, aperture depression etc., therefore plate consent quality has started the practical problem that must inquire into and solve at present.
Summary of the invention
For the defect existing in prior art, technical problem to be solved by this invention is to provide a kind of effective, pcb board part consent manufacture method that cost is low.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of printed circuit board (PCB) plate consent manufacture method, comprises the following steps:
(1) on printed circuit board (PCB) plate, holed in position, predetermined hole;
(2) require described printed circuit board (PCB) plate to carry out metalized according to setting;
(3) the described printed circuit board (PCB) plate after electroplating is carried out to whole plate pasting protective film;
(4) to needing the processing of windowing of the hole upper protective film of consent, make to need the hole of consent exposed;
(5) consent;
(6) after, solidify and process;
(7) peel off the diaphragm of printed circuit board (PCB) plate;
(8) nog plate.
Printed circuit board (PCB) plate consent manufacture method as above, wherein, printed circuit board (PCB) plate thickness is not more than 0.4 millimeter.
Printed circuit board (PCB) plate consent manufacture method as above, in step (3), carries out whole plate Double-face adhesive diaphragm to described printed circuit board (PCB) plate.Described diaphragm is dry film, film diaphragm or the wheat membrane of figure transfer.In the time that described diaphragm is dry film, the mode that adds development by exposure in step (4) realizes windows; In the time that described diaphragm is film diaphragm or wheat membrane, realizes and windowing by laser mode.
Printed circuit board (PCB) plate consent manufacture method as above, is used frictioning directly to carry out whole plate consent in step (5).When consent, use filling holes with resin, conducting resinl consent or anti-solder ink consent, have the white net of the net that stretches tight.
Printed circuit board (PCB) plate consent manufacture method as above, adopts conventional adhesive-bonded fabric polish-brush to carry out simple and easy nog plate in step (8).Described polish-brush is 800 ~ 1000 orders.
The method of the invention, operate under the constant prerequisite of flow process roughly at current conventional consent, reveal the quality problem such as base material, consent crack and consent depression can solve pcb board part plate size distortion, macropore aperture mill after consent flow process in guaranteeing the consent degree of depth; Can also save certain consent tool making cost simultaneously.
Brief description of the drawings
Fig. 1 is the flow chart of pcb board part consent manufacture method in embodiment;
Fig. 2 is pcb board part consent manufacture method Main Stage effect schematic diagram in embodiment.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
As depicted in figs. 1 and 2, in present embodiment, pcb board part consent manufacture method comprises the following steps:
(1) boring: once property gets out all predetermined holes on printed circuit board (PCB) plate.
(2) heavy copper is electroplated: require plate to carry out metalized according to setting, guarantee that hole copper, face copper meet quality of finished requirement.
(3) pasting protective film: plate after plating is carried out to whole plate pasting protective film.
Pcb board part after plating is carried out to the whole plate pad pasting of single or double, and common processing mode can be dry film, film diaphragm or the wheat membrane etc. of figure transfer.Preferably adopt two-sided pad pasting.
(4) diaphragm is windowed: to the processing of windowing of all hole upper protective films that need consent, make all holes of consent that need exposed.
By the processing of windowing of its diaphragm, make it out exposed for all holes that need consent.While being dry film for diaphragm, can directly realize by exposure+development method; While being film diaphragm or wheat membrane for diaphragm, can realizing and windowing by laser mode.
(5) consent: adjust after consent parameter, use frictioning directly to carry out whole plate consent.
This step can be used filling holes with resin, also can use conducting resinl consent, anti-solder ink consent etc.Present embodiment is used filling holes with resin.Completely different from conventional filling holes with resin, without special aluminium flake web plate or screen printing net plate is provided, only need to use the white net that has the net that stretches tight of commonly using.Adjust after consent parameter, adopt conventional consent mode frictioning directly to carry out whole plate consent.Consent oil fills up all holes of having windowed by complete, and consent is full and just concordant with diaphragm, and other regions of plate face are because there being diaphragm to cover, and resin can directly not pollute plate face, after the empty cutter of frictioning is walked, on diaphragm almost without ink residue.
(6) after, solidify and process.
After consent, resin is carried out to rear curing processing.
(7) striping: the diaphragm of directly peeling off printed circuit board (PCB) plate.
Can directly peel off the diaphragm of pcb board part.If diaphragm is dry film, can also adopt special striping liquid medicine to remove.
(8) nog plate: adopt conventional adhesive-bonded fabric polish-brush to carry out simple and easy nog plate.
Because filling holes with resin mode is special, after consent, the plate face resin of emerging is little, and other non-consent regions pollute without rabbet ink completely, resin nog plate herein, can directly adopt conventional adhesive-bonded fabric polish-brush (general control is at 800 ~ 1000 orders), carry out easy nog plate.Pcb board part is good stability of the dimension after resin nog plate, the copper facing of macropore aperture almost without any wearing and tearing, consent plumpness reach >=100%, without quality problem such as any consent crack and consent depressions.
The product that adopts above-mentioned pcb board part consent manufacture method to make, consent plumpness and evenness are all fine, be adapted to especially POFV(plated on filled via) the pcb board part of technological requirement, its consent depression degree is controlled≤5um, can meet the consent that nation determines handicraft product completely and make.Consent manufacture method of the prior art, extremely very large to the product quality of thin plate plate, method for plugging of the present invention is adapted to ultra-thin plate especially, particularly meets thickness of slab≤0.4mm.
And method for plugging of the present invention also can be applicable to the plate consent running of consent and non-consent spacing deficiency, effectively between management and control hole and the ink of plate face pollute.In addition, the method only need be used the white net of conventional consent, without special consent web plate is provided; Resin nog plate and simple, without ceramic nog plate or abrasive belt grinding, has saved certain Material Cost.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technology thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (10)
1. a printed circuit board (PCB) plate consent manufacture method, comprises the following steps:
(1) on printed circuit board (PCB) plate, holed in position, predetermined hole;
(2) require described printed circuit board (PCB) plate to carry out metalized according to setting;
(3) the described printed circuit board (PCB) plate after electroplating is carried out to whole plate pasting protective film;
(4) to needing the processing of windowing of the hole upper protective film of consent, make the described hole of consent that needs exposed;
(5) consent;
(6) after, solidify and process;
(7) peel off the diaphragm of printed circuit board (PCB) plate;
(8) nog plate.
2. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: described printed circuit board (PCB) plate thickness is not more than 0.4 millimeter.
3. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: in step (3), described printed circuit board (PCB) plate is carried out to whole plate Double-face adhesive diaphragm.
4. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: diaphragm described in step (3) is dry film, film diaphragm or the wheat membrane of figure transfer.
5. printed circuit board (PCB) plate consent manufacture method as claimed in claim 4, is characterized in that: in the time that described in step (3), diaphragm is dry film, the mode that adds development by exposure in step (4) realizes windows; In the time that described diaphragm is film diaphragm or wheat membrane, realizes and windowing by laser mode.
6. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: when the middle consent of step (5), use filling holes with resin, conducting resinl consent or anti-solder ink consent.
7. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: in step (5), use frictioning directly to carry out whole plate consent.
8. printed circuit board (PCB) plate consent manufacture method as claimed in claim 1, is characterized in that: when the middle consent of step (5), use the white net that has the net that stretches tight.
9. the printed circuit board (PCB) plate consent manufacture method as described in any one in claim 1 ~ 8, is characterized in that: in step (8), adopt conventional adhesive-bonded fabric polish-brush to carry out simple and easy nog plate.
10. printed circuit board (PCB) plate consent manufacture method as claimed in claim 9, is characterized in that: described in step (8), polish-brush is 800 ~ 1000 orders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002503.8A CN103917060A (en) | 2013-01-05 | 2013-01-05 | Method for manufacturing plug holes in printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002503.8A CN103917060A (en) | 2013-01-05 | 2013-01-05 | Method for manufacturing plug holes in printed circuit board |
Publications (1)
| Publication Number | Publication Date |
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| CN103917060A true CN103917060A (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310002503.8A Pending CN103917060A (en) | 2013-01-05 | 2013-01-05 | Method for manufacturing plug holes in printed circuit board |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
| CN104883827A (en) * | 2015-06-05 | 2015-09-02 | 成都航天通信设备有限责任公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN106028653A (en) * | 2016-06-17 | 2016-10-12 | 景旺电子科技(龙川)有限公司 | Surface pit filling method of copper substrate |
| CN106793580A (en) * | 2016-11-18 | 2017-05-31 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN106852028A (en) * | 2017-01-19 | 2017-06-13 | 广州美维电子有限公司 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
| CN107960004A (en) * | 2016-10-14 | 2018-04-24 | 鹏鼎控股(深圳)股份有限公司 | Scalable circuit board and preparation method thereof |
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN108243563A (en) * | 2016-12-23 | 2018-07-03 | 无锡深南电路有限公司 | A kind of IC support plates filling holes with resin method |
| CN108934128A (en) * | 2017-05-23 | 2018-12-04 | 北大方正集团有限公司 | Prevent the method, printed wiring board and computer installation of anti-solder ink plug-hole |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN109429433A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of pcb board uses electrophoresis resin method for plugging |
| CN109561582A (en) * | 2017-09-25 | 2019-04-02 | 北大方正集团有限公司 | The method of circuit board resin consent |
| CN110121240A (en) * | 2019-04-30 | 2019-08-13 | 胜宏科技（惠州）股份有限公司 | A kind of full glue compression method of aluminum substrate substituting filling holes with resin |
| US10820423B2 (en) | 2017-06-26 | 2020-10-27 | Gold Circuit Electronics Ltd. | Fabrication method of circuit board |
| CN112188734A (en) * | 2020-09-15 | 2021-01-05 | 广州兴森快捷电路科技有限公司 | Resin hole plugging method |
| CN112188733A (en) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | Vacuum hole plugging method |
| CN112351587A (en) * | 2020-10-20 | 2021-02-09 | 江西强达电路科技有限公司 | Grinding-free resin plug hole PCB manufacturing process |
| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
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| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
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Patent Citations (4)
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| US20050026069A1 (en) * | 2003-07-31 | 2005-02-03 | Todd Yeh | Solventless thermosetting photosensitive via-filling material |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
| CN104883827A (en) * | 2015-06-05 | 2015-09-02 | 成都航天通信设备有限责任公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN106028653A (en) * | 2016-06-17 | 2016-10-12 | 景旺电子科技(龙川)有限公司 | Surface pit filling method of copper substrate |
| CN106028653B (en) * | 2016-06-17 | 2018-10-30 | 景旺电子科技(龙川)有限公司 | A kind of copper base surface crater fills and leads up method |
| CN107960004A (en) * | 2016-10-14 | 2018-04-24 | 鹏鼎控股(深圳)股份有限公司 | Scalable circuit board and preparation method thereof |
| CN106793580B (en) * | 2016-11-18 | 2019-03-19 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN106793580A (en) * | 2016-11-18 | 2017-05-31 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN108243563A (en) * | 2016-12-23 | 2018-07-03 | 无锡深南电路有限公司 | A kind of IC support plates filling holes with resin method |
| CN106852028A (en) * | 2017-01-19 | 2017-06-13 | 广州美维电子有限公司 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
| CN108934128A (en) * | 2017-05-23 | 2018-12-04 | 北大方正集团有限公司 | Prevent the method, printed wiring board and computer installation of anti-solder ink plug-hole |
| US10820423B2 (en) | 2017-06-26 | 2020-10-27 | Gold Circuit Electronics Ltd. | Fabrication method of circuit board |
| CN109429433A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of pcb board uses electrophoresis resin method for plugging |
| CN109561582B (en) * | 2017-09-25 | 2020-09-04 | 北大方正集团有限公司 | Method for plugging hole with circuit board resin |
| CN109561582A (en) * | 2017-09-25 | 2019-04-02 | 北大方正集团有限公司 | The method of circuit board resin consent |
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN110121240A (en) * | 2019-04-30 | 2019-08-13 | 胜宏科技（惠州）股份有限公司 | A kind of full glue compression method of aluminum substrate substituting filling holes with resin |
| CN112188733A (en) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | Vacuum hole plugging method |
| CN112188734A (en) * | 2020-09-15 | 2021-01-05 | 广州兴森快捷电路科技有限公司 | Resin hole plugging method |
| CN112351587A (en) * | 2020-10-20 | 2021-02-09 | 江西强达电路科技有限公司 | Grinding-free resin plug hole PCB manufacturing process |
| CN112930043A (en) * | 2021-01-29 | 2021-06-08 | 生益电子股份有限公司 | PCB ink hole plugging method and PCB |
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Application publication date: 20140709 |
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