CN106535506A - Via hole filling method, welding pad manufacturing method, welding pad and circuit board - Google Patents
Via hole filling method, welding pad manufacturing method, welding pad and circuit board Download PDFInfo
- Publication number
- CN106535506A CN106535506A CN201611162552.8A CN201611162552A CN106535506A CN 106535506 A CN106535506 A CN 106535506A CN 201611162552 A CN201611162552 A CN 201611162552A CN 106535506 A CN106535506 A CN 106535506A
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- Prior art keywords
- copper
- hole
- clad plate
- electric conductor
- dry film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a via hole filling method, a welding pad manufacturing method, a welding pad and a circuit board. The via hole filling method comprises the steps that a hole of the preset aperture is drilled on the preset position of the surface of a copper-clad plate; a conductive layer is formed on the hole wall of the hole; a layer of dry film is covered on the surface of the copper-clad plate, and the dry film on the hole is removed by an exposure development manner so that windowing of the dry film on the position of the hole is performed; copper is filled in the hole, the copper and the conductive layer are connected to form an electric conductor together, and the electric conductor is level with the surface of the copper-clad plate; the dry film covered on the surface of the copper-clad plate is removed; and the surface of the electric conductor is polished so that the surface of the electric conductor is maintained to be consistent with the surface of the copper-clad plate. Therefore, via hole cavities and bubbles can be avoided, the copper layer acts as the metal having simple polishing technology and the surface of the copper layer after polishing is smooth and uniform so that pseudo welding or non-uniform welding of electronic components welded on the welding pad internally provided with the via hole does not occur, and the circuit board manufactured by the welding pad is enabled to have highly dense arrangement of internal circuits.
Description
Technical field
The present invention relates to wiring board techniques field, more particularly to a kind of filling perforation method in excessively electric hole, the making side of pad
Method, pad and wiring board.
Background technology
Wiring board, including copper-clad plate, its with insulation board as base material, one side or it is two-sided be covered with layers of copper (Copper Foil), be cut into one
It is sized, at least has a conductive pattern thereon, and be furnished with hole, for replacing the chassis of conventional device electronic devices and components, and
Realize being connected with each other between electronic devices and components.As this plate is made using electron printing, therefore it is referred to as " printing "
Wiring board.It is important element in wiring board to cross electric hole (VIA), and it can play the work of electrical connection, fixation or positioning devices
With.
The electronic circuit of wiring board set up meter it is a kind of be placed in design above electric hole pad (VIP, i.e. VIA in PAD,
The pad in electric hole was set inside), this design can save wiring space, and then realize reducing the area and volume of monoblock wiring board,
Reach light, thin, the little purpose of electronic product.Wiring board introduce in set electric hole pad design can realize diminution wiring board and
The area or volume of electronic product, in order that the excessively electric hole in the middle of pad be unlikely to make pad hollow or the built-in debris in excessively electric hole with
Ensure the impact that bond pad surface is smooth and mitigation is to welding, the excessively electric hole in the middle of pad is generally filled using two methods,
First method is excessively electric hole to be filled using resistance ink or resin, and second method is to fill copper oar in excessively electric hole to be filled out
Fill, solid pad is formed by polishing.But two methods cause the electronics on the pad due to the deficiency in its technique manufacture
Component pads are affected, or cause rosin joint, or out-of-flatness after element welding, the final reliability for affecting electronic product.
Existing filling holes with resin technique easily occurs that consent is not full, resin is empty, resin bubble the problems such as；And it is existing
Resin ground difficulty in process, resin surface depression after grinding, and surface copper is thick cuts down uneven, makes electronics unit is welded on pad
Part easily causes out-of-flatness after rosin joint or welding, it is impossible to meet the making requirement that wiring board is set in highly dense.
The content of the invention
Based on this, it is necessary to easily occur for filling holes with resin technique that consent is not full, resin is empty, resin bubble, with
And after resin ground difficulty in process, grinding, the thick reduction of resin surface depression, surface copper is uneven, welds electronic component easy on pad
Out-of-flatness after rosin joint or welding is caused, the technical problem for setting in highly dense that the making of wiring board is required cannot be also met, there is provided one
Planted preparation method, the preparation method of pad, pad and the wiring board in electric hole.
A kind of filling perforation method in excessively electric hole, including：The hole in default aperture is got out on the predeterminated position on copper-clad plate surface；
One layer of conductive layer is formed on the hole wall in the hole；One layer of dry film is covered on the surface of the copper-clad plate, and passes through exposure imaging side
Formula removes the dry film above the hole, so that dry film opens a window in the position in the hole；Fill out copper in the hole, the copper and described
Conductive layer connection is to be collectively forming electric conductor, also, the electric conductor is maintained an equal level with the surface of the copper-clad plate；Copper is covered described in taking off
The dry film that plate surface is covered；Polish the surface of the electric conductor, protect the surface of the electric conductor and the surface of the copper-clad plate
Hold consistent.
Wherein in one embodiment, the hole that default aperture is got out on the predeterminated position on copper-clad plate surface includes：
Predeterminated position on copper-clad plate surface by the way of machine drilling gets out hole of the default aperture more than or equal to 0.15 millimeter.
Wherein in one embodiment, the hole that default aperture is got out on the predeterminated position on copper-clad plate surface includes：
Predeterminated position on copper-clad plate surface by the way of laser drill gets out hole of the default aperture less than 0.15 millimeter.
Wherein in one embodiment, one layer of conductive layer of formation on the hole wall in the hole includes：Consider to be worth doing removal of impurities is gone
Hole hole wall on formed one layer of conductive layer.
Wherein in one embodiment, one layer of conductive layer of formation on the hole wall in the hole includes：In the hole
One layer of layers of copper is formed by heavy process for copper on hole wall and is used as conductive layer.
Wherein in one embodiment, one layer of conductive layer of formation on the hole wall in the hole includes：In the hole
There is chemical reaction with the resin and/or glass fibre of hole wall using catalyst on hole wall layer of conductive film is formed as conduction
Layer.
The invention also discloses a kind of preparation method of pad, including the filling perforation side in the excessively electric hole described in as above any one
Method, also, on the surface of the polishing electric conductor, make the surface of the electric conductor keep one with the surface of the copper-clad plate
After cause, also include：In the copper-clad plate and the copper coating of the electric conductor, the table of the copper-clad plate and the electric conductor is made
The layers of copper in face thickeies；One layer of dry film is covered on the surface of the copper-clad plate and the electric conductor, and is gone by exposure imaging mode
Except the dry film above preset pattern, so that dry film opens a window in the position of the preset pattern, wherein, the electric conductor is described pre-
If in the forward projection of figure；The copper facing in the preset pattern, so that the layers of copper on the preset pattern surface thickeies；Described
It is tin plating in preset pattern, so that the copper on the preset pattern surface is protected by tin；The dry film on the copper-clad plate surface is taken off, and is removed
The copper for going to the copper-clad plate surface not protected by tin.
The invention also discloses a kind of pad, the pad includes pad body and electric conductor；The surface of the electric conductor with
The bottom connection of the pad body；Some grooves are provided with the pad body, one end of the groove is from the conduction
The radial edge to the pad body in edge in body surface face extends.
Wherein in one embodiment, the quantity of the groove is four, and the pad body is divided into four by the groove
Decile.
The invention also discloses a kind of wiring board, the wiring board includes copper-clad plate and arbitrary pad as above.
The filling perforation method in above-mentioned excessively electric hole, the preparation method of pad, pad and wiring board, the filling perforation method in excessively electric hole pass through
Copper is filled out in excessively electric hole, makes that obtained excessively electric hole is full, avoided the appearance of electric hole cavity and bubble, and layers of copper is used as gold
Category grinding technics is simple, layers of copper surfacing after grinding, uniform so that welding electronic component on the pad for inside setting electric hole will not
Rosin joint or welding out-of-flatness are caused, and also enable circuit to be set in the highly dense ground of wiring board made using this pad.
Description of the drawings
Fig. 1 is the schematic flow sheet of the filling perforation method in excessively electric hole in one embodiment；
Fig. 2A is the structural representation of copper-clad plate in one embodiment；
Fig. 2 B are the schematic cross-section after copper-clad plate drilling in one embodiment；
Fig. 2 C are the schematic cross-section after one layer of conductive layer of formation on the hole wall of one embodiment mesopore；
Fig. 2 D are the schematic cross-section after covering dry film in copper-clad plate in one embodiment；
Fig. 2 E are the schematic cross-section of filling perforation in one embodiment mesopore；
Fig. 3 is the schematic flow sheet of the preparation method of pad in one embodiment；
Fig. 4 is the top view of pad in one embodiment.
Specific embodiment
It is understandable to enable the above objects, features and advantages of the present invention to become apparent from, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Elaborate many details in order to fully understand this in the following description
It is bright.But the present invention can be implemented with being much different from alternate manner described here, and those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
For example, the filling perforation method in the excessively electric hole of an embodiment, the filling perforation method in the excessively electric hole comprise the steps：Covering copper
The hole in default aperture is got out on the predeterminated position of plate surface；One layer of conductive layer is formed on the hole wall in hole；On the surface of copper-clad plate
One layer of dry film is covered, and the dry film above hole is removed by exposure imaging mode, so that dry film opens a window in the position in hole；In hole
Copper is filled out, copper and conductive layer connection are to be collectively forming electric conductor, also, electric conductor is maintained an equal level with the surface of copper-clad plate；Take off copper-clad plate
The dry film that surface covers；The surface of polishing electric conductor, makes the surface of electric conductor be consistent surface with the surface of copper-clad plate.
For example, Fig. 1 is referred to, which is the schematic flow sheet of the filling perforation method in excessively electric hole in one embodiment.Please join simultaneously
Read Fig. 2A～Fig. 2 E, its be the excessively electric hole of an embodiment filling perforation during each stage structural representation.Such as Fig. 1 institutes
Show that the filling perforation method in above-mentioned excessively electric hole comprises the steps：
S110, gets out the hole in default aperture, the sectional view after copper-clad plate drilling on the predeterminated position on copper-clad plate surface
Refer to Fig. 2 B.
For example, the pre-set dimension that standard-sized copper-clad plate Jing sawing sheet operations cut into production design requirement is covered into copper
Plate, and the dust and deburred on the copper-clad plate surface of pre-set dimension is clean, in the pre- of the surface for processing clean copper-clad plate
If position gets out the hole in default aperture.
For example, Fig. 2A is referred to, which is the structural representation of copper-clad plate in one embodiment.Copper-clad plate includes base material 100,
The surface and bottom surface of base material is respectively arranged with layers of copper 200.For example, the material of copper-clad plate is epoxy resin.For example, hole is blind hole,
The layers of copper and base material on blind hole connection copper-clad plate surface and not insertion.For example, hole is through hole, the copper on through hole connection copper-clad plate surface
Layer, the layers of copper of base material and copper-clad plate bottom surface and insertion.For example, copper-clad plate includes multi-layer substrate, is provided with interior between multi-layer substrate
Layer circuit, multi-layer substrate surface and bottom surface are respectively arranged with layers of copper.Fig. 2 B are referred to, through drilling, in multi-layer substrate and inside
Default hole 300 is formed between circuit, turns on multi-layer substrate.
For example, when the default aperture in hole is more than or equal to 0.15 millimeter, in copper-clad plate by the way of machine drilling
The predeterminated position on surface gets out hole of the default aperture more than or equal to 0.15 millimeter.So, when the default aperture in hole is bigger
When, adopt the mode of machine drilling can be with time-consuming.For example, when the default aperture in hole is less than 0.15 millimeter, using laser
Predeterminated position of the mode of drilling on copper-clad plate surface gets out hole of the default aperture less than 0.15 millimeter.So, presetting when hole
When aperture ratio is less, tiny hole can be got out using different types of lasing light emitter.For example, when the default aperture in hole is from the top in hole
Portion to bottom be gradually reduced when, first by the way of machine drilling, get out the big hole in aperture at top, then with the side of laser drill
Formula gets out the little hole in aperture in bottom.Preferably, the hole in S110 is blind hole, and the default aperture in hole is from the top-to-bottom in hole
It is gradually reduced, as shown in Figure 2 B, the bottom in hole reaches copper-clad plate lower surface copper sheet, and does not penetrate lower surface copper sheet；Machine is adopted first
The mode of tool drilling, gets out the big hole in aperture at top, then gets out the little hole in aperture in bottom with the mode of laser drill.
S120, forms one layer of conductive layer on the hole wall in hole, refers to Fig. 2 C, and one layer of conductive layer is formed on the hole wall in hole
400。
For example, dust and colloid of the burr and hole wall of the orifice edge in hole etc. are removed, in the hole in the hole for removing removal of impurities bits
One layer of conductive layer is formed on wall.
For example, conductive layer is layers of copper, forms one layer of layers of copper by heavy process for copper and be used as conductive layer on the hole wall in hole.Its
In, heavy process for copper be using surface sink attached method make hole hole wall deposit one layer of very thin copper.For example, the thickness of layers of copper is 5
Micron.So, heavy process for copper is selected to make the hole wall in hole deposit one layer of very thin copper, the process for copper that sinks is simple, ripe, the material for being used
Material low cost.For example, the layers of copper for being formed on hole wall is connected to form path with the layers of copper on copper-clad plate surface or bottom, makes in the later stage
In electroplating work procedure, because there is electric current to pass through, can be in layers of copper surface plated with copper.
For example, conductive layer is conductive film, using chemical method using catalyst and the base material of hole wall on the hole wall in hole
There is chemical reaction and generate conductive polymer chemical bond in (resin and/or glass fibre) contact, that is, form layer of conductive film and make
For conductive layer.For example, catalyst is polymer catalyst.For example, conductive film is high molecular polymer conductive film.So,
Base material haptoreaction of the chemical method using chemical substance (catalyst) with hole wall is selected to form conductive film, environmentally friendly degree is high.Example
Such as, the conductive film for being formed on hole wall is connected to form path with the layers of copper on copper-clad plate surface or bottom, makes the galvanizer in the later stage
In sequence, because there is electric current to pass through, can be in conductive film surface plated with copper.For example, catalyst includes organic monomeric compound, has
Machine acid and stabilizer, after the organic monomer compound in stabilizer and acid medium is oxidized it is selective on hole wall with hole
One layer of high molecular polymeric conductor films generated and polymerisation in the resin of wall or glass fibre there is.
S130, covers one layer of dry film on the surface of copper-clad plate, and removes the dry film above hole by exposure imaging mode, please
Refering to Fig. 2 D.So that dry film 500 opens a window in the position in hole.
For example, dry film be a kind of macromolecular compound polymerisation is produced after ultraviolet irradiation so as to formed it is steady
Fixed material, dry film are attached to the surface of copper-clad plate, can stop plating and etch, the surface of the copper-clad plate for making to be attached with dry film
Can not be plated or etch.And the surface energy for passing through the copper-clad plate that dry film is removed by exposure imaging is plated or etches.
S140, fills out copper in hole, refers to Fig. 2 E, copper and conductive layer is connected to be collectively forming electric conductor 600, also,
Electric conductor is maintained an equal level with the surface of copper-clad plate.
For example, the position that dry film is covered can not be by copper facing, and dry film opens a window in the position in hole, and hole wall surface forms one layer
Conductive layer, by the way of plating in hole can fill out copper with direct, make copper and conductive layer be collectively forming electric conductor.For example, pass through
Setting plating duration, when making the surface of electric conductor maintain an equal level with the surface of copper-clad plate, just stops filling out copper.So, hole will be by electric conductor
Filling.Wherein, when the surface of electric conductor is fair with the surface of copper-clad plate, simply substantially may maintain an equal level, the surface of electric conductor may
Also out-of-flatness, in addition it is also necessary to by follow-up polishing, make the surfacing of electric conductor.
S150, takes off the dry film of copper-clad plate surface covering.
For example, the dry film of copper-clad plate surface covering is taken off by the way of alkaline solution is by dry film dissolving.For example, alkalescence is molten
Liquid is sodium hydroxide solution.For example, through taking off film process, the dry film on copper-clad plate surface is taken off, exposes copper face.
S160, the surface of electric conductor of polishing, makes the surface of electric conductor be consistent with the surface of copper-clad plate, i.e. to make conduction
The surface of body is consistent with the surface of copper-clad plate.That is, copper is filled out in hole, copper and conductive layer connection are led with being collectively forming
Electric body, also, the surface of electric conductor and copper-clad plate is fair, can only now keep probably maintaining an equal level, middle may also can protrude one
Point, therefore the surface of polishing electric conductor is finally being also needed to, make the surface and the surface of copper-clad plate of electric conductor keep smooth, i.e.
The surface of electric conductor is generally aligned in the same plane with the surface of copper-clad plate.
For example, when the height of electric conductor is fair with the surface of copper-clad plate, stopping copper facing, and the surface irregularity of electric conductor,
Using the surface of sandbag polishing electric conductor, by irregular electric conductor surface rubbing, the surface of electric conductor and the table of copper-clad plate are made
Face keeps smooth.For example, using the surface of amary tape grinding machine polishing electric conductor, irregular electric conductor surface rubbing makes to lead
The surface of electric body keeps smooth with the surface of copper-clad plate.So, excessively electric hole is filled by electric conductor, and electric conductor keeps smooth.
The filling perforation method in above-mentioned excessively electric hole, by filling out copper in excessively electric hole, makes that obtained excessively electric hole is full, avoided electricity
Hole cavity and the appearance of bubble, and the electric conductor filled in excessively electric hole after grinding keeps smooth, make in set electric hole
Electronic component is welded on pad and does not result in rosin joint or welding out-of-flatness.
Further, the present invention also provides a kind of preparation method of pad, refers to Fig. 3, during which is one embodiment
The schematic flow sheet of the preparation method of pad.After step S160, also comprise the steps：S210, in copper-clad plate and conduction
The copper coating of body, thickeies the layers of copper on the surface of copper-clad plate and electric conductor.
For example, using electric plating of whole board, copper-clad plate and surface all copper facing of electric conductor is made, the surface of copper-clad plate and electric conductor is made
Layers of copper thicken.So, make the pad structure to be formed stable, it is to avoid layers of copper is too thin, easily impaired.
S220, covers one layer of dry film on the surface of copper-clad plate and electric conductor, and removes default figure by exposure imaging mode
Dry film above shape removes, so that dry film opens a window in the position of preset pattern, wherein, forward projection of the electric conductor in preset pattern
It is interior.
For example, the position of dry film attachment, can stop plating and etch, the surface of the copper-clad plate for preventing to be attached with dry film from
It is plated or etches.And the surface energy for passing through the copper-clad plate that dry film is removed by exposure imaging is plated or etches.
S230, the copper facing in the preset pattern, so that the layers of copper on preset pattern surface thickeies.
For example, copper-clad plate other positions are covered by dry film, it is impossible to by copper facing, and dry film opens a window in the position of preset pattern,
Preset pattern is not covered by dry film so that thicken in copper facing in preset pattern, the layers of copper on preset pattern surface.So, weld
Disk thickeies, not easily damaged.
S240, it is tin plating in preset pattern, so that the copper on preset pattern surface is protected by tin.
Wherein, tin has resistance erosion protective effect, can make the position covered by tin not by etching shadow during etching
Ring, and the material of the position not covered by tin is etched.
S250, takes off the dry film on copper-clad plate surface, and removes the copper that copper-clad plate surface is not protected by tin.
For example, through taking off film process, the dry film on copper-clad plate surface is taken off, exposes copper face.By using akaline liquid, will
The copper of the position that copper-clad plate surface is not protected by tin is removed, and only retains the copper in the preset pattern protected by tin.So, this portion
The copper divided in the preset pattern protected by tin forms pad body, and pad body and the electric conductor of this part are collectively forming pad.
Wherein in one embodiment, after step S250, also include：
S260, is not covered one layer of solder mask at copper covering on copper-clad plate surface, and by sense organ imaging, is formed forever
Protective layer.
The preparation method of above-mentioned pad, set electric hole by interior, and forms conductive layer in excessively electric hole and fill out copper, formed real
The smooth electric conductor of the heart, makes welding electronic component on the pad to be formed not result in rosin joint or welding out-of-flatness, by exposure
Development obtains preset pattern and forms pad body, and can be formed with pad of different shapes with electric conductor.
Further, the present invention also provides a kind of pad；For example, the pad adopts pad described in any of the above-described embodiment
Preparation method prepare.For example, Fig. 4 is referred to, which is the top view of pad in one embodiment.The pad 10 includes weldering
Disk body 110 and electric conductor 120；The surface of electric conductor 120 is connected with the bottom of pad body 110；Arrange on pad body 110
The one end for having some grooves 111, groove 111 extends from the radial edge to pad body in edge on 120 surface of electric conductor.
So, when tin being printed in bond pad surface, can flow into tin, make the surfacing of pad after scolding tin uniform in groove.Meanwhile, it is recessed
The pad that groove makes is divided into multiple solder joints, compared with traditional solder joint designs solder joint one hole position of correspondence, reduces identical weldering
It is radial to pad body that the quantity of the hole position of point, reduction processing cost, also, one end of groove rush electric conductor marginal surface
Edge extend, make the solder joint position on wiring board corresponding to the pin of element avoid hole position, welding performance is strengthened.
Above-mentioned pad, including being filled in the solid and smooth electric conductor formed by conductive layer and copper in electric hole and set
The pad body in copper-clad plate is put, makes welding electronic component on pad not result in rosin joint and welding out-of-flatness.
For example, the quantity of groove is four, and pad body is divided into the quartering by groove.As such, it is possible to coordinate BGA well
Or the pin of the element such as PGA is the situation in regular matrix display.For example, land pattern is circle, and for example, land pattern can be with
For square.
Further, the present invention also provides a kind of wiring board, and the wiring board includes copper-clad plate, and as above any embodiment
Described pad.
Above-mentioned wiring board, as a result of the pad in the interior excessively electric hole for being provided with and being filled by electric conductor so that wiring board can
Circuit is set in highly dense.Each technical characteristic of embodiment described above arbitrarily can be combined, to make description succinct, not
Combination all possible to each technical characteristic in above-described embodiment is all described, as long as however, these technical characteristics
There is no contradiction in combination, be all considered to be the scope of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Therefore can not be construed as limiting the scope of the patent.It should be pointed out that for one of ordinary skill in the art comes
Say, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (10)
1. a kind of filling perforation method in excessively electric hole, it is characterised in that include：
The hole in default aperture is got out on the predeterminated position on copper-clad plate surface；
One layer of conductive layer is formed on the hole wall in the hole；
One layer of dry film is covered on the surface of the copper-clad plate, and the dry film above the hole is removed by exposure imaging mode, with
Dry film is made to open a window in the position in the hole；
Copper is filled out in the hole, the copper and the conductive layer connect to be collectively forming electric conductor, also, the electric conductor and institute
The surface for stating copper-clad plate maintains an equal level；
Take off the dry film that the copper-clad plate surface covers；
Polish the surface of the electric conductor, the surface and the surface of the copper-clad plate for making the electric conductor is consistent.
2. the filling perforation method in excessively electric hole according to claim 1, it is characterised in that the default position on copper-clad plate surface
Put and get out the hole in default aperture and include：
Predeterminated position on copper-clad plate surface by the way of machine drilling gets out default aperture more than or equal to 0.15 millimeter
Hole.
3. the filling perforation method in excessively electric hole according to claim 1, it is characterised in that the default position on copper-clad plate surface
Put and get out the hole in default aperture and include：
Predeterminated position on copper-clad plate surface by the way of laser drill gets out hole of the default aperture less than 0.15 millimeter.
4. the filling perforation method in excessively electric hole according to claim 1, it is characterised in that described to be formed on the hole wall in the hole
One layer of conductive layer includes：
One layer of conductive layer is formed on the hole wall in hole for removing removal of impurities bits.
5. the filling perforation method in excessively electric hole according to claim 1, it is characterised in that described to be formed on the hole wall in the hole
One layer of conductive layer includes：
One layer of layers of copper is formed by heavy process for copper on the hole wall in the hole and is used as conductive layer.
6. the filling perforation method in excessively electric hole according to claim 1, it is characterised in that described to be formed on the hole wall in the hole
One layer of conductive layer includes：
There is chemical reaction with the resin and/or glass fibre of the hole wall using catalyst on the hole wall in the hole and form one
Layer conductive film is used as conductive layer.
7. a kind of preparation method of pad, it is characterised in that include filling out for the electric hole excessively as any one of claim 1-6
Hole method, also, on the surface of the polishing electric conductor, the surface of the electric conductor is protected with the surface of the copper-clad plate
After holding unanimously, also include：
In the copper-clad plate and the copper coating of the electric conductor, add the layers of copper on the surface of the copper-clad plate and the electric conductor
It is thick；
One layer of dry film is covered on the surface of the copper-clad plate and the electric conductor, and preset pattern is removed by exposure imaging mode
Top dry film so that dry film the preset pattern position open a window, wherein, the electric conductor in the preset pattern just
Into projection；
The copper facing in the preset pattern, so that the layers of copper on the preset pattern surface thickeies；
It is tin plating in the preset pattern, so that the copper on the preset pattern surface is protected by tin；
The dry film on the copper-clad plate surface is taken off, and removes the copper that the copper-clad plate surface is not protected by tin.
8. a kind of pad, it is characterised in that including pad body and electric conductor；
The surface of the electric conductor is connected with the bottom of the pad body；
Some grooves are provided with the pad body, one end of the groove is radial from the edge on the electric conductor surface
Extend to the edge of the pad body.
9. pad according to claim 8, it is characterised in that the quantity of the groove is four, and the groove will be described
Pad body is divided into the quartering.
10. a kind of wiring board, including copper-clad plate, it is characterised in that also include such as the pad described in claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611162552.8A CN106535506A (en) | 2016-12-15 | 2016-12-15 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611162552.8A CN106535506A (en) | 2016-12-15 | 2016-12-15 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
Publications (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106852028A (en) * | 2017-01-19 | 2017-06-13 | 广州美维电子有限公司 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
| CN108133886A (en) * | 2017-12-11 | 2018-06-08 | 上海申和热磁电子有限公司 | A kind of method of DBC substrate backs grinding |
| WO2019007034A1 (en) * | 2017-07-03 | 2019-01-10 | 京东方科技集团股份有限公司 | Circuit board, electrical element and display device |
| CN110536565A (en) * | 2019-08-06 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of filling perforation method of wiring board through-hole |
| CN111107714A (en) * | 2020-01-15 | 2020-05-05 | 广东科翔电子科技股份有限公司 | Method for manufacturing any-layer interconnection HDI inner-layer core board blind hole |
| CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN112996284A (en) * | 2021-02-18 | 2021-06-18 | 福立旺精密机电（中国）股份有限公司 | BGA (ball grid array) position electroplating blind hole filling process, HDI (high Density interconnection) board obtained by adopting process and electronic product applying HDI board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106852028A (en) * | 2017-01-19 | 2017-06-13 | 广州美维电子有限公司 | A kind of processing method of circuit board and the circuit board obtained by the processing method |
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| CN110536565A (en) * | 2019-08-06 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of filling perforation method of wiring board through-hole |
| CN111107714A (en) * | 2020-01-15 | 2020-05-05 | 广东科翔电子科技股份有限公司 | Method for manufacturing any-layer interconnection HDI inner-layer core board blind hole |
| WO2021143100A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Method for manufacturing blind hole in arbitrary-layer interconnected hdi inner-layer core board |
| CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN112582523B (en) * | 2020-12-03 | 2022-05-24 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN112996284A (en) * | 2021-02-18 | 2021-06-18 | 福立旺精密机电（中国）股份有限公司 | BGA (ball grid array) position electroplating blind hole filling process, HDI (high Density interconnection) board obtained by adopting process and electronic product applying HDI board |
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