CN113690360A - Forming method and forming die for packaging wafer - Google Patents
Forming method and forming die for packaging wafer Download PDFInfo
- Publication number
- CN113690360A CN113690360A CN202110921115.4A CN202110921115A CN113690360A CN 113690360 A CN113690360 A CN 113690360A CN 202110921115 A CN202110921115 A CN 202110921115A CN 113690360 A CN113690360 A CN 113690360A
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- Prior art keywords
- wafer
- substrate
- glue
- glue injection
- molding
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 88
- 235000012431 wafers Nutrition 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000002347 injection Methods 0.000 claims abstract description 46
- 239000007924 injection Substances 0.000 claims abstract description 46
- 238000000465 moulding Methods 0.000 claims abstract description 37
- 238000005192 partition Methods 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 238000000748 compression moulding Methods 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000005086 pumping Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a molding method of a packaging wafer, which comprises the following steps: uniformly attaching the bottoms of the plurality of wafers to the substrate; injecting white glue into the wafer on the substrate; curing the substrate added with the white glue through a molding press; adding a partition for dividing the wafer into a plurality of regions; injecting fluorescent glue into each area formed by the partition plates in a separating mode, and starting a molding press to perform compression molding; the die-pressed wafer is diced to separate the wafers one by one. A molding die for packaging a wafer, used for die-molding the wafer, comprises a die-molding device; the die assembly comprises a bottom plate, a pressing plate and a substrate; the pressing plate is provided with a movement mechanism; the bottom plate is provided with a groove; the base plate is provided with a coaming; the glue injection pipe is arranged on the bottom plate; the glue injection pipe is rotationally connected with the bottom plate; an outlet of the glue injection pipe is provided with a glue injection head; the glue injection head is provided with a plurality of glue injection ports which are uniformly distributed on the glue injection head. The problem of uneven distribution of the fluorescent glue is reduced in the compression molding process.
Description
Technical Field
The invention relates to the field of wafer molding, in particular to a molding method and a molding die for packaging a wafer.
Background
Along with the social use demand of LED products becoming larger and larger, manufacturers producing LEDs are also becoming more and more, the competitive pressure of LED manufacturers is also becoming larger and larger, and in the face of the existing market, manufacturers need to continuously find manufacturing processes capable of reducing the production cost and improve the quality of the produced LEDs. In the existing LED production process, after fluorescent glue is injected into a wafer, the fluorescent glue is easily distributed unevenly in a pressing die, and the quality of a product is affected.
Disclosure of Invention
The invention aims to design a molding method and a molding die of a packaging wafer, so that the product quality of an LED is improved.
In order to achieve the purpose, the invention provides the following technical scheme: a molding method of a packaged wafer comprises the following steps:
a step of die bonding: uniformly attaching the bottoms of the plurality of wafers to the substrate; injecting white glue into the wafer on the substrate; curing the substrate added with the white glue through a molding press; adding a partition plate for dividing the wafer into a plurality of areas after solidification;
and (3) a mould pressing step: injecting fluorescent glue into each area formed by the partition plates in a separating mode, and starting a molding press to perform compression molding;
cutting: the die-pressed wafer is cut into individual wafers.
Further, a plurality of wafers are distributed on the substrate in a rectangular array.
Further, the partition board is made of a PET yellow film material; the number of the partition plates is multiple, and the partition plates are fixedly connected with one another to form a plurality of same grid shapes.
Further, the white glue is silica gel.
Further, the wafer is subjected to roll dicing with a resin blade in the dicing step.
A molding die for packaging a wafer is characterized by comprising a die assembly; the die assembly comprises a bottom plate, a pressing plate and a substrate; the pressing plate is provided with a driving mechanism capable of driving the pressing plate to be far away from or close to the bottom plate; the bottom plate is provided with a groove matched with the pressing plate and the substrate; surrounding plates matched with the substrate are arranged on the periphery of the substrate; the upper surface of the substrate is used for bearing a wafer; a glue injection pipe for injecting fluorescent glue is arranged on the bottom plate; the glue injection pipe is rotationally connected with the bottom plate; an outlet of the glue injection pipe is provided with a glue injection head; the glue injection head is provided with a plurality of glue injection ports, and the glue injection ports are uniformly distributed on the glue injection head; the pressure plate is connected with the contact part at the upper end of the groove in a sealing mode.
Further, the upper surface of the substrate is provided with a UV film.
Further, the bottom plate and the pressing plate are both provided with heating plates.
Furthermore, an air pumping hole is formed in the groove; the air pumping port is connected with an air pumping pump through a pipeline.
Further, the driving mechanism is hydraulically driven.
Compared with the prior art, the invention has the beneficial effects that: by optimizing the packaging method of the wafer, the partition plate is added, and the fluorescent glue is injected into the area surrounded by the partition plate, so that the problem of uneven distribution of the fluorescent glue is reduced in the die pressing process. Meanwhile, the fluorescent glue injection port of the molding press is improved, the glue injection head is provided with the glue injection port above the area surrounded by each partition plate, and the fluorescent glue can be uniformly distributed on the wafer in the molding press process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a forming die of the present invention;
FIG. 2 is a schematic diagram of the glue injection head of the present invention;
FIG. 3 is a schematic view of a base plate and a shroud of the present invention;
FIG. 4 is a schematic view of a separator plate according to the present invention;
FIG. 5 is a schematic view of the wafer of the present invention after it is molded;
the names of the components identified in the figures are as follows:
1. a base plate; 2. pressing a plate; 3. a substrate; 4. a groove; 5. a wafer; 6. enclosing plates; 7. a partition plate; 8. a glue injection pipe; 9. a glue injection head; 10. injecting glue holes; 11. fluorescent glue; 12. white glue; 13. and (5) UV films.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the description is only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Example (b):
a molding method of a packaged wafer comprises the following steps:
a step of die bonding: uniformly attaching the bottoms of a plurality of wafers 5 to the substrate 3; injecting white glue 12 into the wafer 5 on the substrate 3; curing the substrate 3 added with the white glue 12 by a molding press; after curing, spacers 7 are added to divide the wafer 5 into a plurality of regions; among the plurality of regions divided by the partition 7, there are a plurality of wafers in each region.
And (3) a mould pressing step: injecting fluorescent glue 11 into each area partitioned by the partition plate 7, and starting a molding press to perform compression molding;
cutting: the die-pressed wafer 5 is cut into individual wafers.
A plurality of wafers are distributed on the substrate in a rectangular array. The rectangular array of wafers 5 facilitates subsequent dicing operations. The resin blade is prevented from cutting to the wafer 5 during rolling.
The partition board 7 is made of a PET yellow film material; the number of the partition boards 7 is plural, and the plural partition boards 7 are fixedly connected with each other to form plural same grid shapes. The PET yellow film material is adopted, so that the separation of the partition board 7 and the fluorescent glue 11 is facilitated, and the pressure of the pressing board 2 can be borne without deformation.
The white glue 12 is silica gel. The silica gel has stronger wear resistance and ensures the quality of products.
The wafer 5 is subjected to roll dicing with a resin blade in the dicing step. Each wafer 5 can be rapidly separated by rolling cutting with a resin knife, and the production efficiency is improved.
A molding die for encapsulating a wafer, for press-molding a wafer 5, includes a press-molding device; the die assembly comprises a bottom plate 1, a pressing plate 2 and a substrate 3; the pressing plate 2 is provided with a driving mechanism which can drive the pressing plate to be far away from or close to the bottom plate 1; the bottom plate 1 is provided with a groove 4 matched with the pressing plate 2 and the substrate 3; surrounding plates 6 matched with the substrate 3 are arranged on the periphery of the substrate; the upper surface of the substrate 3 is used for bearing a wafer 5; a glue injection pipe 8 for injecting fluorescent glue is arranged on the bottom plate 1; the glue injection pipe 8 is rotatably connected with the bottom plate 1; an outlet of the glue injection pipe 8 is provided with a glue injection head 9; the glue injection head 9 is provided with a plurality of glue injection ports, and the glue injection ports are uniformly distributed on the glue injection head 9; the contact part of the pressure plate 2 and the upper end of the groove 4 adopts sealing connection.
The upper surface of the substrate 3 is provided with a UV film 13. The UV film 13 is attached to the substrate and the wafer is attached to the UV film. The UV film 13 on the substrate 3 can adsorb the wafer 5 on the substrate 3, so that the wafer 5 cut and separated by the resin knife cannot fall off randomly or influence the work of the resin knife.
The bottom plate 1 and the pressing plate 2 are both provided with heating plates. The heating plate can change the temperature of the substrate 3, so that the curing time of the white glue 12 and the fluorescent glue 11 on the substrate 3 is shortened.
An air exhaust port is arranged in the groove 4; the air pumping port is connected with an air pumping pump through a pipeline. The grooves 4 are vacuumized, so that air bubbles cannot remain in the cured white glue 12 and the cured fluorescent glue 11, and the quality of products is improved.
The driving mechanism is a hydraulic driving mechanism, and the driving mechanism of the embodiment includes, but is not limited to, a hydraulic driving mechanism, a motor driving mechanism or a screw rod driving mechanism. The hydraulic drive can provide enough power for the pressing plate 2, and the pressure of the pressing plate 2 on the substrate 3 and the tightness of the groove 4 are ensured.
The working principle of the embodiment is as follows:
a UV film 13 is attached to the substrate 3 and the robot attaches the wafers 5 to the UV film 13 one by one to form a matrix of wafers 5 with the same gap. The substrate 3 fully attached with the wafer 5 is placed in the groove 4, the surrounding plate 6 is sleeved on the substrate 3, then the white glue 12 is injected, the white glue 12 is heated and cured, and after the white glue 12 is cured, the partition plates 7 are added to divide the wafer 5 into a plurality of areas. The glue injection pipe 8 is rotated to enable the glue injection head 9 to move to the upper side of the substrate 3, a glue injection port in the glue injection head 9 is aligned to each area enclosed by the partition plates 7, fluorescent glue is injected into each area, and after glue injection is completed, the glue injection pipe 8 stops glue discharging and rotates reversely to the initial position. The pressing plate 2 moves downwards to press the substrate 3, and meanwhile, the groove 4 is sealed into a closed space, and the air suction pump is used for vacuumizing the closed space. So that the closed space is maintained at a stable vacuum degree. The heating plates of the bottom plate 1 and the pressure plate 2 work to provide a high-temperature environment for the closed space, and the fluorescent glue 11 is cured under the high-temperature and high-pressure environment. After the curing time is finished, the coaming 6 and the partition 7 are taken out, the substrate 3 is placed under the resin knife, the driving motor of the resin knife is started, the rotating resin knife rolls on the wafer 5, and the wafer 5 is cut into individual wafers. Finally, the individual wafers are collected.
The invention has the beneficial effects that: by optimizing the packaging method of the wafer 5, the partition plate 7 is added, and the fluorescent glue 11 is injected into the area surrounded by the partition plate 7, so that the problem of uneven distribution of the fluorescent glue 11 is reduced in the compression molding process. Meanwhile, the glue injection port of the fluorescent glue of the molding press is improved, the glue injection head 9 is provided with the glue injection port above the area enclosed by each partition plate 7, and the fluorescent glue 11 in the molding press process can be uniformly distributed on the wafer 5.
Claims (10)
1. A molding method of a packaged wafer is characterized by comprising the following steps:
a step of die bonding: uniformly attaching the bottoms of the plurality of wafers to the substrate; injecting white glue into the wafer on the substrate; curing the substrate added with the white glue through a molding press; adding a partition plate for dividing the wafer into a plurality of areas after solidification;
and (3) a mould pressing step: injecting fluorescent glue into each area formed by the partition plates in a separating mode, and starting a molding press to perform compression molding;
cutting: the die-pressed wafer is cut into individual wafers.
2. The molding method of the packaged wafer as claimed in claim 1, wherein: the plurality of wafers are distributed on the substrate in a rectangular array.
3. The molding method of the packaged wafer as claimed in claim 1, wherein: the partition board is made of a PET yellow film material; the number of the partition plates is multiple, and the partition plates are fixedly connected with one another to form a plurality of same grid shapes.
4. The molding method of the packaged wafer as claimed in claim 1, wherein: the white glue is silica gel.
5. The molding method of the packaged wafer as claimed in claim 1, wherein: the wafer is subjected to roll dicing with a resin blade in the dicing step.
6. A molding die for packaging a wafer is characterized by comprising a die assembly; the die assembly comprises a bottom plate, a pressing plate and a substrate; the pressing plate is provided with a driving mechanism capable of driving the pressing plate to be far away from or close to the bottom plate; the bottom plate is provided with a groove matched with the pressing plate and the substrate; surrounding plates matched with the substrate are arranged on the periphery of the substrate; the upper surface of the substrate is used for bearing a wafer; a glue injection pipe for injecting fluorescent glue is arranged on the bottom plate; the glue injection pipe is rotationally connected with the bottom plate; an outlet of the glue injection pipe is provided with a glue injection head; the glue injection head is provided with a plurality of glue injection ports, and the glue injection ports are uniformly distributed on the glue injection head; the pressure plate is connected with the contact part at the upper end of the groove in a sealing mode.
7. The molding die for packaging a wafer according to claim 5, wherein: and the upper surface of the substrate is provided with a UV film.
8. The molding die for packaging a wafer according to claim 5, wherein: the bottom plate with the clamp plate all is equipped with the hot plate.
9. The molding die for packaging a wafer according to claim 5, wherein: an air extraction opening is formed in the groove; the air pumping port is connected with an air pumping pump through a pipeline.
10. The molding die for packaging a wafer according to claim 5, wherein: the driving mechanism is hydraulically driven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110921115.4A CN113690360A (en) | 2021-08-11 | 2021-08-11 | Forming method and forming die for packaging wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110921115.4A CN113690360A (en) | 2021-08-11 | 2021-08-11 | Forming method and forming die for packaging wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113690360A true CN113690360A (en) | 2021-11-23 |
Family
ID=78579580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110921115.4A Pending CN113690360A (en) | 2021-08-11 | 2021-08-11 | Forming method and forming die for packaging wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113690360A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851826A (en) * | 2014-02-18 | 2015-08-19 | 信越化学工业株式会社 | Vacuum laminating apparatus and method for manufacturing semiconductor apparatus |
| CN108091749A (en) * | 2017-12-22 | 2018-05-29 | 鸿利智汇集团股份有限公司 | A kind of manufacturing method of CSP |
| CN108448012A (en) * | 2018-03-01 | 2018-08-24 | 佛山市国星光电股份有限公司 | All-colour LED display module and its packaging method and display screen |
| US20180277725A1 (en) * | 2015-05-29 | 2018-09-27 | Hongli Zhihui Group Co.,Ltd. | Method of packaging csp led and csp led |
| CN108724566A (en) * | 2018-05-04 | 2018-11-02 | 深圳市德彩光电有限公司 | The encapsulating die and glue-pouring method of LED light source |
| CN111106219A (en) * | 2018-10-25 | 2020-05-05 | 江苏罗化新材料有限公司 | High-color-gamut CSP LED and manufacturing process thereof |
| CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
-
2021
- 2021-08-11 CN CN202110921115.4A patent/CN113690360A/en active Pending
Patent Citations (7)
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|---|---|---|---|---|
| CN104851826A (en) * | 2014-02-18 | 2015-08-19 | 信越化学工业株式会社 | Vacuum laminating apparatus and method for manufacturing semiconductor apparatus |
| US20180277725A1 (en) * | 2015-05-29 | 2018-09-27 | Hongli Zhihui Group Co.,Ltd. | Method of packaging csp led and csp led |
| CN108091749A (en) * | 2017-12-22 | 2018-05-29 | 鸿利智汇集团股份有限公司 | A kind of manufacturing method of CSP |
| CN108448012A (en) * | 2018-03-01 | 2018-08-24 | 佛山市国星光电股份有限公司 | All-colour LED display module and its packaging method and display screen |
| CN108724566A (en) * | 2018-05-04 | 2018-11-02 | 深圳市德彩光电有限公司 | The encapsulating die and glue-pouring method of LED light source |
| CN111106219A (en) * | 2018-10-25 | 2020-05-05 | 江苏罗化新材料有限公司 | High-color-gamut CSP LED and manufacturing process thereof |
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