JP2007207939A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2007207939A
JP2007207939A JP2006023635A JP2006023635A JP2007207939A JP 2007207939 A JP2007207939 A JP 2007207939A JP 2006023635 A JP2006023635 A JP 2006023635A JP 2006023635 A JP2006023635 A JP 2006023635A JP 2007207939 A JP2007207939 A JP 2007207939A
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light
light emitting
emitting diode
vertical direction
diode element
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Masahiro Toda
雅宏 戸田
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device 11 in which color breakup and angle color difference can be improved. <P>SOLUTION: At a position in a recess 20 opposing a light emitting diode element 13 in the vertical direction, a diffusion part 23 having a size comparable to the size of the light emitting diode element 13 when viewed in the vertical direction is provided. A phosphor layer 24 covering the light emitting diode element 13 and the diffusion part 23 is provided in the recess 20. The phosphor layer 24 has a phosphor which is excited with light from the light emitting diode element 13 to emit light. The diffusion part 23 diffuses blue light from the light emitting diode element 13 toward the vertical direction to reduce light distribution in the vertical direction and to increase light distribution in the direction inclining against the vertical direction. Color breakup and angle color difference are improved by reducing light distribution in the vertical direction and increasing light distribution in the inclining direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子を用いた発光装置に関する。   The present invention relates to a light emitting device using a light emitting element.

従来、発光素子として発光ダイオード素子を用いた発光装置は、基板に発光ダイオード素子を配設し、この発光ダイオード素子を被覆するように樹脂を充填して固化させた面実装タイプのものが知られている。   Conventionally, a light emitting device using a light emitting diode element as a light emitting element is known as a surface mount type in which a light emitting diode element is disposed on a substrate and a resin is filled and solidified so as to cover the light emitting diode element. ing.

そして、この種の発光装置により、白色光を発光させるには、青色光を発光する発光ダイオード素子を、樹脂に黄色発光蛍光体を含有させた樹脂層である蛍光体層によって被覆し、発光ダイオード素子が発光する青色光と、この青色光により黄色発光蛍光体を励起させて得た黄色光とを混色させている。   In order to emit white light with this type of light emitting device, a light emitting diode element that emits blue light is covered with a phosphor layer that is a resin layer in which a yellow light emitting phosphor is contained in a resin. The blue light emitted from the element is mixed with the yellow light obtained by exciting the yellow light-emitting phosphor with the blue light.

また、発光ダイオード素子全体を拡散層で覆い、この拡散層の上層に蛍光体層を形成することにより、発光ダイオード素子の青色光を拡散層で拡散させて蛍光体層全体に入射させるようにして発光効率を向上させている(例えば、特許文献1参照)。
特開2003−324215号公報(第3−4頁、図1)
In addition, by covering the entire light emitting diode element with a diffusion layer and forming a phosphor layer on the diffusion layer, the blue light of the light emitting diode element is diffused by the diffusion layer and incident on the entire phosphor layer. Luminous efficiency is improved (for example, refer to Patent Document 1).
JP 2003-324215 A (page 3-4, FIG. 1)

しかしながら、発光ダイオード素子を蛍光体層によって被覆する発光装置では、蛍光体層の表面中央部と発光ダイオード素子との距離の方が蛍光体層の表面周辺部と発光ダイオード素子との距離よりも近い関係にあり、かつ発光ダイオード素子から蛍光体層の表面中央部へ向かう青色光の光度の方が蛍光体層の表面周辺部へ向かう青色光の光度よりも高い配光の関係にあるので、蛍光体層の表面に対して垂直方向から見た場合、発光ダイオード素子に対して垂直方向に対向する蛍光体層の表面中央部においては、青色光の輝度が高く、青色光が抜けて白色光に見え、一方、蛍光体層の表面周辺部においては、黄色光が分布するという現象である色われが発生する問題がある。しかも、蛍光体層の表面の垂直方向に対して傾斜した方向から見た場合には、上述した光路長の関係や配光から、全体的に黄色味がかって見え、そのため、見る角度による角度色差が大きい問題がある。   However, in a light emitting device in which a light emitting diode element is covered with a phosphor layer, the distance between the surface central portion of the phosphor layer and the light emitting diode element is closer than the distance between the surface peripheral portion of the phosphor layer and the light emitting diode element. Since the light intensity of blue light from the light emitting diode element toward the center of the surface of the phosphor layer is higher than the intensity of blue light toward the periphery of the surface of the phosphor layer, When viewed from the direction perpendicular to the surface of the body layer, the brightness of the blue light is high at the center of the surface of the phosphor layer facing the light emitting diode element in the direction perpendicular to the light, and the blue light is emitted to white light. On the other hand, there is a problem in that color fringing, which is a phenomenon in which yellow light is distributed, occurs around the surface of the phosphor layer. In addition, when viewed from a direction inclined with respect to the vertical direction of the surface of the phosphor layer, the overall color looks yellowish due to the above-described optical path length relationship and light distribution. There is a big problem.

また、発光ダイオード素子の青色光を拡散層で拡散させて蛍光体層全体に入射させる構成では、蛍光体層の表面中央部へ向かう発光ダイオード素子の光を拡散させるが、発光ダイオード素子全体を拡散層で覆っているために、蛍光体層の表面周辺部へ向かう発光ダイオード素子の光も拡散させてしまい、その結果、色われや角度色差には十分な改善が得られない問題がある。   In addition, in the configuration in which the blue light of the light emitting diode element is diffused by the diffusion layer and incident on the entire phosphor layer, the light from the light emitting diode element toward the center of the surface of the phosphor layer is diffused, but the entire light emitting diode element is diffused. Since it is covered with the layer, the light of the light emitting diode element toward the peripheral portion of the surface of the phosphor layer is also diffused, and as a result, there is a problem that sufficient improvement cannot be obtained in the color shift and the angular color difference.

本発明は、このような点に鑑みなされたもので、色われや角度色差を改善できる発光装置を提供することを目的とする。   The present invention has been made in view of these points, and an object thereof is to provide a light-emitting device that can improve color distortion and angular color difference.

請求項1記載の発光装置は、凹部を有する基体と;凹部内の底面側に配設される発光素子と;凹部内の発光素子に対して垂直方向に対向する位置でかつ垂直方向視で発光素子の大きさと同程度の大きさに設けられ、垂直方向へ向かう発光素子の光を拡散させて垂直方向ヘの配光を減少させるとともに垂直方向に対して傾斜方向への配光を増大させる拡散部と;凹部内に発光素子および拡散部を覆うように形成され、発光素子の光で励起されて発光する蛍光体を有する蛍光体層と;を具備しているものである。   The light-emitting device according to claim 1, a substrate having a recess; a light-emitting element disposed on a bottom surface side in the recess; and a light emission at a position facing the light-emitting element in the recess in a vertical direction and viewed in a vertical direction Diffusion that is approximately the same as the size of the device and diffuses light from the light emitting device in the vertical direction to reduce light distribution in the vertical direction and increase light distribution in the tilt direction with respect to the vertical direction. And a phosphor layer that is formed so as to cover the light emitting element and the diffusion part in the recess, and has a phosphor that emits light when excited by the light of the light emitting element.

基体は、基板上に絶縁層、回路パターン、反射体を設けた構成や、リードフレームをインサート成形した樹脂成形品などを用いることができる。発光素子は、例えば、青色光を発光する発光ダイオード素子を用いることができる。拡散部には、拡散材を含有した透明樹脂を用いることができる。拡散部の大きさは、凹部の直径より小さく凹部の内面から離反する大きさで、発光素子と同程度であって、発光素子より少し小さくても大きくてもよいが、垂直方向視で発光素子全体を覆うような大きさが好ましい。蛍光体層の蛍光体は、例えば、白色光を得る場合には、発光素子からの青色光で励起して黄色光を発光する黄色発光蛍光体を用いることができる。   As the substrate, a structure in which an insulating layer, a circuit pattern, and a reflector are provided on a substrate, or a resin molded product in which a lead frame is insert-molded can be used. For example, a light emitting diode element that emits blue light can be used as the light emitting element. A transparent resin containing a diffusing material can be used for the diffusing portion. The size of the diffusing portion is smaller than the diameter of the concave portion and separated from the inner surface of the concave portion, and is similar to the light emitting element and may be slightly smaller or larger than the light emitting element. A size that covers the whole is preferable. As the phosphor of the phosphor layer, for example, when white light is obtained, a yellow light-emitting phosphor that emits yellow light when excited with blue light from a light-emitting element can be used.

請求項2記載の発光装置は、請求項1記載の発光装置において、凹部内に形成される拡散部および蛍光体層は、蛍光体層より粘度が高い樹脂材料で拡散部が凹部内の発光素子上に形成された後に、拡散部の樹脂材料より粘度が低い樹脂材料で蛍光体層が凹部内に形成されているものである。   The light-emitting device according to claim 2 is the light-emitting device according to claim 1, wherein the diffusion portion and the phosphor layer formed in the recess are a resin material having a viscosity higher than that of the phosphor layer and the diffusion portion is in the recess. After being formed above, the phosphor layer is formed in the recess with a resin material having a lower viscosity than the resin material of the diffusion portion.

拡散部は、蛍光体層より粘度が高い樹脂材料を用いることにより、蛍光体層の拡散部より粘度が低い樹脂材料と混ざり合うことがなく、拡散部の位置や形状を維持できる。また、凹部内の発光素子の周囲にその発光素子の高さ程度まで一次の蛍光体層を形成し、その状態で発光素子上に拡散部を形成し、その後、凹部内の拡散部や一次の蛍光体層上にさらに二次の蛍光体層を形成してもよく、あるいは、一次の蛍光体層を省略し、発光素子上に拡散部を形成した後、凹部内に蛍光体層を形成してもよい。   By using a resin material whose viscosity is higher than that of the phosphor layer, the diffusion portion is not mixed with a resin material having a viscosity lower than that of the diffusion layer of the phosphor layer, and the position and shape of the diffusion portion can be maintained. Further, a primary phosphor layer is formed around the light emitting element in the concave portion up to the height of the light emitting element, and a diffusion portion is formed on the light emitting element in that state, and then the diffusion portion in the concave portion and the primary portion are formed. A secondary phosphor layer may be further formed on the phosphor layer, or the primary phosphor layer may be omitted and a diffusion part may be formed on the light emitting element, and then a phosphor layer may be formed in the recess. May be.

請求項1記載の発光装置によれば、凹部内の発光素子に対して垂直方向に対向する位置でかつ垂直方向視で発光素子の大きさと同程度の大きさに設けた拡散部により、垂直方向へ向かう発光素子の光を拡散させて垂直方向ヘの配光を減少させるとともに垂直方向に対して傾斜方向への配光を増大させることができ、色われや角度色差を確実に改善できる。   According to the light emitting device of claim 1, the vertical direction is provided by the diffusion portion provided at a position facing the light emitting element in the recess in the vertical direction and having a size approximately equal to the size of the light emitting element as viewed in the vertical direction. The light distribution toward the light emitting element is diffused to reduce the light distribution in the vertical direction, and the light distribution in the inclined direction with respect to the vertical direction can be increased, so that the color deviation and the angular color difference can be improved reliably.

請求項2記載の発光装置によれば、請求項1記載の発光装置の効果に加えて、蛍光体層より粘度が高い樹脂材料で拡散部を凹部内の発光素子上に形成した後に、拡散部の樹脂材料より粘度が低い樹脂材料で蛍光体層を凹部内に形成することにより、凹部内に拡散部および蛍光体層を容易に形成できる。   According to the light emitting device of claim 2, in addition to the effect of the light emitting device of claim 1, the diffusion portion is formed on the light emitting element in the concave portion with a resin material having a viscosity higher than that of the phosphor layer. By forming the phosphor layer in the recess with a resin material having a viscosity lower than that of the resin material, the diffusion portion and the phosphor layer can be easily formed in the recess.

以下、本発明の一実施の形態を図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図1は発光装置の一部の断面図、図2は発光装置の正面図、図3は発光装置の拡散部および蛍光体層の形成方法を(a)(b)(c)の順に示す説明図、図4は発光装置の配光について示すもので、(a)は拡散部を用いた配光図、(b)は拡散部を用いない比較例の配光図である。   FIG. 1 is a cross-sectional view of a part of the light emitting device, FIG. 2 is a front view of the light emitting device, and FIG. 3 is an explanation showing the method of forming the diffusion part and the phosphor layer in the order of (a), (b), and (c). FIGS. 4 and 4 show the light distribution of the light emitting device. FIG. 4A is a light distribution diagram using a diffusion portion, and FIG. 4B is a light distribution diagram of a comparative example using no diffusion portion.

図1および図2に示すように、発光装置11は、発光モジュール12を備え、この発光モジュール12が例えば照明器具の器具本体などの図示しない発光装置本体に対して着脱可能に取り付けられる。発光モジュール12には、複数の発光素子としてチップ状の固体発光素子である発光ダイオード素子(発光ダイオードチップ)13がマトリクス状に配列されている。   As shown in FIGS. 1 and 2, the light-emitting device 11 includes a light-emitting module 12, and the light-emitting module 12 is detachably attached to a light-emitting device main body (not shown) such as a fixture main body of a lighting fixture. In the light emitting module 12, light emitting diode elements (light emitting diode chips) 13, which are chip-shaped solid light emitting elements, are arranged in a matrix as a plurality of light emitting elements.

発光ダイオード素子13は、例えば、発光ピークが450〜460nmの青色光を発光する例えば窒化ガリウム(GaN)系半導体などで構成された青色発光ダイオード素子である。   The light emitting diode element 13 is, for example, a blue light emitting diode element made of, for example, a gallium nitride (GaN) -based semiconductor that emits blue light having an emission peak of 450 to 460 nm.

発光モジュール12は、放熱性および剛性を有するアルミニウム(Al)やニッケル(Ni)、ガラスエポキシ樹脂などで形成された平板状の基板14、この基板14上に形成された絶縁層15、この絶縁層15上に形成された回路パターン層16、これら絶縁層15および回路パターン層16が形成された基板14上に形成された反射体17を有している。そして、基板14および反射体17などで基体18が構成されている。   The light emitting module 12 includes a flat substrate 14 formed of aluminum (Al), nickel (Ni), glass epoxy resin or the like having heat dissipation and rigidity, an insulating layer 15 formed on the substrate 14, and the insulating layer. The circuit pattern layer 16 is formed on the substrate 15, and the reflector 17 is formed on the substrate 14 on which the insulating layer 15 and the circuit pattern layer 16 are formed. A base body 18 is constituted by the substrate 14, the reflector 17, and the like.

回路パターン層16には、各発光ダイオード素子13の位置毎に、CuとNiの合金やAuなどにより、陰極側と陽極側の回路パターン(配線パターン)16a,16bが形成されている。各発光ダイオード素子13は、その底面電極が回路パターン16a,16bの一方にダイボンディングによって電気的および機械的に接続され、上面電極が回路パターン16a,16bの他方にボンディングワイヤ19によって電気的に接続されている。   In the circuit pattern layer 16, cathode-side and anode-side circuit patterns (wiring patterns) 16a and 16b are formed of an alloy of Cu and Ni, Au, or the like for each light emitting diode element 13 position. Each light emitting diode element 13 has a bottom electrode electrically and mechanically connected to one of the circuit patterns 16a and 16b by die bonding, and a top electrode electrically connected to the other of the circuit patterns 16a and 16b by a bonding wire 19. Has been.

反射体17は、例えばPBT(ポリブチレンテレフタレート)やPPA(ポリフタルアミド)、PC(ポリカーボネート)などの樹脂を基板14の一面に流し込んで成形され、各発光ダイオード素子13の位置毎に、各発光ダイオード素子13を収容する収容部である複数の凹部20が形成されている。凹部20は、基板14に対して反対側へ向けて漸次拡開する円錐台状に形成されている。凹部20の周囲には、図示しないレンズを固定するレンズホルダ部21が同心状に形成されている。   The reflector 17 is formed by pouring a resin such as PBT (polybutylene terephthalate), PPA (polyphthalamide), PC (polycarbonate) or the like onto one surface of the substrate 14, and each light emitting diode element 13 emits each light emitting element. A plurality of recesses 20 that are housing portions for housing the diode elements 13 are formed. The recess 20 is formed in a truncated cone shape that gradually expands toward the opposite side with respect to the substrate 14. Around the recess 20, a lens holder portion 21 for fixing a lens (not shown) is formed concentrically.

また、各凹部20には、発光ダイオード素子13を被覆する被覆層22が形成されている。この被覆層22は、発光ダイオード素子13の表面に対して垂直方向に対向する位置に配設される拡散部23と、発光ダイオード素子13および拡散部23を覆うように配設される蛍光体層24とで構成されている。   Each recess 20 is formed with a coating layer 22 that covers the light emitting diode element 13. The covering layer 22 includes a diffusion portion 23 disposed at a position facing the surface of the light emitting diode element 13 in the vertical direction, and a phosphor layer disposed so as to cover the light emitting diode element 13 and the diffusion portion 23. Consists of 24 and.

拡散部23は、透光性を有するシリコーン樹脂やエポキシ樹脂などの熱硬化性透明樹脂にチタン酸カリウム(KTiO)、チタン酸バリウム(BaTiO)、酸化チタン(TiO)、酸化ケイ素(SiO)、酸化亜鉛(ZnO)、アルミナ(Al)、硫酸バリウム(BaSO)、酸化イットリウム(Y)などの拡散材が配合されている。拡散部23の大きさは、凹部20の直径より小さく凹部20の内面から離反する大きさで、発光ダイオード素子13と同程度の大きさに形成されている。この拡散部23の発光ダイオード素子13と同程度の大きさとは、発光ダイオード素子13より少し小さくても大きくてもよいが、垂直方向視で発光ダイオード素子13全体を覆うような大きさが好ましい。拡散部23の厚みは、全体に均一に形成されている。 The diffusion part 23 is made of a thermosetting transparent resin such as translucent silicone resin or epoxy resin, potassium titanate (K 2 TiO 3 ), barium titanate (BaTiO 3 ), titanium oxide (TiO 2 ), silicon oxide. Diffusing materials such as (SiO 2 ), zinc oxide (ZnO), alumina (Al 2 O 3 ), barium sulfate (BaSO 4 ), yttrium oxide (Y 2 O 3 ) are blended. The size of the diffusing portion 23 is smaller than the diameter of the concave portion 20 and separated from the inner surface of the concave portion 20, and is formed to have the same size as the light emitting diode element 13. The size of the diffusing portion 23 comparable to that of the light-emitting diode element 13 may be slightly smaller or larger than the light-emitting diode element 13, but is preferably large enough to cover the entire light-emitting diode element 13 when viewed in the vertical direction. The thickness of the diffusion part 23 is uniformly formed throughout.

蛍光体層24は、透光性を有するシリコーン樹脂やエポキシ樹脂などの熱硬化性透明樹脂に発光ダイオード素子13からの青色光を受光して黄色に蛍光発光する黄色系蛍光体を主体として配合されている。この蛍光体としては、黄色系蛍光体が主体であるが、赤色系蛍光体なども配合されている。   The phosphor layer 24 is mainly composed of a yellow-based phosphor that receives blue light from the light-emitting diode element 13 and emits fluorescent light in yellow to a thermosetting transparent resin such as a translucent silicone resin or epoxy resin. ing. As this phosphor, a yellow phosphor is mainly used, but a red phosphor or the like is also blended.

図3に、拡散部23および蛍光体層24を形成する方法を示す。まず、図3(a)に示すように、凹部20内の底部で発光ダイオード素子13の周囲に、発光ダイオード素子13の表面の高さ位置まで、蛍光体層24を構成する液状の透明樹脂の一部を滴下、塗布などによって配置する。次に、図3(b)に示すように、発光ダイオード素子13の表面側に、拡散部23を構成する液状の透明樹脂を滴下、塗布などによって配置する。このとき、拡散部23を構成する液状の透明樹脂の粘度は、滴下、塗布された位置や形状をある程度維持可能とする粘度で、蛍光体層24を構成する液状の透明樹脂の粘度より高い関係にある。次に、図3(c)に示すように、凹部20内全体を覆うように、蛍光体層24を構成する液状の透明樹脂を滴下、塗布などによって配置する。このとき、拡散部23を構成する液状の透明樹脂の粘度は蛍光体層24を構成する液状の透明樹脂の粘度より高いため、拡散部23と蛍光体層24とが混ざり合うことがなく、拡散部23の位置や形状を維持できる。   FIG. 3 shows a method for forming the diffusion portion 23 and the phosphor layer 24. First, as shown in FIG. 3A, the liquid transparent resin constituting the phosphor layer 24 is formed around the light emitting diode element 13 at the bottom in the recess 20 up to the height of the surface of the light emitting diode element 13. A part is placed by dripping or coating. Next, as shown in FIG. 3B, a liquid transparent resin constituting the diffusion portion 23 is disposed on the surface side of the light emitting diode element 13 by dropping, coating, or the like. At this time, the viscosity of the liquid transparent resin that constitutes the diffusing portion 23 is a viscosity that allows the position and shape of the dropped and applied liquid to be maintained to some extent, and is higher than the viscosity of the liquid transparent resin that constitutes the phosphor layer 24. It is in. Next, as shown in FIG. 3C, a liquid transparent resin constituting the phosphor layer 24 is disposed by dropping, coating, or the like so as to cover the entire inside of the recess 20. At this time, since the viscosity of the liquid transparent resin constituting the diffusion portion 23 is higher than the viscosity of the liquid transparent resin constituting the phosphor layer 24, the diffusion portion 23 and the phosphor layer 24 do not mix and diffuse. The position and shape of the part 23 can be maintained.

なお、発光装置11とレンズを組み合わせて照明装置を構成できる。   Note that a lighting device can be configured by combining the light emitting device 11 and a lens.

次に、発光装置11の作用を説明する。   Next, the operation of the light emitting device 11 will be described.

陰極側と陽極側の回路パターン16a,16b間に、外部から所定の直流電圧が印加されると、発光ダイオード素子13が青色発光し、発光ダイオード素子13の表面や側面などから青色光が出射する。発光ダイオード素子13の表面から出射する青色光は、拡散部23に入射し、この拡散部23で多方向に拡散して蛍光体層24に入射し、蛍光体層24の黄色蛍光体を多方向から励起して黄色発光させる。発光ダイオード素子13の側面から出射する青色光は、蛍光体層24に入射し、蛍光体層24の黄色蛍光体を励起して黄色発光させる。そして、発光ダイオード素子13からの青色光と黄色蛍光体からの黄色光とが混色し、白色光になって凹部20内から外部へ、つまり蛍光体層24の表面から外部へ出射する。   When a predetermined DC voltage is applied from the outside between the cathode-side and anode-side circuit patterns 16a and 16b, the light-emitting diode element 13 emits blue light, and blue light is emitted from the surface and side surfaces of the light-emitting diode element 13. . Blue light emitted from the surface of the light-emitting diode element 13 is incident on the diffusion part 23, diffuses in multiple directions at this diffusion part 23 and enters the phosphor layer 24, and the yellow phosphor of the phosphor layer 24 is multi-directional. Excited to emit yellow light. Blue light emitted from the side surface of the light-emitting diode element 13 enters the phosphor layer 24, and excites the yellow phosphor in the phosphor layer 24 to emit yellow light. Then, the blue light from the light emitting diode element 13 and the yellow light from the yellow phosphor are mixed and become white light, which is emitted from the inside of the recess 20 to the outside, that is, from the surface of the phosphor layer 24 to the outside.

このとき、拡散部23は凹部20内の発光ダイオード素子13に対して垂直方向に対向する位置でかつ垂直方向視で発光ダイオード素子13の大きさと同程度の大きさに設けられているため、垂直方向へ向かう発光ダイオード素子13の光を拡散させて垂直方向ヘの配光を減少させるとともに垂直方向に対して傾斜方向への配光を増大させる。   At this time, the diffusion portion 23 is provided at a position facing the light emitting diode element 13 in the concave portion 20 in the vertical direction and is substantially the same size as the light emitting diode element 13 when viewed in the vertical direction. The light of the light emitting diode element 13 traveling in the direction is diffused to reduce the light distribution in the vertical direction and increase the light distribution in the inclined direction with respect to the vertical direction.

そして、拡散部23を用いた場合と用いない場合との配光を測定した結果を図4に示す。図4(a)には拡散部23を用いた配光図を示し、図4(b)には拡散部23を用いない比較例の配光図を示す。図中、凹部20内の発光ダイオード素子13に対する垂直方向を0°、径方向を光度の強さとしており、青色光を実線で、黄色光を破線で示す。   And the result of having measured the light distribution with the case where the spreading | diffusion part 23 is used and the case where it is not used is shown in FIG. FIG. 4A shows a light distribution diagram using the diffusing unit 23, and FIG. 4B shows a light distribution diagram of a comparative example that does not use the diffusing unit 23. In the figure, the direction perpendicular to the light emitting diode element 13 in the recess 20 is 0 °, the radial direction is the intensity of light intensity, blue light is indicated by a solid line, and yellow light is indicated by a broken line.

図4(b)に示す拡散部23を用いない比較例の場合には、発光ダイオード素子13から垂直方向へ向かう青色光が多く、垂直方向に対して傾斜方向へ向かう青色光が少ない配光となっている。しかも、傾斜方向での青色光と黄色光との光度の差が大きい。そのため、垂直方向から見た場合に中央部と周辺部とで色われが発生しやすく、見る角度による角度色差が大きくなりやすい。   In the case of the comparative example that does not use the diffusing portion 23 shown in FIG. 4B, there is a light distribution in which there is a large amount of blue light traveling in the vertical direction from the light emitting diode element 13 and a small amount of blue light traveling in the inclined direction with respect to the vertical direction. It has become. Moreover, the difference in luminous intensity between blue light and yellow light in the tilt direction is large. For this reason, when viewed from the vertical direction, color distortion tends to occur between the central portion and the peripheral portion, and the angle color difference depending on the viewing angle tends to increase.

それに対して、図4(a)に示す拡散部23を用いた場合には、発光ダイオード素子13から垂直方向へ向かう青色光を拡散させるため、垂直方向ヘの青色光が減少するとともにそれに伴って黄色光も減少し、垂直方向の配光が減少する。一方、発光ダイオード素子13から垂直方向へ向かう青色光を拡散させるため、垂直方向に対して傾斜方向へ向かう青色光が増大するとともにそれに伴って黄色光を増大し、傾斜方向の配光が増大する。しかも、傾斜方向での青色光と黄色光との光度の差が減少する。   On the other hand, when the diffusing section 23 shown in FIG. 4 (a) is used, blue light traveling in the vertical direction from the light emitting diode element 13 is diffused, so that the blue light in the vertical direction is reduced and accompanying this. Yellow light is also reduced and vertical light distribution is reduced. On the other hand, since blue light traveling in the vertical direction from the light emitting diode element 13 is diffused, blue light traveling in the tilt direction with respect to the vertical direction increases, and yellow light increases accordingly, and light distribution in the tilt direction increases. . In addition, the difference in luminous intensity between blue light and yellow light in the tilt direction decreases.

したがって、凹部20内の発光ダイオード素子13に対して垂直方向に対向する位置でかつ垂直方向視で発光ダイオード素子13の大きさと同程度の大きさに設けた拡散部23により、垂直方向へ向かう発光ダイオード素子13の光を拡散させて垂直方向ヘの配光を減少させるとともに垂直方向に対して傾斜方向への配光を増大させることができ、色われや角度色差を確実に改善できる。   Therefore, light is emitted in the vertical direction by the diffusion portion 23 provided at a position facing the light emitting diode element 13 in the concave portion 20 in the vertical direction and having a size approximately equal to the size of the light emitting diode element 13 in the vertical direction. The light from the diode element 13 can be diffused to reduce the light distribution in the vertical direction, and the light distribution in the tilt direction with respect to the vertical direction can be increased, so that the color deviation and the angular color difference can be reliably improved.

また、蛍光体層24より粘度が高い樹脂材料で拡散部23を凹部20内の発光ダイオード素子13上に形成した後に、拡散部23の樹脂材料より粘度が低い樹脂材料で蛍光体層24を凹部20内に形成することにより、凹部20内に拡散部23および蛍光体層24を容易に形成できる。   Further, after the diffusion part 23 is formed on the light emitting diode element 13 in the recess 20 with a resin material having a higher viscosity than the phosphor layer 24, the phosphor layer 24 is formed with a resin material having a lower viscosity than the resin material of the diffusion part 23. By forming in 20, the diffusion part 23 and the phosphor layer 24 can be easily formed in the recess 20.

なお、拡散部23で拡散した光の一部は基板14側へ向かって凹部20の底面で反射するため、この凹部20の底面の反射率を高めることにより、垂直方向に対して傾斜方向への配光をより増大させることができるとともに発光効率を向上できる。凹部20の底面の反射率を高めるには、例えば、絶縁層15に白色樹脂を用い、発光ダイオード素子13を絶縁層15上に接着剤などで配設するとともに各回路パターン16a,16bに対してワイヤボンディングで電気的に接続することで、凹部20の底面における白色の絶縁層15の表面積を広くとることにより可能となる。   A part of the light diffused by the diffusing portion 23 is reflected from the bottom surface of the concave portion 20 toward the substrate 14 side. Therefore, by increasing the reflectance of the bottom surface of the concave portion 20, the direction toward the inclined direction with respect to the vertical direction is increased. Light distribution can be further increased and luminous efficiency can be improved. In order to increase the reflectance of the bottom surface of the recess 20, for example, a white resin is used for the insulating layer 15, and the light emitting diode element 13 is disposed on the insulating layer 15 with an adhesive or the like, and the circuit patterns 16a and 16b are arranged. It is possible to increase the surface area of the white insulating layer 15 on the bottom surface of the recess 20 by electrical connection by wire bonding.

また、基体18としては、金属フレームを樹脂で一体にモールド成形したものでもよい。   Further, the base 18 may be a metal frame integrally molded with resin.

本発明の一実施の形態を示す発光装置の一部の断面図である。1 is a partial cross-sectional view of a light-emitting device showing an embodiment of the present invention. 同上発光装置の正面図である。It is a front view of a light-emitting device same as the above. 同上発光装置の拡散部および蛍光体層の形成方法を(a)(b)(c)の順に示す説明図である。It is explanatory drawing which shows the formation method of the spreading | diffusion part and fluorescent substance layer of a light-emitting device same as the above in order of (a) (b) (c). 同上発光装置の配光について示すもので、(a)は拡散部を用いた配光図、(b)は拡散部を用いない比較例の配光図である。The light distribution of the light emitting device is shown. (A) is a light distribution diagram using a diffusion portion, and (b) is a light distribution diagram of a comparative example that does not use a diffusion portion.

符号の説明Explanation of symbols

11 発光装置
13 発光素子としての発光ダイオード素子
18 基体
20 凹部
23 拡散部
24 蛍光体層
11 Light emitting device
13 Light-emitting diode elements as light-emitting elements
18 substrate
20 Recess
23 Diffusion part
24 phosphor layer

Claims (2)

凹部を有する基体と;
凹部内の底面側に配設される発光素子と;
凹部内の発光素子に対して垂直方向に対向する位置でかつ垂直方向視で発光素子の大きさと同程度の大きさに設けられ、垂直方向へ向かう発光素子の光を拡散させて垂直方向ヘの配光を減少させるとともに垂直方向に対して傾斜方向への配光を増大させる拡散部と;
凹部内に発光素子および拡散部を覆うように形成され、発光素子の光で励起されて発光する蛍光体を有する蛍光体層と;
を具備していることを特徴とする発光装置。
A substrate having a recess;
A light emitting device disposed on the bottom side in the recess;
It is provided at a position facing the light emitting element in the concave portion in the vertical direction and approximately the same size as the light emitting element when viewed in the vertical direction, and diffuses light from the light emitting element toward the vertical direction to A diffuser that reduces the light distribution and increases the light distribution in the direction of inclination with respect to the vertical direction;
A phosphor layer having a phosphor that is formed in the recess so as to cover the light emitting element and the diffusion part and is excited by light of the light emitting element to emit light;
A light-emitting device comprising:
凹部内に形成される拡散部および蛍光体層は、蛍光体層より粘度が高い樹脂材料で拡散部が凹部内の発光素子上に形成された後に、拡散部の樹脂材料より粘度が低い樹脂材料で蛍光体層が凹部内に形成されている
ことを特徴とする請求項1記載の発光装置。
The diffusion part and the phosphor layer formed in the recess are resin materials having a viscosity lower than that of the resin material of the diffusion part after the diffusion part is formed on the light emitting element in the recess with a resin material having a higher viscosity than the phosphor layer. The phosphor layer is formed in the recess, The light-emitting device according to claim 1.
JP2006023635A 2006-01-31 2006-01-31 Light emitting device Pending JP2007207939A (en)

Priority Applications (1)

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Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010237443A (en) * 2009-03-31 2010-10-21 Casio Computer Co Ltd Light source device and projector
JP2012003267A (en) * 2011-07-04 2012-01-05 Casio Comput Co Ltd Fluorescent substrate, light source device, and projector
JP2014131075A (en) * 2014-03-06 2014-07-10 Nichia Chem Ind Ltd Light-emitting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010237443A (en) * 2009-03-31 2010-10-21 Casio Computer Co Ltd Light source device and projector
US8523367B2 (en) 2009-03-31 2013-09-03 Casio Computer Co., Ltd. Light source unit including a laser as a light source and a light emitting wheel with a diffusion layer opposite to the laser
US9250505B2 (en) 2009-03-31 2016-02-02 Casio Computer Co., Ltd. Light source unit including a laser as a light source and a light emitting wheel with a diffusion layer opposite to the laser
JP2012003267A (en) * 2011-07-04 2012-01-05 Casio Comput Co Ltd Fluorescent substrate, light source device, and projector
JP2014131075A (en) * 2014-03-06 2014-07-10 Nichia Chem Ind Ltd Light-emitting device

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