JP5109429B2 - Resin base material having fine diameter through-hole and manufacturing method thereof, chip for ink analysis, inkjet head - Google Patents
Resin base material having fine diameter through-hole and manufacturing method thereof, chip for ink analysis, inkjet head Download PDFInfo
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Description
本発明は、インクジェットプリンタのヘッドや分析機器の滴定に用いる微細径貫通孔を有する樹脂基材およびその製造方法に関する。 The present invention relates to a resin base material having a fine through-hole used for titration of an ink jet printer head or an analytical instrument, and a method for producing the same.
近年、インクジェットプリンタの印刷性能は飛躍的に向上し、一般家庭用のプリンタで一滴が1.5〜2plのレベルとなっている。これに伴い、インクジェットプリンタのインクの吐出量も微細となり、更なる性能向上のためにインクを吐出するための吐出部には、微細径貫通孔を有する基材が必要とされている。 In recent years, the printing performance of ink jet printers has improved dramatically, and a drop of 1.5 to 2 pl has become a level in general household printers. Along with this, the ink discharge amount of the ink jet printer becomes fine, and a substrate having fine through-holes is required for the discharge portion for discharging ink for further performance improvement.
また、印刷性能の向上は、インクにも依存するため、つまりにくいインクの開発が要求されているが、このインクの開発にはいわゆる滴定分析機器が不可欠であり、この分析機器のインク分析用チップにも、微細径貫通孔を有する基材が必要とされている。なお、このようなインクの滴定分析においては、インクの流れが外部から視認できれば、評価が容易になり、効率的である。 In addition, since the improvement in printing performance depends on the ink, the development of a difficult ink is required, but a so-called titration analyzer is indispensable for the development of this ink. In addition, there is a need for a substrate having fine through-holes. In such an ink titration analysis, if the ink flow can be visually recognized from the outside, the evaluation becomes easy and efficient.
さらに、液体や気体の分析装置においても、微細量の分析には滴定量の少ないことが求められ、そのために吐出部に微細径貫通孔を有する基材が必要とされる。 Further, even in a liquid or gas analyzer, a small amount of titration is required for analysis of a fine amount, and for this purpose, a base material having a fine diameter through hole in the discharge portion is required.
上述したように、多方面において微細径貫通孔を有する基材が求められているが、例えば、インクジェットヘッド等は、特許文献1に示されるように、従来は、金属板にエッチングやレーザー加工によって貫通孔を加工していたため、孔の長さ方向の断面形状がテーパとなり、吐出量の制御が安定せず、今後の微細化の進行に対応が困難となってきている。また、上述したインクの開発においては、金属板の吐出口の場合、外部からインクの流れが視認できないため評価が困難であった。 As described above, a substrate having fine-diameter through-holes in many directions is required. For example, as shown in Patent Document 1, an inkjet head or the like is conventionally performed by etching or laser processing on a metal plate. Since the through-hole has been processed, the cross-sectional shape in the length direction of the hole is tapered, the control of the discharge amount is not stable, and it is difficult to cope with the progress of miniaturization in the future. Further, in the development of the ink described above, in the case of the discharge port of the metal plate, it was difficult to evaluate because the ink flow cannot be visually recognized from the outside.
また、従来の加工方法においては50μm以下の孔加工が難しく、孔径の制御が困難であった。
本発明は、かかる点に鑑みて成されたものであり、従来技術では困難であった一方の開口部から他方の開口部まで同一径で、径が50μm以下の微細径貫通孔を形成することを可能とする。また、孔の内部を外部から視認できるようにする。 The present invention has been made in view of the above points, and forms a fine through-hole having the same diameter and a diameter of 50 μm or less from one opening to the other opening, which was difficult in the prior art. Is possible. Also, the inside of the hole is made visible from the outside.
本発明の請求項1に係る発明は、第1の樹脂基材の一平面に所望の微細径の金属線を所望のピッチで配設し、前記金属線が配設された第1の樹脂基材の一平面と、前記第1の樹脂基材と同じ材質からなる第2の樹脂基材の一平面とを、前記第1および第2の樹脂基材の材質を主成分とする接着剤を介して接着して一体化し、一体化された前記第1および第2の樹脂基材を所望の厚さに切断し、一体化された前記第1および第2の樹脂基材をエッチング液に浸漬して前記金属線を溶解すること、を備えることを特徴とする微細径貫通孔を有する樹脂基材の製造方法としたものである。 According to the first aspect of the present invention, a metal wire having a desired fine diameter is disposed at a desired pitch on one plane of the first resin base material, and the first resin substrate on which the metal wire is disposed. An adhesive mainly composed of the material of the first and second resin bases, and one surface of the second resin base material made of the same material as the first resin base material. The first and second resin base materials are cut to a desired thickness, and the integrated first and second resin base materials are immersed in an etching solution. And a method of producing a resin base material having fine through-holes, wherein the metal wire is melted.
本発明の請求項2に係る発明は、金属板に感光性レジストを塗布し、所望の微細径の形状に開口したフォトマスクによって前記感光性レジストを露光し、現像して所望の微細径の形状に前記金属板を露出させ、所望の微細径の形状に露出した前記金属板を電極として電気めっきを行い所望の微細径の形状に金属を析出させ、前記感光性レジストを除去して前記金属板全面に硬化性の樹脂を堆積して硬化させ、硬化した樹脂表面を前記金属板の所望の微細径の形状に析出した部分の表面が露出するように研磨し、前記金属板をエッチング液に浸漬して溶解すること、を備えることを特徴とする微細径貫通孔を有する樹脂基材の製造方法としたものである。 In the invention according to claim 2 of the present invention, a photosensitive resist is applied to a metal plate, the photosensitive resist is exposed by a photomask opened to a desired fine diameter shape, and developed to develop a desired fine diameter shape. The metal plate is exposed, and the metal plate exposed in a desired fine diameter shape is electroplated as an electrode to deposit metal in the desired fine diameter shape, and the photosensitive resist is removed to remove the metal plate. A curable resin is deposited and cured on the entire surface, and the cured resin surface is polished so that the surface of the portion of the metal plate deposited in a desired fine diameter is exposed, and the metal plate is immersed in an etching solution. And a method for producing a resin base material having a fine-diameter through hole.
本発明の請求項3に係る発明は、さらに、前記第1の樹脂基材の前記一平面に所望のピッチで溝を形成し、前記金属線は、前記溝に配設されることを特徴とする請求項1に記載の微細径貫通孔を有する樹脂基材の製造方法としたものである。 The invention according to claim 3 of the present invention is characterized in that grooves are formed at a desired pitch on the one plane of the first resin base material, and the metal wires are arranged in the grooves. It is set as the manufacturing method of the resin base material which has a fine diameter through-hole of Claim 1 to do.
本発明の請求項4に係る発明は、前記第1および第2の樹脂基材は、同一樹脂からなる複数のシート状の樹脂基材を剥離容易な接着層を介して積層した積層樹脂基材を積層方向に切断して形成した積層樹脂基材であって、さらに、一体化された前記第1および第2の樹脂基材の接着層を剥離すること、を備えることを特徴とする請求項1または請求項3に記載の微細径貫通孔を有する樹脂基材の製造方法としたものである。 In the invention according to claim 4 of the present invention, the first and second resin base materials are laminated resin base materials obtained by laminating a plurality of sheet-like resin base materials made of the same resin through an easily peelable adhesive layer. A laminated resin base material formed by cutting in a laminating direction, further comprising peeling the adhesive layers of the integrated first and second resin base materials. This is a method for producing a resin base material having fine through-holes according to claim 1 or claim 3.
本発明の請求項5に係る発明は、前記微細径貫通孔は、一方の開口部から他方の開口部まで同一径であることを特徴とする請求項1乃至請求項4の何れか一に記載の微細貫通孔を有する樹脂基材の製造方法としたものである。 The invention according to claim 5 of the present invention is characterized in that the fine diameter through hole has the same diameter from one opening to the other opening. This is a method for producing a resin base material having fine through holes.
本発明の請求項6に係る発明は、前記所望の微細径は、50μm以下であることを特徴とする請求項1乃至請求項4の何れか一に記載の微細径貫通孔を有する樹脂基材の製造方法としたものである。 The invention according to claim 6 of the present invention is characterized in that the desired fine diameter is 50 μm or less, and the resin base material having fine diameter through-holes according to any one of claims 1 to 4 This is a manufacturing method.
本発明の請求項7に係る発明は、前記第1および第2の樹脂基材の材質は、透明な樹脂であることを特徴とする請求項1乃至請求項4の何れか一に記載の微細径貫通孔を有する樹脂基材の製造方法としたものである。 According to a seventh aspect of the present invention, the material of the first and second resin base materials is a transparent resin, and the fine structure according to any one of the first to fourth aspects. This is a method for producing a resin base material having a diameter through hole.
本発明の請求項8に係る発明は、前記金属線は、該金属線の外周を、前記第1および第2の樹脂基材の材質からなる絶縁体で被覆し、さらに絶縁体の外周に接着層を有する金属線であることを特徴とする請求項1乃至請求項4の何れか一に記載の微細径貫通孔を有する樹脂基材の製造方法としたものである。 In the invention according to claim 8 of the present invention, the metal wire is coated with an insulator made of the material of the first and second resin bases, and further adhered to the outer periphery of the insulator. It is a metal wire which has a layer, It is set as the manufacturing method of the resin base material which has a micro diameter through-hole as described in any one of Claim 1 thru | or 4.
本発明によれば、従来技術では困難であった一方の開口部から他方の開口部まで同一径で、径が50μm以下の微細径貫通孔を形成することが可能となり、また、孔の内部を外部から視認することが可能となる。 According to the present invention, it is possible to form a fine-diameter through-hole having the same diameter and a diameter of 50 μm or less from one opening to the other, which has been difficult in the prior art, It is possible to visually recognize from the outside.
以下に、本発明について図を用いながら詳細に説明する。本明細書においては、同一部材については同一符号を付し、説明を省略または簡略化する。 The present invention will be described in detail below with reference to the drawings. In the present specification, the same members are denoted by the same reference numerals, and description thereof is omitted or simplified.
(実施形態1)
図1および図2を基に、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材の形成方法について説明する。図1および図2は、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材の形成方法を示した模式図である。本発明の一実施形態に係る微細径貫通孔を有する樹脂基材18の形成方法は、半導体装置等の製造において多用されるエッチング技術を用いて、微細径貫通孔を形成する方法である。
(Embodiment 1)
Based on FIG. 1 and FIG. 2, the formation method of the resin base material which has a fine diameter through-hole which concerns on one Embodiment of this invention is demonstrated. 1 and 2 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. The formation method of the resin base material 18 having a fine diameter through hole according to an embodiment of the present invention is a method of forming a fine diameter through hole by using an etching technique frequently used in manufacturing a semiconductor device or the like.
まず、図1(a)に示すように、アクリルなどの透明な樹脂基材10を、切断機等を使用して2分割し、第1の樹脂基材(以下、樹脂基材Aという。)13および第2の樹脂基材(以下、樹脂基材Bという。)14を形成する。分割は、樹脂基材10を水平方向に2分割してもよいし、垂直方向に2分割してもよい。図1(a)においては水平方向に2分割した例を示している。なお、樹脂基材を分割することなく、同一材量で形成された2個の樹脂基材10を用いてもよい。 First, as shown in FIG. 1A, a transparent resin base material 10 such as acrylic is divided into two parts using a cutting machine or the like, and a first resin base material (hereinafter referred to as resin base material A). 13 and a second resin base material (hereinafter referred to as resin base material B) 14 are formed. In the division, the resin base material 10 may be divided into two in the horizontal direction or in the vertical direction. FIG. 1A shows an example in which the image is divided into two in the horizontal direction. In addition, you may use the two resin base materials 10 formed with the same material amount, without dividing | segmenting a resin base material.
次に、一方の樹脂基材A13にダイシング装置などによって図1(b)のように溝(以下、スリットという場合がある。)20を形成していく。この溝20は、微細径貫通孔を形成するために使用する金属線19を等ピッチで配設するための位置決めのためのスリットである。したがって、例えば金属線19として、溶剤融着タイプの被覆金属線19または熱融着タイプの被覆金属線19を使用する場合には、溝20を設けてもよいし、溝20を設けなくてもよい。ここで、溶剤融着タイプの被覆金属線19とは、金属線の周りを樹脂基材10と同じ材量からなる絶縁体で被覆し、さらにその周りに溶剤で溶けるタイプの接着層が形成された金属線をいい、熱融着タイプの被覆金属線19とは、金属線の周りを樹脂基材10と同じ材量からなる絶縁体で被覆し、さらにその周りに熱で溶けるタイプの接着層が形成された金属線をいう。上述したように、溝20は、金属線19を等ピッチで配設するための位置決めのために形成するものであり、最終的に形成される微細径貫通孔の数に対応した本数が形成されるが、溝20の幅、深さおよび形状等は任意に設定できる。一般的には、例えば20μmの金属線19を使用する場合、溝20は、幅30μm、深さ25μmで、V字型に形成するのが好ましい。但し、溝20のピッチは、最終的に形成する微細径貫通孔の間隔(ピッチ)に対応して決定される。 Next, a groove (hereinafter sometimes referred to as a slit) 20 is formed in one resin base material A13 as shown in FIG. The groove 20 is a slit for positioning for arranging the metal wires 19 used for forming the fine-diameter through holes at an equal pitch. Therefore, for example, when the solvent fusion type coated metal wire 19 or the heat fusion type coated metal wire 19 is used as the metal wire 19, the groove 20 may be provided or the groove 20 may not be provided. Good. Here, the solvent fusion-type coated metal wire 19 is formed by coating the periphery of the metal wire with an insulator made of the same material amount as the resin base material 10, and forming an adhesive layer of a type that melts with the solvent around the metal wire. The metal wire 19 is a heat-sealing type coated metal wire 19 in which the metal wire is covered with an insulator made of the same material amount as the resin base material 10 and further melted by heat around the metal wire. Is a metal wire formed. As described above, the grooves 20 are formed for positioning for arranging the metal wires 19 at an equal pitch, and the number corresponding to the number of fine diameter through holes to be finally formed is formed. However, the width, depth, shape and the like of the groove 20 can be arbitrarily set. In general, for example, when a 20 μm metal wire 19 is used, the groove 20 is preferably formed in a V shape with a width of 30 μm and a depth of 25 μm. However, the pitch of the grooves 20 is determined corresponding to the interval (pitch) of the fine diameter through holes to be finally formed.
次に図1(c)のように、形成する微細径貫通孔と同一径の金属線19を、形成する貫通孔の数に対応して形成された溝20に配設していく。図1においては、5本配設した例を示している。すべての溝20に金属線19を配設した後、樹脂基材10と同系の接着剤を溝20ならびに樹脂基材A13上に塗布し、もう一方の樹脂基材B14を接着する(図2(a)参照)。なお、接着の際に接着剤に空気が入り込まないように、接着剤塗布後に真空脱泡を行う。接着剤を完全に硬化させることで、樹脂基材A13と樹脂基材B14が完全に一体となった、金属線19が埋め込まれた樹脂基材塊15を形成する。ここで、樹脂基材塊15は、2個の樹脂基材A13とB14とを、該樹脂基材と同系の接着剤で接着して形成するため、接着剤と基材とが同化し、接合面のない一体化した樹脂基材塊15となる。 Next, as shown in FIG. 1C, metal wires 19 having the same diameter as the fine through holes to be formed are disposed in the grooves 20 formed corresponding to the number of through holes to be formed. FIG. 1 shows an example in which five are arranged. After arranging the metal wires 19 in all the grooves 20, an adhesive similar to the resin base material 10 is applied onto the grooves 20 and the resin base material A13, and the other resin base material B14 is adhered (FIG. 2 ( a)). In order to prevent air from entering the adhesive during bonding, vacuum defoaming is performed after applying the adhesive. By completely curing the adhesive, the resin substrate lump 15 in which the metal wire 19 is embedded, in which the resin substrate A13 and the resin substrate B14 are completely integrated, is formed. Here, since the resin base material block 15 is formed by bonding two resin base materials A13 and B14 with an adhesive similar to the resin base material, the adhesive and the base material are assimilated and joined. An integrated resin base mass 15 having no surface is obtained.
次に、金属線19が埋め込まれて一体となった樹脂基材塊15を、該金属線19は溶解するが樹脂基材塊15には影響を与えないエッチング液に浸漬(以下、ディップという場合がある。)して、金属線19をエッチングによって溶解除去する。例えば、金属線19として銅線を用いた場合、塩化第2鉄液などのエッチング液によってエッチングして、埋め込んだ金属線19を溶解除去する。金属線19は、接着によって一体化された樹脂基材塊15に埋め込まれた状態となっているが、エッチング液に浸漬すると、毛細管現象によりエッチング液が樹脂基材塊15内部に埋め込まれた金属線19にまで確実に浸透し、金属線19は確実に溶解除去される。 Next, the resin base material block 15 in which the metal wire 19 is embedded and integrated is immersed in an etching solution that dissolves the metal wire 19 but does not affect the resin base material block 15 (hereinafter referred to as dip). Then, the metal wire 19 is dissolved and removed by etching. For example, when a copper wire is used as the metal wire 19, the buried metal wire 19 is dissolved and removed by etching with an etchant such as ferric chloride. The metal wire 19 is embedded in the resin base material block 15 integrated by adhesion, but when immersed in an etching solution, the metal is embedded in the resin base material block 15 by capillary action. The wire 19 is surely penetrated and the metal wire 19 is surely dissolved and removed.
金属線19が溶解除去されると、所望の径の微細径貫通孔を有する一体の樹脂基材塊16が形成される。その後、所望の径の微細径貫通孔を有する樹脂基材塊16を、ダイヤモンドソー等で、金属線19を埋め込んだ方向と垂直方向に、所望の厚さに切断し、図2(c)のように所望の径の微細径貫通孔を有する樹脂基材18を、複数形成することができる。最後に、微細径貫通孔を有する樹脂基材18の表面を研磨機等によって研磨して平坦化する。なお、エッチングによる金属線19の溶解除去と、金属線19が埋め込まれた樹脂基材塊15を所望の厚さに切断する工程の順番は、上述の順番に限られない。金属線19が埋め込まれた樹脂基材塊15を、所望の厚さに金属線19ごと切断して金属線19が埋め込まれた樹脂基材17を形成した(図2(b)参照)後に、エッチングによって金属線19を溶解除去して、微細径貫通孔を有する樹脂基材18を形成してもよい(図2(c)参照)。 When the metal wire 19 is dissolved and removed, an integral resin base mass 16 having a fine through hole having a desired diameter is formed. Thereafter, the resin base material block 16 having the fine through-holes having a desired diameter is cut to a desired thickness in a direction perpendicular to the direction in which the metal wire 19 is embedded with a diamond saw or the like, as shown in FIG. In this way, a plurality of resin base materials 18 having fine through holes having a desired diameter can be formed. Finally, the surface of the resin base material 18 having fine diameter through holes is polished and flattened by a polishing machine or the like. In addition, the order of the process of melt | dissolving and removing the metal wire 19 by etching and cutting the resin base material block 15 in which the metal wire 19 is embedded into a desired thickness is not limited to the order described above. After the resin base material block 15 in which the metal wire 19 is embedded is cut into the desired thickness together with the metal wire 19 to form the resin base material 17 in which the metal wire 19 is embedded (see FIG. 2B), The metal wire 19 may be dissolved and removed by etching to form the resin base material 18 having fine diameter through holes (see FIG. 2C).
なお、透明な樹脂基材として、透明なシート状の樹脂基材を、接着シートを介して積層して形成した積層樹脂基材を使用してもよい。図3および図4を基に説明する。図3および図4は、本発明の一実施例に係る微細径貫通孔を有する樹脂基材の形成方法を示した模式図である。例えば、アクリル等の透明なシート状樹脂基材110をシリコンウェハの切断等に用いる紫外線剥離タイプの接着シート111を介して積層して形成した積層樹脂基材112等を、樹脂基材として用いる。接着シート111の貼り合わせには、空気を挟み込まないようにラミネータを使用する。この積層樹脂基材112を使用する場合には、積層樹脂基材112の2分割は、積層された方向で分割する。図3においては、図に向かって垂直方向で第1の積層樹脂基材(以下、積層樹脂基材Aという。)113と、第2の積層樹脂基材(以下、積層樹脂基材Bという。)114とに分割する(図3(c)参照)。分割に際しては、切断面の積層を崩さないように、ダイヤモンドソー等の加工機を使用する。分割された切断面にバリ等が発生している場合には、研磨して切断面の形状を整える。その上で、所定の径の金属線119を、2分割した一方の積層樹脂基材A113の前記切断面に所定のピッチで必要な本数配設し(図3(d)参照)、2分割した他方の積層樹脂基材B114の切断面を、積層が相互に一致する様に接着剤で接着する。接着剤が完全に硬化すると、積層樹脂基材112の積層方向に金属線119が埋め込まれた状態の積層樹脂基材塊115が得られる(図4(a)参照)。その後、積層樹脂基材塊115に紫外線露光装置で紫外線照射を行い、接着シート111の接着力を低下させ、積層樹脂基材塊115を剥離し易くする。接着力の低下した接着シート111を除去して(図4(b)参照)、金属線119が貫通した樹脂基材110を4個形成する。次に、金属線119を切断し、金属線が埋め込まれた樹脂基材117を複数形成し(図示せず)、その後金属線119をエッチングによって除去して、所望の径の微細径貫通孔が形成された樹脂基材118を得ることができる(図4(c)参照)。積層樹脂基材塊115を、エッチング液に浸漬して金属線119をエッチング除去し、その後紫外線照射を行い、接着シート111と樹脂基材110を剥離することによっても、所望の径の微細径貫通孔を有する樹脂基材118を得ることができる。 In addition, you may use the laminated resin base material formed by laminating | stacking a transparent sheet-like resin base material via an adhesive sheet as a transparent resin base material. This will be described with reference to FIGS. 3 and 4 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. For example, a laminated resin base material 112 formed by laminating a transparent sheet-like resin base material 110 such as acrylic via an ultraviolet peeling type adhesive sheet 111 used for cutting a silicon wafer or the like is used as the resin base material. In laminating the adhesive sheet 111, a laminator is used so as not to sandwich air. When this laminated resin substrate 112 is used, the division of the laminated resin substrate 112 is divided in the laminated direction. In FIG. 3, a first laminated resin base material (hereinafter referred to as “laminated resin base material A”) 113 and a second laminated resin base material (hereinafter referred to as “laminated resin base material B”) in the vertical direction toward the figure. ) 114 (see FIG. 3C). In the division, a processing machine such as a diamond saw is used so as not to break the lamination of the cut surfaces. If burrs or the like are generated on the divided cut surfaces, the shape of the cut surfaces is adjusted by polishing. In addition, a required number of metal wires 119 having a predetermined diameter are arranged at a predetermined pitch on the cut surface of one of the two laminated resin base materials A113 (see FIG. 3D) and divided into two. The cut surface of the other laminated resin base material B114 is adhered with an adhesive so that the laminated layers coincide with each other. When the adhesive is completely cured, a laminated resin substrate mass 115 in which the metal wire 119 is embedded in the lamination direction of the laminated resin substrate 112 is obtained (see FIG. 4A). Thereafter, the laminated resin base material mass 115 is irradiated with ultraviolet rays by an ultraviolet exposure device to reduce the adhesive force of the adhesive sheet 111 and make the laminated resin base material mass 115 easy to peel off. The adhesive sheet 111 whose adhesive force has decreased is removed (see FIG. 4B), and four resin base materials 110 through which the metal wires 119 penetrate are formed. Next, the metal wire 119 is cut to form a plurality of resin base materials 117 in which the metal wire is embedded (not shown), and then the metal wire 119 is removed by etching to form a fine through hole having a desired diameter. The formed resin base material 118 can be obtained (see FIG. 4C). The laminated resin base material block 115 is immersed in an etching solution to remove the metal wire 119 by etching, and then irradiated with ultraviolet rays, and the adhesive sheet 111 and the resin base material 110 are peeled off. A resin substrate 118 having holes can be obtained.
なお、接着シート111として、熱剥離タイプの接着シートを用いることも可能である。この場合には、接着シート111の接着力を低下させるために、積層樹脂基材A113と積層樹脂基材B114とを接着剤で接着し、接着剤が硬化して一体化された積層樹脂基材塊115を形成した後に、該積層樹脂基材115をオーブンで加熱して接着力を低下させる。他の工程は同様であるので、説明を省略する。 Note that a heat-peeling type adhesive sheet may be used as the adhesive sheet 111. In this case, in order to reduce the adhesive force of the adhesive sheet 111, the laminated resin substrate A113 and the laminated resin substrate B114 are bonded with an adhesive, and the adhesive is cured to be integrated. After forming the lump 115, the laminated resin substrate 115 is heated in an oven to reduce the adhesive force. Since other processes are the same, description thereof is omitted.
以上のようにして形成された微細径貫通孔を有する樹脂基材18は、該樹脂基材18の略中央に複数の所望の径の微細径貫通孔を有し、前記貫通孔は断面形状がテーパ状とならず、一方の開口から他方の開口まで同一径で形成される。また、前記微細径貫通孔を有する樹脂基材18は、2分割された樹脂基材A13および樹脂基材B14を金属線19を挟んで再度接着したものであるため、複数の微細径貫通孔は、直列に形成される。したがって、吐出量の微細化が求められるインクジェットプリンタのインクジェットヘッドとして活用することで、より精細できれいなインクジェットプリンタが提供される。 The resin base material 18 having a fine diameter through hole formed as described above has a plurality of fine diameter through holes having a desired diameter in the approximate center of the resin base material 18, and the through hole has a cross-sectional shape. It is not tapered and is formed with the same diameter from one opening to the other. Further, since the resin base material 18 having the fine diameter through holes is obtained by re-bonding the resin base material A13 and the resin base material B14 divided into two with the metal wire 19 interposed therebetween, the plurality of fine diameter through holes are , Formed in series. Therefore, a finer and more beautiful ink jet printer is provided by utilizing it as an ink jet head of an ink jet printer that requires a finer discharge amount.
また、以上の工程で形成された、微細径貫通孔を有する樹脂基材18は、孔の一方の開口から他方の開口まで同一径であるため、滴定量の制御が容易である。したがって、気体や液体の分析装置において、微細な滴定量を制御することができ、微細量を分析可能な分析装置を提供することができる。 In addition, since the resin base material 18 having fine through holes formed in the above steps has the same diameter from one opening to the other opening of the hole, the titration amount can be easily controlled. Therefore, in a gas or liquid analyzer, a fine titer can be controlled, and an analyzer capable of analyzing a minute amount can be provided.
またさらに、樹脂基材10としてアクリル等の透明樹脂を用いるため、外部から孔の内部等を視認することができる。したがって、例えばインクの流れ等を容易に確認することができる。このため、インク開発用のインク分析用チップに使用することで、つまりにくいインクの開発が容易になる。 Furthermore, since a transparent resin such as acrylic is used as the resin base material 10, the inside of the hole can be visually recognized from the outside. Therefore, for example, the flow of ink can be easily confirmed. For this reason, the use of the ink analysis chip for ink development facilitates the development of a difficult ink.
(実施形態2)
上述した本発明の実施形態1においては、半導体装置の製造において多用されるエッチング技術を用いて微細径貫通孔を形成したが、半導体装置の製造技術を応用することで、微細径貫通孔を有する樹脂基材の別の製造方法を提供できる。本発明の実施形態2に係る微細径貫通孔を有する樹脂基材の形成方法は、リソグラフィ技術を応用するものである。
(Embodiment 2)
In the first embodiment of the present invention described above, the fine-diameter through hole is formed by using an etching technique frequently used in the manufacture of a semiconductor device. However, by applying the semiconductor device manufacturing technique, the fine-diameter through hole is provided. Another method for producing the resin substrate can be provided. The method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention applies lithography technology.
以下、図に基づいて説明する。図7乃至図9は、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材の形成方法を示した模式図である。本発明による微細貫通穴の形成方法は、基材に金属基材321を用い、該金属基材321上にリソグラフィ技術を用いて、形成する微細径貫通孔と同一径の孔が抜けためっきパターン325を形成する。その後、金属めっきによって、前記微細径貫通孔と同一径の孔から金属を析出させる。析出された金属は、形成すべき微細径貫通孔と同一径の円柱状に形成される。その後この金属基材321上に硬化性樹脂327を塗布して硬化させ、さらに、前記金属基材321をエッチングによって溶解除去して、微細径貫通孔を有する樹脂基材328を形成する。以上が概略方法であるが、より詳細に、図7乃至図9を用いて説明する。 Hereinafter, a description will be given based on the drawings. 7 to 9 are schematic views showing a method of forming a resin base material having a fine diameter through hole according to an embodiment of the present invention. The method for forming fine through holes according to the present invention uses a metal substrate 321 as a base material, and a plating pattern in which holes having the same diameter as the fine through holes to be formed are formed on the metal base material 321 using a lithography technique. 325 is formed. Thereafter, metal is deposited from a hole having the same diameter as the fine through hole by metal plating. The deposited metal is formed into a cylindrical shape having the same diameter as the fine diameter through hole to be formed. Thereafter, a curable resin 327 is applied on the metal substrate 321 and cured, and the metal substrate 321 is dissolved and removed by etching to form a resin substrate 328 having fine diameter through holes. The above is the outline method, but it will be described in more detail with reference to FIGS.
まず、銅板等の金属基材321の上に感光性レジスト322を塗布して平坦化する(図7(a)、図7(b)参照)。これとは別に、予め、微細径貫通孔を形成する場所と完成品である樹脂基材328の外周形状をパターニングしたフォトマスク323を用意する(図7(c)参照)。前記フォトマスク323にパターニングされる形状パターンは、形成すべき微細径貫通孔と同一径であり、例えば、円形である。また、外周形状は、完成品である微細径貫通孔を有する樹脂基材328の外周形状に合わせて所定の幅を持って形成されたものである。 First, the photosensitive resist 322 is apply | coated on the metal base materials 321, such as a copper plate, and it planarizes (refer Fig.7 (a) and FIG.7 (b)). Separately from this, a photomask 323 is prepared by previously patterning the location where the fine diameter through-holes are formed and the outer peripheral shape of the resin base material 328 as a finished product (see FIG. 7C). The shape pattern patterned on the photomask 323 has the same diameter as that of the fine through-hole to be formed, and is circular, for example. Further, the outer peripheral shape is formed with a predetermined width in accordance with the outer peripheral shape of the resin base material 328 having a fine diameter through-hole which is a finished product.
感光性レジスト322を塗布した金属基材321上に、前記フォトマスク323を搭載する(図7(d)参照)。次に、感光性レジスト322の上にフォトマスク323を搭載した金属基材321に、紫外線(UV)324を照射して焼き付ける(図8(a)参照)。続いてパターンを焼き付けた感光性レジスト322を現像し、図8(b)に示すように、微細径貫通孔部と樹脂基材328外周部のレジストが抜けたレジストパターン(以下、めっきパターンという。)325を形成する。 The photomask 323 is mounted on the metal substrate 321 coated with the photosensitive resist 322 (see FIG. 7D). Next, the metal substrate 321 having the photomask 323 mounted on the photosensitive resist 322 is baked by irradiation with ultraviolet (UV) 324 (see FIG. 8A). Subsequently, the photosensitive resist 322 onto which the pattern has been baked is developed, and as shown in FIG. 8B, a resist pattern (hereinafter referred to as a plating pattern) in which the resist on the fine diameter through hole portion and the outer peripheral portion of the resin base material 328 is removed. ) 325 is formed.
めっきパターン325を付けたままの金属基材321を電極として、電気めっきにより銅などの溶解可能な金属を、前記めっきパターン325の開口部に析出させる(図8(c)参照)。電気めっきを行った後、めっきパターン325を剥離することで、微細径貫通孔部および樹脂基材328外周部のパターンを形成した金属基材326を得ることができる(図9(a)参照)。 Using the metal substrate 321 with the plating pattern 325 attached as an electrode, a dissolvable metal such as copper is deposited in the opening of the plating pattern 325 by electroplating (see FIG. 8C). After performing electroplating, the metal substrate 326 in which the pattern of the fine diameter through-hole portion and the outer periphery of the resin substrate 328 is formed can be obtained by peeling the plating pattern 325 (see FIG. 9A). .
次に、めっきパターン325が形成された金属基材326上に、硬化性樹脂327をコーティングし、硬化性樹脂327を硬化させる(図9(b)参照)。硬化性樹脂327は、めっきパターンが形成された金属基材326の微細径貫通孔部および樹脂基材328外周部のパターンが埋没するようにコーティングする。硬化性樹脂327が硬化した後、微細径貫通孔部および樹脂基材328外周部のパターン上の硬化性樹脂327を研磨機によって、当該部分のめっきパターンが形成された金属基材326表面が露出するまで研磨して除去する(図9(c)参照)。この研磨によって、樹脂327は、最終的に形成される微細径貫通孔を有する樹脂基材328の大きさに形成され、かつ、該樹脂327の上面から、微細径貫通孔の部分だけめっきパターンが形成された金属基材326の表面が露出することとなる。 Next, the curable resin 327 is coated on the metal substrate 326 on which the plating pattern 325 is formed, and the curable resin 327 is cured (see FIG. 9B). The curable resin 327 is coated so that the fine diameter through hole portion of the metal base material 326 on which the plating pattern is formed and the pattern of the outer peripheral portion of the resin base material 328 are buried. After the curable resin 327 is cured, the surface of the metal substrate 326 on which the plating pattern of the portion is formed is exposed by a polishing machine with the curable resin 327 on the pattern of the fine diameter through-hole portion and the outer peripheral portion of the resin substrate 328. Until it is polished (see FIG. 9C). By this polishing, the resin 327 is formed in the size of the resin base material 328 having the fine diameter through hole to be finally formed, and the plating pattern is formed only on the fine diameter through hole portion from the upper surface of the resin 327. The surface of the formed metal base material 326 will be exposed.
樹脂327を研磨した後、エッチング液を用いて金属基材326を溶解除去することで、本発明に係る微細径貫通孔を有する樹脂基材328を得ることができる。微細径貫通孔は、所望の径と同一径の抜きのレジストパターン(めっきパターン)325から、電気めっきによって析出させた所望の径と同一径の金属基材326を基に形成し、該金属基材326を溶解除去して形成されるため、一方の開口部から他方の開口部まで同一径に形成され、テーパ状にはならない。また、その径は前記所望の径となる。 After the resin 327 is polished, the metal base material 326 is dissolved and removed using an etching solution, whereby the resin base material 328 having fine through-holes according to the present invention can be obtained. The fine-diameter through hole is formed from a resist pattern (plating pattern) 325 having the same diameter as the desired diameter, based on a metal substrate 326 having the same diameter as the desired diameter deposited by electroplating. Since it is formed by dissolving and removing the material 326, it is formed with the same diameter from one opening to the other and does not become tapered. The diameter is the desired diameter.
図7乃至図9においては、微細径貫通孔を有する樹脂基材328を1個形成する工程を図示しているが、大きな金属基材321を使用し、微細径貫通孔と樹脂基材328外周部のパターンをアレイ状に形成したフォトマスク323を使用することで、微細径貫通孔を有する樹脂基材328を平面的に複数個大量に製造することができる。本発明の実施形態1においては、微細径貫通孔を有する樹脂基材を塊として形成し、切断加工することで、所望の微細径貫通孔を有する樹脂基材を複数個製造する。従って、本実施形態によれば、切断加工を省略できるメリットがある。 7 to 9 illustrate a process of forming one resin base material 328 having a fine diameter through-hole. However, a large metal base material 321 is used, and the fine diameter through-hole and the outer periphery of the resin base material 328 are illustrated. By using the photomask 323 in which the pattern of the part is formed in an array, a plurality of resin base materials 328 having fine diameter through holes can be manufactured in large numbers in a plane. In Embodiment 1 of this invention, the resin base material which has a fine diameter through-hole is formed as a lump, and a plurality of resin base materials which have a desired fine diameter through-hole are manufactured by cutting. Therefore, according to the present embodiment, there is an advantage that the cutting process can be omitted.
また、以上のようにして形成された、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材328は、前記貫通孔の断面形状がテーパ状とならず、一方の開口から他方の開口まで同一径で形成される。したがって、吐出量の微細化が求められるインクジェットプリンタのインクジェットヘッドとして活用することで、より精細できれいなインクジェットプリンタが提供される。 Further, in the resin base material 328 having the fine through-holes according to an embodiment of the present invention formed as described above, the cross-sectional shape of the through-holes is not tapered, and from one opening to the other. It is formed with the same diameter up to the opening. Therefore, a finer and more beautiful ink jet printer is provided by utilizing it as an ink jet head of an ink jet printer that requires a finer discharge amount.
さらに、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材328は、孔の一方の開口から他方の開口まで同一径であるため、滴定量の制御が容易である。したがって、気体や液体の分析装置において、微細な滴定量を制御することができ、微細量を分析可能な分析装置を提供することができる。 Furthermore, since the resin base material 328 having fine through-holes according to an embodiment of the present invention has the same diameter from one opening of the hole to the other opening, the titration amount can be easily controlled. Therefore, in a gas or liquid analyzer, a fine titer can be controlled, and an analyzer capable of analyzing a minute amount can be provided.
さらにまた、樹脂基材としてアクリル等の透明樹脂を用いるため、外部から孔の内部等を視認することができる。したがって、例えばインクの流れ等を容易に確認することができる。このため、インク開発用のインク分析用チップに使用することで、つまりにくいインクの開発が容易になる。 Furthermore, since a transparent resin such as acrylic is used as the resin base material, the inside of the hole can be visually recognized from the outside. Therefore, for example, the flow of ink can be easily confirmed. For this reason, the use of the ink analysis chip for ink development facilitates the development of a difficult ink.
以下、本発明の実施形態の実施例について、図面を基に詳細に説明する。 Hereinafter, examples of embodiments of the present invention will be described in detail with reference to the drawings.
(実施例1)
図1および図2を用いて、本発明の実施例1を説明する。本実施例は、本発明の実施形態1に係る微細径貫通孔を有する樹脂基材の製造方法の実施例である。本実施例においては、樹脂基材10としてアクリル基板を用いた。樹脂基材10を水平方向に切断し、アクリル樹脂基材A13およびアクリル樹脂基材B14を形成した後(図1(a)参照)、一方の樹脂基材A13の表面に、シリコンウェハや基板を切断するダイシング装置を用いて、幅30μm深さ30μmの溝20を、それぞれの溝20の中心の間隔が100μmとなるように(以下、前記間隔をピッチといい、100μmピッチと記す。)で形成する(図1(b)参照)。
Example 1
A first embodiment of the present invention will be described with reference to FIGS. This example is an example of a method for producing a resin base material having a fine-diameter through hole according to Embodiment 1 of the present invention. In this example, an acrylic substrate was used as the resin base material 10. After the resin base material 10 is cut in the horizontal direction to form the acrylic resin base material A13 and the acrylic resin base material B14 (see FIG. 1A), a silicon wafer or substrate is placed on the surface of one resin base material A13. Using a dicing apparatus for cutting, grooves 20 having a width of 30 μm and a depth of 30 μm are formed so that the distance between the centers of the grooves 20 is 100 μm (hereinafter, the distance is referred to as a pitch, and is referred to as a 100 μm pitch). (See FIG. 1B).
次に溝20の上にプロパノールを滴下し、直ちに20μm径の溶剤融着タイプの被覆銅配線19を配設する(図1(c)参照)。前記溶剤融着タイプの被覆銅配線19は、銅線の径が20μmで、前記銅線の周りをアクリル系の3μm厚の絶縁体で被覆し、さらにその周りに1μm厚の溶剤で溶ける接着層を形成した配線である。アクリル系の接着剤をアクリル樹脂基材A13ならびに被覆銅配線19上に塗布し、2分割した他方のアクリル樹脂基材B14をその上に接着する。なお、アクリル樹脂基材B14を接着する前に、エアーボイドの発生を防止するために、真空脱泡機において接着剤に含まれる泡を除去する。アクリル接着剤が硬化し、アクリル樹脂基材A13とアクリル樹脂基材B14が一体となって、一体化されたアクリル樹脂基材塊15が形成される(図2(a)参照)。樹脂基材(アクリル樹脂)と同系の接着剤(アクリル系接着剤)で接着して形成するため、接着剤と基材とが同化し、接合面のない一体化したアクリル樹脂基材塊15となる。また、被覆銅配線19の被覆絶縁体は、上述したようにアクリル系の絶縁体であり、またその周りの接着層も溶剤で溶けるものであるため、樹脂基材A13と樹脂基材B14との接着時に、前記絶縁体がアクリル系接着剤で溶け、樹脂基材および接着剤と一体化して硬化する。したがって、硬化後のアクリル樹脂基材塊15には、20μm径の銅線のみが埋め込まれた状態となる。 Next, propanol is dropped onto the groove 20, and a solvent fusion type coated copper wiring 19 having a diameter of 20 μm is immediately disposed (see FIG. 1C). The solvent fusion type coated copper wiring 19 has a copper wire diameter of 20 μm, the copper wire is covered with an acrylic insulating material having a thickness of 3 μm, and the adhesive layer is melted by a 1 μm thick solvent around the copper wire. Is a wiring formed. An acrylic adhesive is applied onto the acrylic resin base material A13 and the coated copper wiring 19, and the other acrylic resin base material B14 divided into two is adhered thereon. In addition, before adhering acrylic resin base material B14, in order to prevent generation | occurrence | production of an air void, the foam contained in an adhesive agent is removed in a vacuum defoaming machine. The acrylic adhesive is cured, and the acrylic resin base material A13 and the acrylic resin base material B14 are integrated to form an integrated acrylic resin base material mass 15 (see FIG. 2A). Since it is formed by bonding with an adhesive (acrylic adhesive) similar to the resin base material (acrylic resin), the adhesive and base material are assimilated, and the integrated acrylic resin base material block 15 having no joint surface Become. Moreover, since the covering insulator of the covering copper wiring 19 is an acrylic insulator as described above, and the adhesive layer around it is also soluble in the solvent, the resin base material A13 and the resin base material B14 At the time of bonding, the insulator is melted with an acrylic adhesive, and is cured integrally with the resin base material and the adhesive. Therefore, only the 20 μm diameter copper wire is embedded in the cured acrylic resin base material block 15.
続いて、一体となったアクリル樹脂基材塊15を、基材の厚みが200μmとなるようにダイヤモンドソー等を用いて切断加工し、被覆銅配線19の銅線が埋め込まれた樹脂基材17を形成する(図2(b)参照)。切断加工には、上述したダイヤモンドソー以外に研磨装置等が使用できる。 Subsequently, the integrated acrylic resin base material block 15 is cut using a diamond saw or the like so that the thickness of the base material becomes 200 μm, and the resin base material 17 in which the copper wire of the coated copper wiring 19 is embedded. Is formed (see FIG. 2B). For the cutting process, a polishing apparatus or the like can be used in addition to the diamond saw described above.
基材を切断加工した後に、被覆銅配線19の銅線が埋め込まれた樹脂基材17を過硫酸アンモニウム200g/lの溶液にディップし、埋め込んだ被覆銅配線19の銅線を溶解除去する(図2(c)参照)。以上の工程でテーパのない20μm径の微細径貫通孔を有するアクリル樹脂基材18を形成することができた。 After cutting the substrate, the resin substrate 17 in which the copper wire of the coated copper wiring 19 is embedded is dipped in a solution of 200 g / l ammonium persulfate, and the copper wire of the embedded coated copper wiring 19 is dissolved and removed (FIG. 2 (c)). The acrylic resin base material 18 which has a 20 micrometer diameter fine through-hole without a taper by the above process was able to be formed.
なお、樹脂基材10は予め切断した同じ大きさのアクリル樹脂基材10を2個使用してもよい。また、金属線19に溶剤融着タイプの被覆銅配線19を使用しているため、溝20を形成しなくても、接着のみで被覆銅配線19を所定のピッチに配設することができる。さらに、図示しないが、被覆銅配線19の銅線が埋め込まれた状態の一体となった樹脂基材塊15を過硫酸アンモニウム200g/lの溶液にディップし、埋め込んだ被覆銅配線19の銅線を溶解除去した後に、該樹脂基材塊15を、所望の厚さに切断加工してもよい。 In addition, the resin base material 10 may use two acrylic resin base materials 10 of the same size cut | disconnected previously. Further, since the solvent fusion type coated copper wiring 19 is used for the metal wire 19, the coated copper wiring 19 can be disposed at a predetermined pitch only by adhesion without forming the groove 20. Further, although not shown, the resin base lump 15 in an integrated state in which the copper wire of the coated copper wiring 19 is embedded is dipped in a solution of 200 g / l of ammonium persulfate, and the embedded copper wire of the coated copper wiring 19 is used. After dissolving and removing, the resin base material block 15 may be cut into a desired thickness.
(実施例2)
実施例1においては、金属線19として溶剤融着タイプの被覆銅配線19を使用したが、金属線19としては、熱融着タイプの被覆銅配線19を使用することもできる。本実施例は、本発明の実施形態1に係る微細径貫通孔を有する樹脂基材の製造方法の別の実施例である。本実施例は、金属線19として熱融着タイプの被覆銅配線19(銅線径20μm、絶縁体3μm厚、接着層1μm厚)を用いた例である。
(Example 2)
In the first embodiment, the solvent fusion type coated copper wiring 19 is used as the metal wire 19, but the heat fusion type coated copper wiring 19 can also be used as the metal wire 19. This example is another example of the method for producing a resin base material having a fine diameter through hole according to Embodiment 1 of the present invention. This embodiment is an example in which a heat fusion type coated copper wiring 19 (copper wire diameter 20 μm, insulator 3 μm thickness, adhesive layer 1 μm thickness) is used as the metal wire 19.
図1および図2を用いて説明する。樹脂基材としてエポキシ樹脂基材10を用いた。エポキシ樹脂基材10を水平方向に上下に切断し、エポキシ樹脂基材A13およびエポキシ樹脂基材B14を形成した後(図1(a)参照)、一方のエポキシ樹脂基材A13の表面に、シリコンウェハや基板を切断するダイシング装置を用いて、幅30μm深さ30μmの溝20を100μmピッチで形成する(図1(b)参照)。 This will be described with reference to FIGS. Epoxy resin substrate 10 was used as the resin substrate. After the epoxy resin base material 10 is cut vertically in the horizontal direction to form the epoxy resin base material A13 and the epoxy resin base material B14 (see FIG. 1A), silicon is formed on the surface of one epoxy resin base material A13. Grooves 20 having a width of 30 μm and a depth of 30 μm are formed at a pitch of 100 μm using a dicing apparatus for cutting a wafer or a substrate (see FIG. 1B).
次に、溝20の上に、熱融着タイプの被覆銅配線19を配設し、90℃程度の加熱こてを当てて、被覆銅配線19をエポキシ樹脂基材A13上に接着する。ここで、前記被覆銅配線19の絶縁体はエポキシ系の絶縁体である。エポキシ系の接着剤を樹脂基材A13ならびに被覆銅配線19上に塗布し、エポキシ樹脂基材B14をその上に接着し、エポキシ樹脂基材塊15を形成する(図2(a)参照)。エポキシ系接着剤を塗布する際に、エアーボイドの発生を抑制するために、真空脱泡機において接着剤に含まれる泡を除去した上でエポキシ樹脂基材B14を接着する。該樹脂基材(エポキシ樹脂)と同系の接着剤(エポキシ系接着剤)で接着して形成するため、接着剤と基材とが同化し、接合面のない一体化したエポキシ樹脂基材塊15となる。また、被覆銅配線19の被覆絶縁体は、上述したようにエポキシ系の絶縁体であり、またその周りの接着層は熱で溶けるものであるため、樹脂基材A13と樹脂基材B14との接着時に、前記絶縁体はエポキシ系接着剤で溶け、接着層は熱で溶け、樹脂基材および接着剤と一体化して硬化する。したがって、硬化後のエポキシ樹脂基材塊15には、20μm径の銅線のみが埋め込まれた状態となる。 Next, a heat-sealing type coated copper wiring 19 is disposed on the groove 20, and a heated iron of about 90 ° C. is applied to bond the coated copper wiring 19 onto the epoxy resin substrate A13. Here, the insulator of the coated copper wiring 19 is an epoxy insulator. An epoxy-based adhesive is applied on the resin base material A13 and the coated copper wiring 19, and an epoxy resin base material B14 is adhered thereon to form an epoxy resin base material block 15 (see FIG. 2A). When applying an epoxy adhesive, in order to suppress the generation of air voids, the epoxy resin base material B14 is bonded after removing bubbles contained in the adhesive in a vacuum defoaming machine. Since it is formed by bonding with the same adhesive (epoxy adhesive) as that of the resin base (epoxy resin), the adhesive and the base are assimilated, and an integrated epoxy resin base mass 15 having no joint surface It becomes. Moreover, since the covering insulator of the covering copper wiring 19 is an epoxy insulator as described above, and the adhesive layer around it is melted by heat, the resin base material A13 and the resin base material B14 At the time of bonding, the insulator is melted with an epoxy adhesive, and the adhesive layer is melted with heat, and is cured by being integrated with the resin base material and the adhesive. Therefore, only the 20 μm diameter copper wire is embedded in the cured epoxy resin base material block 15.
接着剤が硬化し、樹脂基材A13と樹脂基材B14とが一体となったエポキシ樹脂基材塊15が形成された後、該樹脂基材塊15を、樹脂基材の厚さが200μmとなるように、ダイヤモンドソー等で切断加工し、被覆銅配線19の銅線が埋め込まれた樹脂基材17を形成する(図2(b)参照)。 After the adhesive is cured and the epoxy resin base material block 15 in which the resin base material A13 and the resin base material B14 are integrated is formed, the resin base material block 15 has a thickness of 200 μm. Thus, the resin base material 17 in which the copper wire of the coated copper wiring 19 is embedded is formed by cutting with a diamond saw or the like (see FIG. 2B).
加工した樹脂基材17を過硫酸アンモニウム200g/lのエッチング溶液にディップし、埋め込んだ被覆銅配線19の銅線を溶解除去する。以上の工程によって、テーパのない20μmの微細径貫通孔を有するエポキシ樹脂基材18を形成することができた。 The processed resin base material 17 is dipped in an etching solution of 200 g / l ammonium persulfate, and the copper wire of the embedded coated copper wiring 19 is dissolved and removed. Through the above steps, the epoxy resin substrate 18 having a 20 μm fine diameter through hole without a taper could be formed.
本実施例においても、実施例1と同様に、同じ大きさのエポキシ樹脂基材2個を使用することもできる。また、溝20を形成しないで、接着のみで被覆銅配線19を配設してもよい。また、被覆銅配線19の銅線を溶解除去した後に、切断加工して、微細径貫通孔を有する樹脂基材18を形成してもよい。 Also in this embodiment, two epoxy resin substrates having the same size can be used as in the first embodiment. Further, the coated copper wiring 19 may be disposed only by adhesion without forming the groove 20. Alternatively, after the copper wire of the coated copper wiring 19 is dissolved and removed, it may be cut to form the resin base material 18 having fine diameter through holes.
(実施例3)
本発明に係る樹脂基材は、最終的に200μm程度の厚さで使用されるため、樹脂基材塊として形成した場合には、ダイヤモンドソー等を用いて所望の厚さに切断加工する必要がある。所望の厚さが薄くなるほど加工が難しくなる。そこで、予め所望の厚さのシート状の樹脂基材を接着シート等で多層に積層した積層樹脂基材を使用すれば、微細径貫通孔を形成した後に接着シートを剥離することで、容易に所望の厚さの微細径貫通孔が形成された樹脂基材を、一度に複数形成することができる。本実施例は、本発明の実施形態1に係る微細径貫通孔を有する樹脂基材の製造方法のさらに別の実施例であり、積層樹脂基材を用いた例である。
(Example 3)
Since the resin base material according to the present invention is finally used with a thickness of about 200 μm, when formed as a resin base material block, it is necessary to cut it to a desired thickness using a diamond saw or the like. is there. Processing becomes difficult as the desired thickness decreases. Therefore, if a laminated resin base material in which a sheet-shaped resin base material having a desired thickness is laminated in multiple layers with an adhesive sheet or the like is used, it is easy to peel off the adhesive sheet after forming the fine-diameter through hole. A plurality of resin base materials having fine through-holes with a desired thickness can be formed at a time. This example is yet another example of the method for producing a resin base material having a fine through-hole according to Embodiment 1 of the present invention, and is an example using a laminated resin base material.
図3および図4に基づいて説明する。図3および図4は、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材の形成方法を示した模式図である。樹脂基材110にアクリル基板を用いる。接着シート111として、シリコンウェハの切断に使用する熱剥離タイプの接着シート(日東電工製。製品名リバアルファ。)を用い、樹脂基材110を接着シート111で多段に貼り合わせて(図3(a)参照)、積層樹脂基材112を形成する(図3(b)参照)。接着シート111と樹脂基材110との貼り合わせには、空気を挟み込まないように、ラミネータを使用して貼り合わせる。なお、図3および図4においては、樹脂基材110を、接着シート111を用いて4層積層した例を示しているが、これに限定されるわけではなく、任意の枚数を積層することができる。また、熱剥離タイプの接着シートに換えてUV剥離タイプの接着シートを用いてもよい。 This will be described with reference to FIGS. 3 and 4 are schematic views showing a method for forming a resin base material having fine through holes according to an embodiment of the present invention. An acrylic substrate is used for the resin base 110. As the adhesive sheet 111, a heat-peeling type adhesive sheet (manufactured by Nitto Denko, product name Riva Alpha) used for cutting a silicon wafer is used, and the resin base material 110 is bonded in multiple stages with the adhesive sheet 111 (FIG. 3 ( a)), a laminated resin base material 112 is formed (see FIG. 3B). In laminating the adhesive sheet 111 and the resin base 110, a laminator is used so that air is not caught. 3 and 4 show an example in which the resin base material 110 is stacked in four layers using the adhesive sheet 111, but the present invention is not limited to this, and an arbitrary number of layers may be stacked. it can. Further, a UV peeling type adhesive sheet may be used instead of the heat peeling type adhesive sheet.
積層樹脂基材112を形成した後、積層樹脂基材112を、積層方向(図3および図4においては、図に向かって垂直方向)に任意の場所で切断して、図3(c)に示すように積層樹脂基材A113および積層樹脂基材B114を形成する。切断には切断面を崩さないように、ダイヤモンドソーなどの加工機を使用することが望ましい。さらに切断面にバリなどが発生している場合は、研磨装置によって切断面の形状を整えておく。 After forming the laminated resin base material 112, the laminated resin base material 112 is cut at an arbitrary position in the laminating direction (in FIG. 3 and FIG. 4, the direction perpendicular to the drawings), and the result is shown in FIG. As shown, a laminated resin substrate A113 and a laminated resin substrate B114 are formed. For cutting, it is desirable to use a processing machine such as a diamond saw so as not to break the cut surface. Further, when burrs or the like are generated on the cut surface, the shape of the cut surface is adjusted by a polishing apparatus.
切断した積層樹脂基材A113の切断面に、直径20μmの金属線119を、金属線119の両端を固定して引張しながら図3(d)に示すように垂直に配設する。樹脂基材110の接着に使用した接着シート111の粘着性を利用して、そのまま金属線119を切断面に貼り付けることで、金属線119を固定することが可能である。金属線119には、銅線を用いると後の工程で都合がよい。また、金属線119に熱融着タイプの被覆銅配線119を用いて、被覆銅配線119と積層樹脂基材A113を加熱しながら固定する方法を採ってもよい。この場合には、被覆銅配線119のガイド先端のみ加熱する方法で固定し、接着シート111全体を加熱しないように注意する。 A metal wire 119 having a diameter of 20 μm is disposed vertically on the cut surface of the laminated resin base material A113 as shown in FIG. 3D while fixing both ends of the metal wire 119 and pulling them. The metal wire 119 can be fixed by sticking the metal wire 119 to the cut surface as it is by using the adhesiveness of the adhesive sheet 111 used for bonding the resin base material 110. If the copper wire is used for the metal wire 119, it is convenient in a later process. Alternatively, a method of fixing the coated copper wiring 119 and the laminated resin base material A113 while heating may be adopted by using a heat-sealing type coated copper wiring 119 for the metal wire 119. In this case, care is taken not to heat the entire adhesive sheet 111 by fixing only the guide tip of the coated copper wiring 119 by heating.
金属線119を積層樹脂基材A113に固定した後、アクリル系の接着剤を用いて、切断したもう一方の積層樹脂基材B114を、積層樹脂基材A113に接着し、金属線119を埋め込んだ積層樹脂基材塊115を形成する(図4(a)参照)。接着時に積層樹脂基材同士の相互の切断面が、正確に一致するように注意して接着する。該樹脂基材と同系の接着剤で接着して形成するため、接着剤と基材とが同化し、接合面のない一体化した樹脂基材塊15となる。 After fixing the metal wire 119 to the laminated resin substrate A113, the other laminated resin substrate B114 that was cut was adhered to the laminated resin substrate A113 using an acrylic adhesive, and the metal wire 119 was embedded. A laminated resin base material block 115 is formed (see FIG. 4A). At the time of bonding, the laminated resin substrates are bonded with care so that the cut surfaces of the laminated resin substrates are exactly the same. Since it is formed by bonding with the same adhesive as that of the resin base material, the adhesive and the base material are assimilated to form an integrated resin base material block 15 having no joint surface.
アクリル系の接着剤が硬化した後、積層樹脂基材塊115を、120℃で、10分間オーブンで加熱し、接着シートの粘着性を低下させる。積層された樹脂基材110と接着シート111とが簡単に剥離するので、剥離した接着シート111を除去して、図4(b)に示すように金属線119が貫通した4個の樹脂基材110を形成する。アクリル樹脂基材110と熱剥離タイプの接着シート111は、加熱により接着シート111の接着力が低下するため、容易に剥離することができる。 After the acrylic adhesive is cured, the laminated resin base material block 115 is heated in an oven at 120 ° C. for 10 minutes to reduce the adhesiveness of the adhesive sheet. Since the laminated resin base 110 and the adhesive sheet 111 are easily peeled off, the peeled adhesive sheet 111 is removed, and four resin bases through which the metal wires 119 penetrate as shown in FIG. 110 is formed. Since the adhesive strength of the adhesive sheet 111 is reduced by heating, the acrylic resin substrate 110 and the heat release type adhesive sheet 111 can be easily peeled off.
金属線119が貫通した4個の樹脂基材110間の金属線119を切断して、金属線119が埋め込まれた樹脂基材117を4個形成する。樹脂基材117は、接着部分にアクリル系の接着剤がはみ出しているので、はみ出したバリと金属線119を研磨機によって研磨して除去し、樹脂基材117の表面状態を整える。 The metal wires 119 between the four resin substrates 110 through which the metal wires 119 penetrate are cut to form four resin substrates 117 in which the metal wires 119 are embedded. Since the resin base material 117 has an acrylic adhesive protruding from the bonding portion, the protruding burr and the metal wire 119 are removed by polishing with a polishing machine, and the surface state of the resin base material 117 is adjusted.
次に、表面状態を整えた、金属線119が埋め込まれた樹脂基材117を、過硫酸アンモニウム200g/l溶液に浸漬して金属線119を溶解除去する。これによって、図4(c)に示すように、埋め込まれた金属線119と同じ径の微細径貫通孔を有する樹脂基材118を4個得ることができる。以上の工程でテーパのない20μmの微細径貫通孔を、アクリル樹脂基材に形成することができた。 Next, the resin base material 117 in which the metal wire 119 is embedded in the surface state is immersed in a 200 g / l ammonium persulfate solution to dissolve and remove the metal wire 119. As a result, as shown in FIG. 4C, four resin base materials 118 having fine through holes having the same diameter as the embedded metal wire 119 can be obtained. Through the above process, a 20 μm fine through hole without a taper could be formed in the acrylic resin substrate.
なお、本実施例においても、積層樹脂基材塊115を過硫酸アンモニウム200g/l溶液に浸漬して金属線119を溶解除去して微細径貫通孔を有する樹脂基材塊116を形成した後に、該微細径貫通孔を有する樹脂基材塊116を所望の厚さに切断加工して、微細径貫通孔を有する樹脂基材118を形成してもよい。 Also in this example, after the laminated resin base material mass 115 was immersed in an ammonium persulfate 200 g / l solution to dissolve and remove the metal wire 119, the resin base material mass 116 having fine through-holes was formed. The resin base material mass 116 having fine diameter through holes may be cut into a desired thickness to form the resin base material 118 having fine diameter through holes.
(実施例4)
上述した実施例3においては、樹脂基材に溝を加工することなく、金属線を、接着シートの粘着性を利用して、所定の位置に配設する例を示した。さらに、樹脂基材に溝を加工することで、より確実に所定の位置に金属線を配設することができる。本実施例は、本発明の実施形態1に係る微細径貫通孔を有する樹脂基材の製造方法のさらにまた別の実施例である。本実施例は、積層樹脂基材を使用し、積層樹脂基材に溝を形成した上で金属線を配設する例である。
Example 4
In Example 3 mentioned above, the example which arrange | positions a metal wire in a predetermined position using the adhesiveness of an adhesive sheet was shown, without processing a groove | channel on a resin base material. Furthermore, by processing the groove in the resin base material, the metal wire can be more reliably disposed at a predetermined position. This example is yet another example of a method for producing a resin base material having a fine through-hole according to Embodiment 1 of the present invention. In this example, a laminated resin base material is used, and grooves are formed in the laminated resin base material, and then metal wires are disposed.
図5及び図6を基に、本実施例を説明する。図5および図6は、本発明の一実施形態に係る微細径貫通孔を有する樹脂基材の形成方法を示した模式図である。樹脂基材210としてアクリル基板を用いる。接着シート211には、シリコンウェハの切断に使用するUV剥離タイプの接着シートを用いる。樹脂基材210を、接着シート211を介して多段に貼り合わせ(図5(a)参照)、積層樹脂基材212を形成する(図5(b)参照)。このとき、接着シート211と樹脂基材210の間に空気を挟み込まないように、ラミネータを使用して樹脂基材210を貼り合わせる。 A present Example is demonstrated based on FIG.5 and FIG.6. 5 and 6 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. An acrylic substrate is used as the resin substrate 210. As the adhesive sheet 211, a UV peeling type adhesive sheet used for cutting a silicon wafer is used. The resin base material 210 is bonded in multiple stages via the adhesive sheet 211 (see FIG. 5A) to form a laminated resin base material 212 (see FIG. 5B). At this time, the resin substrate 210 is bonded using a laminator so that air is not sandwiched between the adhesive sheet 211 and the resin substrate 210.
図5(c)に示すように、積層樹脂基材212を形成した後、該積層樹脂基材212を積層方向に任意の場所で切断して、第1の積層樹脂基材(以下、積層樹脂基材Aという。)213および第2の積層樹脂基材(以下、積層樹脂基材Bという。)214を形成する。切断には切断面を崩さないように、ダイヤモンドソーなどの加工機を使用することが望ましい。ダイヤモンドカッター等でもよい。さらに切断面にバリなどが発生している場合は、研磨装置によって研磨して、切断面の形状を整えておく。 As shown in FIG. 5 (c), after forming the laminated resin base material 212, the laminated resin base material 212 is cut at an arbitrary position in the laminating direction to obtain a first laminated resin base material (hereinafter referred to as a laminated resin). A base material A) 213 and a second laminated resin base material (hereinafter referred to as a laminated resin base material B) 214 are formed. For cutting, it is desirable to use a processing machine such as a diamond saw so as not to break the cut surface. A diamond cutter or the like may be used. Further, when burrs or the like are generated on the cut surface, the shape of the cut surface is adjusted by polishing with a polishing apparatus.
切断した一方の積層樹脂基材A213の切断面に、図5(d)に示すように、金属線219を固定するための溝220を、ルータを用いて形成する。ダイシング装置等で溝220を形成してもよい。溝220の形状については、例えば金属線219として直径20μmの金属線219を用いる場合は、幅30μm、深さ25μm程度のV字型形状に形成することが望ましい。形成した溝220に、前記直径20μmの金属線219を、図6(a)に示すように配設する。本実施例においては、金属線219として溶剤融着タイプの被覆銅配線219(銅線径20μm、3μm厚のアクリル系絶縁体、1μm厚の溶剤で溶ける接着層を有する。)を用い、溝220にエタノールを滴下した後、溝220に前記被覆銅配線219を配設することで、溝220に正確に被覆銅配線219を固定する。なお、熱融着タイプの被覆銅線を用いてもよい。 As shown in FIG. 5D, a groove 220 for fixing the metal wire 219 is formed on the cut surface of one of the cut laminated resin base materials A213 using a router. The groove 220 may be formed by a dicing apparatus or the like. As for the shape of the groove 220, for example, when a metal wire 219 having a diameter of 20 μm is used as the metal wire 219, it is desirable to form the groove 220 in a V shape having a width of about 30 μm and a depth of about 25 μm. The metal wire 219 having a diameter of 20 μm is disposed in the formed groove 220 as shown in FIG. In this embodiment, a solvent fusion-type coated copper wiring 219 (having a copper wire diameter of 20 μm, a 3 μm thick acrylic insulator, and an adhesive layer soluble in a solvent of 1 μm thickness) is used as the metal wire 219, and the groove 220. After the ethanol is dropped into the groove 220, the coated copper wiring 219 is accurately fixed to the groove 220 by disposing the coated copper wiring 219 in the groove 220. Note that a heat-sealing type coated copper wire may be used.
被覆銅配線219を積層樹脂基材A213に固定した後、切断したもう一方の積層樹脂基材B214を、被覆銅配線219を配設した前記積層樹脂基材A213と、図6(b)に示すように接着剤を用いて接着し、被覆銅配線219を埋め込んだ積層樹脂基材塊215を形成する。接着剤には、積層樹脂基材A213およびB214と同系のアクリル系接着剤を使用する。また、接着時に積層樹脂基材A213およびB214の切断面同士および接着シート211の切断面同士が、相互に正確に一致するように注意して接着する。該積層樹脂基材と同系の接着剤で接着して形成するため、接着剤と基材とが同化し、接合面のない一体化した積層樹脂基材塊215となる。なお、前記被覆銅配線219の絶縁体はアクリル系であるため、アクリル系接着剤で溶け、積層樹脂基材および接着剤と一体化して硬化する。したがって、硬化後のアクリル積層樹脂基材塊215には、20μm径の銅線のみが埋め込まれた状態となる。 After the coated copper wiring 219 is fixed to the laminated resin base material A213, the other laminated resin base material B214 cut is shown in FIG. 6B as the laminated resin base material A213 provided with the coated copper wiring 219. Thus, the laminated resin base material block 215 in which the coated copper wiring 219 is embedded is formed by using an adhesive. As the adhesive, an acrylic adhesive similar to the laminated resin base materials A213 and B214 is used. Further, during bonding, the cut surfaces of the laminated resin base materials A213 and B214 and the cut surfaces of the adhesive sheet 211 are bonded with care so as to accurately match each other. Since it is formed by bonding with the same adhesive as that of the laminated resin base material, the adhesive and the base material are assimilated to form an integrated laminated resin base material mass 215 having no joint surface. In addition, since the insulator of the said covering copper wiring 219 is an acrylic type, it melt | dissolves with an acrylic adhesive and it hardens | cures integrally with a laminated resin base material and an adhesive agent. Therefore, only the 20 μm diameter copper wire is embedded in the cured acrylic laminated resin base material mass 215.
アクリル系の接着剤が硬化した後、積層樹脂基材塊215の両面から、紫外線露光装置で紫外線(UV)224を照射し、接着シートの粘着性を低下させる。紫外線224を照射することで、積層樹脂基材塊215の、紫外線223が照射された部分のUV剥離タイプ接着シート211の接着力が低下し、接着シート211と樹脂基材210を、容易に分離することができる。積層された樹脂基材210と接着シート211とが簡単に剥離するので、剥離した接着シート211を除去して、図6(c)に示すように被覆銅配線219の銅線が貫通した4個の樹脂基材210を形成する。なお、露光量は、接着シート211の種類によって異なるが、本実施例では、600mJ/cm2の紫外線224を高圧水銀ランプタイプの露光機で照射した。また、紫外線224が透過しない部分は、接着力が残っているため、この場合には、当該部分に対して再度UV照射を行って、接着力を低下させ、樹脂基材210を分離する。 After the acrylic adhesive is cured, ultraviolet light (UV) 224 is irradiated from both surfaces of the laminated resin base material block 215 with an ultraviolet exposure device to reduce the adhesiveness of the adhesive sheet. By irradiating the ultraviolet ray 224, the adhesive strength of the UV peeling type adhesive sheet 211 in the portion of the laminated resin base material mass 215 irradiated with the ultraviolet ray 223 is reduced, and the adhesive sheet 211 and the resin base material 210 are easily separated. can do. Since the laminated resin base material 210 and the adhesive sheet 211 are easily peeled off, the peeled adhesive sheet 211 is removed, and the four copper wires of the coated copper wiring 219 penetrated as shown in FIG. The resin base material 210 is formed. Although the exposure amount differs depending on the type of the adhesive sheet 211, in the present example, the ultraviolet ray 224 of 600 mJ / cm 2 was irradiated with a high pressure mercury lamp type exposure machine. Moreover, since the adhesive force remains in the portion through which the ultraviolet ray 224 does not transmit, in this case, UV irradiation is performed again on the portion to reduce the adhesive force, and the resin base material 210 is separated.
被覆銅配線219の銅線が貫通した4個の樹脂基材210間の銅線を切断して、被覆銅配線219の銅線が埋め込まれた樹脂基材217を4個形成する(図示せず)。被覆銅配線219の銅線が埋め込まれた樹脂基材217からは、接着部分にアクリル系の接着剤が、バリとしてはみ出しているので、はみ出したバリと銅線を研磨機によって除去し、基材の表面状態を整える。 The copper wires between the four resin base materials 210 through which the copper wires of the coated copper wiring 219 penetrate are cut to form four resin base materials 217 in which the copper wires of the coated copper wiring 219 are embedded (not shown). ). From the resin base material 217 in which the copper wire of the coated copper wiring 219 is embedded, an acrylic adhesive protrudes as a burr at the bonded portion. Therefore, the protruding burr and copper wire are removed by a polishing machine, and the base material is removed. To adjust the surface condition.
被覆銅配線219の銅線が埋め込まれた樹脂基材217を過硫酸アンモニウム200g/l溶液に浸漬して、被覆銅配線219の銅線を溶解除去することで、図6(d)に示すように、基材に被覆銅配線219の銅線と同じ径の貫通孔が開いた樹脂基材218を、4個得ることができる。以上の工程でテーパのない20μm径の微細径貫通孔を有する樹脂基材218を形成することができた。 As shown in FIG. 6D, the resin base material 217 in which the copper wire of the coated copper wiring 219 is embedded is immersed in a 200 g / l ammonium persulfate solution, and the copper wire of the coated copper wiring 219 is dissolved and removed. Four resin base materials 218 in which through holes having the same diameter as the copper wires of the coated copper wiring 219 are opened in the base material can be obtained. The resin base material 218 having a 20 μm-diameter fine through-hole without a taper could be formed by the above steps.
なお、本実施例においても、図示しないが、積層樹脂基材塊215を過硫酸アンモニウム200g/l溶液に浸漬して被覆銅配線219の銅線を溶解除去して微細径貫通孔を有する樹脂基材塊216を形成した後に、該微細径貫通孔を有する樹脂基材塊216を所望の厚さに切断加工して、微細径貫通孔を有する樹脂基材218を形成してもよい。 In this embodiment, although not shown, the resin base material having fine through-holes is obtained by immersing the laminated resin base material mass 215 in an ammonium persulfate 200 g / l solution to dissolve and remove the copper wire of the coated copper wiring 219. After the mass 216 is formed, the resin base material mass 216 having fine diameter through holes may be cut into a desired thickness to form the resin base material 218 having fine diameter through holes.
本発明の実施形態1に係る微細径貫通孔を有する樹脂基材の形成方法によれば、上述した実施例1乃至実施例4の何れの方法においても、断面形状がテーパ状とならず、一方の開口部から他方の開口部まで同一径の微細径貫通孔を有する樹脂基材が形成できる。したがって、かかる微細径貫通孔を有する樹脂基材を用いれば、精細できれいなインクジェットプリンタを提供でき、また、微細量の分析が可能な液体や気体の分析装置を提供することができる。さらに、透明な樹脂を使用するため、外部から内部を視認することができ、インク開発用のインク分析用チップに使用することで、つまりにくいインクの開発が容易になる。 According to the method for forming a resin base material having fine through holes according to Embodiment 1 of the present invention, the cross-sectional shape is not tapered in any of the methods of Examples 1 to 4 described above. The resin base material which has the fine diameter through-hole of the same diameter from one opening part to the other opening part can be formed. Therefore, if a resin base material having such fine diameter through holes is used, a fine and clean ink jet printer can be provided, and a liquid or gas analyzer capable of analyzing a minute amount can be provided. Further, since a transparent resin is used, the inside can be visually recognized from the outside, and the use of the ink analysis chip for ink development facilitates the development of a difficult ink.
(実施例5)
本発明の実施形態2に係る微細径貫通孔を有する樹脂基材の形成方法の実施例を、図7乃至図9を基に説明する。金属基材321として150μm厚の銅板を使用する(図7(a)参照)。銅板321上に、感光性レジスト322をコーティングする(図7(b)参照)。レジストの材料は、形成する微細径貫通孔の径に応じて選定するが、本実施例においては、30μm径の微細径貫通孔を形成するため、厚膜用ポジ型レジスト(THB)(JSR株式会社製)を60μm厚で、スピンコートによってコーティングし、110℃、45分の条件で、オーブンによりプリベークする。
(Example 5)
An example of a method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention will be described with reference to FIGS. A 150 μm thick copper plate is used as the metal substrate 321 (see FIG. 7A). A photosensitive resist 322 is coated on the copper plate 321 (see FIG. 7B). The material of the resist is selected according to the diameter of the fine through hole to be formed. In this embodiment, a positive resist for thick film (THB) (JSR stock) is used to form a fine through hole with a diameter of 30 μm. (Made by company) is 60 μm thick, coated by spin coating, and pre-baked in an oven at 110 ° C. for 45 minutes.
感光性レジスト322をコーティングし、プリベークした銅板321上に、予め微細径貫通孔および樹脂基材の外周部をパターニングしたフォトマスク323を搭載し(図7(c)および図7(d)参照)、プリベークした感光性レジスト322に紫外線324を照射して露光する(図8(a)参照)。紫外線324の露光は、ステッパー露光機や平行光露光機を用いて行う。本実施例においては、60mJ/cm2の露光量で実施する。露光後に、専用の現像液で感光性レジスト322を現像することで、微細径貫通孔部と樹脂基材の外周形状のパターンをもったレジストパターン(めっきパターン)325を形成することができる。 A photomask 323 in which fine-diameter through holes and the outer peripheral portion of the resin base material are patterned in advance is mounted on a copper plate 321 coated with a photosensitive resist 322 and pre-baked (see FIGS. 7C and 7D). Then, the pre-baked photosensitive resist 322 is exposed by irradiating with ultraviolet rays 324 (see FIG. 8A). The exposure of the ultraviolet rays 324 is performed using a stepper exposure machine or a parallel light exposure machine. In this embodiment, the exposure is performed at an exposure amount of 60 mJ / cm 2 . After the exposure, the photosensitive resist 322 is developed with a dedicated developer, whereby a resist pattern (plating pattern) 325 having a fine-diameter through-hole portion and a peripheral shape pattern of the resin base material can be formed.
めっきパターン325を形成した後、めっきパターン325を付けた状態の銅板321を電極にして、電気銅めっきにより、50μm厚の狙いでめっきを行う(図8(b)参照)。めっきパターン325の開口部が小さい場合は、電流密度を0.5A/dm2程度に設定すると付き周りが良く、安定しためっきの析出が得られる(図8(c)参照)。銅めっきを行った後、専用の剥離液でめっきパターン325を溶解剥離することで、微細径貫通孔部と樹脂基材328外周部が高くなった銅板326を得ることができる(図9(a)参照)。 After the plating pattern 325 is formed, the copper plate 321 with the plating pattern 325 attached is used as an electrode, and plating is performed with an aim of a thickness of 50 μm by electrolytic copper plating (see FIG. 8B). In the case where the opening of the plating pattern 325 is small, setting the current density to about 0.5 A / dm 2 provides good coverage and stable deposition of plating can be obtained (see FIG. 8C). After performing copper plating, the plating pattern 325 is dissolved and peeled off using a special stripping solution, whereby a copper plate 326 with a fine through-hole portion and a resin substrate 328 outer peripheral portion can be obtained (FIG. 9A). )reference).
微細径貫通孔部と樹脂基材328外周部が高くなった銅板326上に、エポキシ樹脂(アラルダイト)と硬化剤を混合して流し込む。このとき、エポキシ樹脂と硬化剤の混合物(以下、硬化性樹脂という。)327を、銅板326の、微細径貫通孔部と樹脂基材328外周部を覆い隠すように流し込む。流し込んだエポキシ樹脂327は、60℃の温度で60分間、オーブンで加熱することで完全に硬化する(図9(b)参照)。 An epoxy resin (araldite) and a curing agent are mixed and poured onto a copper plate 326 in which the fine diameter through-hole portion and the outer peripheral portion of the resin base material 328 are raised. At this time, a mixture of an epoxy resin and a curing agent (hereinafter referred to as curable resin) 327 is poured so as to cover the fine-diameter through hole portion and the resin base material 328 outer peripheral portion of the copper plate 326. The poured epoxy resin 327 is completely cured by heating in an oven at a temperature of 60 ° C. for 60 minutes (see FIG. 9B).
エポキシ樹脂327が硬化した後、銅板326の微細径貫通孔部と樹脂基材328外周部を覆っているエポキシ樹脂327を、研磨機によって、微細径貫通孔部と樹脂基材238外周部の表面が露出するまで研磨して、除去する。これによって、銅パターンが露出したエポキシ樹脂327を形成することができる(図9(c)参照)。 After the epoxy resin 327 is cured, the epoxy resin 327 covering the fine-diameter through hole portion of the copper plate 326 and the outer periphery of the resin base material 328 is removed by polishing the surface of the fine-diameter through hole portion and the outer periphery of the resin base material 238. Polish and remove until exposed. Thereby, the epoxy resin 327 in which the copper pattern is exposed can be formed (see FIG. 9C).
研磨機での研磨後に、塩化第二鉄液(塩酸20%、温度60℃)や過硫酸アンモニウム溶液(200g/l、30℃)に銅板326を浸漬し、銅板326を溶解除去する。これによって、基材に微細径貫通孔が形成されたエポキシ樹脂基材328を形成することができる。以上の工程で、テーパのない30μmの微細径貫通孔を有するエポキシ樹脂基材328を形成することができた。 After polishing with a polishing machine, the copper plate 326 is immersed in a ferric chloride solution (hydrochloric acid 20%, temperature 60 ° C.) or an ammonium persulfate solution (200 g / l, 30 ° C.), and the copper plate 326 is dissolved and removed. Thereby, the epoxy resin base material 328 in which the fine diameter through hole is formed in the base material can be formed. Through the above steps, an epoxy resin base material 328 having a 30 μm fine diameter through hole without a taper could be formed.
(実施例6)
本発明の実施形態2に係る微細径貫通孔を有する樹脂基材の形成方法の、別の実施例を説明する。微細径貫通孔の形成方法の概略については、上述した実施例5と同様であるので、同一箇所については説明を省略する。
(Example 6)
Another example of the method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention will be described. Since the outline of the method for forming the fine-diameter through hole is the same as that of the above-described embodiment 5, the description of the same portion is omitted.
実施例5に示した工程によって、図9(a)に示した微細径貫通孔部と樹脂基材328外周部が高くなった銅板326を形成する。本実施例においては、前記銅板326上に流し込む硬化性樹脂327に変えて、フィルムタイプのエポキシ樹脂を用いる。微細径貫通孔部と樹脂基材328外周部が高くなった銅板326上に、フィルムタイプのエポキシ樹脂フィルム(太陽インキ製造株式会社製 SRフィルム PFR−800)(図示せず)を、真空ラミネートによって貼り付ける。続いて、エポキシ樹脂フィルムを貼り付けた銅板321に、500mJ/cm2の露光量で紫外線324を照射して露光した後、150℃で60分間加熱することで、エポキシ樹脂を完全に硬化させる。その後、上述した実施例1と同様にエポキシ樹脂表面の研磨、および銅板326のエッチング除去により、テーパのない30μm径の微細径貫通孔を有する樹脂基材328を形成することができた。 The copper plate 326 in which the fine diameter through-hole portion and the outer peripheral portion of the resin base material 328 shown in FIG. In this embodiment, a film type epoxy resin is used instead of the curable resin 327 poured onto the copper plate 326. A film-type epoxy resin film (SR film PFR-800 manufactured by Taiyo Ink Manufacturing Co., Ltd.) (not shown) is vacuum-laminated on the copper plate 326 with the fine-diameter through-hole portion and the resin base material 328 outer periphery increased. paste. Subsequently, the copper plate 321 with the epoxy resin film attached is exposed by irradiating ultraviolet rays 324 with an exposure amount of 500 mJ / cm 2 , and then heated at 150 ° C. for 60 minutes to completely cure the epoxy resin. Thereafter, the resin base material 328 having a 30 μm diameter fine through hole without a taper could be formed by polishing the epoxy resin surface and removing the copper plate 326 by etching in the same manner as in Example 1 described above.
本発明の実施形態2に係る微細径貫通孔を有する樹脂基材の形成方法によれば、上述した実施例5または実施例6の何れの方法においても、断面形状がテーパ状とならず、一方の開口部から他方の開口部まで同一径の微細径貫通孔を有する樹脂基材が形成できる。したがって、かかる微細径貫通孔を有する樹脂基材を用いれば、精細できれいなインクジェットプリンタを提供でき、また、微細量の分析が可能な液体や気体の分析装置を提供することができる。さらに、透明な樹脂を使用するため、外部から内部を視認することができ、インク開発用のインク分析用チップに使用することで、つまりにくいインクの開発が容易になる。 According to the method for forming a resin substrate having fine through-holes according to Embodiment 2 of the present invention, the cross-sectional shape is not tapered in any of the methods of Example 5 or Example 6 described above. The resin base material which has the fine diameter through-hole of the same diameter from one opening part to the other opening part can be formed. Therefore, if a resin base material having such fine diameter through holes is used, a fine and clean ink jet printer can be provided, and a liquid or gas analyzer capable of analyzing a minute amount can be provided. Further, since a transparent resin is used, the inside can be visually recognized from the outside, and the use of the ink analysis chip for ink development facilitates the development of a difficult ink.
本発明の一実施形態に係る微細径貫通孔を有する樹脂基材は、特にインクジェットプリンタのインクジェットヘッドのインク吐出量の微細化に有用であり、また、各種滴定分析機器のインク分析チップの滴定量の微細かに有用である。また、かかる樹脂基材を使用することで、つまりにくいインクの開発が可能となる。 The resin substrate having fine through-holes according to an embodiment of the present invention is particularly useful for miniaturizing the ink discharge amount of an ink jet head of an ink jet printer, and titration of ink analysis chips of various titration analyzers. It is useful to the minute. In addition, by using such a resin base material, it is possible to develop an ink that is difficult to clog.
10:樹脂基材
11:接着シート
12:積層樹脂基材
13:第1の(積層)樹脂基材(A)
14:第2の(積層)樹脂基材(B)
15:(積層)樹脂基材塊
16:微細径貫通孔を有する(積層)樹脂基材塊
17:金属線が埋め込まれた(積層)樹脂基材
18:微細径貫通孔を有する(積層)樹脂基材
19:金属線(被覆銅線)
20:溝(スリット)
21:金属板(銅板)
22:感光性レジスト
23:フォトマスク
24:紫外線(UV)
25:めっきパターン
26:めっきパターンが形成された金属板
27:硬化性樹脂
28:微細径貫通孔が形成された樹脂基材
10: Resin base material
11: Adhesive sheet 12: Laminated resin substrate 13: First (laminated) resin substrate (A)
14: Second (laminated) resin substrate (B)
15: (Laminated) Resin Base Mass 16: Having a Fine Diameter Through Hole (Laminated) Resin Base Mass 17: (Laminated) Resin Base Material Embedded With Metal Wire 18: (Laminated) Resin Having Fine Diameter Through Hole Base material 19: Metal wire (coated copper wire)
20: Groove (slit)
21: Metal plate (copper plate)
22: Photosensitive resist 23: Photomask 24: Ultraviolet (UV)
25: Plating pattern 26: Metal plate 27 on which the plating pattern is formed 27: Curable resin 28: Resin substrate on which fine-diameter through holes are formed
Claims (8)
前記金属線が配設された第1の樹脂基材の一平面と、前記第1の樹脂基材と同じ材質からなる第2の樹脂基材の一平面とを、前記第1および第2の樹脂基材の材質を主成分とする接着剤を介して接着して一体化し、
一体化された前記第1および第2の樹脂基材を所望の厚さに切断し、
一体化された前記第1および第2の樹脂基材をエッチング液に浸漬して前記金属線を溶解すること、
を備えることを特徴とする微細径貫通孔を有する樹脂基材の製造方法。 A metal wire having a desired fine diameter is arranged at a desired pitch on one plane of the first resin substrate,
The first and second planes of the first resin substrate on which the metal wire is disposed and the second plane of the second resin substrate made of the same material as the first resin substrate. Adhering and integrating through an adhesive mainly composed of the resin base material,
Cutting the integrated first and second resin base materials to a desired thickness;
Immersing the integrated first and second resin base materials in an etching solution to dissolve the metal wire;
The manufacturing method of the resin base material which has a fine diameter through-hole characterized by including these.
所望の微細径の形状に開口したフォトマスクによって前記感光性レジストを露光し、現像して所望の微細径の形状に前記金属板を露出させ、
所望の微細径の形状に露出した前記金属板を電極として電気めっきを行い所望の微細径の形状に金属を析出させ、
前記感光性レジストを除去して前記金属板全面に硬化性の樹脂を堆積して硬化させ、
硬化した樹脂表面を前記金属板の所望の微細径の形状に析出した部分の表面が露出するように研磨し、
前記金属板をエッチング液に浸漬して溶解すること、
を備えることを特徴とする微細径貫通孔を有する樹脂基材の製造方法。 Apply a photosensitive resist to a metal plate,
The photosensitive resist is exposed by a photomask opened to a desired fine diameter shape, and developed to expose the metal plate to the desired fine diameter shape,
Electroplating the metal plate exposed in the desired fine diameter shape as an electrode to deposit the metal in the desired fine diameter shape,
Removing the photosensitive resist and depositing and curing a curable resin on the entire surface of the metal plate;
Polish the cured resin surface so that the surface of the portion deposited in the desired fine diameter shape of the metal plate is exposed,
Immersing and dissolving the metal plate in an etching solution;
The manufacturing method of the resin base material which has a fine diameter through-hole characterized by including these.
前記金属線は、前記溝に配設されることを特徴とする請求項1に記載の微細径貫通孔を有する樹脂基材の製造方法。 Furthermore, grooves are formed at a desired pitch on the one plane of the first resin base material,
The method for producing a resin base material having a fine diameter through hole according to claim 1, wherein the metal wire is disposed in the groove.
さらに、一体化された前記第1および第2の樹脂基材の接着層を剥離すること、を備えることを特徴とする請求項1または請求項3に記載の微細径貫通孔を有する樹脂基材の製造方法。 The first and second resin base materials are laminated resins formed by cutting a laminated resin base material in which a plurality of sheet-like resin base materials made of the same resin are laminated via an easily peelable adhesive layer in the laminating direction. A base material,
The resin base material having fine diameter through-holes according to claim 1, further comprising peeling off the adhesive layers of the integrated first and second resin base materials. Manufacturing method.
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