CN208336278U - A kind of full-color LED display screen COB encapsulation module - Google Patents
A kind of full-color LED display screen COB encapsulation module Download PDFInfo
- Publication number
- CN208336278U CN208336278U CN201820724521.5U CN201820724521U CN208336278U CN 208336278 U CN208336278 U CN 208336278U CN 201820724521 U CN201820724521 U CN 201820724521U CN 208336278 U CN208336278 U CN 208336278U
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- groove
- pcb board
- fixedly installed
- fixed pedestal
- display screen
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Abstract
The utility model discloses a kind of full-color LED display screen COB encapsulation modules, including fixed pedestal, the first groove is fixedly installed on the upper surface of the fixed pedestal, solid silicon offset plate is fixedly installed in the bottom of the first groove on the fixed pedestal, the lower end of solid silicon offset plate is provided with several U-shaped radiating grooves on the fixed pedestal, pcb board is fixedly installed on the upper surface of the solid silicon offset plate, the two sides of the pcb board lower surface are fixedly connected with the two sides of fixed pedestal upper end, several the second grooves are provided on the upper surface of the pcb board, LED chip is fixedly installed in the bottom of the second groove on the pcb board, two sides on the LED chip upper surface are fixedly connected to metal wire, it is fixedly connected between the other end of the metal wire and pcb board.The utility model structure is simple, and it is convenient to operate, and heat-conducting effect is more preferable, there is certain waterproof ability, solves the problems, such as to be more in line with the market demand there are obvious luminous point and color difference between LED and LED.
Description
Technical field
The utility model relates to LED device technical field, specially a kind of full-color LED display screen COB encapsulation module.
Background technique
LED display refers to be made of LED component array, by certain control mode, for showing text, text diagram
The display screen of the various information such as shape and TV, video signal, human eye derive from retina to the resolution capability of different colours
Upper 3 kinds of different types of cone cells, there is a different sensitivitys to redgreenblue respectively, LED display industry into
Enter conformity stage, each side's surface technology graduallys mature, and people require higher and higher, LED display to the display image quality of LED display
Field is developed towards directions such as ultra high-definition, high density, high-resolution, small spacing and intelligences, however the small spacing of current high definition
LED display is mostly encapsulated on module group substrates in such a way that the three-in-one LED lamp bead of surface mount is by Reflow Soldering, this
Although mode technology maturation, is widely used, however the high density LED display being assembled into using this discrete LED component, it deposits
The problems such as yields is low, poor reliability and heat dissipation are bad.And COB (chip on board) is encapsulated, and directly encapsulates LED bare chip
Onto module group substrates, whole molding is then carried out.The all-colour LED mould group of this COB encapsulation is few with manufacturing process flow, encapsulates
Cost is relatively low, encapsulates the features such as integrated level height, the good reliability of display screen and display effect uniform and smooth.
It is had the disadvantage that in existing COB encapsulation module
Although 1, there is certain radiating mode, heat dissipation effect is not it is obvious that not having waterproof ability, in certain journey
The service life of device is affected on degree;
2, the problem of there are obvious luminous point and color difference between LED and LED.
Utility model content
The purpose of this utility model is to provide a kind of full-color LED display screen COB encapsulation modules, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the utility model provides the following technical solutions: a kind of full-color LED display screen COB Encapsulation Moulds
Group, including fixed pedestal, are fixedly installed the first groove on the upper surface of the fixed pedestal, in first on the fixed pedestal
The bottom of groove is fixedly installed with solid silicon offset plate, and the lower end of solid silicon offset plate is provided with several U on the fixed pedestal
Shape radiating groove, pcb board is fixedly installed on the upper surface of the solid silicon offset plate, and the two sides of the pcb board lower surface are and solid
The two sides for determining pedestal upper end are fixedly connected, and are provided with several the second grooves on the upper surface of the pcb board, on the pcb board
It is fixedly installed with LED chip in the bottom of the second groove, the two sides on the LED chip upper surface are fixedly connected to metal
Line is fixedly connected between the other end and pcb board of the metal wire, in peace fixed on the side wall of the second groove on the pcb board
Equipped with reflector, the upper end of the LED chip is fixedly installed packaging plastic, is fixedly installed on the upper surface on the pcb board
Transparent resin film is fixedly installed third groove on the upper surface of the pcb board between the second groove.
Preferably, several apertures, the number of the quantity of the aperture and the second groove are provided on the solid silicon offset plate
Measure it is identical and with the second groove on same vertical direction.
Preferably, the quantity of the U-shaped radiating groove is at least 8.
Preferably, the shape of second groove and reflector is disposed as semicircle.
Preferably, the bottom of the third groove is set as arc-shaped.
Compared with prior art, the utility model has the beneficial effects that
1, the utility model on fixed pedestal by being fixedly installed with fixed silica gel plate, if being provided on fixed silica gel plate
The aperture done, the lower end of solid silicon offset plate are provided with several U-shaped radiating groove, and the heat generated in device can be quickly through
Aperture on solid silicon offset plate and solid silicon offset plate is discharged from U-shaped radiating groove, while third groove is provided on pcb board, the
Three grooves will increase the upper surface of device and the contact surface of air, increases heat dissipation effect, transparent resin is additionally provided on pcb board
Film, transparent resin film can be water stain on effective absorption plant, when water stain more, can flow into third groove, from
It is flowed out in third groove, there is good waterproof effect;
2, the utility model is fixedly installed with half by being provided with the second groove on pcb board on the side wall of the second groove
Circular reflector, when LED chip work shine when, reflector can uniform reflection light, prevent due to LED luminous intensity with
The difference of color and there is the problem of there are obvious luminous point and color difference between LED and LED, be more in line with the market demand.
Detailed description of the invention
Fig. 1 is a kind of full-color LED display screen COB encapsulation module overall structure diagram of the utility model;
Fig. 2 is a kind of full-color LED display screen COB encapsulation module overall top view of the utility model;
Fig. 3 is a kind of full-color LED display screen COB encapsulation module solid silicone plate structural schematic diagram of the utility model;
Fig. 4 is enlarged diagram at a kind of one A of full-color LED display screen COB Encapsulation Moulds group picture of the utility model.
In figure: 1- fixed pedestal;The first groove of 2-;3- solid silicon offset plate;4-U shape radiating groove;5-PCB plate;6- second is recessed
Slot;7-LED chip;8- metal wire;9- reflector;10- packaging plastic;11- transparent resin film;12- third groove;13- aperture.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of full-color LED display screen COB encapsulation module,
Including fixed pedestal 1, it is fixedly installed the first groove 2 on the upper surface of the fixed pedestal 1, on the fixed pedestal 1
The bottom of one groove 2 is fixedly installed with solid silicon offset plate 3, if being provided on the fixed pedestal 1 in the lower end of solid silicon offset plate 3
A dry U-shaped radiating groove 4, is fixedly installed with pcb board 5 on the upper surface of the solid silicon offset plate 3, and the two of 5 lower surface of pcb board
Side is fixedly connected with the two sides of 1 upper end of fixed pedestal, several second grooves 6 are provided on the upper surface of the pcb board 5,
It is fixedly installed with LED chip 7 in the bottom of the second groove 6 on the pcb board 5, the two sides on 7 upper surface of LED chip are equal
It is fixedly connected with metal wire 8, is fixedly connected between the other end and pcb board 5 of the metal wire 8, in second on the pcb board 5
Reflector 9 is fixedly installed on the side wall of groove 6, the upper end of the LED chip 7 is fixedly installed packaging plastic 10, the pcb board
It is fixedly installed with transparent resin film 11 on upper surface on 5, is fixed between the second groove 6 on the upper surface of the pcb board 5
It is provided with third groove 12.
Several apertures 13, the quantity of the quantity of the aperture 13 and the second groove 6 are provided on the solid silicon offset plate 3
It is identical and with the second groove 6 on same vertical direction, be conducive to increase solid silicon offset plate 3 heat dissipation performance;The U-shaped dissipates
The quantity of heat channel 4 is at least 8, advantageously ensures that the radiating efficiency of device entirety, improves the thermal conductivity of device;Described second is recessed
The shape of slot 6 and reflector 9 is disposed as semicircle, be conducive to reflector 9 can effective reflection light, while being conducive to seal
Fill the feeding of glue 10;The bottom of the third groove 12 is set as arc-shaped, is conducive to the circulation and water stain export of air.
Working principle: it is fixedly installed with fixed silica gel plate 3 on fixed pedestal 1, is provided with several on fixed silica gel plate 3
Aperture 13, the lower end of solid silicon offset plate 3 is provided with several U-shaped radiating grooves 4, and the heat generated in device can be quickly through solid
Aperture 13 on body silica gel plate 3 and solid silicon offset plate 3 is discharged from U-shaped radiating groove 4, while third groove is provided on pcb board 5
12, third groove 12 will increase the contact surface of device upper surface and air, increases heat dissipation effect, is additionally provided on pcb board 5
Ming tree membrane of lipoprotein 11, transparent resin film 11 can be water stain on effective absorption plant, and when water stain more, it is recessed to flow into third
It in slot 12, is flowed out from third groove 12, there is good waterproof effect, meanwhile, the second groove 6 is provided on pcb board 5,
Semicircular reflector 9 is fixedly installed on the side wall of second groove 6, when the work of LED chip 7 shines, reflector 9 can be uniform
Reflection light, prevent the difference due to LED luminous intensity and color and occur between LED and LED there are obvious luminous point and
The problem of color difference, is more in line with the market demand.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of full-color LED display screen COB encapsulation module, including fixed pedestal (1), it is characterised in that: the fixed pedestal (1)
Upper surface on be fixedly installed the first groove (2), on the fixed pedestal (1) in the first groove (2) bottom be fixedly mounted
Have solid silicon offset plate (3), the lower end of solid silicon offset plate (3) is provided with several U-shaped radiating grooves on the fixed pedestal (1)
(4), it is fixedly installed with pcb board (5) on the upper surface of the solid silicon offset plate (3), the two sides of pcb board (5) lower surface are equal
It is fixedly connected with the two sides of fixed pedestal (1) upper end, is provided with several the second grooves on the upper surface of the pcb board (5)
(6), it is fixedly installed with LED chip (7) on the pcb board (5) in the bottom of the second groove (6), table on the LED chip (7)
Two sides on face are fixedly connected to metal wire (8), are fixedly connected between the other end and pcb board (5) of the metal wire (8),
In being fixedly installed on the side wall of the second groove (6) reflector (9) on the pcb board (5), the upper end of the LED chip (7) is solid
Surely it is provided with packaging plastic (10), is fixedly installed with transparent resin film (11), the PCB on the upper surface on the pcb board (5)
Third groove (12) are fixedly installed between the second groove (6) on the upper surface of plate (5).
2. a kind of full-color LED display screen COB encapsulation module according to claim 1, it is characterised in that: the solid silicone
It is provided with several apertures (13) on plate (3), the quantity of the aperture (13) is identical as the quantity of the second groove (6) and with
Two grooves (6) are on same vertical direction.
3. a kind of full-color LED display screen COB encapsulation module according to claim 1, it is characterised in that: the U-shaped heat dissipation
The quantity of slot (4) is at least 8.
4. a kind of full-color LED display screen COB encapsulation module according to claim 1, it is characterised in that: second groove
(6) and the shape of reflector (9) is disposed as semicircle.
5. a kind of full-color LED display screen COB encapsulation module according to claim 1, it is characterised in that: the third groove
(12) bottom is set as arc-shaped.
Priority Applications (1)
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CN201820724521.5U CN208336278U (en) | 2018-05-16 | 2018-05-16 | A kind of full-color LED display screen COB encapsulation module |
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CN201820724521.5U CN208336278U (en) | 2018-05-16 | 2018-05-16 | A kind of full-color LED display screen COB encapsulation module |
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CN208336278U true CN208336278U (en) | 2019-01-04 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
CN113130467A (en) * | 2021-04-12 | 2021-07-16 | 深圳市科彤科技有限公司 | COB display panel with automatically adjusted contrast |
-
2018
- 2018-05-16 CN CN201820724521.5U patent/CN208336278U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
CN112582523B (en) * | 2020-12-03 | 2022-05-24 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
CN113130467A (en) * | 2021-04-12 | 2021-07-16 | 深圳市科彤科技有限公司 | COB display panel with automatically adjusted contrast |
CN113130467B (en) * | 2021-04-12 | 2022-10-18 | 深圳市科彤科技有限公司 | COB display panel with automatically adjusted contrast |
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