CN114143959A - A PCB, realization method and device for improving the impedance stability of outer layer lines - Google Patents
A PCB, realization method and device for improving the impedance stability of outer layer lines Download PDFInfo
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- CN114143959A CN114143959A CN202111399580.2A CN202111399580A CN114143959A CN 114143959 A CN114143959 A CN 114143959A CN 202111399580 A CN202111399580 A CN 202111399580A CN 114143959 A CN114143959 A CN 114143959A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000010410 layer Substances 0.000 claims abstract description 194
- 229920005989 resin Polymers 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 79
- 239000002344 surface layer Substances 0.000 claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 19
- 238000005553 drilling Methods 0.000 claims description 25
- 238000009713 electroplating Methods 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 239000004840 adhesive resin Substances 0.000 claims description 10
- 229920006223 adhesive resin Polymers 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 8
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
本发明提供一种提升外层线路阻抗稳定性的PCB、实现方法及装置，属于PCB设计加工技术领域，所述PCB包括至少一个PCB芯板；最上层PCB芯板的上表面，以及最下层PCB芯板的下表面均设有PCB表层；至少一个PCB表层的外表面设有凸起的PCB线路，PCB线路之间设置有树脂层，各PCB线路与各树脂层形成齐平的一体化线路树脂层；一体化线路树脂层的外表面设置有绿油层。本发明通过更改原有PCB芯板的层叠结构，PCB线路上线铺设半固化片形成树脂层后，再设置绿油层，避免了绿油流动带来的PCB线路顶部和侧壁厚度不均匀的问题，提高了PCB线路阻抗的稳定性，进而提升信号传输质量。
The invention provides a PCB, a realization method and a device for improving the impedance stability of an outer layer, belonging to the technical field of PCB design and processing. The PCB includes at least one PCB core board; the upper surface of the uppermost PCB core board; and the lowermost PCB The lower surface of the core board is provided with a PCB surface layer; the outer surface of at least one PCB surface layer is provided with a raised PCB circuit, a resin layer is arranged between the PCB circuits, and each PCB circuit and each resin layer form a flush integrated circuit resin layer; the outer surface of the integrated circuit resin layer is provided with a green oil layer. In the present invention, the layered structure of the original PCB core board is changed. After the prepreg is laid on the PCB line to form the resin layer, the green oil layer is arranged, so as to avoid the problem of uneven thickness of the top and side walls of the PCB circuit caused by the flow of green oil, and improve the performance of the circuit. The stability of PCB line impedance, thereby improving the quality of signal transmission.
Description
Technical Field
The invention belongs to the technical field of PCB design and processing, and particularly relates to a PCB for improving impedance stability of an outer layer circuit, and an implementation method and device thereof.
Background
In the fields of communication and server lamps, signal transmission requirements are required, a signal transmission instruction is a key factor, for example, in service, a large number of long high-speed signal lines exist on the surface layer of a PCB, and the signal transmission instruction of the high-speed signal lines is influenced by many factors, such as copper thickness, line width, roughness of a circuit, thickness of green oil behind a dielectric layer between a first layer and a second layer and the like on the circuit.
The green oil on the surface layer of the PCB is printed by a screen printing method, and is exposed and polymerized to develop the unnecessary green oil to leak the copper bonding pad to be welded, and the copper circuit not to be welded is covered with the green oil to prevent oxidation. However, the green oil has certain fluidity, and after the green oil is screened on the line, because the line has certain height, the green oil at the top of the line and the green oil at the corner of the side wall have inconsistent thickness, and the green oil at the top of the line is thicker than the green oil at the corner of the line generally. Uneven thickness of the green oil on the line can cause unstable impedance of the line, and further cause unstable loss of signals in the process of transmission on the line.
Therefore, it is very necessary to provide a PCB, a method and an apparatus for implementing the PCB to improve the impedance stability of the outer layer circuit.
Disclosure of Invention
Aiming at the defect that the green oil on the surface layer of the PCB circuit in the prior art has the characteristic of fluidity, so that the green oil on the top of the circuit is thicker than the ink on a corner, and the impedance stability and the signal transmission quality of the circuit are further influenced, the invention provides the PCB for improving the impedance stability of an outer layer circuit, and the implementation method and the device thereof, so as to solve the technical problems.
In a first aspect, the present invention provides a PCB for improving the impedance stability of an outer layer circuit, comprising at least one PCB core board;
the upper surface of the uppermost layer PCB core board and the lower surface of the lowermost layer PCB core board are both provided with PCB surface layers;
at least one PCB surface layer is provided with a raised PCB circuit, a resin layer is arranged between the PCB circuits, and the PCB circuits and the resin layer form a flush integrated circuit resin layer;
the outer surface of integration circuit resin layer is provided with green oil layer.
Further, the outer surface of the PCB circuit is also provided with an electroplated layer, and the height of the electroplated layer is equal to that of the PCB circuit and the height of the resin layer. The purpose of the plating layer is to prevent the PCB lines from being oxidized, and the thickness of the plating layer is negligible with respect to the height of the PCB lines.
Furthermore, the section of the PCB circuit in the direction perpendicular to the extending direction of the PCB circuit is trapezoidal;
the resin layer between adjacent PCB circuit is the trapezoidal of falling.
Furthermore, when the number of the PCB core boards is at least two, a pressing layer is arranged between the adjacent PCB core boards;
the PCB surface layer on the upper surface of the uppermost PCB core board is a PCB top layer;
the PCB surface layer of the lower surface of the lowest PCB core board is a PCB bottom layer.
Furthermore, the resin layer is a prepreg resin layer, and the prepreg is formed by melting at high temperature.
Furthermore, the PCB circuit adopts a copper foil material, and the thickness of the copper foil is larger than the set thickness.
Further, the copper foil has a thickness of more than 0.05 mm.
In a second aspect, the present invention provides a PCB implementation method for improving impedance stability of an outer layer circuit, including the following steps:
s1, manufacturing a PCB core board, and arranging a PCB circuit on the PCB core board;
s2, arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the surface layer of the PCB with the PCB circuit, and sticking release paper on the outer surface of the prepreg;
s3, carrying out hot melting and laminating on the arranged PCB core boards to form a PCB circuit board, forming a laminating layer by bonding resin, and forming an integrated circuit resin layer by the prepreg and the PCB circuit;
and S4, tearing off the release paper, drilling and electroplating the PCB, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer. The release paper and the prepreg do not react when being pressed and can be easily torn off.
Further, before the prepreg is disposed in step S2, a slot needs to be formed at the prepreg corresponding position according to the pattern of the PCB circuit. The purpose of the groove is to reserve the shape of a PCB circuit on the prepreg, so that the formed integrated circuit resin layer is smooth, and the depth of the groove is set according to the flowing capacity of the adopted prepreg resin.
Further, the step S4 specifically includes the following steps:
s41, tearing off release paper on the outer surface of the integrated circuit resin layer;
s42, judging whether drilling is needed to be carried out on the PCB or not, and carrying out drilling processing when drilling is needed;
s43, electroplating the PCB in the integrated circuit resin layer;
and S44, printing ink on the surface of the integrated circuit resin layer, and setting a green oil layer. The purpose of plating is to prevent oxidation of the PCB traces, and the plating thickness is negligible relative to the PCB trace thickness.
In a third aspect, a PCB implementation apparatus for improving impedance stability of an outer layer circuit is provided, including:
the PCB core board manufacturing module is used for manufacturing a PCB core board, and PCB circuits are arranged on the PCB core board;
the PCB core board arrangement module is used for arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the surface layer of the PCB with the PCB circuit, and pasting release paper on the outer surface of the prepreg;
the laminating module is used for carrying out hot melting laminating on the arranged PCB core boards to form a PCB circuit board, bonding resin forms a laminating layer, and the prepreg and the PCB circuit form an integrated circuit resin layer;
and the PCB circuit board processing module is used for tearing off release paper, drilling and electroplating the PCB circuit board, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer.
Further, the PCB circuit board processing module comprises:
the release paper stripping unit is used for tearing off the release paper on the outer surface of the integrated circuit resin layer;
the drilling processing unit is used for judging whether drilling is needed to be carried out on the PCB or not and carrying out drilling processing when drilling is needed;
the electroplating processing unit is used for electroplating the PCB circuit in the integrated circuit resin layer;
and the green oil setting unit is used for printing ink on the surface of the integrated circuit resin layer and setting a green oil layer.
The invention has the beneficial effects that:
according to the PCB for improving the impedance stability of the outer layer circuit, the implementation method and the device, the original laminated structure of the PCB core board is changed, the green oil layer is arranged after the semi-solidified sheet is laid on the PCB circuit to form the resin layer, the problem of uneven thickness of the top and the side wall of the PCB circuit caused by green oil flowing is solved, the impedance stability of the PCB circuit is improved, and the signal transmission quality is further improved.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a PCB structure for improving impedance stability of an outer layer circuit according to the present invention.
FIG. 2 is a first flowchart of the method of the present invention.
FIG. 3 is a second schematic flow chart of the method of the present invention.
FIG. 4 is a schematic diagram of a PCB implementation apparatus for improving impedance stability of an outer layer circuit according to the present invention.
Fig. 5 is a schematic diagram of a prior art PCB structure.
In the figure, 1-PCB core board; 2-PCB circuit; 3-a resin layer; 4-green oil layer; 5-a lamination layer; 6-manufacturing a module by using the PCB core board; 7-PCB core board arrangement module; 8-pressing a module; 9-PCB circuit board processing module; l1-top layer of PCB; L2-PCB second layer; L3-PCB third layer; L4-PCB fourth layer; L5-PCB fifth layer; L6-PCB sixth layer; l7-seventh layer of PCB; L8-PCB bottom layer.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
as shown in fig. 1, the present invention provides a PCB for improving the impedance stability of an outer layer circuit, which includes at least one PCB core board 1;
the upper surface of the uppermost layer PCB core board 1 and the lower surface of the lowermost layer PCB core board 1 are both provided with PCB surface layers;
at least one PCB surface layer is provided with raised PCB circuits 2, a resin layer 3 is arranged between the PCB circuits 2, and the PCB circuits 2 and the resin layer 3 form a flush integrated circuit resin layer;
a green oil layer 4 is arranged on the outer surface of the integrated circuit resin layer; the evenness of integration circuit resin layer guarantees that green oil reservoir 4 thickness is even.
Example 2:
the traditional inner layer PCB core board is characterized in that an outer layer copper foil is arranged in a mode shown in figure 5, six inner layer PCB layers are formed by three PCB core boards, a PCB top layer and a PCB bottom layer are formed by two outer layer copper foils, PCB circuits are laid on the PCB top layer and the PCB bottom layer, and then green oil is laid on the PCB circuits in a screen printing mode.
In order to solve the above problems, the present invention provides a PCB for improving the impedance stability of an outer layer circuit, as shown in fig. 1, including four PCB core boards 1;
each PCB core board 1 comprises an upper surface and a lower surface, and the four PCB core boards 1 are sequentially provided with a PCB top layer L1, a PCB second layer L2, a PCB third layer L3, a PCB fourth layer L4, a PCB fifth layer L5, a PCB sixth layer L6, a PCB seventh layer L7 and a PCB bottom layer L8 from top to bottom;
a pressing layer 5 is arranged between the adjacent PCB core boards 1;
the upper surface of the uppermost layer PCB core board 1 and the lower surface of the lowermost layer PCB core board 1 are both provided with PCB surface layers; the PCB top layer L1 and the PCB bottom layer L8 are PCB surface layers;
the PCB top layer L1 and the PCB bottom layer L8 are PCB surface layers provided with raised PCB circuits 2, resin layers 3 are arranged between the PCB circuits 2, and the PCB circuits 2 and the resin layers 3 form a flush integrated circuit resin layer; the outer surface of the PCB circuit 2 is also provided with an electroplated layer, the height of the electroplated layer is equal to that of the PCB circuit 2 and the height of the electroplated layer is equal to that of the resin layer 3, the purpose of electroplating is to prevent the PCB circuit 2 from being oxidized, and the thickness of the electroplated layer can be ignored relative to the thickness of the PCB circuit; the resin layer 3 is a prepreg resin layer and is formed by melting the prepreg at high temperature; the PCB circuit 2 is made of copper foil, and the thickness of the copper foil is greater than the set thickness by 0.05 mm;
a green oil layer 4 is arranged on the outer surface of the integrated circuit resin layer; the flatness of the integrated circuit resin layer ensures that the thickness of the green oil layer 4 is uniform;
the section of the PCB circuit 2 of the PCB top layer L1 in the direction perpendicular to the extending direction of the PCB circuit 2 is trapezoidal;
the resin layer between the adjacent PCB circuits 2 is in an inverted trapezoid shape;
the PCB circuit 2 of the PCB bottom layer L8 is in a reversed trapezoid shape on the section vertical to the extending direction of the PCB circuit 2;
the resin layer between adjacent PCB lines 2 is trapezoidal.
In the above embodiment 2, the PCB circuit 2 is formed by electroplating the pattern of the PCB circuit 2 by using a method of copper foil thickness not greater than 0.05mm, and finally, by using a pressed film exposure development electroplating method on the surface layer of the PCB, the deficiency of the copper foil thickness is compensated.
Example 3:
as shown in fig. 2, the present invention provides a PCB implementation method for improving impedance stability of an outer layer circuit, including the following steps:
s1, manufacturing a PCB core board, and arranging a PCB circuit on the PCB core board;
s2, arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the surface layer of the PCB with the PCB circuit, and sticking release paper on the outer surface of the prepreg;
s3, carrying out hot melting and laminating on the arranged PCB core boards to form a PCB circuit board, forming a laminating layer by bonding resin, and forming an integrated circuit resin layer by the prepreg and the PCB circuit;
and S4, tearing off the release paper, drilling and electroplating the PCB, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer.
Example 4:
as shown in fig. 5, the conventional PCB structure adopts an inner layer PCB core board and an outer layer copper foil, after the inner layer PCB core board and the outer layer PCB top layer and the outer layer PCB bottom layer as the copper foils are laminated, the PCB core boards and the top layer PCB core board, the bottom layer PCB and the core boards form a laminated layer, after the lamination is completed, drilling and electroplating are performed, and finally, the PCB circuit is printed with printing ink, the printing ink can flow in this way, the finally formed green oil layer is thick at the top of the PCB circuit, and the green oil at the corner of the side wall of the PCB circuit is thin, so that the impedance of the PCB circuit is unstable, and further, the loss of signals transmitted on the PCB circuit is unstable.
Different from the traditional PCB processing flow, the invention provides a PCB implementation method for improving the impedance stability of an outer layer circuit, as shown in FIG. 3, comprising the following steps:
s1, manufacturing a PCB core board, and arranging a PCB circuit on the PCB core board;
s2, arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the surface layer of the PCB with the PCB circuit, and sticking release paper on the outer surface of the prepreg; before arranging the prepreg, grooving at a semi-curing corresponding position according to a pattern of a PCB circuit; the purpose of the groove is to reserve the shape of a PCB circuit on the prepreg, so that the formed integrated circuit resin layer is smooth, and the depth of the groove is set according to the flowing capacity of the adopted prepreg resin;
s3, carrying out hot melting and laminating on the arranged PCB core boards to form a PCB circuit board, forming a laminating layer by bonding resin, and forming an integrated circuit resin layer by the prepreg and the PCB circuit;
s4, tearing off release paper, drilling and electroplating the PCB, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer; the method comprises the following specific steps:
s41, tearing off release paper on the outer surface of the integrated circuit resin layer; the release paper and the prepreg do not react when being pressed, and can be easily torn off;
s42, judging whether drilling is needed to be carried out on the PCB or not, and carrying out drilling processing when drilling is needed;
s43, electroplating the PCB in the integrated circuit resin layer; the purpose of electroplating is to prevent the PCB circuit from being oxidized, and the thickness of the electroplating layer is negligible relative to the thickness of the PCB circuit;
and S44, printing ink on the surface of the integrated circuit resin layer, and setting a green oil layer.
Example 5:
as shown in fig. 4, the present invention provides a PCB implementation apparatus for improving impedance stability of an outer layer circuit, including:
the PCB core board manufacturing module 6 is used for manufacturing a PCB core board, and PCB circuits are arranged on the PCB core board;
the PCB core board arrangement module 7 is used for arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the PCB surface layer with PCB circuits, and pasting release paper on the outer surface of the prepreg;
the laminating module 8 is used for carrying out hot melting lamination on the arranged PCB core boards to form a PCB circuit board, bonding resin forms a laminating layer, and the prepreg and the PCB circuit form an integrated circuit resin layer;
and the PCB processing module 9 is used for tearing off release paper, drilling and electroplating the PCB, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer.
Example 6:
as shown in fig. 4, the present invention provides a PCB implementation apparatus for improving impedance stability of an outer layer circuit, including:
the PCB core board manufacturing module 6 is used for manufacturing a PCB core board, and PCB circuits are arranged on the PCB core board;
the PCB core board arrangement module 7 is used for arranging the PCB core boards according to a set sequence, arranging adhesive resin between the adjacent PCB core boards, arranging a prepreg on the PCB surface layer with PCB circuits, and pasting release paper on the outer surface of the prepreg;
the laminating module 8 is used for carrying out hot melting lamination on the arranged PCB core boards to form a PCB circuit board, bonding resin forms a laminating layer, and the prepreg and the PCB circuit form an integrated circuit resin layer;
the PCB processing module 9 is used for tearing off release paper, drilling and electroplating the PCB, and printing ink on the surface of the integrated circuit resin layer to form a green oil layer; the PCB board processing module 9 includes:
the release paper stripping unit is used for tearing off the release paper on the outer surface of the integrated circuit resin layer;
the drilling processing unit is used for judging whether drilling is needed to be carried out on the PCB or not and carrying out drilling processing when drilling is needed;
the electroplating processing unit is used for electroplating the PCB circuit in the integrated circuit resin layer;
and the green oil setting unit is used for printing ink on the surface of the integrated circuit resin layer and setting a green oil layer.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399580.2A CN114143959A (en) | 2021-11-19 | 2021-11-19 | A PCB, realization method and device for improving the impedance stability of outer layer lines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399580.2A CN114143959A (en) | 2021-11-19 | 2021-11-19 | A PCB, realization method and device for improving the impedance stability of outer layer lines |
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| Publication Number | Publication Date |
|---|---|
| CN114143959A true CN114143959A (en) | 2022-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111399580.2A Pending CN114143959A (en) | 2021-11-19 | 2021-11-19 | A PCB, realization method and device for improving the impedance stability of outer layer lines |
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| CN103237422A (en) * | 2013-04-25 | 2013-08-07 | 无锡江南计算技术研究所 | Laminating manufacturing method for thick copper multilayer plate |
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| CN104918416A (en) * | 2014-03-11 | 2015-09-16 | 深南电路有限公司 | Circuit board resistance welding processing method and external-layer ultra-thick copper circuit board |
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| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
| CN108495487A (en) * | 2018-04-16 | 2018-09-04 | 深圳市景旺电子股份有限公司 | A kind of production method of multilayer heavy copper circuit board |
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2021
- 2021-11-19 CN CN202111399580.2A patent/CN114143959A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103237422A (en) * | 2013-04-25 | 2013-08-07 | 无锡江南计算技术研究所 | Laminating manufacturing method for thick copper multilayer plate |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick copper circuit board and its welding-proof manufacturing method |
| CN104918416A (en) * | 2014-03-11 | 2015-09-16 | 深南电路有限公司 | Circuit board resistance welding processing method and external-layer ultra-thick copper circuit board |
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| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
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