CN102970822A - Hot wind bonding pad structure - Google Patents
Hot wind bonding pad structure Download PDFInfo
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- CN102970822A CN102970822A CN 201110259752 CN201110259752A CN102970822A CN 102970822 A CN102970822 A CN 102970822A CN 201110259752 CN201110259752 CN 201110259752 CN 201110259752 A CN201110259752 A CN 201110259752A CN 102970822 A CN102970822 A CN 102970822A
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- shaped hollow
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- speed signal
- pad structure
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- 230000008054 signal transmission Effects 0.000 abstract description 9
- 230000001681 protective effect Effects 0.000 abstract 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
The invention provides a hot wind bonding pad structure which is applicable to a printed circuit board (PCB). The PCB is provided with a plurality of high-speed signal wires routed along a first direction. The hot wind bonding pad structure comprises a connecting area, a first fan-ring-shaped hollow-out area and a second fan-ring-shaped hollow-out area, the connecting area is used for fixing electronic elements, the first and the second fan-ring-shaped hollow-out areas are surrounded outside the connecting area and distributed with an axis of a second direction which is mutually perpendicular to the first direction serving as a center line, spacing distance between the first and the second fan-ring-shaped hollow-out areas is at least two times longer than the wire width of the high-speed signal wires, and protective distance is reserved between the first and the second fan-ring-shaped hollow-out areas and adjacent high-speed signal wire. Compared with hot wind bonding pad structures in prior art, the hot wind bonding pad structure has the advantages that when the structure is applied to distribution of the PCBs of the high-speed signal wires, more space can be saved for facilitating signal routing. Besides, the protective distance is reserved between fan-ring-shaped hollow-out areas and the adjacent high-speed signal wire, electrical connection between the high-speed signal wires and the areas is prevented, then a complete backflow plane layer of the PCB can be maintained, and the signal transmission quality can be improved.
Description
Technical Field
The invention relates to a wiring technology of a printed circuit board, in particular to a hot air bonding pad structure during wiring of the printed circuit board.
Background
With the rapid development of electronic products, various high-end electronic products such as servers tend to be high-speed and high-performance in circuit design. Here, the high-speed circuit mainly includes two aspects: one is high frequency, which is generally considered to be when digital logic circuits are designed to reach or exceed 45MHz to 50MHz, and the circuit portion operating at the frequency occupies at least one third of the whole circuit. If only a few modules such as a System clock work in the frequency range, the whole circuit cannot be called a High Speed System Design (HSSD); the second is that the rising and falling edges of the digital signal (or called the transition of the signal) are very fast. However, when signal edges need to be considered, the more high frequency components, the more easily crosstalk, overshoot, undershoot, oscillation, and the like are caused.
Generally, a physical pad includes three pads, i.e., a regular pad (regular pad), a basic pad of a via pad; a Thermal Relief (also called a patterned pad) is usually disposed on a power layer and/or a ground layer including a large copper foil to prevent heat dissipation and deformation of a via hole and a hole wall due to compression caused by Thermal expansion and contraction; and an isolation Pad (Anti Pad) for isolating the Pad from the copper metallization in the negative. Taking a Printed Circuit Board (PCB) layout design as an example, when a high-speed signal line is routed on the PCB, the high-speed signal line is often touched to contact with a hot air pad, which results in discontinuous signal transmission and failure of normal signal transmission. In addition, each signal transmission line on the PCB board has its own reflow signal, and in order to keep the reflow plane layer on the board complete, a designer needs to spend a lot of time to adjust or optimize the signal routing, for example, to adjust the phenomenon that the routing path of the high-speed signal line crosses the hot air pad.
In view of this, a problem to be solved by related technical personnel in the industry is urgently needed to design a new structure or a new process capable of effectively inhibiting the high-speed signal line from crossing the hot air bonding pad, ensuring the stability of high-speed signal transmission and improving the signal quality.
Disclosure of Invention
Aiming at the defects of a high-speed signal wire on a PCB in the prior art during wiring design, the invention provides a hot air bonding pad structure.
According to an aspect of the present invention, there is provided a hot air pad structure suitable for a printed circuit board having a plurality of high speed signal lines routed along a first direction, wherein the hot air pad structure includes:
a connecting region for fixing an electronic component; and
the pair of fan-shaped annular hollow areas comprise a first fan-shaped annular hollow area and a second fan-shaped annular hollow area, the first fan-shaped annular hollow area and the second fan-shaped annular hollow area surround the outside of the connecting area and are distributed by taking an axis in a second direction perpendicular to the first direction as a central line, the spacing distance between the first fan-shaped annular hollow area and the second fan-shaped annular hollow area is at least twice the line width of the high-speed signal line, and a protection distance is reserved between the first fan-shaped annular hollow area and the adjacent high-speed signal line and between the second fan-shaped annular hollow area and the adjacent high-speed signal line.
Preferably, the connection region is a through hole.
Preferably, the pair of sector-ring-shaped hollowed-out areas is axisymmetric along the axis.
In an embodiment, the pcb further has an intermediate power layer, and the hot air pad structure is located on the intermediate power layer. In another embodiment, the pcb further has an intermediate ground layer, and the thermal pad structure is located on the intermediate ground layer.
Preferably, the printed circuit board has a plurality of the hot air pad structures.
Compared with the prior art, when the hot air bonding pad structure is used on a printed circuit board for distributing high-speed signal wires, more space can be saved so as to be beneficial to signal routing. Meanwhile, a protection distance is reserved between the fan-shaped hollow area and the adjacent high-speed signal line, so that the high-speed signal line can be prevented from being electrically connected with the area, the integrity of a backflow plane layer of the PCB can be further kept, and the signal transmission quality is improved.
Drawings
The various aspects of the present invention will become more apparent to the reader after reading the detailed description of the invention with reference to the attached drawings. Wherein,
FIG. 1 is a schematic diagram showing the components of a prior art hot air pad structure;
FIG. 2 illustrates a schematic diagram of the composition of a hot air pad structure in accordance with an aspect of the present invention; and
fig. 3 is a schematic diagram illustrating a state of the hot air pad structure in fig. 2 when used for high-speed signal wire routing.
Detailed Description
In order to make the present disclosure more complete and complete, reference is made to the accompanying drawings, in which like references indicate similar or analogous elements, and to the various embodiments of the invention described below. However, it will be understood by those of ordinary skill in the art that the examples provided below are not intended to limit the scope of the present invention. In addition, the drawings are only for illustrative purposes and are not drawn to scale.
Specific embodiments of various aspects of the present invention are described in further detail below with reference to the accompanying drawings.
Fig. 1 shows a schematic composition diagram of a prior art hot air pad structure. As described above, the hot air pad is disposed on the power layer and/or the ground layer including the large copper foil, so as to prevent heat dissipation and prevent deformation of the via hole and the hole wall due to extrusion caused by thermal expansion and contraction. For example, the hot air pad may be a spoke-type heat dissipation pad etched on the copper body portion of the bottom surface around a through hole, which is not directly connected to the bottom surface, but connected to the bottom surface through one or more narrow tracks through an opening of the bottom surface, so as to minimize the heat transferred to the bottom surface during the soldering process, thereby avoiding the problem of insufficient soldering due to too fast heat dissipation, and further affecting the stability of various signals transmitted in the circuit. In addition, when the PCB is designed to run the high-speed signal wire, the high-speed signal wire should be prevented from contacting the hot air bonding pad to the utmost extent, so that signal transmission discontinuity is prevented, and the integrity of the reflow plane layer on the PCB is maintained.
Referring to fig. 1, the hot blast pad structure includes four fan-shaped spoke portions, i.e., an upper left spoke portion 11, an upper right spoke portion 12, a lower left spoke portion 13, and a lower right spoke portion 14. Wherein the opening distance in the horizontal direction between the spoke portions 11 and 12, the opening distance in the horizontal direction between the spoke portions 13 and 14 are each w1, such as 10 mils (1mil is equal to 0.0254 mm), and the opening distance in the vertical direction between the spoke portions 11 and 13, the opening distance in the vertical direction between the spoke portions 12 and 14 are each w2, such as 10 mils.
Since the spokes 11 and 12 and the spokes 13 and 14 of the hot air pad are spaced apart by the opening distance w1, the leftmost ends of the spokes 11 and 12 and the leftmost ends of the spokes 13 and 14 of the hot air pad will occupy more board layout space. For the routing design of the high-speed signal line, the routing difficulty is increased, and a lot of time required for adjustment and optimization of related personnel is consumed.
To solve the above-mentioned disadvantages of fig. 1, fig. 2 is a schematic diagram illustrating a composition of a thermal via pad structure according to an aspect of the present invention, and fig. 3 is a schematic diagram illustrating a state of the thermal via pad structure in fig. 2 for high-speed signal line routing.
Referring to fig. 2, the hot air pad structure on the PCB includes a connection region and a pair of sector-ring-shaped hollow regions, namely, a sector-ring-shaped hollow region 21 and a sector-ring-shaped hollow region 22. For example, the connection region is a through hole. The pair of fan-ring shaped hollow areas surround the connecting area, and are distributed by taking an axis in the horizontal direction perpendicular to the vertical routing direction of the high-speed signal lines as a central line, the spacing distance w3 between the fan-ring shaped hollow area 21 and the fan-ring shaped hollow area 22 is at least twice the line width of the high-speed signal lines, and a protection distance exists between the fan-ring shaped hollow area (such as the fan-ring shaped hollow area 21 and the fan-ring shaped hollow area 22) and the adjacent high-speed signal lines. For example, the shielding distance exists between the leftmost end of the fan-shaped hollow-out area and the adjacent high-speed signal line, and the shielding distance also exists between the rightmost end of the fan-shaped hollow-out area and the adjacent high-speed signal line.
In one embodiment, the printed circuit board further includes an intermediate power plane, and the hot air pad structure is located on the intermediate power plane. In another embodiment, the printed circuit board further includes an intermediate ground layer, and the hot air pad structure is located on the intermediate ground layer. In yet another embodiment, the printed circuit board further includes an intermediate power layer and an intermediate ground layer, and a portion of the hot air pad structure is located on the intermediate power layer and another portion of the hot air pad structure is located on the intermediate ground layer.
In one embodiment, the pair of fan-ring shaped hollow areas are axisymmetric along the axis. That is, the sector-ring shaped hollow area 21 is identical to the sector-ring shaped hollow area 22, and a connecting line between two points at corresponding positions in the sector-ring shaped hollow areas 21 and 22 is perpendicular to the axis, and a distance from each point to the axis is equal.
In more detail, the sector ring-shaped hollow area 21 has a left opening end and a right opening end, and the sector ring-shaped hollow area 22 is disposed opposite to the sector ring-shaped hollow area 21 and also has a left opening end and a right opening end. The left open end of the fan-shaped annular hollow area 22 and the left open end of the fan-shaped annular hollow area 21 are located on the same vertical line, and the opening distance therebetween (i.e., the spacing distance between the fan-shaped annular hollow area 21 and the fan-shaped annular hollow area 22) is w3, for example, 20 mil. The right opening end of the fan-shaped hollow-out area 22 and the right opening end of the fan-shaped hollow-out area 21 are also located on the same vertical line, and the opening distance between the two is also w3, such as 20 mil. The fan-shaped hollow area 21 and the fan-shaped hollow area 22 extend along the horizontal direction, and a protection distance is provided between each of the fan-shaped hollow area 21 and the fan-shaped hollow area 22 and the high-speed signal line to prevent or prevent the high-speed signal line from being electrically contacted with the adjacent high-speed signal line, so that the integrity of the reflow plane layer in the PCB can be maintained.
Different from fig. 1, the hot air pad structure of fig. 2 only includes a pair of fan-shaped hollow areas, and compared with the prior art, the hot air pad structure of the present invention only maintains the opening between the left and right opening ends of the fan-shaped hollow areas 21 and 22, and cancels the opening between the upper and lower opening ends of the existing hot air pad structure. Therefore, when the high-speed signal wires are uniformly routed in the vertical direction on the PCB, more routing space can be vacated for the high-speed signal wires by adopting the improved hot air bonding pad structure, the possibility of electrical contact between the high-speed signal wires and the hot air bonding pad structure is further reduced, the integrity of a ground reflow plane layer of the PCB is kept, and the signal transmission quality is improved.
Referring to fig. 3, the hot air pad structure having the fan-shaped hollow area 21 and the fan-shaped hollow area 22 is disposed between any two adjacent high-speed signal lines. When the high-speed signal wire is routed in the vertical direction, the high-speed signal wire does not contact the leftmost end or the rightmost end of the hot air bonding pad structure, and therefore the integrity of a reflow plane layer in the PCB is guaranteed. In addition, under the condition that the opening distances are the same (for example, the sum of the opening distances in the horizontal direction and the vertical direction in the prior art is 40 mils, and the opening distance in the vertical direction in the present invention is also 40 mils), the hot air pad structure of the present invention has a smaller size, and the vacated space can be used for more high-speed signal line routing designs.
It should be understood by those skilled in the art that the fan-shaped hollow-out regions in the hot air pad structure shown in the present invention are all arranged along the horizontal direction, that is, the opening distance between the two fan-shaped hollow-out regions 21 and 22 along the vertical direction is w3, which is very beneficial for high-speed signal line routing in the vertical direction, and not only can avoid the high-speed signal line from electrically contacting with the hot air pad during routing, and damage the integrity of the reflow plane layer in the PCB, but also can compress the size of the hot air pad, thereby reducing the board arrangement space occupied by the hot air pad. However, the invention is not limited to this, for example, the hot air pad structure may also be arranged along the vertical direction, and an opening distance is set between two spoke portions along the horizontal direction, so as to satisfy the situation that the high-speed signal wire may be routed along the horizontal direction. For another example, the hot air pad structure may be arranged in two types, i.e., a horizontal layout and a vertical layout, so as to be adjusted according to specific routing requirements.
Compared with the prior art, when the hot air bonding pad structure is used on a printed circuit board for distributing high-speed signal wires, more space can be saved so as to be beneficial to signal routing. Meanwhile, a protection distance is reserved between the fan-shaped hollow area and the adjacent high-speed signal line, so that the high-speed signal line can be prevented from being electrically connected with the area, the integrity of a backflow plane layer of the PCB can be further kept, and the signal transmission quality is improved.
Hereinbefore, specific embodiments of the present invention are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present invention without departing from the spirit and scope of the invention. Such modifications and substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (6)
1. A hot air pad structure, suitable for a printed circuit board having a plurality of high speed signal lines routed along a first direction, the hot air pad structure comprising:
a connecting region for fixing an electronic component; and
the pair of fan-ring-shaped hollow areas comprise a first fan-ring-shaped hollow area and a second fan-ring-shaped hollow area, the first fan-ring-shaped hollow area and the second fan-ring-shaped hollow area surround the outside of the connecting area and are distributed by taking an axis in a second direction perpendicular to the first direction as a central line, the spacing distance between the first fan-ring-shaped hollow area and the second fan-ring-shaped hollow area is at least twice the line width of the high-speed signal line, and a protection distance is reserved between each of the first fan-ring-shaped hollow area and the adjacent high-speed signal line and between each of the second fan-ring-shaped hollow area and the adjacent high-speed signal line.
2. The hot air pad structure of claim 1, wherein the connection area is a via.
3. The hot air pad structure of claim 1, wherein the first and second scalloped areas are axisymmetric along the axis.
4. The hot air pad structure of claim 1, wherein the printed circuit board further comprises an intermediate power plane, and wherein the hot air pad structure is located on the intermediate power plane.
5. The hot air pad structure of claim 1, wherein the printed circuit board further has an intermediate ground plane, and wherein the hot air pad structure is located on the intermediate ground plane.
6. The hot air pad structure of claim 1, wherein the printed circuit board has a plurality of the hot air pad structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110259752 CN102970822A (en) | 2011-08-31 | 2011-08-31 | Hot wind bonding pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110259752 CN102970822A (en) | 2011-08-31 | 2011-08-31 | Hot wind bonding pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102970822A true CN102970822A (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110259752 Pending CN102970822A (en) | 2011-08-31 | 2011-08-31 | Hot wind bonding pad structure |
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| Country | Link |
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| CN (1) | CN102970822A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281861A (en) * | 2013-05-28 | 2013-09-04 | 浪潮电子信息产业股份有限公司 | Installing method of FLASH bonding pad for preventing high-speed transmission line from being segmented in crossing way |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| WO2021143100A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Method for manufacturing blind hole in arbitrary-layer interconnected hdi inner-layer core board |
-
2011
- 2011-08-31 CN CN 201110259752 patent/CN102970822A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281861A (en) * | 2013-05-28 | 2013-09-04 | 浪潮电子信息产业股份有限公司 | Installing method of FLASH bonding pad for preventing high-speed transmission line from being segmented in crossing way |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| WO2021143100A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Method for manufacturing blind hole in arbitrary-layer interconnected hdi inner-layer core board |
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Application publication date: 20130313 |