CN112188734A - Resin hole plugging method - Google Patents
Resin hole plugging method Download PDFInfo
- Publication number
- CN112188734A CN112188734A CN202010967944.1A CN202010967944A CN112188734A CN 112188734 A CN112188734 A CN 112188734A CN 202010967944 A CN202010967944 A CN 202010967944A CN 112188734 A CN112188734 A CN 112188734A
- Authority
- CN
- China
- Prior art keywords
- hole
- plate
- auxiliary material
- resin
- plugging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a resin hole plugging method, which comprises the following steps: processing a first through hole and a second through hole on the plate, and processing an opening hole on the auxiliary material; carrying out negative film electroplating on the plate subjected to hole machining; combining the auxiliary material on the surface of the plate, aligning the window hole with the first through hole, and covering the auxiliary material on the second through hole; the filler is inserted into the first through-hole through the opening. According to the resin hole plugging method, the second through hole can be processed after the first through hole is processed, and due to the fact that expansion and contraction deformation of the plate does not occur, the processing of the second through hole cannot be affected, the condition of hole deviation and disc breakage cannot occur, and therefore the rejection rate of the plate is reduced. After the hole machining operation is completed, because the first through hole and the second through hole are machined, the plate can be electroplated only by once metallization operation, the trouble of twice electroplating operations in the conventional resin hole plugging operation is avoided, and the uniform thickness of the plating layer on the plate can be effectively ensured, so that the quality of the plate is improved.
Description
Technical Field
The invention relates to the technical field of circuit board resin hole plugging, in particular to a resin hole plugging method.
Background
In the manufacturing process of the circuit board, resin hole plugging can be applied, in order to prevent resin from being plugged into a non-resin hole, a resin hole needs to be drilled on a plate in the common resin hole plugging operation, the hole plugging operation is completed on the resin hole after the copper deposition negative film electroplating is completed, then baking is carried out to solidify the resin, and then the non-resin hole is drilled and secondary copper deposition negative film electroplating is carried out.
However, the circuit board is subjected to expansion and shrinkage deformation after being baked, so that a deviated hole and broken disc are easy to occur when a non-resin hole is drilled, and the circuit board is scrapped; in addition, the two times of negative electroplating are easy to cause uneven copper layer thickness. Therefore, the circuit board obtained by the common resin hole plugging method has poor quality and even can be scrapped.
Disclosure of Invention
Therefore, it is necessary to provide a resin hole plugging method which can reduce the rejection rate of the circuit board and improve the quality.
A method of resin plugging a hole, comprising the steps of:
and (3) hole machining operation: processing a first through hole and a second through hole on the plate, and processing an opening hole on the auxiliary material;
metallization operation: carrying out negative film electroplating on the plate subjected to hole machining;
combining operation: combining the auxiliary material on the surface of the plate, aligning the window hole with the first through hole, and covering the auxiliary material on the second through hole;
hole plugging operation: the filler is inserted into the first through-hole through the opening.
According to the resin hole plugging method, the second through hole can be processed after the first through hole is processed, and the plate does not expand and contract when the second through hole is processed, so that the processing of the second through hole is not influenced, the condition of eccentric hole and disc breakage is avoided, and the rejection rate of the plate is reduced. In addition, after the hole machining operation is completed, because the first through hole and the second through hole are machined, the plate can be electroplated only by once metallization operation, the trouble that two times of electroplating operation are needed in the conventional resin hole plugging operation is avoided, and the uniform thickness of a plating layer on the plate can be effectively ensured, so that the quality of the plate is improved.
In one embodiment, the hole machining operation further comprises the steps of:
preparing a plate to be treated and auxiliary materials;
combining the auxiliary materials on the surface of the plate;
penetrating the auxiliary material and the plate, and synchronously processing an opening hole and a first through hole;
taking down the auxiliary materials from the plate;
and processing a second through hole on the plate.
In one embodiment, the auxiliary material is a covering film layer, and the auxiliary material is adhered to the surface of the plate.
In one embodiment, the plate has a first surface and a second surface opposite to each other, and the auxiliary material is bonded to both the first surface and the second surface.
In one embodiment, a first positioning structure is arranged on the auxiliary material, a second positioning structure is arranged on the plate, and in the combination operation, the first positioning structure is matched with the second positioning structure so as to position when the auxiliary material is combined on the surface of the plate.
In one embodiment, one of the first positioning structure and the second positioning structure is a positioning column, and the other is a positioning hole.
In one embodiment, after the metallization operation, copper layers are formed on the surface of the board, the inner wall surface of the first through hole and the inner wall surface of the second through hole.
In one embodiment, in the plugging operation, the filler plugged in the first through hole is resin.
In one embodiment, the plugging operation is followed by the steps of:
baking operation: removing the auxiliary materials on the plate, and baking the plate;
grinding operation: and grinding the filler in the first through hole to be flush with the surface of the plate.
In one embodiment, the grinding operation uses a ceramic grinding plate to grind the filler.
Drawings
FIG. 1 is a flow chart of a resin plug hole method according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the plate and the auxiliary materials in S110;
fig. 3 is a schematic view of the plate in S120, where the auxiliary materials are combined on both sides of the plate;
FIG. 4 is a schematic view illustrating the opening and the first through hole formed in the auxiliary material and the plate in step S130;
fig. 5 is a schematic view illustrating that a second through hole is processed in the plate in S150;
fig. 6 is a schematic diagram of the metallization operation performed on the board to form a copper layer in S200;
FIG. 7 is a schematic view illustrating the auxiliary material having the opening holes being combined on the plate member in S300;
fig. 8 is a schematic diagram illustrating the filling of the first through hole in S400;
fig. 9 is a schematic view illustrating the step of grinding the fillers to be flush with the surface of the board in S600.
Description of reference numerals:
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
As shown in fig. 1, a resin hole plugging method according to an embodiment of the present invention includes the steps of:
s100, hole machining operation: a first through hole and a second through hole are processed on the plate, and an opening hole is processed on the auxiliary material.
S200, metallization operation: and (5) carrying out negative film electroplating on the plate subjected to hole machining.
S300, combining operations: and combining the auxiliary material on the surface of the plate, aligning the window opening to the first through hole, and covering the second through hole by the auxiliary material.
S400, hole plugging operation: the filler is inserted into the first through-hole through the opening.
S500, baking: removing the auxiliary materials on the plate, and baking the plate;
s600, grinding operation: and grinding the filler in the first through hole to be flush with the surface of the plate.
In the resin hole plugging method, the first through hole and the second through hole can be respectively processed in the hole processing operation stage, and the expansion and contraction deformation of the plate is not generated during the processing of the second through hole, so that the processing of the second through hole is not influenced, the condition of hole deviation and disc breakage is avoided, and the rejection rate of the plate is reduced. In addition, after the hole machining operation is completed, because the first through hole and the second through hole are machined, the plate can be electroplated only by once metallization operation, the trouble that two times of electroplating operation are needed in the conventional resin hole plugging operation is avoided, and the uniform thickness of a plating layer on the plate can be effectively ensured, so that the quality of the plate is improved.
Specifically, in this embodiment, S100, the hole machining operation further includes the following steps:
s110, preparing the plate to be processed and auxiliary materials.
Specifically, in this embodiment, as shown in fig. 2, the auxiliary material 810 is a peelable high-temperature-resistant covering film layer, such as a high-temperature adhesive tape. In other embodiments, the auxiliary material may also be a sheet metal material, such as an aluminum sheet.
And S120, combining the auxiliary materials on the surface of the plate.
As shown in fig. 3, the auxiliary material 810 is a covering film layer, which can adhere to the plate 820 due to its adhesiveness and can also be peeled off from the plate 820 without leaving a residue on the surface of the plate 820, and thus, the auxiliary material 810 adheres to the surface of the plate 820 to achieve the bonding of the auxiliary material 810 on the plate 820. In other embodiments, when the auxiliary materials 810 are metal plates, the plate 820 is placed flat, the auxiliary materials 810 are placed on the plate 820, and the plate 820 and the auxiliary materials 810 are horizontally placed, so that the auxiliary materials 810 are placed on the plate 820 or the plate 820 is placed on the auxiliary materials 810, thereby realizing the combination of the two.
As shown in fig. 3, specifically, the plate 820 has a first surface and a second surface opposite to each other, and the auxiliary materials 810 are combined on both the first surface and the second surface. When the auxiliary material 810 is a covering film layer, the auxiliary material 810 is adhered to both the first surface and the second surface. When the auxiliary materials 810 are metal plates, the auxiliary materials-plate-auxiliary materials are sequentially arranged in a vertical direction such that the two auxiliary materials 810 are respectively positioned at both sides of the plate 820.
S130, penetrating through the auxiliary material and the plate, and synchronously processing an opening hole and a first through hole.
As shown in fig. 4, the entire body of the auxiliary material 810 and the plate 820 is perforated using a processing tool (e.g., a drill or a laser beam) to form an opening 811 on the auxiliary material 810 and a first through-hole 821 on the plate 820, such that the opening 811 is matched with the first through-hole 821.
In addition, in the case that the auxiliary materials 810 are combined on both the first surface and the second surface, the windowing holes 811 are simultaneously formed in the two auxiliary materials 810, so that the two auxiliary materials 810 are combined to the surface of the plate 820 again in the combining operation stage.
And S140, taking down the auxiliary materials from the plate.
And S150, processing a second through hole on the plate.
Because the auxiliary material has been taken off, do not receive sheltering from of auxiliary material, can directly process out the second through-hole with running through on the plate. As shown in fig. 5, the auxiliary material 810 of fig. 4 is removed from the plate 820, and a second through hole 822 is formed in the plate 820 by using a machining tool (e.g., a drill). Thereafter, as shown in fig. 6, the board 820 may be metalized at S200 to form copper layers 830 on the surface of the board 820, the inner wall surface of the first through hole 821 and the inner wall surface of the second through hole 822. Therefore, the devices on the first surface and the devices on the second surface of the manufactured circuit board can realize signal conduction through the copper layer 830.
As shown in fig. 4 and 7, in the step S300 of bonding operation, the auxiliary material 810 having the opening 811 removed in S140 is adhered to the plate 820 again, and the opening 811 is aligned with the first through hole 821, so that the first through hole 821 is exposed, and the second through hole 822 is covered by the auxiliary material 810, so that in the step of plugging operation shown in fig. 8, since the first through hole 821 is exposed, the filler 840 can be plugged into the first through hole 821 through the opening 811, and since the second through hole 822 is covered, the plugging of the filler 840 in the first through hole 821 is not affected, and the filler 840 cannot enter the second through hole 822.
It should be noted that in the case of the auxiliary material being a metal plate, since the plate and the auxiliary material are kept horizontally, the hole-processing operation can be performed only in the vertical direction, and the hole-plugging operation can be performed only in the horizontal direction. Compared with the prior art, when the auxiliary material is the covering film layer, because it can adhere to the surface of plate, the plate can be placed by arbitrary gesture, can not influence going on of each operating procedure, and can also adapt to the position orientation of spot facing work instrument and consent apparatus, and the plate can be placed and cooperate spot facing work and the going on of consent operation with arbitrary gesture promptly, therefore has better environmental suitability. In addition, compared with the metal plate such as an aluminum plate, the auxiliary material is a covering film layer, so that the production cost can be reduced, and the market competitiveness is improved.
In another embodiment, if the auxiliary material is a metal plate, the S100 hole machining operation may further include the steps of:
s210, preparing the plate to be processed and auxiliary materials.
S220, processing a first through hole and a second through hole on the plate.
S230, processing out the fenestration on the auxiliary material, and can be when the auxiliary material combines on the plate, fenestration and first through-hole phase-match, and the auxiliary material can cover the second through-hole.
Both the above-mentioned hole processing methods can realize the processing of the first through hole 821 and the second through hole 822 before the expansion and contraction deformation of the plate 820 does not occur, thereby ensuring that the second through hole 822 does not have the condition of eccentric hole breaking during the processing, and reducing the rejection rate of the plate 820. In addition, after the hole machining operation is completed, since the first through hole 821 and the second through hole 822 are both machined, the electroplating of the plate 820 can be completed only by one metallization operation, so that the thickness uniformity of the plating layer on the plate 820 is effectively ensured, and the quality of the plate 820 is improved. In addition, at the hole machining stage, the opening hole 811 matched with the first through hole 821 can be machined in the auxiliary material 810, and the auxiliary material 810 can cover the second through hole 822 after being combined on the plate 820, so that when the filler 840 is inserted into the first through hole 821, the filler 840 cannot enter the second through hole 822, and the smooth completion of hole plugging operation is guaranteed.
As shown in fig. 4 and 7, in particular, in the step S300 of the bonding operation, since the opening 811 is already opened on the auxiliary material 810, it is necessary to ensure that the opening 811 is precisely aligned with the first through hole 821, so as to facilitate the subsequent step S400 of plugging the hole in fig. 8, and avoid the filler 840 from entering the second through hole 822. Further, the auxiliary materials 810 are combined on the first surface and the second surface, the opening holes 811 in the auxiliary materials 810 on the two sides of the plate 820 are aligned with the two ends of the first through hole 821, and the two ends of the second through hole 822 can be covered, so that the filler 840 is prevented from entering the second through hole 822 when the filler 840 is filled into the first through hole 821.
Specifically, be equipped with first location structure (not shown) on the auxiliary material, be equipped with second location structure (not shown) on the plate, in the combination operation, first location structure cooperatees with second location structure to fix a position when the auxiliary material combines in the plate surface. Through the cooperation of first location structure and second location structure, can realize the accurate location of auxiliary material on the plate to make the first through-hole of opening on the auxiliary material and the plate aim at, in order to ensure that first through-hole exposes completely and the second through-hole is covered completely. Specifically, one of the first positioning structure and the second positioning structure is a positioning column, and the other is a positioning hole. Through the cooperation of reference column and locating hole, can realize the quick location of auxiliary material on the plate. Furthermore, the first positioning structure is a positioning hole, and the second positioning structure is a positioning column. The positioning hole on the auxiliary material can also be processed in the hole processing operation stage, for example, the positioning hole is processed before the first through hole is processed. In other embodiments, the first positioning structure may be configured as a positioning column, and the second positioning structure may be configured as a positioning hole.
As shown in fig. 4, 7 and 8, in the plugging operation of S400, the filler 840 plugged into the first through hole 821 is resin. By filling the first through hole 821, the situation that the manufactured circuit board is exposed to heat and causes air expansion in the first through hole 821 to cause board explosion can be avoided.
In the S600 grinding operation, the filler is ground using a ceramic grinding plate. As shown in fig. 8 and 9, since the filler 840 is inserted into the first through hole 821 through the opening 811, in order to fill the first through hole 821 with the filler 840, the filler 840 needs to be flush with the opening 811 or to protrude out of the opening 811. After the auxiliary material 810 is removed, the plate 820 is baked, so that the filler 840 is cured and the filler 840 is higher than the first surface and the second surface to form a boss structure. The filling 840 is ground to a level higher than the first and second surfaces until the filling is flush with the first and second surfaces, so that the circuit board can be manufactured. By using a ceramic grinding plate, the ground surface can be given a better surface quality.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A resin hole plugging method is characterized by comprising the following steps:
and (3) hole machining operation: processing a first through hole and a second through hole on the plate, and processing an opening hole on the auxiliary material;
metallization operation: carrying out negative film electroplating on the plate subjected to hole machining;
combining operation: combining the auxiliary material on the surface of the plate, aligning the window hole with the first through hole, and covering the auxiliary material on the second through hole;
hole plugging operation: the filler is inserted into the first through-hole through the opening.
2. The method of resin plug hole of claim 1, wherein said hole machining operation further comprises the steps of:
preparing a plate to be treated and auxiliary materials;
combining the auxiliary materials on the surface of the plate;
penetrating the auxiliary material and the plate, and synchronously processing an opening hole and a first through hole;
taking down the auxiliary materials from the plate;
and processing a second through hole on the plate.
3. The method of claim 2, wherein said auxiliary material is a cover film layer, said auxiliary material being adhered to a surface of said plate.
4. The method of resin plug hole of claim 2, wherein said plate has first and second opposing surfaces, both of said first and second surfaces having said secondary material bonded thereto.
5. A method for plugging a hole in a resin plug as claimed in claim 1, wherein said auxiliary material is provided with a first positioning structure and said plate is provided with a second positioning structure, said first positioning structure and said second positioning structure cooperating in said bonding operation to position said auxiliary material when said auxiliary material is bonded to said plate surface.
6. The method of claim 5, wherein one of said first and second locating structures is a locating post and the other is a locating hole.
7. The method for resin via hole according to claim 1, wherein after the metallization operation, a copper layer is formed on the surface of the plate, the inner wall surface of the first through hole, and the inner wall surface of the second through hole.
8. The method for resin plugging according to claim 1 wherein in said plugging operation, the filler plugged in said first through hole is resin.
9. The resin taphole method according to claim 1, characterized by further comprising, after said taphole operation, the steps of:
baking operation: removing the auxiliary materials on the plate, and baking the plate;
grinding operation: and grinding the filler in the first through hole to be flush with the surface of the plate.
10. The resin taphole method according to claim 9, characterized by the grinding operation using a ceramic grinding plate to grind the filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010967944.1A CN112188734A (en) | 2020-09-15 | 2020-09-15 | Resin hole plugging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010967944.1A CN112188734A (en) | 2020-09-15 | 2020-09-15 | Resin hole plugging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112188734A true CN112188734A (en) | 2021-01-05 |
Family
ID=73921145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010967944.1A Pending CN112188734A (en) | 2020-09-15 | 2020-09-15 | Resin hole plugging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112188734A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6497991B1 (en) * | 1999-06-30 | 2002-12-24 | Ngk Spark Plug Co., Ltd. | Method of producing a printed circuit board and mask for carrying out the same |
| CN103813654A (en) * | 2012-11-12 | 2014-05-21 | 北大方正集团有限公司 | Printed circuit board and plugging method thereof |
| CN103917060A (en) * | 2013-01-05 | 2014-07-09 | 北大方正集团有限公司 | Method for manufacturing plug holes in printed circuit board |
| CN105792519A (en) * | 2016-03-22 | 2016-07-20 | 深圳崇达多层线路板有限公司 | Method for preventing blistering of electroplating copper of resin-filled board |
| CN106793573A (en) * | 2016-11-30 | 2017-05-31 | 重庆凯歌电子股份有限公司 | A kind of method for plugging of via-hole of circuit board |
| CN206620361U (en) * | 2017-03-09 | 2017-11-07 | 大连亚太电子有限公司 | Pcb board and air guide plate positioning device |
| CN108243563A (en) * | 2016-12-23 | 2018-07-03 | 无锡深南电路有限公司 | A kind of IC support plates filling holes with resin method |
| CN108347833A (en) * | 2018-03-15 | 2018-07-31 | 深圳市景旺电子股份有限公司 | A kind of technique of filling holes with resin |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN109496071A (en) * | 2018-11-01 | 2019-03-19 | 广州金鹏源康精密电路股份有限公司 | A kind of welding resistance consent component |
| CN110248473A (en) * | 2019-05-28 | 2019-09-17 | 深圳崇达多层线路板有限公司 | A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole |
| CN210130008U (en) * | 2019-03-19 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Air guide backing plate |
-
2020
- 2020-09-15 CN CN202010967944.1A patent/CN112188734A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6497991B1 (en) * | 1999-06-30 | 2002-12-24 | Ngk Spark Plug Co., Ltd. | Method of producing a printed circuit board and mask for carrying out the same |
| CN103813654A (en) * | 2012-11-12 | 2014-05-21 | 北大方正集团有限公司 | Printed circuit board and plugging method thereof |
| CN103917060A (en) * | 2013-01-05 | 2014-07-09 | 北大方正集团有限公司 | Method for manufacturing plug holes in printed circuit board |
| CN105792519A (en) * | 2016-03-22 | 2016-07-20 | 深圳崇达多层线路板有限公司 | Method for preventing blistering of electroplating copper of resin-filled board |
| CN106793573A (en) * | 2016-11-30 | 2017-05-31 | 重庆凯歌电子股份有限公司 | A kind of method for plugging of via-hole of circuit board |
| CN108243563A (en) * | 2016-12-23 | 2018-07-03 | 无锡深南电路有限公司 | A kind of IC support plates filling holes with resin method |
| CN206620361U (en) * | 2017-03-09 | 2017-11-07 | 大连亚太电子有限公司 | Pcb board and air guide plate positioning device |
| CN108347833A (en) * | 2018-03-15 | 2018-07-31 | 深圳市景旺电子股份有限公司 | A kind of technique of filling holes with resin |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN109496071A (en) * | 2018-11-01 | 2019-03-19 | 广州金鹏源康精密电路股份有限公司 | A kind of welding resistance consent component |
| CN210130008U (en) * | 2019-03-19 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Air guide backing plate |
| CN110248473A (en) * | 2019-05-28 | 2019-09-17 | 深圳崇达多层线路板有限公司 | A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8256112B2 (en) | Method of manufacturing high density printed circuit board | |
| US6936532B2 (en) | Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another | |
| US8956918B2 (en) | Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier | |
| CN107484356B (en) | Manufacturing method of thick copper sandwich aluminum substrate | |
| EP1435658B1 (en) | Substrates and method for producing the same | |
| TWI552654B (en) | A method for manufacturing a cavity substrate | |
| US3670396A (en) | Method of making a circuit assembly | |
| CN104025728A (en) | Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same | |
| EP3622304B1 (en) | Method for producing a multi-layer of a probe card for a testing apparatus of electronic devices | |
| CN112188734A (en) | Resin hole plugging method | |
| CN113613415A (en) | Printed circuit board and non-metallized step groove processing technology thereof | |
| US20080127484A1 (en) | Selective filling of through holes | |
| JP2004241771A (en) | Electronic package correction process | |
| CN115038255B (en) | Windowing method for cover film of flexible circuit board | |
| CN108401358B (en) | Printed circuit board and manufacturing method thereof | |
| CN115623667A (en) | Printed circuit board with embedded heat dissipation block and manufacturing method thereof | |
| US20120080318A1 (en) | Forming Through-Substrate Vias by Electrofilling | |
| CN116390356A (en) | Manufacturing method of double-sided thick copper circuit board and circuit board | |
| CN217062065U (en) | Embedded substrate | |
| JPS59147486A (en) | Method of filling hole of green sheet | |
| JP6889000B2 (en) | Manufacturing method of ceramic wiring board | |
| JP3243035B2 (en) | Method for manufacturing ceramic multilayer substrate and jig for green sheet carrier | |
| JP5109429B2 (en) | Resin base material having fine diameter through-hole and manufacturing method thereof, chip for ink analysis, inkjet head | |
| CN116347786A (en) | Thermoelectric separation substrate with stepped welding surface and manufacturing method | |
| CN117693112A (en) | LED carrier plate and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210105 |