CN106852028A - A kind of processing method of circuit board and the circuit board obtained by the processing method - Google Patents
A kind of processing method of circuit board and the circuit board obtained by the processing method Download PDFInfo
- Publication number
- CN106852028A CN106852028A CN201710044331.9A CN201710044331A CN106852028A CN 106852028 A CN106852028 A CN 106852028A CN 201710044331 A CN201710044331 A CN 201710044331A CN 106852028 A CN106852028 A CN 106852028A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- dry film
- blind hole
- processing method
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Abstract
The circuit board obtained the invention discloses a kind of processing method of circuit board and by the processing method, is comprised the following steps：1) blind hole is got out on circuit boards；2) dry film is sticked, windowing treatment then is carried out to circuit board；3) dry film through hole is cut out on dry film；The dry film through hole is corresponding with the blind hole of circuit board；A diameter of a of the dry film through hole, a diameter of b, a of blind hole>b；4) plating is carried out to the circuit board surface in blind hole inwall and dry film via regions and fills out copper；5) dry film is removed, filling holes with resin is then carried out；6) by the surface rubbing of circuit board；The present invention is effectively improved the resin solved between outer layer blind hole layers of copper and grinds sordid problem, it is achieved thereby that feasible production procedure of the outer layer blind hole+depth high than VIPPO somewhat complex design.
Description
Technical field
The circuit board obtained the present invention relates to a kind of processing method of circuit board and by the processing method, belongs to circuit board
Processing technique field.
Background technology
Electronic product develops towards light, thin, short, small direction, and (High Density are interconnected to printed circuit board high density
Interconnect, HDI) reliability have a requirement higher, the reliability connection of each interlayer of printed circuit board then mainly according to
Rely in through hole and blind hole.Through hole or blind hole are by way of copper facing, consent.
VIPPO takes the abbreviation of the previous letter abbreviations of English word：Via-In-Pad Plated Over, VIPPO's
Technique is that VIA holes are bored on PAD, then with the technique for electroplating cap bore.It is more complicated than VIPPO in blind hole obtained in this technique+depth high
In Design PCB finished product, find there be one layer of foreign matter between outer layer blind hole layers of copper, by analysis, the foreign matter between outer layer blind hole layers of copper
For blind hole filling perforation certainly exists 6~10um Dimple values, tree is filled at blind hole Dimple in vacuum whole plate filling holes with resin
Fat, due to 6~10um more recessed than copper face herein, it is impossible to which the resin mill in Dimple is clean.
The content of the invention
In order to overcome the deficiencies in the prior art, first purpose of the invention is to provide a kind of processing side of circuit board
Method, is effectively improved the resin solved in outer layer blind hole layers of copper and grinds sordid problem, it is achieved thereby that outer layer blind hole+depth high
Than the feasible production procedure of VIPPO somewhat complex design.
Realize that the purpose of the present invention can reach by adopting the following technical scheme that：A kind of processing method of circuit board, bag
Include following steps：
1) blind hole is got out on circuit boards；
2) dry film is sticked, windowing treatment then is carried out to circuit board；
3) dry film through hole is cut out on dry film；The dry film through hole is corresponding with the blind hole of circuit board；The dry film through hole
A diameter of a, a diameter of b, a of blind hole>b；
4) heavy copper is carried out to the circuit board surface in blind hole inwall and dry film via regions；
5) dry film is removed, filling holes with resin is then carried out；
6) by the surface rubbing of circuit board.
Preferably, step 1) in, a diameter of 4~14mil of the blind hole.
Preferably, step 1) in, the depth ratio of the blind hole is 6~8：1.
Preferably, step 4) in, the heavy copper thickness of the circuit board surface is 18~20um.
Preferably, step 6) in, using ceramic nog plate by the surface rubbing of circuit board.
Second object of the present invention is to provide for a kind of circuit board obtained by the above method.
Realize that the purpose of the present invention can reach by adopting the following technical scheme that：
A kind of circuit board, is obtained by processing method as described above.
Design principle of the invention is as follows：
On the basis of dry film opens a window originally, increase and the dry film through hole bigger than blind hole diameter is set, so sink later
Copper plated hole flow can be by above many plating 18~20um of thickness of the copper thickness rate in blind hole, and 18~20um copper thickness can be caused in resin plug
During resin will not flow to Dimple during hole, then by the surface rubbing of blind hole, so as to solve the resin in outer layer blind hole layers of copper
Foreign matter problem.
Compared to existing technology, the beneficial effects of the present invention are：
1st, the present invention is effectively improved the resin solved between outer layer blind hole layers of copper and grinds sordid problem, it is achieved thereby that
Feasible production procedure of the outer layer blind hole+depth high than VIPPO somewhat complex design；
2nd, processing method of the present invention is simply efficient.
Brief description of the drawings
Fig. 1 is schematic diagram when circuit board of the invention is processed；
Wherein, 1, blind hole；2nd, dry film；21st, dry film through hole.
Specific embodiment
Below, with reference to accompanying drawing and specific embodiment, the present invention is described further：
Embodiment
A kind of reference picture 1, processing method of circuit board, comprises the following steps：
1) blind hole 1 is got out on circuit boards；A diameter of 14mil of the blind hole 1, the depth ratio of the blind hole 1 is 8：1；
2) dry film 2 is sticked, windowing treatment then is carried out to circuit board；
3) dry film through hole 21 is cut out on dry film 2；The dry film through hole 21 is corresponding with the blind hole 1 of circuit board；It is described dry
A diameter of a of film through hole 21, a diameter of b, a of blind hole 1>b；
4) heavy copper is carried out to the circuit board surface in the inwall of blind hole 1 and the via regions of dry film 2；The circuit board surface it is heavy
Copper thickness is 18~20um；
5) dry film 2 is removed, filling holes with resin is then carried out；
6) ceramic nog plate is used by the surface rubbing of circuit board.
By above processing method, a kind of circuit board is obtained；After testing, the blind hole Dimple of the circuit board does not have resin different
Thing.
For a person skilled in the art, technical scheme that can be as described above and design, make other each
Plant corresponding change and deform, and all these changes and deforms the protection model that should all belong to the claims in the present invention
Within enclosing.
Claims (6)
1. a kind of processing method of circuit board, it is characterised in that comprise the following steps：
1) blind hole is got out on circuit boards；
2) dry film is sticked, windowing treatment then is carried out to circuit board；
3) dry film through hole is cut out on dry film；The dry film through hole is corresponding with the blind hole of circuit board；The dry film through hole it is straight
Footpath is a, a diameter of b, a of blind hole>b；
4) plating is carried out to the circuit board surface in blind hole inwall and dry film via regions and fills out copper；
5) dry film is removed, filling holes with resin is then carried out；
6) by the surface rubbing of circuit board.
2. the processing method of circuit board according to claim 1, it is characterised in that：Step 1) in, the diameter of the blind hole
It is 4~14mil.
3. the processing method of circuit board according to claim 1, it is characterised in that：Step 1) in, the depth of the blind hole
Than being 6~8：1.
4. the processing method of circuit board according to claim 1, it is characterised in that：Step 4) in, the circuit board surface
Heavy copper thickness be 18~20um.
5. the processing method of circuit board according to claim 1, it is characterised in that：Step 6) in, will using ceramic nog plate
The surface rubbing of circuit board.
6. a kind of circuit board, it is characterised in that：Obtained by the processing method described in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044331.9A CN106852028A (en) | 2017-01-19 | 2017-01-19 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044331.9A CN106852028A (en) | 2017-01-19 | 2017-01-19 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106852028A true CN106852028A (en) | 2017-06-13 |
Family
ID=59119720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710044331.9A Pending CN106852028A (en) | 2017-01-19 | 2017-01-19 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106852028A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801310A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | Circuit board manufacturing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103917060A (en) * | 2013-01-05 | 2014-07-09 | 北大方正集团有限公司 | Method for manufacturing plug holes in printed circuit board |
| CN106102349A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of technique improving plating filling perforation depression value |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
-
2017
- 2017-01-19 CN CN201710044331.9A patent/CN106852028A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103917060A (en) * | 2013-01-05 | 2014-07-09 | 北大方正集团有限公司 | Method for manufacturing plug holes in printed circuit board |
| CN106102349A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of technique improving plating filling perforation depression value |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801310A (en) * | 2017-11-29 | 2018-03-13 | 瑞声声学科技(苏州)有限公司 | Circuit board manufacturing method and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
|
| RJ01 | Rejection of invention patent application after publication |