KR102400249B1 - Light emitting module and display including the module - Google Patents

Abstract

The light emitting module of the embodiment includes a substrate, at least one light emitting device package disposed on the substrate, and at least one reflective sheet disposed to surround the side surface of the at least one light emitting device package inserted into the first recess in a dam form, and at least It is disposed on the one reflective sheet, and includes a pattern portion for absorbing light emitted from at least one light emitting device package.

Description

Light emitting module and display device including the same

The embodiment relates to a light emitting module and a display including the same.

A light emitting diode (LED) is a type of semiconductor device that converts electricity into infrared or light by using characteristics of a compound semiconductor to send and receive signals or used as a light source.

Group III-V nitride semiconductors are in the spotlight as a core material for light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties. have.

Since these light emitting diodes do not contain environmentally harmful substances such as mercury (Hg) used in conventional lighting fixtures such as incandescent and fluorescent lamps, they have excellent eco-friendliness, and have advantages such as long lifespan and low power consumption characteristics. are replacing them Various studies are being conducted to improve the reliability of a conventional light emitting device package including such a light emitting diode.

A light emitting module including a light emitting device package may be used in various fields. Conventional light emitting modules adopting a Chip On Board (COB) method have better heat dissipation characteristics than general light emitting modules, but have a problem in that the central luminance is brighter than the surrounding luminance.

The embodiment provides a light emitting module having a uniform luminance distribution in the center and the periphery, and a display including the same.

A light emitting module according to an embodiment includes a substrate; at least one light emitting device package disposed on the substrate; at least one reflective sheet disposed to surround a side surface of the at least one light emitting device package inserted in the first recess in a dam shape; and a pattern portion disposed on the at least one reflective sheet to absorb light emitted from the at least one light emitting device package.

For example, each of the reflective sheet and the pattern part may have a circular or annular planar shape. The pattern portion may be disposed on the entire surface of the upper portion of the reflective sheet, or may be disposed on a portion of the upper portion. For example, the area of the pattern portion may be 1/4 of the total area of the upper portion of the reflective sheet.

For example, the pattern part may include a plurality of pattern rings spaced apart from each other and disposed on the reflective sheet, and one of the plurality of pattern rings may be disposed in contact with the at least one light emitting device package.

For example, the pattern part may be disposed to be spaced apart from the at least one light emitting device package or disposed in contact with the light emitting device package. Based on the upper surface of the substrate, the first height of the reflective sheet and the second height of the at least one light emitting device package may be substantially the same. Based on the upper surface of the substrate, the first height of the reflective sheet and the second height of the at least one light emitting device package may be as follows.

Here, H2 represents the second height and H1 represents the first height.

For example, the reflectance of the pattern portion may be 15% or less. The pattern part may be disposed on the reflective sheet in a painted form. The at least one reflective sheet may include at least one second recess, and the pattern part may be disposed to be inserted into the at least one second recess.

For example, the light emitting module further includes at least one lens disposed on the at least one light emitting device package, and the at least one reflective sheet is at least one third lens into which the leg of the at least one lens is inserted. Seth may further include.

For example, the at least one light emitting device package may include a light emitting device chip disposed on the substrate; and a molding member disposed on top and side surfaces of the light emitting device chip and including a phosphor.

For example, the minimum value of the diameter of the pattern portion may be 9 mm, and the reflective sheet may include E60L.

A display device according to another embodiment includes: the light emitting module; and an optical member disposed on the light emitting module, wherein the at least one reflective sheet includes a plurality of reflective sheets, and the at least one light emitting device package includes a plurality of light emitting device packages respectively disposed on the plurality of reflective sheets. may include

A light emitting module and a display device including the same according to an embodiment may have a uniform luminance distribution by reducing a central luminous point.

1 is a plan view of a light emitting module according to an embodiment.
2 is a cross-sectional view of the light emitting module shown in FIG. 1 taken along line I-I' according to an embodiment of the present invention.
3 is an exploded cross-sectional view of the light emitting module shown in FIG. 1 taken along line I-I' according to an embodiment.
4 is a cross-sectional view showing an embodiment of the light emitting device package shown in FIGS. 1 to 3 .
5 is a cross-sectional view of the light emitting module shown in FIG. 1 taken along line I-I' according to another embodiment;
6 is an exploded cross-sectional view of the light emitting module shown in FIG. 1 taken along line I-I' according to another embodiment.
7 is a plan view of a light emitting module according to another embodiment.
8 is a cross-sectional view of the light emitting module shown in FIG. 7 taken along line II-II' according to an embodiment.
9 is a cross-sectional view of the light emitting module shown in FIG. 7 taken along line II-II' according to another embodiment.
10 is a plan view of a light emitting module according to another embodiment.
11 is a cross-sectional view of the light emitting module shown in FIG. 10 taken along line III-III' according to an embodiment.
12 is a cross-sectional view of the light emitting module shown in FIG. 10 taken along line III-III' according to another embodiment.
13A to 13D show light emitting modes of light emitting modules according to the first, second, and third comparative examples and examples.
14 is a cross-sectional view of a display device according to an embodiment.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings to help the understanding of the present invention by giving examples and to explain the present invention in detail. However, embodiments according to the present invention may be modified in various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments of the present invention are provided in order to more completely explain the present invention to those of ordinary skill in the art.

In the description of the embodiment according to the present invention, in the case where it is described as being formed on "up (above)" or "below (on or under)" of each element, upper (upper) or lower (lower) (on or under) includes both elements in which two elements are in direct contact with each other or one or more other elements are disposed between the two elements indirectly. In addition, when expressed as “up (up)” or “down (on or under)”, the meaning of not only the upward direction but also the downward direction based on one element may be included.

Also, as used hereinafter, relational terms such as “first” and “second,” “top/top/top” and “bottom/bottom/bottom” refer to any physical or logical relationship between such entities or elements or It may be used only to distinguish one entity or element from another, without requiring or implying an order.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not fully reflect the actual size.

Although the light emitting modules 100A, 100B, and 100C and the display device 300 according to the embodiment are described using a Cartesian coordinate system, it goes without saying that the description may be made using other coordinate systems. In the Cartesian coordinate system, the x-axis, y-axis, and z-axis shown in each figure are orthogonal to each other.

1 shows a plan view of a light emitting module 100A according to an embodiment, and FIG. 2 is an embodiment 100A-1 of the light emitting module 100A shown in FIG. 1 taken along line I-I'. FIG. 3 is an exploded cross-sectional view of the light emitting module 100A shown in FIG. 1 taken along line I-I' according to an embodiment 100A-1. For convenience of description, the lens 150 illustrated in FIGS. 2 and 3 is omitted from FIG. 1 .

1 to 3 , the light emitting modules 100A and 100A-1 according to an embodiment include a substrate 110 , a light emitting device package 120 , a reflective sheet 130 , a pattern unit 140 , and a lens ( 150) may be included.

The light emitting device package 120 and the reflective sheet 130 may be mounted on the substrate 110 . The substrate 110 may have an electrode pattern for connecting an adapter for supplying power to the light emitting device package 120 . For example, a carbon nanotube electrode pattern for connecting the light emitting device package 120 and the adapter may be formed on the upper surface of the substrate 110 .

The substrate 110 may be a printed circuit board (PCB) substrate made of any one material selected from polyethylene terephthalate (PET), glass, polycarbonate (PC), and silicon (Si), or may be formed in a film form. .

In addition, the substrate 110 may selectively use a single-layer PCB, a multi-layer PCB, a ceramic substrate, a metal core PCB, and the like.

4 is a cross-sectional view showing an embodiment of the light emitting device package 120 shown in FIGS. 1 to 3 .

As illustrated in FIG. 4 , the light emitting device package 120 may include a light emitting device chip 122 and a molding member 124 .

The light emitting device chip 122 may be disposed on the substrate 110 . The light emitting device chip 122 may include a top view type light emitting diode or a side view type light emitting diode, but the embodiment is not limited to the light emission type. In addition, the light emitting device chip 122 is composed of a blue LED chip or an ultraviolet LED chip, or at least one or more of a red LED chip, a green LED chip, a blue LED chip, a yellow green LED chip, and a white LED chip. It may be configured in the form of a package combining .

The molding member 124 is disposed on the upper portion and the side surface of the light emitting device chip 122 , respectively, and may include a phosphor. The molding member 124 may surround the light emitting device chip 122 in a film shape, a plate shape, or a bulk shape, and may be implemented with resin, but the embodiment is not limited to the material of the molding member 124 .

The phosphor may include a phosphor that is a wavelength conversion means of any one of YAG-based, TAG-based, Silicate-based, Sulfide-based, and Nitride-based phosphors capable of converting light generated from the light emitting device chip 122 into white light. is not limited to the type of phosphor.

YAG and TAG-based fluorescent materials can be used by selecting from (Y, Tb, Lu, Sc ,La, Gd, Sm)3(Al, Ga, In, Si, Fe)5(O, S)12:Ce, The silicate-based fluorescent material can be selected from (Sr, Ba, Ca, Mg)2SiO4: (Eu, F, Cl).

In addition, the Sulfide-based fluorescent material can be selected from (Ca,Sr)S:Eu, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, and the Nitride-based fluorescent material is (Sr, Ca, Si, Al , O)N:Eu (e.g. CaAlSiN4:Eu β-SiAlON:Eu) or (Cax,My)(Si,Al)12(O,N)16 based on Ca-α SiAlON:Eu, where M is Eu, Tb , Yb, or Er at least one material, and can be used by selecting from among 0.05<(x+y)<0.3, 0.02<x<0.27 and 0.03<y<0.3, phosphor components.

As the red phosphor, a nitride-based phosphor including N (eg, CaAlSiN3:Eu) may be used. Such a nitride-based red phosphor has superior reliability to external environments such as heat and moisture, and has a lower risk of discoloration than a sulfide-based phosphor.

4 is only an example of the light emitting device package 120 shown in FIGS. 1 to 3 , and the light emitting device package 120 may be implemented in various forms.

Meanwhile, the reflective sheet 130 may be disposed to surround the side surface 120 - 1 of the light emitting device package 120 in a dam shape. To this end, the reflective sheet 130 may include a first recess R1. The light emitting device package 120 may be disposed to be inserted into the first recess R1 of the reflective sheet 130 .

In addition, based on the upper surface 110 - 1 of the substrate 110 , the first height H1 of the reflective sheet 130 in the thickness direction (eg, the z-axis direction) of the substrate 110 and the light emitting device package The second height H2 of 120 may be substantially the same. If the first height H1 and the second height H2 are the same, luminous efficiency may be improved. For example, when the first height H1 is greater than 1.055 multiples of the second height H2, the amount of light may be greatly reduced, and when the first height H1 is smaller than 1.055 multiples of the second height H2, light is emitted. Light emitted from the side of the device package 120 may not be blocked. Accordingly, the first height H1 and the second height H2 may have a relationship as in Equation 1 below, but the embodiment is not limited thereto.

For example, when the second height H2 is 0.35 mm, the first height may be 0.35±0.02 mm.

The reflective sheet 130 may include E60L, but the embodiment is not limited to a specific material of the reflective sheet 130 .

Meanwhile, the pattern unit 140 may be disposed on the reflective sheet 130 to absorb light emitted from the light emitting device package 120 . To this end, the pattern unit 140 may be implemented with a material that absorbs light. For example, the reflectance of the pattern unit 140 may be 15% or less, but the embodiment is not limited thereto.

According to the exemplary embodiment 100A-1 illustrated in FIGS. 2 and 3 , the reflective sheet 130 includes at least one 2-1 recess (or groove) R21 , and the pattern part 140 . ) may be disposed to be inserted into the at least one 2-1 recess (R21).

FIG. 5 is a cross-sectional view showing a combination of the light emitting module 100A shown in FIG. 1 according to another embodiment 100A-2 taken along line I-I', and FIG. 6 is the light emitting module 100A shown in FIG. ) is an exploded cross-sectional view according to another embodiment 100A-2 taken along line I-I'.

5 and 6 , the pattern unit 140 may be disposed on the upper portion 130 - 1 of the reflective sheet 130 in a painted form. In this case, instead of the reflective sheet 130 including the 2-1 recess R21, the lens 150 may include the 2-2 recess R22. The pattern part 140 disposed in a painted form on the upper part 130-1 of the reflective sheet 130 may be inserted into the 2-2nd recess R22 of the lens 150. As described above, except that the pattern part 140 is disposed in a painted form on the upper part 130-1 of the reflective sheet 130, and the lens 150 has a 2-2 second recess R22, as shown in FIG. The light emitting module 100A-2 shown in FIGS. 5 and 6 is the same as the light emitting module 100A-1 shown in FIGS. 2 and 3 , respectively, and thus overlapping descriptions will be omitted.

7 is a plan view of a light emitting module 100B according to another embodiment, and FIG. 8 is an embodiment 100B-1 of the light emitting module 100B shown in FIG. 7 taken along line II-II'. 9 is a cross-sectional view of the light emitting module 100B shown in FIG. 7 taken along the line II-II' according to another embodiment 100B-2. For convenience of explanation, the lens 150 is not shown in FIGS. 7 to 9, but as shown in FIGS. 2, 3, 5 and 6, the light emitting module 100B- shown in FIGS. 8 and 9 It goes without saying that the lens 150 may be disposed at 1, 100B-2).

According to an embodiment, as illustrated in FIGS. 1 to 3 , 5 and 6 , a direction (eg, x-axis and y-axis direction) orthogonal to the z-axis direction that is the thickness direction of the substrate 110 . Thus, the pattern unit 140 may be disposed in contact with the light emitting device package 120 .

According to another embodiment, as illustrated in FIGS. 7 to 9 , in a direction (eg, x-axis and y-axis direction) orthogonal to the thickness direction (eg, z-axis direction) of the substrate 110 . The pattern unit 140 may be disposed to be spaced apart from the light emitting device package 120 . As such, the light emitting modules 100B, 100B-1, and 100B-2 illustrated in FIGS. 7 to 9 are shown in FIGS. 1, 2 and 5, except that the arrangement of the pattern unit 140 is different. Since they are the same as the light emitting modules 100A, 100A-1, and 100A-2, overlapping descriptions will be omitted.

In the case of the light emitting module 100B-1 illustrated in FIG. 8 , the pattern portion 140 is formed on the upper portion 130-1 of the reflective sheet 130 as illustrated in FIGS. 2 and 3 ; It may be disposed to be inserted into the set R21. Alternatively, in the case of the light emitting module 100B-2 illustrated in FIG. 9 , the pattern part 140 may be disposed on the upper part 130-1 of the reflective sheet 130 in a painted form. As described above, the light emitting module 100B-1 shown in FIG. 8 is the same as the light emitting module 100B-2 shown in FIG. 9 , except that the shape in which the pattern part 140 is disposed is different.

10 is a plan view of a light emitting module 100C according to another embodiment, and FIG. 11 is an embodiment 100C-1 of the light emitting module 100C shown in FIG. 10 taken along line III-III'. 12 is a cross-sectional view of the light emitting module 100C shown in FIG. 10 taken along line III-III' according to another embodiment 100C-2. For convenience of explanation, the lens 150 is not shown in FIGS. 10 to 12, but as shown in FIGS. 2, 3, 5 and 6, the light emitting module 100C- shown in FIGS. 11 and 12 Of course, the lens 150 may be disposed at 1, 100C-2).

According to another embodiment, as illustrated in FIGS. 10 to 12 , the pattern unit 140 may be formed in a direction (eg, the x-axis and It may include a plurality of pattern rings 142 and 144 spaced apart from each other in the y-axis direction and disposed on the reflective sheet 130 . In this case, one 142 of the plurality of pattern rings 142 and 144 may be disposed in contact with the light emitting device package 120 . As such, the light emitting modules 100C, 100C-1, and 100C-2 illustrated in FIGS. 10 to 12 are shown in FIGS. 1, 2 and 5, except that the arrangement of the pattern unit 140 is different. Since they are the same as the light emitting modules 100A, 100A-1, and 100A-2, overlapping descriptions will be omitted.

In the case of the light emitting module 100C-1 illustrated in FIG. 11 , the pattern portion 140 is formed on the upper portion 130-1 of the reflective sheet 130 as illustrated in FIGS. 2 and 3 ; It may be disposed to be inserted into the set R21. Alternatively, in the case of the light emitting module 100C-2 illustrated in FIG. 12 , the pattern part 140 may be disposed on the upper part 130-1 of the reflective sheet 130 in a painted form. As such, the light emitting module 100C-1 shown in FIG. 11 is the same as the light emitting module 100C-2 shown in FIG. 12, except that the shape in which the pattern unit 140 is disposed is different.

In addition, each of the reflective sheet 130 and the pattern unit 140 may have various planar shapes, such as a circular shape, a polygonal shape, an elliptical shape, and an annular shape. For example, as illustrated in FIGS. 1, 7, and 10 , the reflective sheet 130 may have a circular planar shape. Also, as illustrated in FIG. 1 , the pattern unit 140 may have a circular planar shape, and as illustrated in FIGS. 7 and 10 , the pattern unit 140 may have an annular planar shape.

If the pattern unit 140 has a circular planar shape, in order to derive 80% or more of the full width at half maximum (FWHM) performance, the minimum value of the diameter of the pattern unit 140 may be 9 mm, and , the reflectance of the reflective sheet 130 may be 15% or less.

In addition, in the case of FIGS. 1 to 3 and 5 to 12 , the pattern part 140 is exemplified as being disposed on a part of the upper part 130 - 1 of the reflective sheet 130 , but the embodiment is not limited thereto. does not That is, according to another embodiment, the pattern unit 140 may be disposed on the upper front surface of the reflective sheet 130 .

If the pattern part 140 is locally disposed on a part of the upper part 130-1 of the reflective sheet 130, the first area of the pattern part 140 is the upper part 130-1 of the reflective sheet 130. ) may be 25% of the total second area. That is, an area ratio of the first area to the second area may be 1/4, but the embodiment is not limited thereto. That is, the area ratio between the first area of the pattern part 140 and the second area of the reflective sheet 130 may vary depending on various factors such as light distribution distribution or properties of the reflective sheet 140 .

Meanwhile, in the light emitting modules 100A, 100B, and 100C according to the above-described embodiment, the lens 150 is disposed on the light emitting device package 120 and may be combined with the reflective sheet 130 . In the case of FIG. 2 or FIG. 5 , the lens 150 is disposed in contact with the reflective sheet 130 , but the embodiment is not limited thereto. That is, according to another embodiment, the lens 150 may be disposed to be spaced apart from the reflective sheet 130 in the thickness direction (eg, the z-axis direction) of the substrate 110 .

Referring to FIG. 3 , the lens 150 may include a leg 152 and a body 154 . Here, the leg 152 supports the body 154 of the lens 150 , and serves to couple the body 154 to the reflective sheet 130 . To this end, the reflective sheet 130 may further include at least one third recess R31 and R32 into which the leg 152 of the lens 150 is inserted. Here, the third recesses R31 and R32 are exemplified as having a through-hole shape, but the embodiment is not limited thereto. The third recesses R31 and R32 may have a blind hole shape.

1, 7 and 10 , the third recesses R31 , R32 , and R33 are orthogonal to the thickness direction (eg, the z-axis direction) of the substrate 110 with respect to the light emitting device package 120 . It may be disposed in a radial shape in a direction (eg, an x-axis direction and a y-axis direction), but the embodiment is not limited thereto. That is, if the body 154 of the lens 150 can be fixed to the reflective sheet 130 through the legs 152 , the embodiment provides a specific number or specific arrangement of the third recesses R31 , R32 , R33 . is not limited to

The illustrated lens 150 may be a refracting type that refracts and emits light emitted from the light emitting device package 120 , or a reflective type that reflects and exits the light emitted from the light emitting device package 120 . The upper surface of the lens 150 may have various shapes depending on whether the lens 150 is a refractive type or a reflective type. That is, the upper surface of the body 154 of the lens 150 may have a shape in which a curved surface, a facing or an inclined surface are variously combined. For example, the lens 150 may have a dome shape as shown, and a concave recess (not shown) may be formed on the dome. However, the embodiment is not limited to a specific shape of the lens 150 . That is, the light emitting modules 100A, 100B, and 100C according to the embodiment may include various types of lenses 150 .

The light emitting modules 100A, 100B, and 100C according to the above-described embodiments may be implemented by a chip on board (COB) method. In general, a light emitting module (hereinafter, referred to as 'a light emitting module according to the first comparative example') individually packages a plurality of light emitting device chips to form a plurality of light emitting device packages, and then uses the plurality of light emitting device packages for modules. It is configured to be mounted on a substrate.

On the other hand, in order to manufacture a light emitting module adopting the chip-on-board method (hereinafter, referred to as 'a light emitting module according to the second comparative example'), a plurality of light emitting device packages are directly mounted on the substrate 110 .

In the case of the light emitting module according to the first comparative example, the manufacturing process is easy, and instead of having the advantage of emitting light through a single surface, it has poor heat dissipation characteristics and has a limit in increasing the amount of light. However, in the case of the light emitting module according to the second comparative example, the heat dissipation characteristic is excellent, and there is an advantage in that the amount of light can be increased compared to the light emitting module according to the first comparative example. However, since the light emitting module according to the second comparative example emits light through a total of five surfaces, it is difficult to control the light and has many problems in the process.

In order to improve this, a light emitting module having a dam structure (hereinafter referred to as 'a light emitting module according to the third comparative example') may be implemented. In the case of the light emitting module according to Comparative Example 3, while maintaining excellent heat dissipation characteristics, it has an advantage in that light can be controlled because light can be emitted through a single surface instead of five surfaces due to the dam structure. In the case of the light emitting module according to Comparative Example 1, the FWHM may be about 90, and the amount of light may be 83.5 lm. In the case of the light emitting module according to the second comparative example, the separation distance between the lens and the light emitting device package can be reduced by about 0.5 mm compared to the light emitting module according to the first comparative example, and the amount of light when the lens is disposed is 115.2 lm, whereas the lens The amount of light when is placed can be reduced to 102.79 lm. In addition, in the case of the light emitting module according to Comparative Example 3, the amount of light when the lens is not disposed may be 109.24 lm, whereas the amount of light when the lens is disposed may be 94.46 lm.

On the other hand, in the case of the light emitting module according to the embodiment, when the FWHM is about 80, the amount of light when the lens 150 is not disposed is 101.96 lm, whereas the amount of light when the lens 150 is disposed decreases as 90.036 lm. can At this time, although the overall light quantity may be lowered in the case of the light emitting module according to the embodiment, since the overall light quantity is larger than that of the light emitting module according to the first comparative example by adopting the chip-on method, the lens ( 150) can be maintained. That is, in the case of the light emitting module according to the embodiment, although the total amount of light may be reduced, since the heat dissipation characteristic is excellent, the current value may be increased, thereby increasing the total amount of light.

13A to 13D show light emitting modes of light emitting modules according to the first, second, and third comparative examples and examples.

Compared with the first comparative example shown in FIG. 13A , the case of the light emitting module according to the second and third comparative examples shown in FIGS. 13B and 13C , respectively. There is a problem that a central bright point occurs. That is, there is a problem that the center is bright.

On the other hand, in the case of the light emitting module according to the embodiment shown in FIG. 13D , since a portion of the light near the light emitting device package 120 is absorbed by the pattern unit 140 , the central bright point tends to decrease. That is, it can be seen that the mura decreases. Here, mura means unevenness of light.

Meanwhile, the light emitting module adopting the chip-on-board method according to the embodiment includes the first to N-th light emitting module units LM1, LM2, ..., LM(N-1), LMN disposed on the substrate 110 . can do. Here, N is a positive integer of 2 or more. Each of the first to Nth light emitting module units LM1, LM2, ..., LM(N-1), LMN (LMn) is a substrate 110 in the light emitting module 100A, 100B, 100C according to the above-described embodiment. ) may be included. Here, 1 ≤ n ≤ N. That is, the nth light emitting module unit LMn includes an nth light emitting device package, an nth reflective sheet, and an nth pattern unit. The n-th light-emitting device package, the n-th reflective sheet, and the n-th pattern part correspond to the light-emitting device package 120 , the reflective sheet 130 and the pattern part 140 shown in FIGS. 1 to 3 or 5 to 12 , respectively. Therefore, redundant descriptions are omitted. As such, the light emitting module adopting the chip-on method may include first to Nth light emitting device packages, first to Nth reflective sheets, and first to Nth pattern portions.

Meanwhile, the light emitting module according to the above-described embodiment may also be applied to a display device (or a display device), an indicator device, and a lighting device. Here, the display device includes a bottom cover, a reflecting plate disposed on the bottom cover, a light emitting module emitting light, a light guide plate disposed in front of the reflecting plate and guiding light emitted from the light emitting module in front of the light guide plate An optical sheet comprising prism sheets disposed thereon, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel, and a color filter disposed in front of the display panel may include Here, the bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. Liquid crystals that implement various colors in a liquid crystal panel of a display device cannot emit light by themselves. Therefore, the backlight unit illuminates the light from behind the liquid crystal and transmits the liquid crystal, and serves as a light source for realizing color. The backlight unit may be classified into an edge type and a direct type according to the position of the light source.

Hereinafter, a display device according to an embodiment will be described with reference to the accompanying drawings.

14 is a cross-sectional view of the display device 300 according to the embodiment.

The display device 300 according to the embodiment illustrated in FIG. 14 includes a substrate 110, first to N-th light emitting module units LM1, LM2, ..., LM(N-1), LMN, and an optical member ( 310) may be included.

Since the substrate 110 corresponds to the substrate 110 illustrated in FIGS. 1 to 3 and 4 to 12 , a redundant description will be omitted. In addition, each LMn of the first to Nth light emitting module units LM1, LM2, ..., LM(N-1), LMN is shown in FIGS. 1 to 3 and 4 to 12 as described above. The illustrated light emitting device package 120 , a reflective sheet 130 , a pattern unit 140 , and a lens 150 may be included. Accordingly, overlapping descriptions of the first to Nth light emitting module units LM1 , LM2 , ..., LM(N-1), LMN will be omitted.

The optical member 310 is made of at least one sheet, and may selectively include a diffusion sheet, a prism sheet, a brightness enhancing sheet, and the like. The diffusion sheet diffuses the light emitted from the first to N-th light source module units LM1, LM2, ..., LM(N-1), LMN, and the prism sheet guides the diffused light to the light emitting area, The luminance enhancing sheet may enhance luminance. In addition, at least one of an upper surface and a lower surface of the optical member 310 may have a concave-convex shape for uniform diffusion of light.

In FIG. 14 , the separation distance D (or optical gap) between the substrate 110 and the optical member 310 may be 12 mm, but the embodiment is not limited thereto.

The display device 300 illustrated in FIG. 14 is an embodiment in which a direct backlight unit is adopted. However, it goes without saying that the display apparatus according to another embodiment may be applied to an edge type in which the first to Nth light source modules are disposed at the edge.

In addition, the lighting device may include the light emitting module according to the above-described embodiment, a heat sink for dissipating heat of the light emitting module, and a power supply unit that processes or converts an electrical signal provided from the outside and provides the same to the light emitting module. For example, the lighting device may include a lamp, a head lamp, or a street lamp.

The head lamp includes the aforementioned light emitting module, a reflector that reflects light emitted from the light emitting module in a certain direction, for example, forward, a lens that refracts the light reflected by the reflector forward, and a lens that is reflected by the reflector. A shade that blocks or reflects a portion of the directed light to form a light distribution pattern desired by a designer may be included.

In the above, the embodiment has been mainly described, but this is only an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are not exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

100A, 100B, 100C, 100A-1, 100A-2, 100B-1, 100B-2, 100C-1, 100C-2: light emitting module
110: substrate 110-1: upper surface of the substrate
120: light emitting device package 120-1: side of the light emitting device package
122: light emitting device chip 124: molding member
130: reflective sheet 130-1: upper portion of the reflective sheet
140: pattern portion 142. 144: pattern ring
150: lens 300: display device
310: optical member

Claims (18)

Board;
at least one light emitting device package disposed on the substrate;
an inner surface forming a sidewall of the first recess, an outer surface facing the inner surface, and the inner surface surrounding the side surface of the at least one light emitting device package inserted into the first recess in a dam shape and at least one reflective member including an upper surface connecting the outer surface; and
and a pattern part disposed only on at least a portion of an upper surface of the at least one reflective member among the inner surface, the outer surface, and the upper surface to absorb light emitted from the at least one light emitting device package. delete delete Board;
at least one light emitting device package disposed on the substrate;
at least one reflective member disposed to surround a side surface of the at least one light emitting device package inserted in the first recess in a dam shape; and
and a pattern portion disposed on at least a portion of an upper portion of the at least one reflective member to absorb light emitted from the at least one light emitting device package,
The pattern portion is disposed on a portion of the upper portion of the reflective member,
The area of the pattern part is 1/4 of the total area of the upper part of the reflective member,
The pattern part includes a plurality of pattern rings spaced apart from each other and disposed on the reflective member,
One of the plurality of pattern rings is disposed in contact with the at least one light emitting device package,
The other one of the plurality of pattern rings is a light emitting module disposed to be spaced apart from the at least one light emitting device package. delete delete delete delete Board;
at least one light emitting device package disposed on the substrate;
an inner surface forming a sidewall of the first recess, an outer surface facing the inner surface, and the inner surface surrounding the side surface of the at least one light emitting device package inserted into the first recess in a dam shape and at least one reflective member including an upper surface connecting the outer surface; and
and a pattern portion disposed on at least a portion of an upper surface of the at least one reflective member to absorb light emitted from the at least one light emitting device package,
Based on the upper surface of the substrate, the first height of the reflective member and the second height of the at least one light emitting device package are substantially the same, or a light emitting module as follows.

(Here, H2 represents the second height and H1 represents the first height.) delete delete According to claim 1, further comprising at least one lens disposed on the at least one light emitting device package,
The at least one light emitting device package
a light emitting device chip disposed on the substrate; and
It is disposed on the upper and side surfaces of the light emitting device chip, and includes a molding member including a phosphor,
The pattern part is disposed in a painted form on the upper portion of the reflective member, or is disposed to be inserted into at least one second recess formed in the at least one reflective member,
The at least one reflection member includes at least one third recess into which the leg of the at least one lens is inserted. delete delete delete delete delete The light emitting module according to any one of claims 1, 4, 9 and 12; and
Including an optical member disposed on the light emitting module,
The at least one reflective member includes a plurality of reflective members,
The at least one light emitting device package includes a plurality of light emitting device packages respectively disposed on the plurality of reflective members.

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