CN105792519A - Method for preventing blistering of electroplating copper of resin-filled board - Google Patents
Method for preventing blistering of electroplating copper of resin-filled board Download PDFInfo
- Publication number
- CN105792519A CN105792519A CN201610164562.9A CN201610164562A CN105792519A CN 105792519 A CN105792519 A CN 105792519A CN 201610164562 A CN201610164562 A CN 201610164562A CN 105792519 A CN105792519 A CN 105792519A
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- Prior art keywords
- hole
- resin
- copper
- coppering
- board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Abstract
The invention discloses a method for preventing blistering of electroplating copper of a resin-filled board. The method comprises the following steps of 1) after laminating an inner-layer core board and an outer-layer copper foil, drilling a through hole and a buried hole once; 2) performing outer-layer copper deposition and metalizing the through hole and the buried hole; 3) making a hole-covering dry membrane after complete board electroplating, and covering the through hole with the dry membrane; 4) filling the buried hole with resin; 5) grinding the board by an abrasive belt; and 6) after removing the dry membrane, performing secondary outer-layer copper deposition and secondary complete board electroplating. According to the method, the through hole and the buried hole are drilled once and subjected to full copper electroplating, the buried hole is filled with the resin, and the board is ground by the abrasive belt, so that the risk of copper skin blistering caused by poor copper foil adhesion due to an excessively thin copper layer on the surface of the circuit board after board grinding by the abrasive belt is prevented, the problems of circuit board expansion and contraction and coefficient re-measurement for making the through hole caused by board grinding by the abrasive belt are improved, a technological process is simplified, the production efficiency is improved, and the production yield is increased.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, relate in particular to a kind of method that circuit board preventing resinous consent bubbles when electro-coppering.
Background technology
The application in PCB industry in recent years of the technique of filling holes with resin is more and more extensive, and the product high particularly in the number of plies, circuit board thickness is big enjoys favor more.
In prior art, circuit board containing filling holes with resin generally adopts following flow process to prepare: first make filling holes with resin, then sink copper plate electric makes the layers of copper of 7-11um, adopt plated hole flow process by enough for copper plating in hole again, through hole is made again after abrasive belt grinding, because table copper thickness can be ground off at least 6um by abrasive belt grinding process, and raw sheet electrolytic copper only has 7-11um, after abrasive belt grinding, plate electrolytic copper thickness is less than 5um, because plate electrolytic copper crosses thin, subsequent conditioning circuit plate can occur that Copper Foil adhesion is poor after being heated, and then cause the quality problem such as copper sheet foaming.After abrasive belt grinding, produce plate because of abrasive band meeting boost circuit plate, cause plate face harmomegathus, need to again survey coefficient when making outer layer boring, again practice shooting, become to produce long flow path, add workload.
Summary of the invention
For this, the present invention to solve above-mentioned technical problem just, thus proposing a kind of method that production procedure is short, technique simply prevents resinous match orifice plate electro-coppering from bubbling.
For solving above-mentioned technical problem, the technical scheme is that
The present invention provides a kind of method preventing resinous jack panel electro-coppering from bubbling, and it comprises the steps:
1), after core material and outer copper foil pressing, through hole and buried via hole are once got out；
2) the heavy copper of outer layer, metallize described through hole and buried via hole；
3) make masking hole dry film after electric plating of whole board, described through hole dry film is covered；
4) filling holes with resin, fills described buried via hole resin；
5) abrasive belt grinding, polishes the circuit board surface abrasive band after filling holes with resin；
6) take off except, after described dry film, carrying out the heavy copper of second time outer layer and second time electric plating of whole board.
As preferably, after carrying out described second time electric plating of whole board, circuit board surface copper thickness is 7-12 μm.
As preferably, described step 4) in by laying half tone, resin ink is carried out consent through half tone, the mesh radius more described buried via hole big 0.15mm of radius of described half tone.
As preferably, described step 4) after, baking sheet 1h at 150 DEG C.
As preferably, described step 6) after also include the step of outer-layer circuit graphic making, the etching of outer layer negative film.
As preferably, described step 3) in, the radius more described through hole big 0.15mm of radius of described masking hole dry film.
As preferably, described step 1) before also include core material and operation that outer copper foil sawing sheet, inner line figure make.
As preferably, described step 4) in the concretely comprising the following steps of filling holes with resin: the position without filling holes with resin is hidden with aluminium flake, half tone is positioned over the upper surface of described circuit board, resin ink is coated on described half tone, use cutter that described resin ink is carried out blade coating to bite, until described resin adhesive liquid infiltrates into the full described resin hole that need to fill in of filling from described half tone mesh.
As preferably, described step 4) in described cutter include scraper and ink knife, first by described scraper blade coating resin ink, then adopt the ink knife reverse blade coating resin ink to described scraper blade coating.
As preferably, the blade coating speed of described scraper is 50mm/s, and during blade coating resin ink, the pressure that described scraper is applied is 5-8kg, and the pressure that described ink knife is applied is 3-7kg, and the pressure that scraper is applied is more than the pressure that ink knife is applied；The angle of described scraper and circuit board surface is 50-70 °, and the thickness of described scraper is 15-25mm, shore hardness is 75-85 degree.
The technique scheme of the present invention has the advantage that the method preventing resinous jack panel electro-coppering from bubbling of the present invention compared to existing technology, once get out through hole and buried via hole simultaneously, then once by enough for copper plating in hole, abrasive belt grinding is carried out after resin plug buried via hole, prevent because after abrasive belt grinding, circuit board surface layers of copper is crossed thin and occurred that Copper Foil adhesion is poor, cause the risk that copper sheet bubbles, simultaneously, improve the circuit board harmomegathus because abrasive belt grinding causes, need to remeasure the problem that coefficient makes through hole, simplify technological process, improve production efficiency and produce yield.
Detailed description of the invention
In order to make present disclosure be more likely to be clearly understood, below according to specific embodiments of the invention, the present invention is further detailed explanation.
Embodiment 1
Present embodiments provide a kind of method preventing resinous jack panel electro-coppering from bubbling,
It is first according to required size and cuts out core material and outer copper foil, and adopting the line pattern that conventional method carries out core material to make, internal layer AOI detects, and what check internal layer circuit opens short-circuit conditions, and fault location is modified, then carry out following step:
1) after core material and outer copper foil pressing, once get out through hole and buried via hole, before pressing, carry out brown according to end copper copper thickness, vitrification point according to each laminate material selects suitable lamination to carry out pressing, utilizes borehole data to be got out together with buried via hole by through hole after pressing；
2) the heavy copper of outer layer, adopts the mode of the heavy copper of conventional chemical to make described through hole and buried via hole metallization, and through hole and the test of buried via hole backlight after metallization reach 9.5 grades；
3) electric plating of whole board, according to the copper in the enough through holes of the disposable plating of requirement of hole copper thickness and buried via hole, masking hole figure with 6 lattice or 21 exposure guide rule making through holes, and develop, produce masking hole dry film, described through hole dry film is covered, the radius more described through hole big 0.15mm of radius of described masking hole dry film；
null4) filling holes with resin，Described buried via hole resin is filled，Position without filling holes with resin is hidden with aluminium flake，Half tone is laid on surface on circuit boards，Described half tone offers mesh corresponding to the position of described buried via hole，The radius more described buried via hole big 0.15mm of radius of mesh，It is respectively adopted scraper and ink knife resin ink carries out blade coating to bite until described resin adhesive liquid infiltrates into the full described resin hole that need to fill in of filling from described half tone mesh，First with scraper blade coating resin ink，Then with the ink knife reverse blade coating resin ink to described scraper blade coating，Wherein，The blade coating speed of scraper is 50mm/s，During blade coating resin ink，The pressure that described scraper is applied is 5kg，The pressure that described ink knife is applied is 3kg，The angle of described scraper and circuit board surface is 50 °，The thickness of described scraper is 15mm、Shore hardness is 75 degree；After filling holes with resin, at 150 DEG C, baking sheet 1h makes resin solidify；
5) abrasive belt grinding, polishes the circuit board surface abrasive band after filling holes with resin；
6) taking off except, after described dry film, carrying out the heavy copper of second time outer layer and make the position metallization then second time electric plating of whole board of filling holes with resin, making circuit board surface copper thickness is 7 μm, meets the requirement that top layer copper is thick；
Adopt conventional method to carry out outer-layer circuit graphic making, the etching of outer layer negative film, form the final circuit needed, then carry out outer layer AOI detection, check opening short-circuit conditions and defect being made correction of outer circuit.
Prevent, described in the present embodiment, the method that resinous jack panel electro-coppering bubbles, once get out through hole and buried via hole simultaneously, then once by enough for copper plating in hole, abrasive belt grinding is carried out after resin plug buried via hole, prevent because after abrasive belt grinding, circuit board surface layers of copper crosses risk that is thin and that occur that Copper Foil adhesion is poor, cause copper sheet to bubble, meanwhile, improve the circuit board harmomegathus because abrasive belt grinding causes, need to remeasure the problem of coefficient making through hole, simplify technological process.
Embodiment 2
Present embodiments provide a kind of method preventing resinous jack panel electro-coppering from bubbling,
It is first according to required size and cuts out core material and outer copper foil, and adopting the line pattern that conventional method carries out core material to make, internal layer AOI detects, and what check internal layer circuit opens short-circuit conditions, and fault location is modified, then carry out following step:
1) after core material and outer copper foil pressing, once get out through hole and buried via hole, before pressing, carry out brown according to end copper copper thickness, vitrification point according to each laminate material selects suitable lamination to carry out pressing, utilizes borehole data to be got out together with buried via hole by through hole after pressing；
2) the heavy copper of outer layer, adopts the mode of the heavy copper of conventional chemical to make described through hole and buried via hole metallization, and through hole and the test of buried via hole backlight after metallization reach 9.5 grades；
3) electric plating of whole board, according to the copper in the enough through holes of the disposable plating of requirement of hole copper thickness and buried via hole, masking hole figure with 6 lattice or 21 exposure guide rule making through holes, and develop, produce masking hole dry film, described through hole dry film is covered, the radius more described through hole big 0.15mm of radius of described masking hole dry film；
null4) filling holes with resin，Described buried via hole resin is filled，Position without filling holes with resin is hidden with aluminium flake，Half tone is laid on surface on circuit boards，Described half tone offers mesh corresponding to the position of described buried via hole，The radius more described buried via hole big 0.15mm of radius of mesh，It is respectively adopted scraper and ink knife resin ink carries out blade coating to bite until described resin adhesive liquid infiltrates into the full described resin hole that need to fill in of filling from described half tone mesh，First with scraper blade coating resin ink，Then with the ink knife reverse blade coating resin ink to described scraper blade coating，Wherein，The blade coating speed of scraper is 50mm/s，During blade coating resin ink，The pressure that described scraper is applied is 8kg，The pressure that described ink knife is applied is 7kg，The angle of described scraper and circuit board surface is 70 °，The thickness of described scraper is 25mm、Shore hardness is 85 degree；After filling holes with resin, at 150 DEG C, baking sheet 1h makes resin solidify；
5) abrasive belt grinding, polishes the circuit board surface abrasive band after filling holes with resin；
6) taking off except, after described dry film, carrying out the heavy copper of second time outer layer and make the position metallization then second time electric plating of whole board of filling holes with resin, making circuit board surface copper thickness is 12 μm, meets the requirement that top layer copper is thick；
Adopt conventional method to carry out outer-layer circuit graphic making, the etching of outer layer negative film, form the final circuit needed, then carry out outer layer AOI detection, check opening short-circuit conditions and defect being made correction of outer circuit.
Embodiment 3
It is first according to required size and cuts out core material and outer copper foil, and adopting the line pattern that conventional method carries out core material to make, internal layer AOI detects, and what check internal layer circuit opens short-circuit conditions, and fault location is modified, then carry out following step:
1) after core material and outer copper foil pressing, once get out through hole and buried via hole, before pressing, carry out brown according to end copper copper thickness, vitrification point according to each laminate material selects suitable lamination to carry out pressing, utilizes borehole data to be got out together with buried via hole by through hole after pressing；
2) the heavy copper of outer layer, adopts the mode of the heavy copper of conventional chemical to make described through hole and buried via hole metallization, and through hole and the test of buried via hole backlight after metallization reach 9.5 grades；
3) electric plating of whole board, according to the copper in the enough through holes of the disposable plating of requirement of hole copper thickness and buried via hole, masking hole figure with 6 lattice or 21 exposure guide rule making through holes, and develop, produce masking hole dry film, described through hole dry film is covered, the radius more described through hole big 0.15mm of radius of described masking hole dry film；
null4) filling holes with resin，Described buried via hole resin is filled，Position without filling holes with resin is hidden with aluminium flake，Half tone is laid on surface on circuit boards，Described half tone offers mesh corresponding to the position of described buried via hole，The radius more described buried via hole big 0.15mm of radius of mesh，It is respectively adopted scraper and ink knife resin ink carries out blade coating to bite until described resin adhesive liquid infiltrates into the full described resin hole that need to fill in of filling from described half tone mesh，First with scraper blade coating resin ink，Then with the ink knife reverse blade coating resin ink to described scraper blade coating，Wherein，The blade coating speed of scraper is 50mm/s，During blade coating resin ink，The pressure that described scraper is applied is 6kg，The pressure that described ink knife is applied is 4kg，The angle of described scraper and circuit board surface is 60 °，The thickness of described scraper is 20mm、Shore hardness is 80 degree；After filling holes with resin, at 150 DEG C, baking sheet 1h makes resin solidify；
5) abrasive belt grinding, polishes the circuit board surface abrasive band after filling holes with resin；
6) taking off except, after described dry film, carrying out the heavy copper of second time outer layer and make the position metallization then second time electric plating of whole board of filling holes with resin, making circuit board surface copper thickness is 10 μm, meets the requirement that top layer copper is thick；
Adopt conventional method to carry out outer-layer circuit graphic making, the etching of outer layer negative film, form the final circuit needed, then carry out outer layer AOI detection, check opening short-circuit conditions and defect being made correction of outer circuit.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (10)
1. one kind prevents the method that resinous jack panel electro-coppering is bubbled, it is characterised in that comprise the steps:
1), after core material and outer copper foil pressing, through hole and buried via hole are once got out；
2) the heavy copper of outer layer, metallize described through hole and buried via hole；
3) make masking hole dry film after electric plating of whole board, described through hole dry film is covered；
4) filling holes with resin, fills described buried via hole resin；
5) abrasive belt grinding, polishes the circuit board surface abrasive band after filling holes with resin；
6) take off except, after described dry film, carrying out the heavy copper of second time outer layer and second time electric plating of whole board.
2. the method preventing resinous jack panel electro-coppering from bubbling according to claim 1, it is characterised in that after carrying out described second time electric plating of whole board, circuit board surface copper thickness is 7-12 μm.
3. the method preventing resinous jack panel electro-coppering from bubbling according to claim 1 and 2, it is characterized in that, described step 4) in by laying half tone, resin ink is carried out consent through half tone, the mesh aperture more described buried via hole big 0.15mm of radius of described half tone.
4. the method preventing resinous jack panel electro-coppering from bubbling according to claim 3, it is characterised in that described step 4) after, baking sheet 1h at 150 DEG C.
5. the method preventing resinous jack panel electro-coppering from bubbling according to claim 4, it is characterised in that described step 6) after also include outer-layer circuit graphic making, outer layer negative film etching step.
6. the method preventing resinous jack panel electro-coppering from bubbling according to claim 5, it is characterised in that described step 3) in, the radius more described through hole big 0.15mm of radius of described masking hole dry film.
7. the method preventing resinous jack panel electro-coppering from bubbling according to claim 6, it is characterised in that described step 1) also include core material and the operation of outer copper foil sawing sheet, inner line figure making before.
8. the method preventing resinous jack panel electro-coppering from bubbling according to claim 7, it is characterized in that, described step 4) in the concretely comprising the following steps of filling holes with resin: the position without filling holes with resin is hidden with aluminium flake, half tone is positioned over the upper surface of described circuit board, resin ink is coated on described half tone, use cutter that described resin adhesive liquid is carried out blade coating to bite, until described resin adhesive liquid infiltrates into the full described resin hole that need to fill in of filling from described half tone mesh.
9. the method preventing resinous jack panel electro-coppering from bubbling according to claim 8, it is characterized in that, described step 4) in described cutter include scraper and ink knife, first by described scraper blade coating resin ink, then adopt the ink knife reverse blade coating resin ink to described scraper blade coating.
10. the method preventing resinous jack panel electro-coppering from bubbling according to claim 9, it is characterized in that, the blade coating speed of described scraper is 50mm/s, during blade coating resin ink, the pressure that described scraper is applied is 5-8kg, the pressure that described ink knife is applied is 3-7kg, and the pressure that scraper is applied is more than the pressure that ink knife is applied；The angle of described scraper and circuit board surface is 50-70 °, and the thickness of described scraper is 15-25mm, shore hardness is 75-85 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610164562.9A CN105792519A (en) | 2016-03-22 | 2016-03-22 | Method for preventing blistering of electroplating copper of resin-filled board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610164562.9A CN105792519A (en) | 2016-03-22 | 2016-03-22 | Method for preventing blistering of electroplating copper of resin-filled board |
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| CN105792519A true CN105792519A (en) | 2016-07-20 |
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| CN201610164562.9A Pending CN105792519A (en) | 2016-03-22 | 2016-03-22 | Method for preventing blistering of electroplating copper of resin-filled board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
| CN110430689A (en) * | 2019-07-18 | 2019-11-08 | 宁波华远电子科技有限公司 | A kind of production method of thin plate through-hole dual-side ink |
| CN112188734A (en) * | 2020-09-15 | 2021-01-05 | 广州兴森快捷电路科技有限公司 | Resin hole plugging method |
| CN112351587A (en) * | 2020-10-20 | 2021-02-09 | 江西强达电路科技有限公司 | Grinding-free resin plug hole PCB manufacturing process |
| CN112672510A (en) * | 2020-12-07 | 2021-04-16 | 高德（无锡）电子有限公司 | Processing method for resin hole plugging of ultrathin printed circuit rigid-flex board |
| CN114269074A (en) * | 2021-12-14 | 2022-04-01 | 生益电子股份有限公司 | Circuit board and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
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| CN112351587A (en) * | 2020-10-20 | 2021-02-09 | 江西强达电路科技有限公司 | Grinding-free resin plug hole PCB manufacturing process |
| CN112672510A (en) * | 2020-12-07 | 2021-04-16 | 高德（无锡）电子有限公司 | Processing method for resin hole plugging of ultrathin printed circuit rigid-flex board |
| CN114269074A (en) * | 2021-12-14 | 2022-04-01 | 生益电子股份有限公司 | Circuit board and preparation method thereof |
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Application publication date: 20160720 |
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