CN112582523B - LED device, manufacturing method of LED device and LED car lamp - Google Patents

LED device, manufacturing method of LED device and LED car lamp Download PDF

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Publication number
CN112582523B
CN112582523B CN202011413034.5A CN202011413034A CN112582523B CN 112582523 B CN112582523 B CN 112582523B CN 202011413034 A CN202011413034 A CN 202011413034A CN 112582523 B CN112582523 B CN 112582523B
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chip
led device
chips
groove
white glue
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CN112582523A (en
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陈刚
范正龙
李福海
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Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses an LED device, a manufacturing method of the LED device and an LED car lamp, wherein the LED device comprises a substrate, the substrate is provided with a mounting side surface, at least one group of chip groups is arranged on the mounting side surface, a white glue layer is arranged around each group of chip groups, a fluorescent layer is arranged on one side, away from the substrate, of each chip group, the white glue layer is provided with a first side surface, away from the substrate, the fluorescent layer is provided with a second side surface, away from the chip groups, the height of the first side surface is lower than that of the second side surface, and at least one first groove is concavely arranged on the first side surface. The first side face is lower than the second side face, so that the boundary between the white glue layer and the fluorescent layer is clear, a light emitting dark space is avoided, the light emitting color of the LED device is more uniform, the heat radiation path of a chip in the chip set and the outside air can be shortened, and the heat radiation performance of the chip set is improved; through setting up first recess, can increase the surface area of first side to the surface area of white glue layer outside heat radiation has been increased, the heat dispersion of LED device has further been improved.

Description

LED device, manufacturing method of LED device and LED car lamp
Technical Field
The invention relates to the technical field of LEDs, in particular to an LED device, a manufacturing method of the LED device and an LED car lamp comprising the LED device.
Background
At present, an LED device has two packaging processes, one is to fix a chip on a ceramic substrate, stick a fluorescent glue film on the chip, and then spot white glue on the periphery of the chip to complete packaging; and the other method is that after a chip is fixed on the ceramic substrate, white glue is firstly dispensed around the chip, and then fluorescent glue is sprayed on the chip and the white glue to finish packaging. In the two packaging processes, due to the limitation of the processes, the boundaries of the fluorescent glue and the white glue are not clear, and the boundaries of the fluorescent glue and the white glue have the phenomena of uneven fluctuation or scattered fluorescent powder, so that the spatial distribution uniformity of the light-emitting color of the lamp bead is influenced, even an obvious light-emitting dark area is generated, and the light quality of an LED device is reduced. In addition, some LED devices with large power still have a heat dissipation problem, and the long-time use of LED devices in a high temperature environment will lead to a reduction in the lifetime thereof, which is not favorable for the use and maintenance of equipment.
Disclosure of Invention
One object of an embodiment of the present invention is to: the utility model provides a LED device, it can make the fluorescence glue and the white boundary of gluing clear, and the radiating effect is good, and the luminous colour spatial distribution of lamp pearl is more even.
Another object of an embodiment of the present invention is to: provided is a method for manufacturing an LED device, which is low in production cost.
It is yet another object of embodiments of the invention to: the LED vehicle lamp is uniform in chromaticity, high in luminous efficiency and good in heat dissipation.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, an LED device is provided, which comprises a substrate, wherein the substrate is provided with a mounting side surface, at least one group of chip groups is arranged on the mounting side surface, a white glue layer is annularly arranged around each chip group, one side of the chip group, which is far away from the substrate, is provided with a fluorescent layer, the white glue layer is provided with a first side surface, which is far away from the substrate, the fluorescent layer is provided with a second side surface, which is far away from the chip groups, the height of the first side surface is lower than that of the second side surface, and at least one first groove is concavely arranged on the first side surface.
As a preferable scheme of the LED device, the first grooves are disposed at least on two symmetrical sides of the chip set.
As a preferable mode of the LED device, the first groove surrounds the periphery of the chip set.
As a preferable scheme of the LED device, the first side surface is concavely provided with a plurality of first grooves, the plurality of first grooves are arranged at intervals, and two adjacent first grooves form a protrusion.
As a preferable scheme of the LED device, the first groove has a U-shaped, V-shaped, or arc-shaped cross section.
As a preferable scheme of the LED device, upper ends of groove walls of two adjacent first grooves intersect.
As a preferred scheme of the LED device, each group of chip sets at least comprises two chips, every two adjacent chips share one bonding pad, a second groove is formed in each bonding pad and located between the two chips, and each bonding pad is an anode bonding pad or a cathode bonding pad.
As a preferable scheme of the LED device, the chips of the chip set are arranged along a first direction, the length of the second groove extends along a second direction, the first direction is perpendicular to the second direction, and the length of the second groove is not less than the length of the chip along the second direction.
As a preferable scheme of the LED device, the distance between two adjacent chips in the same group is 40-60 micrometers.
As a preferable scheme of the LED device, each group of chip sets includes at least two chip subsets, at least two chip subsets are arranged at intervals along a second direction, each chip subset includes at least two chips, each chip of a single chip subset is arranged at intervals along a first direction, and the first direction is perpendicular to the second direction.
As a preferable scheme of the LED device, the color of the fluorescent layer of different chip subsets of the same group of chip sets is different.
In a second aspect, a method for manufacturing an LED device is provided, where a substrate is provided, a chip set is fixed on the substrate, white glue is applied or jet-printed on the periphery of the chip set to form a white glue layer, fluorescent glue is sprayed on the top surface of the chip set to form a fluorescent layer, the white glue layer is cut, and a first groove is cut at the top of the white glue layer.
As a preferable scheme of the manufacturing method of the LED device, the white adhesive layer is cut after the fluorescent layer is shaped, and in the specific cutting, a cutting tool is used to cut along the periphery of the chip group.
In a third aspect, an LED vehicle lamp is provided, which includes the LED device described above.
The invention has the beneficial effects that: the first side face is lower than the second side face, so that the boundary between the white glue layer and the fluorescent layer is clear, a light emitting dark space is avoided, the light emitting color of the LED device is more uniform, the heat radiation path of a chip in the chip set and the outside air can be shortened, and the heat radiation performance of the chip set is improved; through setting up first recess, can increase the surface area of first side to the surface area of white glue layer outside heat radiation has been increased, the heat dispersion of LED device has further been improved.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a cross-sectional view of an LED device according to an embodiment of the present invention.
Fig. 2 is a schematic top view of an LED device according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a substrate of an LED device according to an embodiment of the invention.
Fig. 4 is an enlarged schematic view of a portion a of fig. 3.
Fig. 5 is a schematic top view of the substrate with the chip set mounted thereon according to the embodiment of the invention.
Fig. 6 is an enlarged schematic view of fig. 5 at B.
Fig. 7 is a schematic top view illustrating the substrate after the white glue layer is disposed thereon according to the embodiment of the invention.
Fig. 8 is an enlarged schematic view of fig. 7 at C.
Fig. 9 is a schematic top view of the substrate after the fluorescent layer is sprayed.
Fig. 10 is a schematic top view of a white glue layer of a cut portion of an LED device according to an embodiment of the invention.
Fig. 11 is a schematic top view of a white glue layer of an LED device according to an embodiment of the present invention after cutting.
FIG. 12 is a diagram illustrating the separation of different chipsets according to an embodiment of the invention.
Fig. 13 is a top view of an LED device according to another embodiment of the invention.
FIG. 14 is a comparison graph of the color temperature difference between the LED device of the present invention and the relative light emitting surface of the prior art at zero deflection angle.
FIG. 15 is a partial cross-sectional view of a white glue layer in accordance with one embodiment of the present invention.
Fig. 16 is a partial cross-sectional view of a white glue layer in accordance with another embodiment of the present invention.
Fig. 17 is a schematic top view of an LED device according to another embodiment of the invention.
In the figure:
1. a substrate; 101. a mounting side surface; 102. a second groove; 103. a positive electrode pad; 104. a negative electrode pad; 105. a reference bit; 2. a chipset; 201. a chip sub-group; 2011. a chip; 3. a white glue layer; 301. a first groove; 302. a protrusion; 4. a fluorescent layer.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, an LED device provided by the present invention includes a substrate 1, the substrate 1 has a mounting side 101, at least one group of chip sets 2 is disposed on the mounting side 101, a white glue layer 3 is disposed around the periphery of the chip sets 2, a fluorescent layer 4 is disposed on a side of the chip sets 2 away from the substrate 1, a side of the white glue layer 3 away from the substrate 1 is defined as a first side, a side of the fluorescent layer 4 away from a chip 2011 is defined as a second side, wherein a height of the first side is lower than that of the second side, and at least one first groove 301 is recessed in the first side. By setting the first side surface lower than the second side surface, the boundary between the white glue layer 3 and the fluorescent layer 4 can be clear, a light-emitting dark space is avoided, and the light-emitting color of the LED device is more uniform, referring to FIG. 14, compared with the prior art, the color temperature difference curve of the LED device relative to the light-emitting surface at a zero deflection angle is smoother. Meanwhile, the heat radiation paths of the chip 2011 in the chipset 2 and the outside air can be shortened, and the heat radiation performance of the chip is improved; through setting up first recess 301, can increase the surface area of first side to the surface area of the outside heat radiation of white glue layer 3 has been increased, the heat dispersion of LED device has further been improved.
The white glue layer 3 is a mixture of silica gel and titanium dioxide particles, and the fluorescent layer 4 is a mixture of silica gel and fluorescent powder.
Preferably, the distance from the bottom of the first groove 301 of the white glue layer 3 to the side surface of the substrate 1 is H, the height of the chip 2011 is H, and H is 0.42H to 0.59H, so that the white glue layer 3 can not only block the light of the chip 2011 from being emitted from the side surface, but also play a good role in heat dissipation.
Specifically, the first grooves 301 are arranged at least on two symmetrical sides of the chip group 2, so that the surface area of the white glue layer 3 can be increased, and the heat dissipation performance of the LED device is improved.
Preferably, the area of the chip group 2 of a single LED device is S, the area of the substrate 1 of the single LED device is S1, and when S is greater than or equal to 0.6S1, the first grooves 301 may be disposed at two symmetrical sides of the chip group 2 because the relative area of the chip group 2 is large and the width of the white glue layer 3 is narrow; when S <0.6S1, since the relative area of the chip set 2 is small and the width of the white glue layer 3 is wide, the first grooves 301 need to be disposed on the four sides of the chip set 2, so that the heat dissipation performance of the LED device can be improved.
Specifically, in the present embodiment, referring to fig. 2, the first groove 301 surrounds the periphery of the chip set 2, so that the surface area of the white glue layer 3 can be increased to the maximum.
Specifically, a plurality of first grooves 301 are concavely arranged on a first side surface of the white glue layer 3, in this embodiment, referring to fig. 1, 4 first grooves 301 are concavely arranged on the first side surface, the 4 first grooves 301 are arranged at intervals, and two adjacent first grooves 301 form a protrusion 302. By arranging the plurality of first grooves 301 and the plurality of protrusions 302, the first side surface can be a curved surface, the surface area of the first side surface is further increased, and the heat dissipation performance of the LED device is further improved.
In this embodiment, the first grooves 301 are discontinuous, and the first grooves 301 are respectively parallel to the side edges of the chip 2011, so that the processing difficulty can be reduced.
Of course, in other embodiments, referring to fig. 17, the first grooves 301 may also be continuous, in which case, the first grooves 301 are annular first grooves 301, and the annular first grooves 301 with different sizes are arranged at intervals around the chip set 2; of course, the first groove 301 may also be curved, so as to further increase the surface area of the first side surface and improve the heat dissipation performance of the LED device.
Specifically, referring to fig. 1, 15 and 16, the cross section of the first groove 301 may be U-shaped, V-shaped or circular arc, of course, the first groove 301 may have other shapes, and different types of first grooves 301 may be selected according to the requirements of the device. In this embodiment, the cross section of the first groove 301 is an arc, wherein the upper ends of the groove walls of two adjacent first grooves 301 may intersect or may not intersect, the groove walls of two adjacent first grooves 301 shown in fig. 1 intersect, and the groove walls of two adjacent first grooves 301 shown in fig. 15 and 16 do not intersect.
Specifically, referring to fig. 2, fig. 3 and fig. 4, each group of chip sets 2 at least includes two chips 2011, in this embodiment, each group of chip sets 2 has 3 chips 2011, and two adjacent chips 2011 share one pad, where a second groove 102 is formed on the pad, the second groove 102 is located between two adjacent chips 2011, and the pad may be an anode pad 103 or a cathode pad 104. Because the chip 2011 and the substrate 1 are fixed in a welding mode, by arranging the second groove 102, redundant soldering flux can fall into the second groove 102 during welding, the phenomenon that the stress of the chip 2011 is uneven due to connection of the soldering flux is avoided, and the installation defects of twisting, connection and the like of the chip 2011 are avoided; meanwhile, the second groove 102 is arranged, so that the positioning difficulty between two adjacent chips 2011 can be reduced, the distance between the adjacent chips 2011 is shortened, a light-emitting dark space is avoided, and the light emission of the LED device is more uniform.
Specifically, referring to fig. 4, 5 and 6, the X direction is a first direction, the Y direction is a second direction, and the X direction and the Y direction are perpendicular to each other, in this embodiment, the chips 2011 in the same group are arranged along the first direction, the length of the second groove 102 extends along the second direction, and the length of the second groove 102 is not less than the length of the chip 2011 in the second direction. Through setting up the length of second recess 102 and being not less than the length of chip 2011, can guarantee when the welding, unnecessary scaling powder all can fall into second recess 102 in, avoids chip 2011 to appear the installation defect.
Specifically, the distance between two adjacent chips 2011 in the same group is 40 to 60 micrometers, and the distance between the adjacent chips 2011 is shortened to 40 to 60 micrometers, so that the defect of a light emitting dark area of the LED device can be avoided, and further, the light distribution of the LED device is more uniform.
Specifically, referring to fig. 13, in another embodiment, each group of chip sets 2 may include at least two chip subsets 201, each chip subset 201 includes at least two chips 2011, and for example, the two chip subsets 201 and each chip subset 201 includes 3 chips 2011, the two chip subsets 201 are arranged at intervals along the second direction, and the 3 chips 2011 in the same group are arranged at intervals along the first direction. The arrangement of the plurality of chip subgroups 201 can increase the light intensity of the LED device.
Specifically, the colors of the fluorescent layers 4 of different chip sub-groups 201 of the same group of chip groups 2 may be different, so that the LED device can emit light of multiple colors, and the light requirements under different conditions are met. Of course, the color of the fluorescent layers 4 between different chip sub-groups 201 may be the same, and when the number of chip sub-groups 201 is 3 or more than 3, the color of the fluorescent layers 4 of different chip sub-groups 201 may be the same or different.
The invention also provides a manufacturing method of the LED device to manufacture the LED device in the above embodiment, firstly, the chip group 2 is fixed on the substrate 1, white glue is dotted or jet-printed on the periphery of the chip group 2 to form a white glue layer 3, then fluorescent glue is sprayed on the top surface of the chip group 2, after the fluorescent glue forms a fluorescent layer 4, the white glue layer 3 is cut, so that the height of the white glue layer 3 is lower than that of the fluorescent layer 4, and a first groove 301 can be cut on the top of the white glue layer 3 while the white glue layer 3 is cut. The first side surface of the white glue layer 3 is lower than the second side surface of the fluorescent layer 4 by cutting and forms the first groove 301, so that the processing difficulty can be reduced, and the production cost is reduced.
Specifically, referring to fig. 7 to 9, after the white glue is dispensed or the white glue is sprayed on the periphery of the chipset 2 to form the white glue layer 3, the white glue layer 3 is baked first, and then the fluorescent glue is sprayed. Therefore, the boundary between the fluorescent layer 4 and the white glue layer 3 can be clearer, and the LED device can emit light more uniformly.
Specifically, referring to fig. 10 and 11, after the fluorescent layer 4 is shaped, the cutting tool is used to cut the white adhesive layer 3, in this embodiment, the cutting tool cuts along the periphery of the chip set 2, and the cutting tool may cut along the first direction first and then along the second direction, or may cut along the second direction first and then along the first direction. A cutting blade is arranged to cut along the periphery of the chip package 2 to form a discontinuous first groove 301. During cutting, the cutting distance of the cutting tool is slightly larger than the thickness of the cutting tool, so that the two adjacent first grooves 301 form the protrusions 302, and the first side surface of the white glue layer 3 is a curved surface.
Referring to fig. 3 to 12, in the present embodiment, the method for manufacturing LED devices in batch includes the following specific steps:
step S100 of aligning the chips 2011 of the plurality of chip groups 2 with the mounting side surfaces 101 of the substrate 1, respectively;
step S200, welding and fixing the chip 2011 and the mounting side surface 101;
step S300, white glue is dispensed or sprayed on the installation side surface 101 at the periphery of the chip set 2 to form a white glue layer 3;
s400, baking the white glue layer 3;
step S500, after the white glue layer 3 is dried and formed, spraying fluorescent glue on the top surface of the chip 2011 to form a fluorescent layer 4;
step S600, baking the fluorescent layer 4;
step S700, after the fluorescent glue is dried and formed, cutting the white glue layer 3 by using a cutting tool;
step S800, the substrate 1 is cut using a dicing blade, and different chip groups 2 are separated.
Specifically, the edge of the substrate 1 is provided with a reference position 105 for positioning the scribing cutter, and the reference position 105 is aligned with the gap formed by the two adjacent sets of chip sets 2. Through setting up reference position 105, the scribing cutter can fix a position fast, reduces the degree of difficulty of scribing, improves production efficiency.
Specifically, in step S500, a steel mesh may be used to assist in spraying the fluorescent glue, wherein the mesh area of the steel mesh is slightly larger than the area of the chip 2011, the mesh of the steel mesh is aligned with the chip 2011, and then the fluorescent glue is sprayed on the chip 2011, so that it is avoided that the fluorescent layer 4 covers the chip 2011 and the relative position between the chip 2011 and the cutting tool is difficult to determine.
The invention also provides the LED vehicle lamp which adopts the LED device mentioned in the embodiment and is produced by adopting the manufacturing method of the LED device mentioned in the embodiment, so that the produced LED vehicle lamp has the advantage of uniform light-emitting color space distribution and good heat radiation performance.
Specifically, each group of chip sets 2 of the LED vehicle lamp at least includes 3 chips 2011, and each chip 2011 is a blue chip. The blue light chip has higher power, and can meet the illumination brightness required by the running of the vehicle.
In this embodiment, referring to fig. 13, an LED car light includes two sets of chip subsets 201, each set of chip subset 201 includes 3 blue light chips, and the fluorescent layers 4 of the two different chip subsets 201 are different. Through setting up two different chip subgroups 201 of fluorescent layer 4, when two sets of chip subgroups 201 were lighted simultaneously, the light type of LED car light was better, and its central illuminance is higher.

Claims (14)

1. An LED device is characterized by comprising a substrate, wherein the substrate is provided with a mounting side surface, at least one group of chip groups are arranged on the mounting side surface, a white glue layer is arranged around each group of chip groups in a surrounding manner, a fluorescent layer is arranged on one side, far away from the substrate, of each chip group, the white glue layer is provided with a first side surface, far away from the substrate, the fluorescent layer is provided with a second side surface, far away from the chip groups, the first side surface is lower than the second side surface in height, and at least one first groove is concavely arranged on the first side surface;
each group of chip sets at least comprises two chips, every two adjacent chips share one bonding pad, a second groove is formed in each bonding pad, and each second groove is located between every two chips.
2. The LED device of claim 1, wherein the first recess is disposed at least on two sides of the chip package symmetry.
3. The LED device of claim 2, wherein the first groove surrounds a periphery of the chip package.
4. The LED device as claimed in claim 3, wherein a plurality of the first grooves are recessed on the first side surface, the plurality of the first grooves are spaced apart, and two adjacent first grooves form a protrusion.
5. The LED device of claim 1, wherein the cross-section of the first groove is U-shaped, V-shaped, or circular arc-shaped.
6. The LED device of claim 4, wherein upper ends of the groove walls of two adjacent first grooves intersect.
7. The LED device of claim 1, wherein the pad is a positive pad or a negative pad.
8. The LED device of claim 7, wherein the chips of the chip set are arranged along a first direction, the length of the second groove extends along a second direction, the first direction is perpendicular to the second direction, and the length of the second groove is not less than the length of the chips along the second direction.
9. The LED device of claim 7, wherein the pitch between two adjacent chips of a same group is 40-60 microns.
10. The LED device of any of claims 1 to 9, wherein each group of chips comprises at least two subgroups of chips, at least two subgroups of chips being spaced apart along a second direction, each subgroup of chips comprising at least two chips, each chip of a single subgroup of chips being spaced apart along a first direction, the first direction being perpendicular to the second direction.
11. The LED device of claim 10, wherein said phosphor layers of different said subsets of chips of the same set of said chips are different colors.
12. A method for manufacturing an LED device, for manufacturing the LED device as claimed in any one of claims 1 to 11, providing a substrate, fixing a chip set on the substrate, dispensing or spraying white glue on the periphery of the chip set to form a white glue layer, spraying fluorescent glue on the top surface of the chip set to form a fluorescent layer, cutting the white glue layer, and cutting a first groove on the top of the white glue layer.
13. The method of claim 12, wherein the white adhesive layer is cut after the fluorescent layer is shaped, and a cutting tool is used to cut along the periphery of the chip assembly during the cutting.
14. An LED vehicle lamp characterized by comprising the LED device according to any one of claims 1 to 11.
CN202011413034.5A 2020-12-03 2020-12-03 LED device, manufacturing method of LED device and LED car lamp Active CN112582523B (en)

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