JP5109429B2 - Resin base material having fine diameter through-hole and manufacturing method thereof, chip for ink analysis, inkjet head - Google Patents

Description

The present invention relates to a resin base material having a fine through-hole used for titration of an ink jet printer head or an analytical instrument, and a method for producing the same.

In recent years, the printing performance of ink jet printers has improved dramatically, and a drop of 1.5 to 2 pl has become a level in general household printers. Along with this, the ink discharge amount of the ink jet printer becomes fine, and a substrate having fine through-holes is required for the discharge portion for discharging ink for further performance improvement.

In addition, since the improvement in printing performance depends on the ink, the development of a difficult ink is required, but a so-called titration analyzer is indispensable for the development of this ink. In addition, there is a need for a substrate having fine through-holes. In such an ink titration analysis, if the ink flow can be visually recognized from the outside, the evaluation becomes easy and efficient.

Further, even in a liquid or gas analyzer, a small amount of titration is required for analysis of a fine amount, and for this purpose, a base material having a fine diameter through hole in the discharge portion is required.

As described above, a substrate having fine-diameter through-holes in many directions is required. For example, as shown in Patent Document 1, an inkjet head or the like is conventionally performed by etching or laser processing on a metal plate. Since the through-hole has been processed, the cross-sectional shape in the length direction of the hole is tapered, the control of the discharge amount is not stable, and it is difficult to cope with the progress of miniaturization in the future. Further, in the development of the ink described above, in the case of the discharge port of the metal plate, it was difficult to evaluate because the ink flow cannot be visually recognized from the outside.

Further, in the conventional processing method, it is difficult to drill holes of 50 μm or less, and it is difficult to control the hole diameter.
JP-A-4-279356

The present invention has been made in view of the above points, and forms a fine through-hole having the same diameter and a diameter of 50 μm or less from one opening to the other opening, which was difficult in the prior art. Is possible. Also, the inside of the hole is made visible from the outside.

According to the first aspect of the present invention, a metal wire having a desired fine diameter is disposed at a desired pitch on one plane of the first resin base material, and the first resin substrate on which the metal wire is disposed. An adhesive mainly composed of the material of the first and second resin bases, and one surface of the second resin base material made of the same material as the first resin base material. The first and second resin base materials are cut to a desired thickness, and the integrated first and second resin base materials are immersed in an etching solution. And a method of producing a resin base material having fine through-holes, wherein the metal wire is melted.

In the invention according to claim 2 of the present invention, a photosensitive resist is applied to a metal plate, the photosensitive resist is exposed by a photomask opened to a desired fine diameter shape, and developed to develop a desired fine diameter shape. The metal plate is exposed, and the metal plate exposed in a desired fine diameter shape is electroplated as an electrode to deposit metal in the desired fine diameter shape, and the photosensitive resist is removed to remove the metal plate. A curable resin is deposited and cured on the entire surface, and the cured resin surface is polished so that the surface of the portion of the metal plate deposited in a desired fine diameter is exposed, and the metal plate is immersed in an etching solution. And a method for producing a resin base material having a fine-diameter through hole.

The invention according to claim 3 of the present invention is characterized in that grooves are formed at a desired pitch on the one plane of the first resin base material, and the metal wires are arranged in the grooves. It is set as the manufacturing method of the resin base material which has a fine diameter through-hole of Claim 1 to do.

In the invention according to claim 4 of the present invention, the first and second resin base materials are laminated resin base materials obtained by laminating a plurality of sheet-like resin base materials made of the same resin through an easily peelable adhesive layer. A laminated resin base material formed by cutting in a laminating direction, further comprising peeling the adhesive layers of the integrated first and second resin base materials. This is a method for producing a resin base material having fine through-holes according to claim 1 or claim 3.

The invention according to claim 5 of the present invention is characterized in that the fine diameter through hole has the same diameter from one opening to the other opening. This is a method for producing a resin base material having fine through holes.

The invention according to claim 6 of the present invention is characterized in that the desired fine diameter is 50 μm or less, and the resin base material having fine diameter through-holes according to any one of claims 1 to 4 This is a manufacturing method.

According to a seventh aspect of the present invention, the material of the first and second resin base materials is a transparent resin, and the fine structure according to any one of the first to fourth aspects. This is a method for producing a resin base material having a diameter through hole.

In the invention according to claim 8 of the present invention, the metal wire is coated with an insulator made of the material of the first and second resin bases, and further adhered to the outer periphery of the insulator. It is a metal wire which has a layer, It is set as the manufacturing method of the resin base material which has a micro diameter through-hole as described in any one of Claim 1 thru | or 4.

According to the present invention, it is possible to form a fine-diameter through-hole having the same diameter and a diameter of 50 μm or less from one opening to the other, which has been difficult in the prior art, It is possible to visually recognize from the outside.

The present invention will be described in detail below with reference to the drawings. In the present specification, the same members are denoted by the same reference numerals, and description thereof is omitted or simplified.

(Embodiment 1)
Based on FIG. 1 and FIG. 2, the formation method of the resin base material which has a fine diameter through-hole which concerns on one Embodiment of this invention is demonstrated. 1 and 2 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. The formation method of the resin base material 18 having a fine diameter through hole according to an embodiment of the present invention is a method of forming a fine diameter through hole by using an etching technique frequently used in manufacturing a semiconductor device or the like.

First, as shown in FIG. 1A, a transparent resin base material 10 such as acrylic is divided into two parts using a cutting machine or the like, and a first resin base material (hereinafter referred to as resin base material A). 13 and a second resin base material (hereinafter referred to as resin base material B) 14 are formed. In the division, the resin base material 10 may be divided into two in the horizontal direction or in the vertical direction. FIG. 1A shows an example in which the image is divided into two in the horizontal direction. In addition, you may use the two resin base materials 10 formed with the same material amount, without dividing | segmenting a resin base material.

Next, a groove (hereinafter sometimes referred to as a slit) 20 is formed in one resin base material A13 as shown in FIG. The groove 20 is a slit for positioning for arranging the metal wires 19 used for forming the fine-diameter through holes at an equal pitch. Therefore, for example, when the solvent fusion type coated metal wire 19 or the heat fusion type coated metal wire 19 is used as the metal wire 19, the groove 20 may be provided or the groove 20 may not be provided. Good. Here, the solvent fusion-type coated metal wire 19 is formed by coating the periphery of the metal wire with an insulator made of the same material amount as the resin base material 10, and forming an adhesive layer of a type that melts with the solvent around the metal wire. The metal wire 19 is a heat-sealing type coated metal wire 19 in which the metal wire is covered with an insulator made of the same material amount as the resin base material 10 and further melted by heat around the metal wire. Is a metal wire formed. As described above, the grooves 20 are formed for positioning for arranging the metal wires 19 at an equal pitch, and the number corresponding to the number of fine diameter through holes to be finally formed is formed. However, the width, depth, shape and the like of the groove 20 can be arbitrarily set. In general, for example, when a 20 μm metal wire 19 is used, the groove 20 is preferably formed in a V shape with a width of 30 μm and a depth of 25 μm. However, the pitch of the grooves 20 is determined corresponding to the interval (pitch) of the fine diameter through holes to be finally formed.

Next, as shown in FIG. 1C, metal wires 19 having the same diameter as the fine through holes to be formed are disposed in the grooves 20 formed corresponding to the number of through holes to be formed. FIG. 1 shows an example in which five are arranged. After arranging the metal wires 19 in all the grooves 20, an adhesive similar to the resin base material 10 is applied onto the grooves 20 and the resin base material A13, and the other resin base material B14 is adhered (FIG. 2 ( a)). In order to prevent air from entering the adhesive during bonding, vacuum defoaming is performed after applying the adhesive. By completely curing the adhesive, the resin substrate lump 15 in which the metal wire 19 is embedded, in which the resin substrate A13 and the resin substrate B14 are completely integrated, is formed. Here, since the resin base material block 15 is formed by bonding two resin base materials A13 and B14 with an adhesive similar to the resin base material, the adhesive and the base material are assimilated and joined. An integrated resin base mass 15 having no surface is obtained.

Next, the resin base material block 15 in which the metal wire 19 is embedded and integrated is immersed in an etching solution that dissolves the metal wire 19 but does not affect the resin base material block 15 (hereinafter referred to as dip). Then, the metal wire 19 is dissolved and removed by etching. For example, when a copper wire is used as the metal wire 19, the buried metal wire 19 is dissolved and removed by etching with an etchant such as ferric chloride. The metal wire 19 is embedded in the resin base material block 15 integrated by adhesion, but when immersed in an etching solution, the metal is embedded in the resin base material block 15 by capillary action. The wire 19 is surely penetrated and the metal wire 19 is surely dissolved and removed.

When the metal wire 19 is dissolved and removed, an integral resin base mass 16 having a fine through hole having a desired diameter is formed. Thereafter, the resin base material block 16 having the fine through-holes having a desired diameter is cut to a desired thickness in a direction perpendicular to the direction in which the metal wire 19 is embedded with a diamond saw or the like, as shown in FIG. In this way, a plurality of resin base materials 18 having fine through holes having a desired diameter can be formed. Finally, the surface of the resin base material 18 having fine diameter through holes is polished and flattened by a polishing machine or the like. In addition, the order of the process of melt | dissolving and removing the metal wire 19 by etching and cutting the resin base material block 15 in which the metal wire 19 is embedded into a desired thickness is not limited to the order described above. After the resin base material block 15 in which the metal wire 19 is embedded is cut into the desired thickness together with the metal wire 19 to form the resin base material 17 in which the metal wire 19 is embedded (see FIG. 2B), The metal wire 19 may be dissolved and removed by etching to form the resin base material 18 having fine diameter through holes (see FIG. 2C).

In addition, you may use the laminated resin base material formed by laminating | stacking a transparent sheet-like resin base material via an adhesive sheet as a transparent resin base material. This will be described with reference to FIGS. 3 and 4 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. For example, a laminated resin base material 112 formed by laminating a transparent sheet-like resin base material 110 such as acrylic via an ultraviolet peeling type adhesive sheet 111 used for cutting a silicon wafer or the like is used as the resin base material. In laminating the adhesive sheet 111, a laminator is used so as not to sandwich air. When this laminated resin substrate 112 is used, the division of the laminated resin substrate 112 is divided in the laminated direction. In FIG. 3, a first laminated resin base material (hereinafter referred to as “laminated resin base material A”) 113 and a second laminated resin base material (hereinafter referred to as “laminated resin base material B”) in the vertical direction toward the figure. ) 114 (see FIG. 3C). In the division, a processing machine such as a diamond saw is used so as not to break the lamination of the cut surfaces. If burrs or the like are generated on the divided cut surfaces, the shape of the cut surfaces is adjusted by polishing. In addition, a required number of metal wires 119 having a predetermined diameter are arranged at a predetermined pitch on the cut surface of one of the two laminated resin base materials A113 (see FIG. 3D) and divided into two. The cut surface of the other laminated resin base material B114 is adhered with an adhesive so that the laminated layers coincide with each other. When the adhesive is completely cured, a laminated resin substrate mass 115 in which the metal wire 119 is embedded in the lamination direction of the laminated resin substrate 112 is obtained (see FIG. 4A). Thereafter, the laminated resin base material mass 115 is irradiated with ultraviolet rays by an ultraviolet exposure device to reduce the adhesive force of the adhesive sheet 111 and make the laminated resin base material mass 115 easy to peel off. The adhesive sheet 111 whose adhesive force has decreased is removed (see FIG. 4B), and four resin base materials 110 through which the metal wires 119 penetrate are formed. Next, the metal wire 119 is cut to form a plurality of resin base materials 117 in which the metal wire is embedded (not shown), and then the metal wire 119 is removed by etching to form a fine through hole having a desired diameter. The formed resin base material 118 can be obtained (see FIG. 4C). The laminated resin base material block 115 is immersed in an etching solution to remove the metal wire 119 by etching, and then irradiated with ultraviolet rays, and the adhesive sheet 111 and the resin base material 110 are peeled off. A resin substrate 118 having holes can be obtained.

Note that a heat-peeling type adhesive sheet may be used as the adhesive sheet 111. In this case, in order to reduce the adhesive force of the adhesive sheet 111, the laminated resin substrate A113 and the laminated resin substrate B114 are bonded with an adhesive, and the adhesive is cured to be integrated. After forming the lump 115, the laminated resin substrate 115 is heated in an oven to reduce the adhesive force. Since other processes are the same, description thereof is omitted.

The resin base material 18 having a fine diameter through hole formed as described above has a plurality of fine diameter through holes having a desired diameter in the approximate center of the resin base material 18, and the through hole has a cross-sectional shape. It is not tapered and is formed with the same diameter from one opening to the other. Further, since the resin base material 18 having the fine diameter through holes is obtained by re-bonding the resin base material A13 and the resin base material B14 divided into two with the metal wire 19 interposed therebetween, the plurality of fine diameter through holes are , Formed in series. Therefore, a finer and more beautiful ink jet printer is provided by utilizing it as an ink jet head of an ink jet printer that requires a finer discharge amount.

In addition, since the resin base material 18 having fine through holes formed in the above steps has the same diameter from one opening to the other opening of the hole, the titration amount can be easily controlled. Therefore, in a gas or liquid analyzer, a fine titer can be controlled, and an analyzer capable of analyzing a minute amount can be provided.

Furthermore, since a transparent resin such as acrylic is used as the resin base material 10, the inside of the hole can be visually recognized from the outside. Therefore, for example, the flow of ink can be easily confirmed. For this reason, the use of the ink analysis chip for ink development facilitates the development of a difficult ink.

(Embodiment 2)
In the first embodiment of the present invention described above, the fine-diameter through hole is formed by using an etching technique frequently used in the manufacture of a semiconductor device. However, by applying the semiconductor device manufacturing technique, the fine-diameter through hole is provided. Another method for producing the resin substrate can be provided. The method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention applies lithography technology.

Hereinafter, a description will be given based on the drawings. 7 to 9 are schematic views showing a method of forming a resin base material having a fine diameter through hole according to an embodiment of the present invention. The method for forming fine through holes according to the present invention uses a metal substrate 321 as a base material, and a plating pattern in which holes having the same diameter as the fine through holes to be formed are formed on the metal base material 321 using a lithography technique. 325 is formed. Thereafter, metal is deposited from a hole having the same diameter as the fine through hole by metal plating. The deposited metal is formed into a cylindrical shape having the same diameter as the fine diameter through hole to be formed. Thereafter, a curable resin 327 is applied on the metal substrate 321 and cured, and the metal substrate 321 is dissolved and removed by etching to form a resin substrate 328 having fine diameter through holes. The above is the outline method, but it will be described in more detail with reference to FIGS.

First, the photosensitive resist 322 is apply | coated on the metal base materials 321, such as a copper plate, and it planarizes (refer Fig.7 (a) and FIG.7 (b)). Separately from this, a photomask 323 is prepared by previously patterning the location where the fine diameter through-holes are formed and the outer peripheral shape of the resin base material 328 as a finished product (see FIG. 7C). The shape pattern patterned on the photomask 323 has the same diameter as that of the fine through-hole to be formed, and is circular, for example. Further, the outer peripheral shape is formed with a predetermined width in accordance with the outer peripheral shape of the resin base material 328 having a fine diameter through-hole which is a finished product.

The photomask 323 is mounted on the metal substrate 321 coated with the photosensitive resist 322 (see FIG. 7D). Next, the metal substrate 321 having the photomask 323 mounted on the photosensitive resist 322 is baked by irradiation with ultraviolet (UV) 324 (see FIG. 8A). Subsequently, the photosensitive resist 322 onto which the pattern has been baked is developed, and as shown in FIG. 8B, a resist pattern (hereinafter referred to as a plating pattern) in which the resist on the fine diameter through hole portion and the outer peripheral portion of the resin base material 328 is removed. ) 325 is formed.

Using the metal substrate 321 with the plating pattern 325 attached as an electrode, a dissolvable metal such as copper is deposited in the opening of the plating pattern 325 by electroplating (see FIG. 8C). After performing electroplating, the metal substrate 326 in which the pattern of the fine diameter through-hole portion and the outer periphery of the resin substrate 328 is formed can be obtained by peeling the plating pattern 325 (see FIG. 9A). .

Next, the curable resin 327 is coated on the metal substrate 326 on which the plating pattern 325 is formed, and the curable resin 327 is cured (see FIG. 9B). The curable resin 327 is coated so that the fine diameter through hole portion of the metal base material 326 on which the plating pattern is formed and the pattern of the outer peripheral portion of the resin base material 328 are buried. After the curable resin 327 is cured, the surface of the metal substrate 326 on which the plating pattern of the portion is formed is exposed by a polishing machine with the curable resin 327 on the pattern of the fine diameter through-hole portion and the outer peripheral portion of the resin substrate 328. Until it is polished (see FIG. 9C). By this polishing, the resin 327 is formed in the size of the resin base material 328 having the fine diameter through hole to be finally formed, and the plating pattern is formed only on the fine diameter through hole portion from the upper surface of the resin 327. The surface of the formed metal base material 326 will be exposed.

After the resin 327 is polished, the metal base material 326 is dissolved and removed using an etching solution, whereby the resin base material 328 having fine through-holes according to the present invention can be obtained. The fine-diameter through hole is formed from a resist pattern (plating pattern) 325 having the same diameter as the desired diameter, based on a metal substrate 326 having the same diameter as the desired diameter deposited by electroplating. Since it is formed by dissolving and removing the material 326, it is formed with the same diameter from one opening to the other and does not become tapered. The diameter is the desired diameter.

7 to 9 illustrate a process of forming one resin base material 328 having a fine diameter through-hole. However, a large metal base material 321 is used, and the fine diameter through-hole and the outer periphery of the resin base material 328 are illustrated. By using the photomask 323 in which the pattern of the part is formed in an array, a plurality of resin base materials 328 having fine diameter through holes can be manufactured in large numbers in a plane. In Embodiment 1 of this invention, the resin base material which has a fine diameter through-hole is formed as a lump, and a plurality of resin base materials which have a desired fine diameter through-hole are manufactured by cutting. Therefore, according to the present embodiment, there is an advantage that the cutting process can be omitted.

Further, in the resin base material 328 having the fine through-holes according to an embodiment of the present invention formed as described above, the cross-sectional shape of the through-holes is not tapered, and from one opening to the other. It is formed with the same diameter up to the opening. Therefore, a finer and more beautiful ink jet printer is provided by utilizing it as an ink jet head of an ink jet printer that requires a finer discharge amount.

Furthermore, since the resin base material 328 having fine through-holes according to an embodiment of the present invention has the same diameter from one opening of the hole to the other opening, the titration amount can be easily controlled. Therefore, in a gas or liquid analyzer, a fine titer can be controlled, and an analyzer capable of analyzing a minute amount can be provided.

Furthermore, since a transparent resin such as acrylic is used as the resin base material, the inside of the hole can be visually recognized from the outside. Therefore, for example, the flow of ink can be easily confirmed. For this reason, the use of the ink analysis chip for ink development facilitates the development of a difficult ink.

Hereinafter, examples of embodiments of the present invention will be described in detail with reference to the drawings.

Example 1
A first embodiment of the present invention will be described with reference to FIGS. This example is an example of a method for producing a resin base material having a fine-diameter through hole according to Embodiment 1 of the present invention. In this example, an acrylic substrate was used as the resin base material 10. After the resin base material 10 is cut in the horizontal direction to form the acrylic resin base material A13 and the acrylic resin base material B14 (see FIG. 1A), a silicon wafer or substrate is placed on the surface of one resin base material A13. Using a dicing apparatus for cutting, grooves 20 having a width of 30 μm and a depth of 30 μm are formed so that the distance between the centers of the grooves 20 is 100 μm (hereinafter, the distance is referred to as a pitch, and is referred to as a 100 μm pitch). (See FIG. 1B).

Next, propanol is dropped onto the groove 20, and a solvent fusion type coated copper wiring 19 having a diameter of 20 μm is immediately disposed (see FIG. 1C). The solvent fusion type coated copper wiring 19 has a copper wire diameter of 20 μm, the copper wire is covered with an acrylic insulating material having a thickness of 3 μm, and the adhesive layer is melted by a 1 μm thick solvent around the copper wire. Is a wiring formed. An acrylic adhesive is applied onto the acrylic resin base material A13 and the coated copper wiring 19, and the other acrylic resin base material B14 divided into two is adhered thereon. In addition, before adhering acrylic resin base material B14, in order to prevent generation | occurrence | production of an air void, the foam contained in an adhesive agent is removed in a vacuum defoaming machine. The acrylic adhesive is cured, and the acrylic resin base material A13 and the acrylic resin base material B14 are integrated to form an integrated acrylic resin base material mass 15 (see FIG. 2A). Since it is formed by bonding with an adhesive (acrylic adhesive) similar to the resin base material (acrylic resin), the adhesive and base material are assimilated, and the integrated acrylic resin base material block 15 having no joint surface Become. Moreover, since the covering insulator of the covering copper wiring 19 is an acrylic insulator as described above, and the adhesive layer around it is also soluble in the solvent, the resin base material A13 and the resin base material B14 At the time of bonding, the insulator is melted with an acrylic adhesive, and is cured integrally with the resin base material and the adhesive. Therefore, only the 20 μm diameter copper wire is embedded in the cured acrylic resin base material block 15.

Subsequently, the integrated acrylic resin base material block 15 is cut using a diamond saw or the like so that the thickness of the base material becomes 200 μm, and the resin base material 17 in which the copper wire of the coated copper wiring 19 is embedded. Is formed (see FIG. 2B). For the cutting process, a polishing apparatus or the like can be used in addition to the diamond saw described above.

After cutting the substrate, the resin substrate 17 in which the copper wire of the coated copper wiring 19 is embedded is dipped in a solution of 200 g / l ammonium persulfate, and the copper wire of the embedded coated copper wiring 19 is dissolved and removed (FIG. 2 (c)). The acrylic resin base material 18 which has a 20 micrometer diameter fine through-hole without a taper by the above process was able to be formed.

In addition, the resin base material 10 may use two acrylic resin base materials 10 of the same size cut | disconnected previously. Further, since the solvent fusion type coated copper wiring 19 is used for the metal wire 19, the coated copper wiring 19 can be disposed at a predetermined pitch only by adhesion without forming the groove 20. Further, although not shown, the resin base lump 15 in an integrated state in which the copper wire of the coated copper wiring 19 is embedded is dipped in a solution of 200 g / l of ammonium persulfate, and the embedded copper wire of the coated copper wiring 19 is used. After dissolving and removing, the resin base material block 15 may be cut into a desired thickness.

(Example 2)
In the first embodiment, the solvent fusion type coated copper wiring 19 is used as the metal wire 19, but the heat fusion type coated copper wiring 19 can also be used as the metal wire 19. This example is another example of the method for producing a resin base material having a fine diameter through hole according to Embodiment 1 of the present invention. This embodiment is an example in which a heat fusion type coated copper wiring 19 (copper wire diameter 20 μm, insulator 3 μm thickness, adhesive layer 1 μm thickness) is used as the metal wire 19.

This will be described with reference to FIGS. Epoxy resin substrate 10 was used as the resin substrate. After the epoxy resin base material 10 is cut vertically in the horizontal direction to form the epoxy resin base material A13 and the epoxy resin base material B14 (see FIG. 1A), silicon is formed on the surface of one epoxy resin base material A13. Grooves 20 having a width of 30 μm and a depth of 30 μm are formed at a pitch of 100 μm using a dicing apparatus for cutting a wafer or a substrate (see FIG. 1B).

Next, a heat-sealing type coated copper wiring 19 is disposed on the groove 20, and a heated iron of about 90 ° C. is applied to bond the coated copper wiring 19 onto the epoxy resin substrate A13. Here, the insulator of the coated copper wiring 19 is an epoxy insulator. An epoxy-based adhesive is applied on the resin base material A13 and the coated copper wiring 19, and an epoxy resin base material B14 is adhered thereon to form an epoxy resin base material block 15 (see FIG. 2A). When applying an epoxy adhesive, in order to suppress the generation of air voids, the epoxy resin base material B14 is bonded after removing bubbles contained in the adhesive in a vacuum defoaming machine. Since it is formed by bonding with the same adhesive (epoxy adhesive) as that of the resin base (epoxy resin), the adhesive and the base are assimilated, and an integrated epoxy resin base mass 15 having no joint surface It becomes. Moreover, since the covering insulator of the covering copper wiring 19 is an epoxy insulator as described above, and the adhesive layer around it is melted by heat, the resin base material A13 and the resin base material B14 At the time of bonding, the insulator is melted with an epoxy adhesive, and the adhesive layer is melted with heat, and is cured by being integrated with the resin base material and the adhesive. Therefore, only the 20 μm diameter copper wire is embedded in the cured epoxy resin base material block 15.

After the adhesive is cured and the epoxy resin base material block 15 in which the resin base material A13 and the resin base material B14 are integrated is formed, the resin base material block 15 has a thickness of 200 μm. Thus, the resin base material 17 in which the copper wire of the coated copper wiring 19 is embedded is formed by cutting with a diamond saw or the like (see FIG. 2B).

The processed resin base material 17 is dipped in an etching solution of 200 g / l ammonium persulfate, and the copper wire of the embedded coated copper wiring 19 is dissolved and removed. Through the above steps, the epoxy resin substrate 18 having a 20 μm fine diameter through hole without a taper could be formed.

Also in this embodiment, two epoxy resin substrates having the same size can be used as in the first embodiment. Further, the coated copper wiring 19 may be disposed only by adhesion without forming the groove 20. Alternatively, after the copper wire of the coated copper wiring 19 is dissolved and removed, it may be cut to form the resin base material 18 having fine diameter through holes.

(Example 3)
Since the resin base material according to the present invention is finally used with a thickness of about 200 μm, when formed as a resin base material block, it is necessary to cut it to a desired thickness using a diamond saw or the like. is there. Processing becomes difficult as the desired thickness decreases. Therefore, if a laminated resin base material in which a sheet-shaped resin base material having a desired thickness is laminated in multiple layers with an adhesive sheet or the like is used, it is easy to peel off the adhesive sheet after forming the fine-diameter through hole. A plurality of resin base materials having fine through-holes with a desired thickness can be formed at a time. This example is yet another example of the method for producing a resin base material having a fine through-hole according to Embodiment 1 of the present invention, and is an example using a laminated resin base material.

This will be described with reference to FIGS. 3 and 4 are schematic views showing a method for forming a resin base material having fine through holes according to an embodiment of the present invention. An acrylic substrate is used for the resin base 110. As the adhesive sheet 111, a heat-peeling type adhesive sheet (manufactured by Nitto Denko, product name Riva Alpha) used for cutting a silicon wafer is used, and the resin base material 110 is bonded in multiple stages with the adhesive sheet 111 (FIG. 3 ( a)), a laminated resin base material 112 is formed (see FIG. 3B). In laminating the adhesive sheet 111 and the resin base 110, a laminator is used so that air is not caught. 3 and 4 show an example in which the resin base material 110 is stacked in four layers using the adhesive sheet 111, but the present invention is not limited to this, and an arbitrary number of layers may be stacked. it can. Further, a UV peeling type adhesive sheet may be used instead of the heat peeling type adhesive sheet.

After forming the laminated resin base material 112, the laminated resin base material 112 is cut at an arbitrary position in the laminating direction (in FIG. 3 and FIG. 4, the direction perpendicular to the drawings), and the result is shown in FIG. As shown, a laminated resin substrate A113 and a laminated resin substrate B114 are formed. For cutting, it is desirable to use a processing machine such as a diamond saw so as not to break the cut surface. Further, when burrs or the like are generated on the cut surface, the shape of the cut surface is adjusted by a polishing apparatus.

A metal wire 119 having a diameter of 20 μm is disposed vertically on the cut surface of the laminated resin base material A113 as shown in FIG. 3D while fixing both ends of the metal wire 119 and pulling them. The metal wire 119 can be fixed by sticking the metal wire 119 to the cut surface as it is by using the adhesiveness of the adhesive sheet 111 used for bonding the resin base material 110. If the copper wire is used for the metal wire 119, it is convenient in a later process. Alternatively, a method of fixing the coated copper wiring 119 and the laminated resin base material A113 while heating may be adopted by using a heat-sealing type coated copper wiring 119 for the metal wire 119. In this case, care is taken not to heat the entire adhesive sheet 111 by fixing only the guide tip of the coated copper wiring 119 by heating.

After fixing the metal wire 119 to the laminated resin substrate A113, the other laminated resin substrate B114 that was cut was adhered to the laminated resin substrate A113 using an acrylic adhesive, and the metal wire 119 was embedded. A laminated resin base material block 115 is formed (see FIG. 4A). At the time of bonding, the laminated resin substrates are bonded with care so that the cut surfaces of the laminated resin substrates are exactly the same. Since it is formed by bonding with the same adhesive as that of the resin base material, the adhesive and the base material are assimilated to form an integrated resin base material block 15 having no joint surface.

After the acrylic adhesive is cured, the laminated resin base material block 115 is heated in an oven at 120 ° C. for 10 minutes to reduce the adhesiveness of the adhesive sheet. Since the laminated resin base 110 and the adhesive sheet 111 are easily peeled off, the peeled adhesive sheet 111 is removed, and four resin bases through which the metal wires 119 penetrate as shown in FIG. 110 is formed. Since the adhesive strength of the adhesive sheet 111 is reduced by heating, the acrylic resin substrate 110 and the heat release type adhesive sheet 111 can be easily peeled off.

The metal wires 119 between the four resin substrates 110 through which the metal wires 119 penetrate are cut to form four resin substrates 117 in which the metal wires 119 are embedded. Since the resin base material 117 has an acrylic adhesive protruding from the bonding portion, the protruding burr and the metal wire 119 are removed by polishing with a polishing machine, and the surface state of the resin base material 117 is adjusted.

Next, the resin base material 117 in which the metal wire 119 is embedded in the surface state is immersed in a 200 g / l ammonium persulfate solution to dissolve and remove the metal wire 119. As a result, as shown in FIG. 4C, four resin base materials 118 having fine through holes having the same diameter as the embedded metal wire 119 can be obtained. Through the above process, a 20 μm fine through hole without a taper could be formed in the acrylic resin substrate.

Also in this example, after the laminated resin base material mass 115 was immersed in an ammonium persulfate 200 g / l solution to dissolve and remove the metal wire 119, the resin base material mass 116 having fine through-holes was formed. The resin base material mass 116 having fine diameter through holes may be cut into a desired thickness to form the resin base material 118 having fine diameter through holes.

Example 4
In Example 3 mentioned above, the example which arrange | positions a metal wire in a predetermined position using the adhesiveness of an adhesive sheet was shown, without processing a groove | channel on a resin base material. Furthermore, by processing the groove in the resin base material, the metal wire can be more reliably disposed at a predetermined position. This example is yet another example of a method for producing a resin base material having a fine through-hole according to Embodiment 1 of the present invention. In this example, a laminated resin base material is used, and grooves are formed in the laminated resin base material, and then metal wires are disposed.

A present Example is demonstrated based on FIG.5 and FIG.6. 5 and 6 are schematic views showing a method for forming a resin base material having fine through-holes according to an embodiment of the present invention. An acrylic substrate is used as the resin substrate 210. As the adhesive sheet 211, a UV peeling type adhesive sheet used for cutting a silicon wafer is used. The resin base material 210 is bonded in multiple stages via the adhesive sheet 211 (see FIG. 5A) to form a laminated resin base material 212 (see FIG. 5B). At this time, the resin substrate 210 is bonded using a laminator so that air is not sandwiched between the adhesive sheet 211 and the resin substrate 210.

As shown in FIG. 5 (c), after forming the laminated resin base material 212, the laminated resin base material 212 is cut at an arbitrary position in the laminating direction to obtain a first laminated resin base material (hereinafter referred to as a laminated resin). A base material A) 213 and a second laminated resin base material (hereinafter referred to as a laminated resin base material B) 214 are formed. For cutting, it is desirable to use a processing machine such as a diamond saw so as not to break the cut surface. A diamond cutter or the like may be used. Further, when burrs or the like are generated on the cut surface, the shape of the cut surface is adjusted by polishing with a polishing apparatus.

As shown in FIG. 5D, a groove 220 for fixing the metal wire 219 is formed on the cut surface of one of the cut laminated resin base materials A213 using a router. The groove 220 may be formed by a dicing apparatus or the like. As for the shape of the groove 220, for example, when a metal wire 219 having a diameter of 20 μm is used as the metal wire 219, it is desirable to form the groove 220 in a V shape having a width of about 30 μm and a depth of about 25 μm. The metal wire 219 having a diameter of 20 μm is disposed in the formed groove 220 as shown in FIG. In this embodiment, a solvent fusion-type coated copper wiring 219 (having a copper wire diameter of 20 μm, a 3 μm thick acrylic insulator, and an adhesive layer soluble in a solvent of 1 μm thickness) is used as the metal wire 219, and the groove 220. After the ethanol is dropped into the groove 220, the coated copper wiring 219 is accurately fixed to the groove 220 by disposing the coated copper wiring 219 in the groove 220. Note that a heat-sealing type coated copper wire may be used.

After the coated copper wiring 219 is fixed to the laminated resin base material A213, the other laminated resin base material B214 cut is shown in FIG. 6B as the laminated resin base material A213 provided with the coated copper wiring 219. Thus, the laminated resin base material block 215 in which the coated copper wiring 219 is embedded is formed by using an adhesive. As the adhesive, an acrylic adhesive similar to the laminated resin base materials A213 and B214 is used. Further, during bonding, the cut surfaces of the laminated resin base materials A213 and B214 and the cut surfaces of the adhesive sheet 211 are bonded with care so as to accurately match each other. Since it is formed by bonding with the same adhesive as that of the laminated resin base material, the adhesive and the base material are assimilated to form an integrated laminated resin base material mass 215 having no joint surface. In addition, since the insulator of the said covering copper wiring 219 is an acrylic type, it melt | dissolves with an acrylic adhesive and it hardens | cures integrally with a laminated resin base material and an adhesive agent. Therefore, only the 20 μm diameter copper wire is embedded in the cured acrylic laminated resin base material mass 215.

After the acrylic adhesive is cured, ultraviolet light (UV) 224 is irradiated from both surfaces of the laminated resin base material block 215 with an ultraviolet exposure device to reduce the adhesiveness of the adhesive sheet. By irradiating the ultraviolet ray 224, the adhesive strength of the UV peeling type adhesive sheet 211 in the portion of the laminated resin base material mass 215 irradiated with the ultraviolet ray 223 is reduced, and the adhesive sheet 211 and the resin base material 210 are easily separated. can do. Since the laminated resin base material 210 and the adhesive sheet 211 are easily peeled off, the peeled adhesive sheet 211 is removed, and the four copper wires of the coated copper wiring 219 penetrated as shown in FIG. The resin base material 210 is formed. Although the exposure amount differs depending on the type of the adhesive sheet 211, in the present example, the ultraviolet ray 224 of 600 mJ / cm ² was irradiated with a high pressure mercury lamp type exposure machine. Moreover, since the adhesive force remains in the portion through which the ultraviolet ray 224 does not transmit, in this case, UV irradiation is performed again on the portion to reduce the adhesive force, and the resin base material 210 is separated.

The copper wires between the four resin base materials 210 through which the copper wires of the coated copper wiring 219 penetrate are cut to form four resin base materials 217 in which the copper wires of the coated copper wiring 219 are embedded (not shown). ). From the resin base material 217 in which the copper wire of the coated copper wiring 219 is embedded, an acrylic adhesive protrudes as a burr at the bonded portion. Therefore, the protruding burr and copper wire are removed by a polishing machine, and the base material is removed. To adjust the surface condition.

As shown in FIG. 6D, the resin base material 217 in which the copper wire of the coated copper wiring 219 is embedded is immersed in a 200 g / l ammonium persulfate solution, and the copper wire of the coated copper wiring 219 is dissolved and removed. Four resin base materials 218 in which through holes having the same diameter as the copper wires of the coated copper wiring 219 are opened in the base material can be obtained. The resin base material 218 having a 20 μm-diameter fine through-hole without a taper could be formed by the above steps.

In this embodiment, although not shown, the resin base material having fine through-holes is obtained by immersing the laminated resin base material mass 215 in an ammonium persulfate 200 g / l solution to dissolve and remove the copper wire of the coated copper wiring 219. After the mass 216 is formed, the resin base material mass 216 having fine diameter through holes may be cut into a desired thickness to form the resin base material 218 having fine diameter through holes.

According to the method for forming a resin base material having fine through holes according to Embodiment 1 of the present invention, the cross-sectional shape is not tapered in any of the methods of Examples 1 to 4 described above. The resin base material which has the fine diameter through-hole of the same diameter from one opening part to the other opening part can be formed. Therefore, if a resin base material having such fine diameter through holes is used, a fine and clean ink jet printer can be provided, and a liquid or gas analyzer capable of analyzing a minute amount can be provided. Further, since a transparent resin is used, the inside can be visually recognized from the outside, and the use of the ink analysis chip for ink development facilitates the development of a difficult ink.

(Example 5)
An example of a method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention will be described with reference to FIGS. A 150 μm thick copper plate is used as the metal substrate 321 (see FIG. 7A). A photosensitive resist 322 is coated on the copper plate 321 (see FIG. 7B). The material of the resist is selected according to the diameter of the fine through hole to be formed. In this embodiment, a positive resist for thick film (THB) (JSR stock) is used to form a fine through hole with a diameter of 30 μm. (Made by company) is 60 μm thick, coated by spin coating, and pre-baked in an oven at 110 ° C. for 45 minutes.

A photomask 323 in which fine-diameter through holes and the outer peripheral portion of the resin base material are patterned in advance is mounted on a copper plate 321 coated with a photosensitive resist 322 and pre-baked (see FIGS. 7C and 7D). Then, the pre-baked photosensitive resist 322 is exposed by irradiating with ultraviolet rays 324 (see FIG. 8A). The exposure of the ultraviolet rays 324 is performed using a stepper exposure machine or a parallel light exposure machine. In this embodiment, the exposure is performed at an exposure amount of 60 mJ / cm ² . After the exposure, the photosensitive resist 322 is developed with a dedicated developer, whereby a resist pattern (plating pattern) 325 having a fine-diameter through-hole portion and a peripheral shape pattern of the resin base material can be formed.

After the plating pattern 325 is formed, the copper plate 321 with the plating pattern 325 attached is used as an electrode, and plating is performed with an aim of a thickness of 50 μm by electrolytic copper plating (see FIG. 8B). In the case where the opening of the plating pattern 325 is small, setting the current density to about 0.5 A / dm ² provides good coverage and stable deposition of plating can be obtained (see FIG. 8C). After performing copper plating, the plating pattern 325 is dissolved and peeled off using a special stripping solution, whereby a copper plate 326 with a fine through-hole portion and a resin substrate 328 outer peripheral portion can be obtained (FIG. 9A). )reference).

An epoxy resin (araldite) and a curing agent are mixed and poured onto a copper plate 326 in which the fine diameter through-hole portion and the outer peripheral portion of the resin base material 328 are raised. At this time, a mixture of an epoxy resin and a curing agent (hereinafter referred to as curable resin) 327 is poured so as to cover the fine-diameter through hole portion and the resin base material 328 outer peripheral portion of the copper plate 326. The poured epoxy resin 327 is completely cured by heating in an oven at a temperature of 60 ° C. for 60 minutes (see FIG. 9B).

After the epoxy resin 327 is cured, the epoxy resin 327 covering the fine-diameter through hole portion of the copper plate 326 and the outer periphery of the resin base material 328 is removed by polishing the surface of the fine-diameter through hole portion and the outer periphery of the resin base material 238. Polish and remove until exposed. Thereby, the epoxy resin 327 in which the copper pattern is exposed can be formed (see FIG. 9C).

After polishing with a polishing machine, the copper plate 326 is immersed in a ferric chloride solution (hydrochloric acid 20%, temperature 60 ° C.) or an ammonium persulfate solution (200 g / l, 30 ° C.), and the copper plate 326 is dissolved and removed. Thereby, the epoxy resin base material 328 in which the fine diameter through hole is formed in the base material can be formed. Through the above steps, an epoxy resin base material 328 having a 30 μm fine diameter through hole without a taper could be formed.

(Example 6)
Another example of the method for forming a resin base material having fine through-holes according to Embodiment 2 of the present invention will be described. Since the outline of the method for forming the fine-diameter through hole is the same as that of the above-described embodiment 5, the description of the same portion is omitted.

The copper plate 326 in which the fine diameter through-hole portion and the outer peripheral portion of the resin base material 328 shown in FIG. In this embodiment, a film type epoxy resin is used instead of the curable resin 327 poured onto the copper plate 326. A film-type epoxy resin film (SR film PFR-800 manufactured by Taiyo Ink Manufacturing Co., Ltd.) (not shown) is vacuum-laminated on the copper plate 326 with the fine-diameter through-hole portion and the resin base material 328 outer periphery increased. paste. Subsequently, the copper plate 321 with the epoxy resin film attached is exposed by irradiating ultraviolet rays 324 with an exposure amount of 500 mJ / cm ² , and then heated at 150 ° C. for 60 minutes to completely cure the epoxy resin. Thereafter, the resin base material 328 having a 30 μm diameter fine through hole without a taper could be formed by polishing the epoxy resin surface and removing the copper plate 326 by etching in the same manner as in Example 1 described above.

According to the method for forming a resin substrate having fine through-holes according to Embodiment 2 of the present invention, the cross-sectional shape is not tapered in any of the methods of Example 5 or Example 6 described above. The resin base material which has the fine diameter through-hole of the same diameter from one opening part to the other opening part can be formed. Therefore, if a resin base material having such fine diameter through holes is used, a fine and clean ink jet printer can be provided, and a liquid or gas analyzer capable of analyzing a minute amount can be provided. Further, since a transparent resin is used, the inside can be visually recognized from the outside, and the use of the ink analysis chip for ink development facilitates the development of a difficult ink.

The resin substrate having fine through-holes according to an embodiment of the present invention is particularly useful for miniaturizing the ink discharge amount of an ink jet head of an ink jet printer, and titration of ink analysis chips of various titration analyzers. It is useful to the minute. In addition, by using such a resin base material, it is possible to develop an ink that is difficult to clog.

It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention. It is the schematic diagram which showed the formation method of the resin base material which has a micro diameter through-hole which concerns on one Embodiment of this invention.

Explanation of symbols

10: Resin base material
11: Adhesive sheet 12: Laminated resin substrate 13: First (laminated) resin substrate (A)
14: Second (laminated) resin substrate (B)
15: (Laminated) Resin Base Mass 16: Having a Fine Diameter Through Hole (Laminated) Resin Base Mass 17: (Laminated) Resin Base Material Embedded With Metal Wire 18: (Laminated) Resin Having Fine Diameter Through Hole Base material 19: Metal wire (coated copper wire)
20: Groove (slit)
21: Metal plate (copper plate)
22: Photosensitive resist 23: Photomask 24: Ultraviolet (UV)
25: Plating pattern 26: Metal plate 27 on which the plating pattern is formed 27: Curable resin 28: Resin substrate on which fine-diameter through holes are formed

Claims (8)

A metal wire having a desired fine diameter is arranged at a desired pitch on one plane of the first resin substrate,
The first and second planes of the first resin substrate on which the metal wire is disposed and the second plane of the second resin substrate made of the same material as the first resin substrate. Adhering and integrating through an adhesive mainly composed of the resin base material,
Cutting the integrated first and second resin base materials to a desired thickness;
Immersing the integrated first and second resin base materials in an etching solution to dissolve the metal wire;
The manufacturing method of the resin base material which has a fine diameter through-hole characterized by including these. Apply a photosensitive resist to a metal plate,
The photosensitive resist is exposed by a photomask opened to a desired fine diameter shape, and developed to expose the metal plate to the desired fine diameter shape,
Electroplating the metal plate exposed in the desired fine diameter shape as an electrode to deposit the metal in the desired fine diameter shape,
Removing the photosensitive resist and depositing and curing a curable resin on the entire surface of the metal plate;
Polish the cured resin surface so that the surface of the portion deposited in the desired fine diameter shape of the metal plate is exposed,
Immersing and dissolving the metal plate in an etching solution;
The manufacturing method of the resin base material which has a fine diameter through-hole characterized by including these. Furthermore, grooves are formed at a desired pitch on the one plane of the first resin base material,
The method for producing a resin base material having a fine diameter through hole according to claim 1, wherein the metal wire is disposed in the groove. The first and second resin base materials are laminated resins formed by cutting a laminated resin base material in which a plurality of sheet-like resin base materials made of the same resin are laminated via an easily peelable adhesive layer in the laminating direction. A base material,
The resin base material having fine diameter through-holes according to claim 1, further comprising peeling off the adhesive layers of the integrated first and second resin base materials. Manufacturing method. The said fine diameter through-hole is the same diameter from one opening part to the other opening part, The manufacture of the resin base material which has a fine through-hole as described in any one of Claim 1 thru | or 4 characterized by the above-mentioned. Method. The method for producing a resin base material having a fine diameter through hole according to any one of claims 1 to 4, wherein the desired fine diameter is 50 µm or less. The method for producing a resin base material having a fine diameter through hole according to any one of claims 1 to 4, wherein a material of the first and second resin base materials is a transparent resin. . The metal wire is a metal wire in which an outer periphery of the metal wire is covered with an insulator made of the material of the first and second resin substrates, and an adhesive layer is further provided on the outer periphery of the insulator. The manufacturing method of the resin base material which has a fine diameter through-hole as described in any one of Claim 1 thru | or 4.