JP2010118531A - White lighting system and lighting fixture for vehicle - Google Patents

White lighting system and lighting fixture for vehicle Download PDF

Info

Publication number
JP2010118531A
JP2010118531A JP2008291151A JP2008291151A JP2010118531A JP 2010118531 A JP2010118531 A JP 2010118531A JP 2008291151 A JP2008291151 A JP 2008291151A JP 2008291151 A JP2008291151 A JP 2008291151A JP 2010118531 A JP2010118531 A JP 2010118531A
Authority
JP
Japan
Prior art keywords
light
phosphor layer
distance
light emitting
emitting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008291151A
Other languages
Japanese (ja)
Inventor
Yasuyuki Kawakami
康之 川上
Tsutomu Akagi
努 赤木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2008291151A priority Critical patent/JP2010118531A/en
Publication of JP2010118531A publication Critical patent/JP2010118531A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system having large luminance, a small temperature increase, and improved chromaticity uniformity, where a plurality of LED chips are arranged linearly. <P>SOLUTION: The lighting system includes: a plurality of light-emitting elements 2 arranged in a line with a prescribed interval; and a phosphor layer 3 for integrally covering the upper and side faces of the plurality of light-emitting elements 2. The interval (d1) of the light-emitting elements is nearly equal to distance (d2) between the side face of the light-emitting elements and that of the phosphor layer 3, thus preventing a change in chromaticity from appearing periodically in illumination light. Also, a film thickness (d3) of the phosphor layer is reduced as compared with d1 or d2, thus further preferably preventing a phenomenon, where emission light (excitation light) from the light-emitting elements has a strong color taste at edges of illumination light. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、一列に並べて配置したLED(半導体発光素子)を光源とする照明装置、特に、自動車用前照灯等の車両用灯具に関する。   The present invention relates to an illumination device that uses LEDs (semiconductor light emitting elements) arranged in a line as a light source, and more particularly, to a vehicular lamp such as an automotive headlamp.

LEDを用いた照明装置では、明るさを稼ぐために複数のLEDチップを用い、これを所定形状に配列した構成とするのが一般的である。特許文献1〜3には、LEDチップを複数配列した光源の例が記載されている。   In an illuminating device using LEDs, a plurality of LED chips are generally used in order to increase brightness, and are arranged in a predetermined shape. Patent Documents 1 to 3 describe examples of light sources in which a plurality of LED chips are arranged.

LEDを光源とした照明装置の中でも車輛用灯具は、発光形状が矩形をしていること(特許文献1)、照射面全体に渡って色度を均一にすること(特許文献2)が重要である。特許文献1には、配列したLEDチップの発光面の短辺と長辺との比が1:2〜1:6の範囲になるように設計することにより発光形状を矩形にしたLED光源が開示されている。特許文献2には、複数のLEDチップとこれを覆う蛍光体層の間に透光性の樹脂層を配置することにより照射面内の色度を均一にする発明が開示されている。   Among lighting devices using LEDs as light sources, it is important that vehicle lamps have a rectangular light emission shape (Patent Document 1) and that the chromaticity is uniform over the entire irradiated surface (Patent Document 2). is there. Patent Document 1 discloses an LED light source in which the light emission shape is rectangular by designing the ratio of the short side and long side of the light emitting surface of the arranged LED chips to be in the range of 1: 2 to 1: 6. Has been. Patent Document 2 discloses an invention in which the chromaticity in the irradiation surface is made uniform by disposing a translucent resin layer between a plurality of LED chips and a phosphor layer covering the LED chips.

また、特許文献1の図2には、配列した複数のLEDチップの周りに蛍光体を配置して白色光源を製造することが開示されている。   FIG. 2 of Patent Document 1 discloses that a white light source is manufactured by arranging phosphors around a plurality of arranged LED chips.

特開2006−048934号公開公報JP 2006-048934 A 特開2005−109434号公開公報JP 2005-109434 A 特開2007−281473号公開公報JP 2007-281473 A

複数のLEDチップを配列した光源と、レンズや反射面を組み合わせた光学系では、LEDチップの間隔を詰めて配置した方が点光源として取り扱えるため好ましい。このことは、それぞれのチップの配光特性のズレが小さくなり、最高輝度を高くできることを意味している。特に車輌用灯具等ではこの最高輝度が重要である。しかしながら、LEDチップの間隔を詰めると放熱特性が低下するという問題が生じる。特に車輛用灯具では輝度を高くする必要があるために、LEDチップに大電流を投入しているため、放熱特性が低いとLEDチップ部分で大きな発熱を伴ってしまい、発光効率が低下する等の問題を生じる。   In an optical system in which a light source in which a plurality of LED chips are arranged and a lens or a reflecting surface is combined, it is preferable to arrange the LED chips with a small space between them so that it can be handled as a point light source. This means that the deviation of the light distribution characteristics of each chip is reduced and the maximum luminance can be increased. This maximum brightness is particularly important for vehicle lamps and the like. However, if the space between the LED chips is reduced, there arises a problem that the heat dissipation characteristics are deteriorated. In particular, since it is necessary to increase the brightness of the vehicle lamp, a large current is supplied to the LED chip. Therefore, if the heat dissipation characteristic is low, the LED chip part generates a large amount of heat, resulting in a decrease in luminous efficiency. Cause problems.

また、車輛用灯具に用いられるLED光源は、指向性を高めるために、通常LEDチップを水平方向に一列に配置した構成である。このため、LEDチップ列を複数の並べて配置する他の一般照明のように、複数のLEDチップ列の発する光束を相互に重ね合わせて均一化することができず、一列に配置したLEDチップから色度および輝度の均一性に優れた光を出射させることが必要である。   Moreover, the LED light source used for the vehicle lamp has a configuration in which LED chips are usually arranged in a line in the horizontal direction in order to enhance directivity. For this reason, unlike other general illuminations in which a plurality of LED chip rows are arranged side by side, the light beams emitted from the plurality of LED chip rows cannot be overlapped and made uniform, and the colors from the LED chips arranged in a row cannot be obtained. It is necessary to emit light with excellent uniformity of brightness and brightness.

本発明の目的は、複数のLEDチップを直線状に配列した照明装置であって、輝度が大きく、温度上昇が少なく、色度の均一性に優れた照明装置を提供することを目的とする。   An object of the present invention is to provide an illuminating device in which a plurality of LED chips are linearly arranged, which has a large luminance, a small temperature rise, and an excellent chromaticity uniformity.

上記目的を達成するために、本発明では、所定の間隔をあけて一列に配置された複数の発光素子と、複数の発光素子の上面および側面を一体に覆う蛍光体層とを有する照明装置であって、隣接する発光素子の間隔(d1)は、発光素子の側面と蛍光体層の側面との距離(d2)と略等しい構成とした白色照明装置を提供する。d1とd2とを略等しい関係に設計することにより、照明光に周期的な色度変化が表れるのを防止することができる。   In order to achieve the above object, according to the present invention, there is provided a lighting device having a plurality of light emitting elements arranged in a row at a predetermined interval, and a phosphor layer that integrally covers the upper surface and side surfaces of the plurality of light emitting elements. Thus, a white illumination device is provided in which the interval (d1) between adjacent light emitting elements is substantially equal to the distance (d2) between the side surface of the light emitting element and the side surface of the phosphor layer. By designing d1 and d2 to be substantially equal, it is possible to prevent periodic chromaticity changes from appearing in the illumination light.

上述の発光素子上面における前記蛍光体層の膜厚(d3)は、発光素子の間隔(d1)、または、発光素子の側面と蛍光体層の側面との距離(d2)よりも小さい場合には、照明光のエッジ部分において発光素子の出射光(励起光)の色みが強い白色光となる現象を防止できるためさらに好ましい。   The film thickness (d3) of the phosphor layer on the upper surface of the light emitting element is smaller than the distance (d1) between the light emitting elements or the distance (d2) between the side surface of the light emitting element and the side surface of the phosphor layer. Further, it is more preferable because the phenomenon that the light emitted from the light emitting element (excitation light) becomes white light at the edge portion of the illumination light can be prevented.

また、本発明の別の態様としては、車輛用灯具が提供される。すなわち、ランプハウジングと、ランプハウジング内に配置された白色光源と、白色光源から出射された光が通過する位置に配置された投光レンズとを有する車輛用灯具であって、白色光源は、所定の間隔をあけて一列に配置された複数の発光素子と、該複数の発光素子の上面および側面を一体に覆う蛍光体層とを有し、隣接する発光素子の間隔(d1)は、発光素子の側面と蛍光体層の側面との距離(d2)と略等しい構成としたものである。これにより、車輛用灯具の照明光に周期的な色度変化が表れるのを防止することができる。   As another aspect of the present invention, a vehicle lamp is provided. That is, a vehicle lamp having a lamp housing, a white light source disposed in the lamp housing, and a light projecting lens disposed at a position through which light emitted from the white light source passes, the white light source being a predetermined light source A plurality of light emitting elements arranged in a row with a spacing of and a phosphor layer that integrally covers the top and side surfaces of the plurality of light emitting elements, and the interval (d1) between adjacent light emitting elements is the light emitting element The distance between the side surface and the side surface of the phosphor layer is substantially equal to the distance (d2). Thereby, it is possible to prevent periodic chromaticity changes from appearing in the illumination light of the vehicle lamp.

また、上記車輛用灯具において、発光素子上面における蛍光体層の膜厚(d3)が、発光素子の間隔(d1)、または、発光素子の側面と前記蛍光体層の側面との距離(d2)よりも小さい場合には、照明光のエッジ部分において発光素子の出射光(励起光)の色みが強い白色光となる現象を防止できるためさらに好ましい。   Further, in the vehicle lamp, the thickness (d3) of the phosphor layer on the upper surface of the light emitting element is the distance (d1) between the light emitting elements, or the distance (d2) between the side surface of the light emitting element and the side surface of the phosphor layer. Is smaller than that, since it is possible to prevent a phenomenon in which the emitted light (excitation light) of the light emitting element becomes white light at the edge portion of the illumination light, which is further preferable.

複数のLEDチップを一列に配置した照明装置であっても、色度の均一性低下、輝度低下、温度上昇等を防止することができる。特にレンズや反射面と組み合わされた車輌用灯具に最適な白色照明装置(光源)を得ることができる。   Even in a lighting device in which a plurality of LED chips are arranged in a row, it is possible to prevent a decrease in chromaticity uniformity, a decrease in luminance, an increase in temperature, and the like. In particular, it is possible to obtain a white illumination device (light source) that is most suitable for a vehicular lamp combined with a lens or a reflecting surface.

以下、本発明の一実施の形態を図1〜図3を用いて詳細に説明する。   Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.

本実施形態の白色照明装置の斜視図を図1に、A−A’断面図を図2に示す。図1および図2のように、白色照明装置1は、予め配線が形成された基板4上に複数のLEDチップ2(ここでは4個)を一列に並べて配置し、複数のLEDチップ2の上面および側面を蛍光体層3で一体に覆った構成である。蛍光体層3の外形は矩形状である。   FIG. 1 is a perspective view of the white illumination device of this embodiment, and FIG. 2 is a cross-sectional view taken along the line A-A ′. As shown in FIGS. 1 and 2, the white lighting device 1 has a plurality of LED chips 2 (four in this case) arranged in a line on a substrate 4 on which wiring is formed in advance, and the upper surface of the plurality of LED chips 2. And the side surface is integrally covered with the phosphor layer 3. The outer shape of the phosphor layer 3 is rectangular.

図1のように隣り合うLEDチップ2間の距離をd1として、LEDチップ2側面と蛍光体層3の側面との距離をd2とする。図2のようにLEDチップ2の上面における蛍光体層3の厚さをd3とする。   As shown in FIG. 1, the distance between adjacent LED chips 2 is d1, and the distance between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 is d2. As shown in FIG. 2, the thickness of the phosphor layer 3 on the upper surface of the LED chip 2 is d3.

LEDチップ2は、フリップチップであり、図示していないがLED基板上に活性層を含む発光層を搭載し、その上に所定形状の電極層を備えた構成である。LEDチップ2は、LED基板を上方に向け、電極層を基板4側に向けて、基板4に搭載されている。電極層は、基板4上の配線にボンディングされている。LED基板としては、発光層の発する光に対して透明な材質が用いられている。   The LED chip 2 is a flip chip, and has a configuration in which a light emitting layer including an active layer is mounted on an LED substrate, and an electrode layer having a predetermined shape is provided thereon, although not shown. The LED chip 2 is mounted on the substrate 4 with the LED substrate facing upward and the electrode layer facing the substrate 4 side. The electrode layer is bonded to the wiring on the substrate 4. As the LED substrate, a material transparent to the light emitted from the light emitting layer is used.

LEDチップ2の発光層は、上面および側面から青色光を発するように構成されている。蛍光体層3には、青色光を励起光として黄色の蛍光を発する蛍光体(例えばYAG系蛍光体等)を含有する。   The light emitting layer of the LED chip 2 is configured to emit blue light from the upper surface and side surfaces. The phosphor layer 3 contains a phosphor that emits yellow fluorescence using blue light as excitation light (for example, a YAG phosphor).

よって、LEDチップ2から発せられた青色光は、蛍光体層3に入射し、青色光の一部は蛍光体を励起し、黄色光(蛍光)に変換される。残りの青色光は、青色光のまま蛍光体層3を透過する。これにより、黄色光(蛍光)と青色光とが混合され、白色光が出射される。   Therefore, the blue light emitted from the LED chip 2 enters the phosphor layer 3, and part of the blue light excites the phosphor and is converted into yellow light (fluorescence). The remaining blue light passes through the phosphor layer 3 as blue light. Thereby, yellow light (fluorescence) and blue light are mixed, and white light is emitted.

本実施形態では、隣り合うLEDチップ2間の距離(d1)と、チップ2側面と蛍光体層3側面との距離(d2)とがほぼ等しくなるように、複数のLEDチップ2の配置と蛍光体層3の形状を定めている。さらに、この条件に加えて、チップ2上面の蛍光体層3の膜厚(d3)が、チップ2間の距離(d1)、もしくは、チップ2側面と蛍光体層3側面との距離(d2)より小さくなるように、複数のLEDチップ2と蛍光体層3を配置することが望ましい。   In the present embodiment, the arrangement and fluorescence of the plurality of LED chips 2 are set so that the distance (d1) between the adjacent LED chips 2 and the distance (d2) between the side surface of the chip 2 and the side surface of the phosphor layer 3 are substantially equal. The shape of the body layer 3 is defined. Further, in addition to this condition, the thickness (d3) of the phosphor layer 3 on the top surface of the chip 2 is the distance (d1) between the chips 2 or the distance (d2) between the side surface of the chip 2 and the side surface of the phosphor layer 3. It is desirable to arrange a plurality of LED chips 2 and phosphor layers 3 so as to be smaller.

これら距離d1、d2、d3を上述の様に定めるのは下記の理由による。   These distances d1, d2, and d3 are determined as described above for the following reason.

(1)隣り合うLEDチップ2間の距離d1は、点光源として取り扱いを可能にし、最高輝度を高くするために、できるだけ小さいほうが好ましい。LEDチップ2間の距離d1が小さければ、発光面積が小さくなり、点光源に近くなるため、レンズや反射面の設計をしやすくなるとともに、光量に対する発光面積も小さくなり最高輝度も向上する。   (1) The distance d1 between adjacent LED chips 2 is preferably as small as possible in order to enable handling as a point light source and increase the maximum luminance. If the distance d1 between the LED chips 2 is small, the light emitting area becomes small and becomes close to a point light source, so that it becomes easy to design a lens and a reflecting surface, and the light emitting area with respect to the amount of light becomes small and the maximum luminance is improved.

(2)一方、放熱性を考慮するとLEDチップ2間の距離d1は、大きい方が有利である。   (2) On the other hand, in consideration of heat dissipation, it is advantageous that the distance d1 between the LED chips 2 is larger.

(3)LEDチップ2側面と蛍光体層3側面との距離d2は、チップ2間距離d1と無関係に決めて良さそうであるが、チップ2間距離d1が、チップ2側面と蛍光体層3側面との距離d2に比べて大きい場合には、一列に並んだ複数のチップ2の配列に対応した周期的な色度変化が生じ、チップ2上面から出射する白色光の色度均一性が悪くなってしまう。   (3) The distance d2 between the LED chip 2 side surface and the phosphor layer 3 side surface seems to be determined regardless of the distance d1 between the chips 2, but the distance d1 between the chips 2 is equal to the side surface 2 of the chip 2 and the phosphor layer 3 When the distance d2 is larger than the distance d2 from the side surface, a periodic chromaticity change corresponding to the arrangement of the plurality of chips 2 arranged in a row occurs, and the chromaticity uniformity of the white light emitted from the upper surface of the chip 2 is poor. turn into.

すなわち、図3に示したように、チップ2間距離d1が、チップ2側面と蛍光体層3側面との距離d2よりも大きい場合、隣接するチップ2の間に存在する蛍光体量が、チップ2側面と蛍光体層3側面との間に存在する蛍光体量よりも多くなり、隣接するチップ2の間の領域31における黄色光(蛍光)の発生量が、チップ2側面と蛍光体層3側面との間における黄色光の発生量よりも増加する。このため、隣接するチップ2の間の領域31から出射される白色光の黄色みが周囲の領域30の白色光よりも強くなり、LEDチップ2の間隙ごとに周期的に黄色みが強いという色度変化を生じる。   That is, as shown in FIG. 3, when the distance d1 between the chips 2 is larger than the distance d2 between the side surface of the chip 2 and the side surface of the phosphor layer 3, the amount of phosphor existing between the adjacent chips 2 is More than the amount of phosphor existing between the two side surfaces and the phosphor layer 3 side surface, the amount of yellow light (fluorescence) generated in the region 31 between the adjacent chips 2 is reduced. It increases more than the amount of yellow light generated between the sides. For this reason, the yellow color of the white light emitted from the region 31 between the adjacent chips 2 is stronger than the white light of the surrounding region 30, and the yellow color is periodically strong for each gap between the LED chips 2. A degree change occurs.

このような周期的な色度変化を生じるLED照明装置を灯具として用いると、照射光の中心部分に周期的な色度変化が現れるため、甚だ品位の悪いものになってしまう。   When an LED lighting device that generates such a periodic chromaticity change is used as a lamp, a periodic chromaticity change appears in the central portion of the irradiation light, resulting in a very poor quality.

(4)チップ2側面と蛍光体層3側面との距離d2が、チップ2上面の蛍光体層3の膜厚d3よりも小さい場合には、LEDチップ列の側面から出射される光が、上面から出射される光より励起光(LEDチップの出射光)の色みが強くなる。すなわち、図4のようにカットオフラインを形成する照明光のエッジ部分41において、周辺領域40よりも励起光色が強く出る現象が生じる。   (4) When the distance d2 between the side surface of the chip 2 and the side surface of the phosphor layer 3 is smaller than the film thickness d3 of the phosphor layer 3 on the top surface of the chip 2, the light emitted from the side surface of the LED chip array is The color of the excitation light (light emitted from the LED chip) becomes stronger than the light emitted from the LED. That is, as shown in FIG. 4, a phenomenon occurs in which the excitation light color is more intense than the peripheral region 40 in the edge portion 41 of the illumination light that forms the cut-off line.

この現象は、LEDチップ2の上面と側面とで戻り光の反射率が異なることに起因する。図2に示すようにLEDチップ2から上面方向に出射された光20の一部が蛍光体の内部で反射されLEDチップ2側への戻り光21となった場合、LEDチップ2の主平面にほぼ垂直な方向から入射するためLEDチップ2の構造上、活性層の界面や電極膜で反射され、再び上面方向に向かう光22となる。これにより、LEDチップ2上面の蛍光体層3を再度通過し蛍光を発光させる。これに対し、LEDチップ2の側面方向に出射された光23の一部が、蛍光体の内部で反射され、LEDチップ2への戻り光24となった場合、LEDチップ2の主平面に平行な方向からLEDチップ2に入射するため、多くは活性層や電極で吸収され、反射される光はわずかである。このため、再び側面方向に向かう光は少なく、再び蛍光体層3を通過して蛍光を発光させる光量も少ない。   This phenomenon is caused by the fact that the reflectance of the return light is different between the upper surface and the side surface of the LED chip 2. As shown in FIG. 2, when a part of the light 20 emitted from the LED chip 2 in the upper surface direction is reflected inside the phosphor and becomes return light 21 toward the LED chip 2, the main surface of the LED chip 2 is reflected. Since the light is incident from a substantially vertical direction, the light is reflected by the interface of the active layer and the electrode film on the structure of the LED chip 2 and becomes light 22 toward the upper surface again. Thereby, it passes again through the phosphor layer 3 on the upper surface of the LED chip 2 to emit fluorescence. On the other hand, when a part of the light 23 emitted in the side surface direction of the LED chip 2 is reflected inside the phosphor and becomes return light 24 to the LED chip 2, it is parallel to the main plane of the LED chip 2. Since the light is incident on the LED chip 2 from any direction, most of the light is absorbed by the active layer and the electrode, and the reflected light is very small. For this reason, there is little light which goes to a side surface again, and there is also little light quantity which passes the fluorescent substance layer 3 again and light-emits fluorescence.

このため、LEDチップ2の上面方向については、蛍光体層3の膜厚d3が薄くても十分な蛍光を発するのに対し、LEDチップ2の側面の蛍光体層3は、LEDチップ2の側面と蛍光体層3側面との距離d2が小さい場合には、十分な蛍光を発することができず、青色光(励起光)の色みが強くなる。   For this reason, in the upper surface direction of the LED chip 2, the phosphor layer 3 on the side surface of the LED chip 2 emits sufficient fluorescence even when the film thickness d3 of the phosphor layer 3 is thin. When the distance d2 between the phosphor layer 3 and the side surface of the phosphor layer 3 is small, sufficient fluorescence cannot be emitted and the color of blue light (excitation light) becomes strong.

これが照射光のエッジ部分41、いわゆるカットオフラインに現れ、励起光色ムラとして容易に識別できるようになる原因であり、照明光の品位を低下させる。   This appears in the edge portion 41 of the irradiation light, so-called cut-off line, and can be easily identified as excitation light color unevenness, and deteriorates the quality of the illumination light.

これらの考え方に従って、各寸法に関して鋭意検討を重ねた結果、白色照明装置が以下の(a)または(b)の関係を満たす時に、輝度が大きく、温度上昇が少なく、色度の均一性に優れた照明装置を提供することができることを見出した。特にレンズや反射面と組み合わされた車輌用灯具において優れた光源を得ることができる。
(a)隣り合うLEDチップ2間の距離d1とLEDチップ2の側面と蛍光体層3側面との距離d2がほぼ等しい。
(b)隣り合うLEDチップ2間の距離d1と、LEDチップ2の側面と蛍光体層3側面との距離d2とがほぼ等しく、かつ、LEDチップ2上面の蛍光体層3の膜厚d3が、LEDチップ2間距離d1およびLEDチップ2の側面と蛍光体層3側面との距離d2より小さい。
As a result of intensive studies on each dimension according to these ideas, when the white lighting device satisfies the following relationship (a) or (b), the brightness is large, the temperature rise is small, and the chromaticity uniformity is excellent. It was found that a lighting device can be provided. In particular, an excellent light source can be obtained in a vehicular lamp combined with a lens or a reflecting surface.
(a) The distance d1 between the adjacent LED chips 2 and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 are substantially equal.
(b) The distance d1 between the adjacent LED chips 2 and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 are substantially equal, and the film thickness d3 of the phosphor layer 3 on the upper surface of the LED chip 2 is The distance d1 between the LED chips 2 and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 are smaller.

上記(a)の関係が満たされる構成の場合には、照射光の中心部分に周期的な色度変化が生じることを防止できる。また、上記(b)の関係が満たされる構成の場合には、照明光の周期的な色度変化の防止、および、カットオフラインを形成する照射光のエッジ部分で青色光(励起光)色が強く出る現象の両方を防止できる。   In the case of the configuration in which the relationship (a) is satisfied, it is possible to prevent a periodic chromaticity change from occurring in the central portion of the irradiation light. Further, in the case of the configuration in which the relationship (b) is satisfied, the blue light (excitation light) color is prevented at the edge portion of the irradiation light that prevents the periodic chromaticity change of the illumination light and forms the cut-off line. Both strong phenomena can be prevented.

なお、上記(a)および(b)の関係を満たす照明装置において、距離d1と距離d2がほぼ等しいとは、d1とd2とが完全に一致している場合のみならず、照明光に生じる周期的な色度変化が所定の許容範囲に収まる範囲であればよく、d1とd2とが若干異なっている場合も含まれる。   In the lighting device that satisfies the relationship (a) and (b) above, the distance d1 and the distance d2 are substantially equal, not only when d1 and d2 are completely matched, but also in the period that occurs in the illumination light. The chromaticity change may be within a predetermined allowable range, and the case where d1 and d2 are slightly different is also included.

本発明の照明装置は、複数のLEDチップを用いた各種の白色照明装置として用いることができる。特に、本発明では、複数のLEDチップを一列に直線状に並べた場合であっても、周期的な色度変化や、カットオフラインを形成する照明光のエッジ部分で青色光が強く出る現象を防止し、輝度が大きく、温度上昇が少なく、色度の均一性に優れた照明装置を提供することができるため、車輌用灯具に適した白色照明を提供できる。例えば、ランプハウジング内に本実施形態の白色照明装置を配置し、その前面に投光レンズを配置した車輛用灯具(例えば、ヘッドランプ)の構成とする。白色照明装置から出射された光が投光レンズを通過することにより照明光となって、車輛前方に照射される。   The illumination device of the present invention can be used as various white illumination devices using a plurality of LED chips. In particular, in the present invention, even when a plurality of LED chips are arranged in a straight line, a phenomenon in which blue light is intensely emitted at the edge portion of illumination light that forms a periodic chromaticity change or a cut-off line. Therefore, it is possible to provide an illumination device that has high brightness, little temperature rise, and excellent chromaticity uniformity. Therefore, white illumination suitable for a vehicular lamp can be provided. For example, a configuration of a vehicle lamp (for example, a headlamp) in which the white illumination device of the present embodiment is arranged in a lamp housing and a light projecting lens is arranged on the front surface thereof is adopted. The light emitted from the white illumination device passes through the light projecting lens and becomes illumination light, which is irradiated forward of the vehicle.

<実施例1>
実施例1として、上記実施形態の隣り合うLEDチップ2間の距離d1とLEDチップ2の側面と蛍光体層3側面との距離d2がほぼ等しい照明装置を製造した。
<Example 1>
As Example 1, an illuminating device in which the distance d1 between adjacent LED chips 2 of the above embodiment and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 were substantially equal was manufactured.

まず、上面の一辺の長さが1.0mmのLEDチップ2をセラミック製基板4上に、チップ間距離d1を100μmとして、4個のLEDチップ2を直線状に配置し、ボンディングした。このLEDチップ2の側面及び上面にステンシル印刷(メタルマスク印刷)の手法を用いて蛍光体層3を形成した。   First, the LED chip 2 having a length of one side of the upper surface of 1.0 mm was placed on the ceramic substrate 4 and the distance between the chips d1 was set to 100 μm, and the four LED chips 2 were linearly arranged and bonded. The phosphor layer 3 was formed on the side surface and upper surface of the LED chip 2 by using a stencil printing (metal mask printing) technique.

蛍光体層3は、シリコーン系熱硬化樹脂に対して、蛍光体粒子を35wt%から52wt%、粘度調整を目的としたヒュームドシリカを10wt%混合したペーストを使用し、ステンレス製ステンシル(メタルマスク)を使用して印刷をおこなうことにより形成した。ステンシルの厚さは、基板4との接合部を含んだLEDチップ2厚さとLEDチップ2上に配置される蛍光体の厚さd3を足し合わせた厚さにほぼ等しい厚さを有するものを使用した。ステンシルの開口幅は、LEDチップ2側面と蛍光体層3側面との距離d2が100μmとなるように設計した。   The phosphor layer 3 is made of a paste obtained by mixing 35 wt% to 52 wt% of phosphor particles and 10 wt% of fumed silica for viscosity adjustment with respect to a silicone-based thermosetting resin, and a stainless steel stencil (metal mask). ) Was used for printing. The thickness of the stencil having a thickness approximately equal to the sum of the thickness of the LED chip 2 including the junction with the substrate 4 and the thickness d3 of the phosphor disposed on the LED chip 2 is used. did. The opening width of the stencil was designed such that the distance d2 between the LED chip 2 side surface and the phosphor layer 3 side surface was 100 μm.

蛍光体層3のペーストを印刷後、150℃で2時間加熱し、シリコーン樹脂を硬化させた。   After the paste of the phosphor layer 3 was printed, it was heated at 150 ° C. for 2 hours to cure the silicone resin.

これにより、本実施例のLEDチップ2間の距離d1とチップ2側面と蛍光体層3の側面との距離d2とがいずれも100μmで等しい照明装置を製造した。   As a result, a lighting device was manufactured in which the distance d1 between the LED chips 2 of this example and the distance d2 between the side surface of the chip 2 and the side surface of the phosphor layer 3 were all equal to 100 μm.

本実施例の照明装置の照射光を観察したところ照射面全体に渡って色度が均一であった。   When the irradiation light of the illumination device of this example was observed, the chromaticity was uniform over the entire irradiation surface.

一方、比較例1として、隣り合うLEDチップ2間距離d1を300μmとし、チップ2側面と蛍光体層3の側面との距離d2を100μmとした比較例1の照明装置を同様に製造した。比較例1の照明装置の照明光を観察したところ、図3に示すように、チップ2上面から出射する白色光の色度均一性が悪くなり、一列に並んだ4個のLEDチップ配列に対応した、周期的な色度変化が生じていた。このため品位の悪いものになっていた。なお、黄色みが強い領域は、LEDチップ2の間隙の領域に対応していた。   On the other hand, as Comparative Example 1, an illumination device of Comparative Example 1 was manufactured in the same manner, in which the distance d1 between adjacent LED chips 2 was 300 μm and the distance d2 between the side surface of the chip 2 and the side surface of the phosphor layer 3 was 100 μm. When the illumination light of the illumination device of Comparative Example 1 was observed, as shown in FIG. 3, the chromaticity uniformity of the white light emitted from the upper surface of the chip 2 was deteriorated, corresponding to the arrangement of four LED chips arranged in a row. There was a periodic change in chromaticity. For this reason, it was poor. In addition, the area | region where yellowishness was strong respond | corresponded to the area | region of the gap | interval of LED chip 2. FIG.

<実施例2>
実施例2として、隣り合うLEDチップ2間の距離d1と、LEDチップ2の側面と蛍光体層3側面との距離d2とがほぼ等しく、かつ、LEDチップ2上面の蛍光体層3の膜厚d3が、LEDチップ2間距離d1およびLEDチップ2の側面と蛍光体層3側面との距離d2より小さい照明装置を製造した。
<Example 2>
As Example 2, the distance d1 between the adjacent LED chips 2 and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 are substantially equal, and the film thickness of the phosphor layer 3 on the upper surface of the LED chip 2 An illumination device was manufactured in which d3 is smaller than the distance d1 between the LED chips 2 and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3.

製造方法は、基本的には実施例1と同様であり、チップ2間の距離d1は100μmとした。LEDチップ2の側面と蛍光体層3側面との距離d2も、100μmとした。   The manufacturing method was basically the same as in Example 1, and the distance d1 between the chips 2 was 100 μm. The distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 was also set to 100 μm.

また、ステンシルの厚さを設計し、LEDチップ2上に配置される蛍光体の膜厚d3が75μmになるようにした。   In addition, the thickness of the stencil was designed so that the thickness d3 of the phosphor disposed on the LED chip 2 was 75 μm.

実施例2の照明装置の照明光を観察したところ、照射面全体に渡って色度が均一であった。   When the illumination light of the illumination device of Example 2 was observed, the chromaticity was uniform over the entire irradiated surface.

一方、比較例2として、LEDチップ2上面の蛍光体層の膜厚d3を120μm、隣り合うLEDチップ2間距離d1を100μm、LEDチップ2の側面と蛍光体層3側面との距離d2を100μmとし、他の条件は実施例2と同様にして、比較例2の照明装置を製造した。   On the other hand, as Comparative Example 2, the thickness d3 of the phosphor layer on the upper surface of the LED chip 2 is 120 μm, the distance d1 between adjacent LED chips 2 is 100 μm, and the distance d2 between the side surface of the LED chip 2 and the side surface of the phosphor layer 3 is 100 μm. The lighting device of Comparative Example 2 was manufactured in the same manner as in Example 2 except for the other conditions.

比較例2の照明装置の照明光を観察したところ、チップ列の側面から出射される光は、上面から出射される光より青みが強く、これが図4に示すように照射光のエッジ部分41、いわゆるカットオフラインに現れ、青ムラとして容易に識別できた。このため甚だ品位が悪かった。   When the illumination light of the illumination device of Comparative Example 2 was observed, the light emitted from the side surface of the chip row was more bluish than the light emitted from the upper surface, and this was an edge portion 41 of the irradiated light as shown in FIG. It appeared in a so-called cut-off line and could be easily identified as blue unevenness. For this reason, the quality was very bad.

また、蛍光体層の膜厚d3を変化させた試料を作成して色度の均一性を測定したところ、膜厚d3がd2/2より小さいと色度の均一性が悪くなることがわかった。よって、d3はd2/2以上の厚さであって、かつ、d1またはd2よりも小さいことが好ましい。さらに、0.6×d2≦d3≦0.8×d2の範囲が色度均一性が特に向上するため好ましい。   In addition, when samples with varying thickness d3 of the phosphor layer were prepared and the uniformity of chromaticity was measured, it was found that the uniformity of chromaticity deteriorates when the thickness d3 is smaller than d2 / 2. . Therefore, d3 is preferably d2 / 2 or more in thickness and smaller than d1 or d2. Furthermore, the range of 0.6 × d2 ≦ d3 ≦ 0.8 × d2 is preferable because chromaticity uniformity is particularly improved.

上述の実施例1および実施例2では、ステンシル印刷により蛍光体層3を形成したが、この方法に限られるものではなく、スクリーン印刷法やディスペンス法等の一般的な蛍光体層の形成方法が適用できる。   In Example 1 and Example 2 described above, the phosphor layer 3 is formed by stencil printing. However, the present invention is not limited to this method, and a general phosphor layer forming method such as a screen printing method or a dispensing method can be used. Applicable.

本実施形態の照明装置のチップ間隔d1、ならびに、チップ側面と蛍光体層側面との距離d2を示す斜視図。The perspective view which shows the chip | tip space | interval d1 of the illuminating device of this embodiment, and the distance d2 of a chip | tip side surface and a fluorescent substance layer side surface. チップ側面と蛍光体層側面との距離d2と、チップ上面に配置される蛍光体の膜厚d3の関係を説明するための、図1のA−A’断面図。FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. 1 for explaining a relationship between a distance d2 between the chip side surface and the phosphor layer side surface and a film thickness d3 of the phosphor disposed on the chip upper surface. 照明装置の照明光に周期的な色度変化が生じていることを示す照明光色度分布図。The illumination light chromaticity distribution figure which shows that the periodic chromaticity change has arisen in the illumination light of an illuminating device. 照明装置の照明光のエッジ部分に青ムラが生じていることを示す照明光色度分布図。The illumination light chromaticity distribution map which shows that the blue nonuniformity has arisen in the edge part of the illumination light of an illuminating device.

符号の説明Explanation of symbols

1…白色照明装置、2…LEDチップ、3…蛍光体層、4…基板。   DESCRIPTION OF SYMBOLS 1 ... White illuminating device, 2 ... LED chip, 3 ... Phosphor layer, 4 ... Substrate.

Claims (4)

所定の間隔をあけて一列に配置された複数の発光素子と、該複数の発光素子の上面および側面を一体に覆う蛍光体層とを有し、
隣接する前記発光素子の間隔(d1)は、前記発光素子の側面と前記蛍光体層の側面との距離(d2)に略等しいことを特徴とする白色照明装置。
A plurality of light emitting elements arranged in a row at a predetermined interval, and a phosphor layer that integrally covers the top and side surfaces of the plurality of light emitting elements,
The white illumination device according to claim 1, wherein a distance (d1) between the adjacent light emitting elements is substantially equal to a distance (d2) between a side surface of the light emitting element and a side surface of the phosphor layer.
請求項1に記載の白色照明装置において、前記発光素子上面における前記蛍光体層の膜厚(d3)は、前記発光素子の間隔(d1)、または、前記発光素子の側面と前記蛍光体層の側面との距離(d2)よりも小さいことを特徴とする白色照明装置。   2. The white illumination device according to claim 1, wherein the thickness (d3) of the phosphor layer on the upper surface of the light emitting element is an interval (d1) between the light emitting elements, or a side surface of the light emitting element and the phosphor layer. A white illumination device characterized by being smaller than a distance (d2) from a side surface. ランプハウジングと、該ランプハウジング内に配置された白色光源と、白色光源から出射された光が通過する位置に配置された投光レンズとを有する車輛用灯具であって、
前記白色光源は、所定の間隔をあけて一列に配置された複数の発光素子と、該複数の発光素子の上面および側面を一体に覆う蛍光体層とを有し、
隣接する前記発光素子の間隔(d1)は、前記発光素子の側面と前記蛍光体層の側面との距離(d2)に略等しいことを特徴とする車輛用灯具。
A vehicle lamp having a lamp housing, a white light source disposed in the lamp housing, and a light projecting lens disposed at a position through which light emitted from the white light source passes,
The white light source has a plurality of light emitting elements arranged in a row at a predetermined interval, and a phosphor layer that integrally covers the top and side surfaces of the plurality of light emitting elements,
The vehicle lamp according to claim 1, wherein a distance (d1) between the adjacent light emitting elements is substantially equal to a distance (d2) between a side surface of the light emitting element and a side surface of the phosphor layer.
請求項3に記載の車輛用灯具において、前記発光素子上面における前記蛍光体層の膜厚(d3)は、前記発光素子の間隔(d1)、または、前記発光素子の側面と前記蛍光体層の側面との距離(d2)よりも小さいことを特徴とする車輛用灯具。   4. The vehicle lamp according to claim 3, wherein the thickness (d3) of the phosphor layer on the upper surface of the light emitting element is the distance (d1) between the light emitting elements or the side surface of the light emitting element and the phosphor layer. A vehicle lamp characterized by being smaller than a distance (d2) from a side surface.
JP2008291151A 2008-11-13 2008-11-13 White lighting system and lighting fixture for vehicle Pending JP2010118531A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008291151A JP2010118531A (en) 2008-11-13 2008-11-13 White lighting system and lighting fixture for vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008291151A JP2010118531A (en) 2008-11-13 2008-11-13 White lighting system and lighting fixture for vehicle

Publications (1)

Publication Number Publication Date
JP2010118531A true JP2010118531A (en) 2010-05-27

Family

ID=42306013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008291151A Pending JP2010118531A (en) 2008-11-13 2008-11-13 White lighting system and lighting fixture for vehicle

Country Status (1)

Country Link
JP (1) JP2010118531A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012144126A1 (en) * 2011-04-20 2012-10-26 パナソニック株式会社 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US8373182B2 (en) 2010-09-09 2013-02-12 Stanley Electric Co., Ltd. Semiconductor light-emitting device and manufacturing method
WO2013036070A2 (en) * 2011-09-08 2013-03-14 Lg Innotek Co., Ltd. Lighting device and lighting control method
US8455907B2 (en) 2010-06-16 2013-06-04 Stanley Electric Co., Ltd. Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing
KR101272691B1 (en) 2011-12-06 2013-06-10 엘지이노텍 주식회사 Lighting device
US8461610B2 (en) 2010-06-16 2013-06-11 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing
JP2013168626A (en) * 2012-02-15 2013-08-29 Polar-Lights Opto Co Ltd Cob type mixed light emitting diode electric light board
US8546823B2 (en) 2011-06-16 2013-10-01 Panasonic Corporation Light emitting device and illumination apparatus including same
EP2648219A2 (en) 2012-04-06 2013-10-09 Panasonic Corporation Light-emitting device
US8581287B2 (en) 2011-01-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing
JP2014225588A (en) * 2013-05-17 2014-12-04 スタンレー電気株式会社 Semiconductor light-emitting element array
US8921877B2 (en) 2010-08-02 2014-12-30 Stanley Electric Co., Ltd. Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same
US9368690B2 (en) 2013-01-24 2016-06-14 Stanley Electric Co., Ltd. Semiconductor light-emitting device
JP2021024427A (en) * 2019-08-05 2021-02-22 豊田合成株式会社 Indoor illumination device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234307A (en) * 2006-02-28 2007-09-13 Stanley Electric Co Ltd Lighting tool
JP2008270314A (en) * 2007-04-17 2008-11-06 Toyoda Gosei Co Ltd Light-emitting device and method of manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234307A (en) * 2006-02-28 2007-09-13 Stanley Electric Co Ltd Lighting tool
JP2008270314A (en) * 2007-04-17 2008-11-06 Toyoda Gosei Co Ltd Light-emitting device and method of manufacturing the same

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8461610B2 (en) 2010-06-16 2013-06-11 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing
US8455907B2 (en) 2010-06-16 2013-06-04 Stanley Electric Co., Ltd. Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing
US8921877B2 (en) 2010-08-02 2014-12-30 Stanley Electric Co., Ltd. Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same
US8373182B2 (en) 2010-09-09 2013-02-12 Stanley Electric Co., Ltd. Semiconductor light-emitting device and manufacturing method
US8581287B2 (en) 2011-01-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing
US9299743B2 (en) 2011-04-20 2016-03-29 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
WO2012144126A1 (en) * 2011-04-20 2012-10-26 パナソニック株式会社 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
JPWO2012144126A1 (en) * 2011-04-20 2014-07-28 パナソニック株式会社 Light source, backlight unit, liquid crystal display device and illumination device
USRE47780E1 (en) 2011-04-20 2019-12-24 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US9601669B2 (en) 2011-04-20 2017-03-21 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US8546823B2 (en) 2011-06-16 2013-10-01 Panasonic Corporation Light emitting device and illumination apparatus including same
WO2013036070A3 (en) * 2011-09-08 2013-05-02 Lg Innotek Co., Ltd. Lighting device and lighting control method
WO2013036070A2 (en) * 2011-09-08 2013-03-14 Lg Innotek Co., Ltd. Lighting device and lighting control method
KR101272691B1 (en) 2011-12-06 2013-06-10 엘지이노텍 주식회사 Lighting device
JP2013168626A (en) * 2012-02-15 2013-08-29 Polar-Lights Opto Co Ltd Cob type mixed light emitting diode electric light board
EP2648219A2 (en) 2012-04-06 2013-10-09 Panasonic Corporation Light-emitting device
US9046228B2 (en) 2012-04-06 2015-06-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device for emitting light of multiple color temperatures
US9368690B2 (en) 2013-01-24 2016-06-14 Stanley Electric Co., Ltd. Semiconductor light-emitting device
US9793455B2 (en) 2013-01-24 2017-10-17 Stanley Electric Co., Ltd. Semiconductor light-emitting device
JP2014225588A (en) * 2013-05-17 2014-12-04 スタンレー電気株式会社 Semiconductor light-emitting element array
JP2021024427A (en) * 2019-08-05 2021-02-22 豊田合成株式会社 Indoor illumination device

Similar Documents

Publication Publication Date Title
JP2010118531A (en) White lighting system and lighting fixture for vehicle
KR102603695B1 (en) Light emitting device and vehicle lamp comprising the same
US8610135B2 (en) Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same
US9246067B2 (en) Semiconductor light emitting device and vehicle lamp
US8960932B2 (en) Light emitting device
TWI392121B (en) Gehaeuse fuer ein lumineszenzdioden-bauelement und lumineszenzdioden-bauelement
JP2011060967A (en) Illumination device
US8979325B2 (en) Lens and bulb-type light emitting device lamp employing the lens
JP5443959B2 (en) Lighting device
JP2007081234A (en) Lighting system
US8587008B2 (en) Light-emitting device
TW201535797A (en) Light emitting device
JP2009087681A (en) Vehicle headlight light source and vehicle headlight
TWI593918B (en) Light emitting module
JP2016167518A (en) Light emission device and luminaire
JP2009289772A (en) Led lamp
US20120319143A1 (en) Light emitting device and illumination apparatus including same
JP2018129492A (en) Light-emitting device, and illuminating device
JP2007043074A (en) Luminaire
KR102400249B1 (en) Light emitting module and display including the module
KR101305375B1 (en) LED Package and Backlight Assembly using the same
JP2007207939A (en) Light emitting device
WO2012077274A1 (en) Illumination device
WO2012077269A1 (en) Illumination device
JP2014135322A (en) Light emitting device and luminaire

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111014

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120626

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121023