TW201307958A - Backlight module - Google Patents

Abstract

The present invention provides a backlight module, which comprises a light guide plate and at least one light emitting device. The light guide plate comprises a light output surface, a back surface opposite to the light output surface and a peripheral surface connecting the periphery of the light output surface and the periphery of the back surface. The light emitting device is configured toward the peripheral surface. The light emitting device is a high power light emitting diode or a multi-chip packaging light emitting diode light panel. In addition, the location of the peripheral surface of the light guide plate correspondingly configured with the light emitting device is further configured with a microstructure, such that the light emitted from the light emitting device may enter the light guide plate through the microstructure and then emit from the light output surface.

Description

Backlight module

The invention relates to a backlight module, in particular to a backlight module using a high-power light-emitting diode or a polycrystalline package of a light-emitting diode lamp board.

The light sources used in the existing backlight modules are commonly used as Cold Cathode Florescent Lamps (CCFLs) and Light Emitting Diodes (LEDs).

Since cold cathode ray tubes are relatively energy-intensive and do not meet environmental protection requirements, most of the light sources used in backlight modules have been developed toward light-emitting diodes in recent years. However, since the backlight module using the light-emitting diode as a light source is conventionally installed, a plurality of single-crystal package light-emitting diodes are linearly arranged on the same circuit board to form a light-bar, and a backlight is used. A plurality of light strips are used in the module to provide the brightness required for the backlight module. Since the use of the light-emitting diode strips is cumbersome in the fabrication and assembly process, it must be improved.

Accordingly, it is an object of the present invention to provide a backlight module that is easy to fabricate and assemble.

Therefore, in accordance with one aspect of the present invention, the backlight module of the present invention comprises: a light guide plate and at least one light emitting element. The light guide plate has a light emitting surface, a back surface on the opposite side of the light emitting surface, and a circumferential surface connecting the peripheral edge of the light emitting surface and the peripheral edge of the back surface. The light-emitting element is disposed toward the circumferential surface, and the light-emitting element is a high-power light-emitting diode or a light-emitting diode light-emitting plate of a polycrystalline package. Moreover, the peripheral surface of the light guide plate is further provided with a microstructure at the corresponding light-emitting element, and the light emitted by the light-emitting element passes through the microstructure and then enters the light guide plate, and then is emitted from the light-emitting surface.

Preferably, the light guide plate has a substantially rectangular shape, and the peripheral surface includes four symmetrical sides, and the light emitting element is disposed at an intermediate position with respect to at least one side.

Preferably, the light guide plate is substantially rectangular, and the four corners are truncated, the peripheral surface includes four two-symmetrical sides, and four truncated portions respectively formed by the respective truncated angles, and the light-emitting elements are opposite to at least one The truncated section is set.

Preferably, the light guide plate has a rectangular shape, and the four corners are truncated angles, the peripheral surface includes four symmetrical sides, and four truncated portions respectively formed by the respective truncated angles, and the plurality of illuminating elements are And disposed at an intermediate position and at least one truncated portion with respect to at least one side.

Preferably, the microstructure is a U-shaped groove, a V-shaped groove or a roughened surface.

According to another aspect of the present invention, a backlight module of the present invention includes: a light guide plate and at least one light emitting element. The light guide plate has a light emitting surface, a back surface on the opposite side of the light emitting surface, and a circumferential surface connecting the peripheral edge of the light emitting surface and the peripheral edge of the back surface. The light emitting element is disposed toward the back surface, and the light emitting element is a high power light emitting diode or a light emitting diode light board which is a polycrystalline package. Moreover, the back surface of the light guide plate is further provided with a microstructure at the corresponding light-emitting element, and the light emitted by the light-emitting element passes through the microstructure and then enters the light guide plate, and then is emitted from the light-emitting surface.

Preferably, the plurality of light-emitting elements are disposed at a plurality of intervals.

The light-emitting component of the backlight module of the present invention is a polycrystalline package light-emitting diode lamp plate or a high-power light-emitting diode, which can simplify the assembly process and match with the light-emitting diode light bar. The light guide plate is provided with a microstructure to achieve a better optical effect.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are represented by the same reference numerals, and the elements in the drawings are not drawn according to the actual size ratio, and are only used to assist the description. .

Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the backlight module of the present invention comprises a light guide plate 1 and a plurality of light-emitting elements 2.

The light guide plate 1 has a light exit surface 11, a back surface 12 on the opposite side of the light exit surface 11, and a peripheral surface 13 that connects the periphery of the light exit surface 11 and the periphery of the back surface 12. In the present embodiment, the light guide plate 1 is substantially rectangular, and the four corners are truncated. The peripheral surface 13 includes four two-sided symmetrical edge portions 131, and four truncated portions 132 respectively formed by the respective truncated angles.

The plurality of light-emitting elements 2 are respectively provided at intermediate positions of the side portions 131 and the respective truncated portions 132. Referring to FIG. 3 and FIG. 4 , in the embodiment, each of the light-emitting elements 2 is a poly-encapsulated light-emitting diode lamp board (COB light board), and is packaged on the same substrate 22 by a plurality of light-emitting diode chips 21 . (Chip-on-board, COB), which constitutes a surface light source. If a plurality of light-emitting diode chips 21 are arranged in only one row to form a line light source, the light-emitting diode of the single-crystal package can have higher brightness. The light-emitting diode lamp plate is a surface light source or a line light source, and the light-scattering angle is larger than that of the single-crystal package light-emitting diode which is a point light source, and the light is easily dispersed. Moreover, the positions where the light-emitting elements 2 are disposed are dispersed, are spaced apart from each other by a large distance, and are relatively easy to dissipate heat. Of course, the number and position of the light-emitting elements 2 can be adjusted according to the size of the light guide plate 1. For example, if the area of the light guide plate 1 is small, only one light-emitting element 2 can be provided. When one light-emitting element 2 is provided, it may be provided at an intermediate position with respect to one of the side portions 131 or one of the truncated portions 132.

In addition, the peripheral surface 13 of the light guide plate 1 is provided with a microstructure 14 at the corresponding light-emitting element 2 for diverging light. When the light emitted by the light-emitting element 2 passes through the microstructure 14, the light is diverged by the microstructure 14 and then enters the light guide plate 1. The light entering the light guide plate 1 can be uniformly dispersed and then emitted from the light-emitting surface 11. The surface of the light guide plate 1 is provided with a reflective layer (not shown) except for the light-emitting surface 11 and the light-incident surface (where the microstructure 14 is provided), that is, the back surface 12 and the peripheral surface are not provided with the microstructure 14 There is a reflective layer. The reflective layer is a film layer composed of a highly reflective material coated or attached to the surface of the light guide plate 1 for reflecting light in the light guide plate 1 so that most of the light entering the light guide plate 1 can be emitted by the light-emitting surface. 11 shots. In the present embodiment, the microstructures 14 are V-shaped grooves, but may also be U-shaped grooves or roughened surfaces (roughening the surface).

In this embodiment, the light-emitting element 2 is a polycrystalline package light-emitting diode light board, which can also be a high-power light-emitting diode with high brightness, compared with the existing light-emitting diode light strips. It simplifies the assembly process.

Referring to FIG. 5, a second preferred embodiment of the backlight module of the present invention comprises a light guide plate 1 and a plurality of light-emitting elements 2. The light guide plate 1 has a light exit surface 11, a back surface 12 on the opposite side of the light exit surface 11, and a peripheral surface 13 that connects the periphery of the light exit surface 11 and the periphery of the back surface 12. The plurality of light-emitting elements 2 are disposed at a distance from the back surface 12 of the light guide plate 11. The back surface 12 of the light guide plate 11 is a light-incident surface, and the light-emitting element 2 is further provided with a microstructure 14 . In the embodiment, the light guide plate 11 is provided. The back surface 12 is provided with a microstructure 14 which is a roughened surface (roughening the surface), and may of course be replaced by a microstructure in the form of a U-shaped groove, a V-shaped groove or the like. The peripheral surface 13 of the light guide plate 11 is provided with a reflective layer.

As in the first preferred embodiment, each of the light-emitting elements 2 is a poly-encapsulated light-emitting diode lamp plate, which may be replaced by a high-power light-emitting diode. When the light emitted by the light-emitting element 2 passes through the microstructure 14, the light-emitting element 2 is utilized. The microstructure 14 diverges the light and enters the light guide plate 1, so that the light entering the light guide plate 1 can be evenly dispersed, and then emitted from the light exit surface 11.

In summary, the light-emitting element 2 of the backlight module of the present invention is a polycrystalline package light-emitting diode lamp board or a high-power light-emitting diode, which can simplify the assembly process compared with the light-emitting diode light strip, and In combination with the microstructure 14 disposed on the light guide plate 1, a better optical effect can be achieved, and the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1. . . Light guide

11. . . Glossy surface

12. . . back

13. . . Weekly

131. . . Edge

132. . . Truncated section

14. . . microstructure

2. . . Light-emitting element

twenty one. . . Light-emitting diode chip

twenty two. . . Substrate

1 is a perspective view showing a first preferred embodiment of a backlight module of the present invention;

Figure 2 is a plan view showing the first preferred embodiment;

3 is a partial perspective view showing the relationship between the light guide plate and the light-emitting element of the first preferred embodiment;

Figure 4 is an exploded perspective view showing the light-emitting element of the first preferred embodiment; and

Figure 5 is a perspective view showing a second preferred embodiment of the backlight module of the present invention.

11. . . Glossy surface

131. . . Edge

132. . . Truncated section

14. . . microstructure

2. . . Light-emitting element

Claims (8)

A backlight module includes: a light guide plate having a light emitting surface, a back surface on the opposite side of the light emitting surface, and a peripheral surface connecting the peripheral edge of the light emitting surface and the peripheral edge of the back surface; and at least one light emitting element, Provided toward the circumferential surface, the light-emitting element is a high-power light-emitting diode or a light-emitting diode light-emitting board of a polycrystalline package; and the peripheral surface of the light-guiding plate is further provided with the light-emitting element The light emitted by the light-emitting element re-enters the light guide plate through the microstructure, and is emitted from the light-emitting surface. The backlight module of claim 1, wherein the light guide plate has a rectangular shape, and the peripheral surface includes four symmetrical sides; the illuminating element is opposite to at least one side Location settings. The backlight module of claim 1, wherein the light guide plate has a rectangular shape, and the four corners are truncated, the circumferential surface includes four symmetrical sides, and four respectively a truncated portion formed by each truncated angle; the light emitting element is disposed with respect to at least one truncated portion. The backlight module of claim 1, wherein the light guide plate has a rectangular shape, and the four corners are truncated, the circumferential surface includes four symmetrical sides, and four respectively a truncated portion formed by each truncated angle; the plurality of light-emitting elements are provided, and are disposed at an intermediate position and at least one truncated portion with respect to at least one side portion. The backlight module of claim 1, wherein the microstructure is a U-shaped groove, a V-shaped groove or a roughened surface. A backlight module includes: a light guide plate having a light emitting surface, a back surface on the opposite side of the light emitting surface, and a peripheral surface connecting the peripheral edge of the light emitting surface and the peripheral edge of the back surface; and at least one light emitting element, The light-emitting element is disposed on the back surface, and the light-emitting element is a high-power light-emitting diode or a light-emitting diode light-emitting board of a polycrystalline package; and the back surface of the light-guiding plate is further provided with a microstructure, The light emitted by the light-emitting element enters the light guide plate through the microstructure, and is emitted from the light-emitting surface. The backlight module of claim 6, wherein the plurality of light-emitting elements are disposed at a plurality of intervals. The backlight module of claim 6, wherein the microstructure is a U-shaped groove, a V-shaped groove or a roughened surface.