CN104918416A - Circuit board resistance welding processing method and external-layer ultra-thick copper circuit board - Google Patents
Circuit board resistance welding processing method and external-layer ultra-thick copper circuit board Download PDFInfo
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- CN104918416A CN104918416A CN201410088266.6A CN201410088266A CN104918416A CN 104918416 A CN104918416 A CN 104918416A CN 201410088266 A CN201410088266 A CN 201410088266A CN 104918416 A CN104918416 A CN 104918416A
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Abstract
The invention discloses a circuit board resistance welding processing method and an external-layer ultra-thick copper circuit board, for solving the technical problems of printing ink bubbles, printing ink disengagement and the like existing during resistance welding processing on an external-layer ultra-thick copper circuit board in the prior art. The method can comprises the following steps: pressing an insulation layer on the surface of a circuit board to enable the line gap of an external-layer ultra-thick copper line of the circuit board to be filled and leveled up by the insulation layer; performing surface processing to enable the external-layer ultra-thick copper line to be exposed on the surface of the circuit board and enable the insulation layer in the line gap to be flush with the surface of the external-layer ultra-thick copper line; thickening the external-layer ultra-thick copper line, wherein the thickness of a thickening layer is 0.5OZ to 1.5OZ; and arranging a solder resist in the line gap between the thickening layer.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of circuit board resistance welding processing method and outer super-thick copper circuit board.
Background technology
The thickness of its outer-layer circuit layer of outer super-thick copper circuit board reaches 15 ounces of (OZ, 1OZ approximates 0.035 millimeter) or more, welding resistance is carried out to it and adds man-hour, general needs carry out repeatedly silk-screen, such as more than 6 times, the certain thickness solder resist of each silk-screen, until the gap of outer-layer circuit layer is filled and led up by solder resist.
But this technique has following defect: because the drop of circuit and base material is comparatively large, that is, trace clearance is comparatively dark, causes the bubble in the solder resist such as ink printed not overflow completely, easily occurs bubbles of ink; Because ink is too thick, follow-uply ink can not to be exposed completely, so easily there is the problem that ink comes off; Further, silk-screen number of times is more, complicated operation.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board resistance welding processing method and outer super-thick copper circuit board, carries out welding resistance add the technical problems such as the bubbles of ink, the ink that exist man-hour come off to solve in prior art to outer super-thick copper circuit board.
First aspect present invention provides a kind of circuit board resistance welding processing method, comprising:
At circuit board surface pressing insulating barrier, the trace clearance of the outer super-thick copper circuit of described circuit board is filled and led up by described insulating barrier;
Carry out surface treatment, make described outer super-thick copper circuit be revealed in circuit board surface, and insulating barrier in described trace clearance is concordant with described outer super thick copper wire surface;
Described outer super-thick copper circuit plating is thickened, and the thickness of thickening layer is 0.5OZ to 1.5OZ;
In trace clearance between described thickening layer, solder resist is set.
Second aspect present invention provides a kind of outer super-thick copper circuit board, comprising:
Internal layer multi-layer sheet and the outer super-thick copper circuit being formed in described internal layer multi-layer sheet surface, insulating barrier and solder resist is filled with in the trace clearance of described outer super-thick copper circuit, wherein, described insulating barrier is positioned at the middle and lower part of trace clearance, described solder resist is positioned at the top of trace clearance, and the thickness of described solder resist is 0.5OZ to 1.5OZ.
Therefore, in embodiment of the present invention technical scheme, by at circuit board surface pressing insulating barrier, the trace clearance of outer super-thick copper circuit is filled and led up, then the outer super-thick copper circuit plating revealed is thickened 0.5OZ to 1.5OZ, like this, carry out welding resistance and add man-hour, only need the solder resist that 0.5OZ to 1.5OZ thickness is set in the trace clearance between thickening layer, and for the thickness of 0.5OZ to 1.5OZ, only need a silk-screen, simple to operate, and there will not be the problems such as bubbles of ink and ink come off.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of a kind of circuit board resistance welding processing method that the embodiment of the present invention provides;
Fig. 2 a to 2g is the schematic diagram in each process segment when adopting embodiment of the present invention method making circuit board.Embodiment
The embodiment of the present invention provides a kind of circuit board resistance welding processing method and outer super-thick copper circuit board, carries out welding resistance add the technical problems such as the bubbles of ink, the ink that exist man-hour come off to solve in prior art to outer super-thick copper circuit.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of circuit board resistance welding processing method, can comprise:
110, at circuit board surface pressing insulating barrier, the trace clearance of the outer super-thick copper circuit of described circuit board is filled and led up by described insulating barrier.
In the embodiment of the present invention, said circuit board is outer super-thick copper circuit board, and this circuit board comprises internal layer multi-layer sheet and is formed in the outer super-thick copper circuit on internal layer multi-layer sheet two sides.Wherein, internal layer multi-layer sheet includes the line layer of at least one layer thickness at below 2OZ, and the thickness of outer super-thick copper circuit, generally can at more than 15OZ at least at more than 12OZ.
In a kind of execution mode, as shown in Figure 2 a, this outer super-thick copper circuit board can be obtained in the following way: in two sides all pressing super-thick copper layers of foil 30 of internal layer multi-layer sheet 20, described internal layer multi-layer sheet 20 comprises at least one deck internal layer circuit layer 21, the thickness of described super-thick copper layers of foil 30 is more than or equal to 15OZ, and the logicalnot circuit graphics field of the inner surface of described super-thick copper layers of foil 30 is subtracted thick by etching in advance; After pressing, then the etching of the logicalnot circuit graphics field of the outer surface of described super-thick copper layers of foil 30 is removed, namely form outer super-thick copper circuit 31; Thus obtained outer super-thick copper circuit board, as shown in Figure 2 b.
Wherein, the logicalnot circuit graphics field of the inner surface of described super-thick copper layers of foil 30 is subtracted thick thickness by etching in advance can about 1/3rd of the gross thickness of super-thick copper layers of foil, and such as, for the super-thick copper layers of foil of 15OZ thickness, etching subtracts thick thickness and can be 5OZ; Then, after pressing, from another side, remaining 10OZ etching is removed, namely obtains the outer super-thick copper circuit that required thickness is 15OZ or more.
In some embodiments of the invention, consider the impact of subsequent processing operations, large 0.1 millimeter of thickness of the comparable final needs of thickness of the outer super-thick copper circuit of the super-thick copper circuit board provided.
In this step, at circuit board surface pressing insulating barrier, the trace clearance of the outer super-thick copper circuit of described circuit board is filled and led up by described insulating barrier.In some embodiments of the invention, said insulating barrier can adopt prepreg (i.e. PP sheet).Due to the mobility of PP sheet, can not as outermost layer when pressing.Therefore, in some embodiments of the invention, as shown in Figure 2 c, saidly can to comprise at circuit board surface pressing insulating barrier: all pressing insulating barrier 41 respectively on the two sides of circuit board, block sheet 42 and false central layer 43; After pressing completes, described in removal, block sheet 42 and false central layer 43.
Wherein, saidly block sheet and false central layer plays assisted compression effect, only in bonding processes as outermost layer, prevent the prepreg as insulating barrier from flowing everywhere, and utilize false central layer to improve the profile pattern of the whole plate of circuit board after pressing.After pressing, prepreg is cured as insulating barrier, can remove and block sheet and false central layer.Said false central layer is the insulation board with certain degree of hardness, can be glass mat or glass fiber resin plate, the such as insulation board of FR4 material.In some execution modes, the etching of the copper foil layer on double face copper two sides can be removed, the insulating barrier in the middle of retaining is as this false central layer.The said sheet 42 that blocks is used for preventing insulating barrier 41 and false central layer 43 from boning, and double faced adhesive tape or Teflon can be adopted as blocking sheet 42.
After pressing, as shown in Figure 2 d, the trace clearance between outer super-thick copper circuit 31 fill by insulating barrier 41, and due to the mobility of prepreg, the upper surface of outer super-thick copper circuit 31 all can be coated in insulating barrier 41, and can not reveal.
120, carry out surface treatment, make described outer super-thick copper circuit be revealed in circuit board surface, and insulating barrier in described trace clearance is concordant with described outer super thick copper wire surface.
In this step, the dark miller skill of control can be adopted to carry out surface treatment to circuit board, comprising: carry out respectively on the two sides of circuit board controlling dark milling, the insulating barrier 41 on described circuit board two sides is subtracted thick, until described outer super-thick copper circuit 31 reveals, as shown in Figure 2 e.Circuit board after surface treatment, its outer super-thick copper circuit 31 is revealed in circuit board surface, and insulating barrier 41 in described trace clearance is concordant with described outer super-thick copper circuit 31 surface.
After surface treatment, if necessary, Drilling operation can be carried out to circuit board, process required various vias on circuit boards.
130, described outer super-thick copper circuit plating is thickened, and the thickness of thickening layer is 0.5OZ to 1.5OZ.
As shown in figure 2f, in this step, heavy copper and plating are carried out to circuit board, on the one hand, all form one deck electrodeposited coating 50 on the two sides of circuit board, on the other hand, by processed various via metallization.In the present embodiment, the thickness being preferably the electrodeposited coating 50, h of h at circuit board surface formation thickness should be more than or equal to 0.5OZ, but is less than or equal to 1.5OZ, and h generally can be selected to equal 1OZ.
Subsequently; outer graphics technique can be adopted; by the line pattern region (i.e. the region of outer super-thick copper circuit 31) of superficies and the position of via; with etchant resist protection, then etch, the etching of the electrodeposited coating of logicalnot circuit graphics field is removed; finally; above outer super-thick copper circuit 31, only form one deck plating thickening layer 51, and the thickness of this thickening layer is between 0.5OZ to 1.5OZ, as shown in Figure 2 g.
As can be seen from Fig. 2 g, in described circuit board, the overwhelming majority of outer super-thick copper circuit 31 is all embedded among insulating barrier 31, and the part that surface exposes is only the thickening layer 51 of thickness between 0.5OZ to 1.5OZ, that is, the outer-layer circuit of thick with ordinary copper circuit board is identical.
140, in the trace clearance between described thickening layer, solder resist is set.
In this step, carry out welding resistance processing at the superficies of circuit board.The overwhelming majority due to outer super-thick copper circuit 31 is all embedded among insulating barrier 31, surface only exposes the thickening layer 51 of thickness between 0.5OZ to 1.5OZ, the outer-layer circuit of the circuit board thick with ordinary copper is identical, therefore, in this step, private network typography can be adopted to print solder resist at circuit board surface, and, only need one-step print, the solder resist of adequate thickness (0.5OZ to 1.5OZ) can be printed in the trace clearance between thickening layer 51.After printing, can adopt conventional curing process, such as exposure technology etc., solidify solder resist.
Due to only silk-screen once, and the thickness of solder resist is no more than 1.5OZ, therefore: the bubble in solder resist such as ink can easily be overflowed, and is not easy to occur bubbles of ink; Ink can be exposed completely, is fixed on circuit board surface firmly, is not easy the problem occurring that ink comes off.
To sum up, embodiments provide a kind of circuit board resistance welding processing method, for outer super-thick copper circuit board, by at circuit board surface pressing insulating barrier, the trace clearance of outer super-thick copper circuit is filled and led up, then the outer super-thick copper circuit plating revealed is thickened 0.5OZ to 1.5OZ, like this, carry out welding resistance and add man-hour, drop between outer-layer circuit and base material is between 0.5OZ to 1.5OZ, only need the solder resist that 0.5OZ to 1.5OZ thickness is set, and for the thickness of 0.5OZ to 1.5OZ, only need a silk-screen, simple to operate, there will not be the problems such as bubbles of ink and ink come off.
In addition, insulating barrier is filled owing to adopting collectivization to be pressed together in the gap of outer super-thick copper circuit, again by controlling the technology that dark milling makes outer super-thick copper circuit reveal, alignment issues can be considered, the filling completely to trace clearance can be realized, the relatively technology of not silk-screen resin filling trace clearance, there will not be because the calamitous leak problem that causes is forbidden in contraposition, there will not be and do not add because trace clearance is completely filled the follow-up welding resistance caused the solder mask air bubble problem occurred man-hour.
Embodiment two,
Please refer to Fig. 2 g, the embodiment of the present invention provides a kind of outer super-thick copper circuit board, comprising:
Internal layer multi-layer sheet 20 and the outer super-thick copper circuit 31 being formed in described internal layer multi-layer sheet surface, insulating barrier 41 is filled with in the trace clearance of described outer super-thick copper circuit, wherein, described insulating barrier is positioned at the middle and lower part of trace clearance, 0.5OZ to 1.5OZ lower than the surface of described outer super-thick copper circuit 31.
In some execution modes, also can be filled with in the trace clearance of outer super-thick copper circuit 31 be positioned at insulating barrier 41 upper surface, thickness is the solder resist of 0.5OZ to 1.5OZ.
Wherein, the thickness of described outer super-thick copper circuit 31 can be more than or equal to 12 Ο Ζ, or is more than or equal to 15 Ο Ζ.Described internal layer multi-layer sheet 20 comprises at least one deck internal layer circuit layer 21, and the thickness of described internal layer circuit layer 21 is less than or equal to 2 Ο Ζ.
To sum up, embodiments provide a kind of outer super-thick copper circuit board, insulating barrier is filled with in the trace clearance of its outer super-thick copper circuit, and low a little 0.5OZ to the 1.5OZ of the Thickness Ratio circuit surface of insulating barrier, like this, carry out welding resistance and add man-hour, drop between outer-layer circuit and base material is between 0.5OZ to 1.5OZ, only need the solder resist that 0.5OZ to 1.5OZ thickness is set, and for the thickness of 0.5OZ to 1.5OZ, only need a silk-screen, simple to operate, there will not be the problems such as bubbles of ink and ink come off.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The circuit board resistance welding processing method provided the embodiment of the present invention above and outer super-thick copper circuit board are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (10)
1. a circuit board resistance welding processing method, is characterized in that, comprising:
At circuit board surface pressing insulating barrier, the trace clearance of the outer super-thick copper circuit of described circuit board is filled and led up by described insulating barrier;
Carry out surface treatment, make described outer super-thick copper circuit be revealed in circuit board surface, and insulating barrier in described trace clearance is concordant with described outer super thick copper wire surface;
Described outer super-thick copper circuit plating is thickened, and the thickness of thickening layer is 0.5OZ to 1.5OZ;
In trace clearance between described thickening layer, solder resist is set.
2. method according to claim 1, is characterized in that, described before circuit board surface pressing insulating barrier, also comprises:
In the multiple-plate two sides of internal layer all pressing super-thick copper layers of foil, described internal layer multi-layer sheet comprises at least one deck internal layer circuit layer, the thickness of described super-thick copper layers of foil is more than or equal to 15OZ, and the logicalnot circuit graphics field of the inner surface of described super-thick copper layers of foil is subtracted thick by etching in advance;
The etching of the logicalnot circuit graphics field of the outer surface of described super-thick copper layers of foil is removed, forms outer super-thick copper circuit, obtain the circuit board with outer super-thick copper circuit.
3. method according to claim 1, is characterized in that, describedly comprises at circuit board surface pressing insulating barrier:
At the two sides of circuit board difference all pressing insulating barriers, block sheet and false central layer;
After pressing completes, described in removal, block sheet and false central layer.
4. method according to claim 1, is characterized in that, described in carry out surface treatment and comprise:
Carry out respectively on the two sides of circuit board controlling dark milling, the insulating barrier on described circuit board two sides is subtracted thick, until described outer super-thick copper circuit reveals.
5. method according to claim 1, is characterized in that, described described outer super-thick copper circuit plating being thickened comprises:
Heavy copper and plating are carried out to described circuit board, all forms on the two sides of described circuit board the coating that thickness is 0.5OZ to 1.5OZ respectively;
Adopt etch process to be removed by the coating of logicalnot circuit graphics field, described outer super-thick copper circuit retains one deck coating as thickening layer.
6. method according to claim 1, is characterized in that, described described outer super-thick copper circuit plating is thickened before also comprise:
Via processed by described circuit board.
7. method according to claim 1, is characterized in that, arranges solder resist and comprise in described trace clearance between described thickening layer:
Adopt silk-screen printing technique, print solder resist in the trace clearance between the thickening layer on described circuit board surface, and described solder resist is solidified.
8. an outer super-thick copper circuit board, is characterized in that, comprising:
Internal layer multi-layer sheet and the outer super-thick copper circuit being formed in described internal layer multi-layer sheet surface, insulating barrier and solder resist is filled with in the trace clearance of described outer super-thick copper circuit, wherein, described insulating barrier is positioned at the middle and lower part of trace clearance, described solder resist is positioned at the top of trace clearance, and the thickness of described solder resist is 0.5OZ to 1.5OZ.
9. circuit board according to claim 8, is characterized in that:
The thickness of described outer super-thick copper circuit is more than or equal to 15 Ο Ζ.
10. circuit board according to claim 8, is characterized in that:
Described internal layer multi-layer sheet comprises at least one deck internal layer circuit layer, and the thickness of described internal layer circuit layer is less than or equal to 2 Ο Ζ.
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| CN201410088266.6A CN104918416B (en) | 2014-03-11 | 2014-03-11 | Circuit board resistance welding processing method and outer layer super thick copper circuit board |
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| WO2017168342A1 (en) * | 2016-03-31 | 2017-10-05 | At&S (China) Co. Ltd. | Component embedding in thinner core using dielectric sheet |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110831339A (en) * | 2019-11-14 | 2020-02-21 | 江苏上达电子有限公司 | Graphic design method for avoiding ink bubbles |
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
| CN113056100A (en) * | 2021-02-26 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Manufacturing method of high-precision buried conductive carbon oil resistor printed circuit board |
| US11116083B2 (en) | 2016-03-31 | 2021-09-07 | At&S (China) Co. Ltd. | Electronic component embedded by laminate sheet |
| CN114143959A (en) * | 2021-11-19 | 2022-03-04 | 苏州浪潮智能科技有限公司 | PCB for improving impedance stability of outer layer circuit, and implementation method and device |
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| CN113056100A (en) * | 2021-02-26 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Manufacturing method of high-precision buried conductive carbon oil resistor printed circuit board |
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