JP2009289772A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
JP2009289772A
JP2009289772A JP2008137411A JP2008137411A JP2009289772A JP 2009289772 A JP2009289772 A JP 2009289772A JP 2008137411 A JP2008137411 A JP 2008137411A JP 2008137411 A JP2008137411 A JP 2008137411A JP 2009289772 A JP2009289772 A JP 2009289772A
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Prior art keywords
led
protrusions
led lamp
led chips
heat
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JP2008137411A
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Japanese (ja)
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Hiroyuki Fukui
啓之 福井
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP2008137411A priority Critical patent/JP2009289772A/en
Priority to US12/471,634 priority patent/US7973332B2/en
Publication of JP2009289772A publication Critical patent/JP2009289772A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lamp capable of equalizing a light quantity and preventing color irregularity. <P>SOLUTION: The LED lamp A is provided with a plurality of LED modules 3 and a heat radiation member 2 to which heat from the plurality of LED modules 3 is transmitted, wherein the plurality of LED modules 3 are one-dimensionally or two-dimensionally arranged to be dispersed, the heat radiating member 2 has a plurality of protrusions 21a, 21b, 21c, 22a, 22b, 22c which are superimposed on one of the plurality of LED modules 3, respectively, in a view of the main emission direction of the plurality of LED chips 3 and protrude to the rear of the main emission direction, and the plurality of protrusions 21a, 21b, 21c, 22a, 22b, 22c are arranged so that the closer to a center O of an arrangement region 3A the position is, the larger the surface area is. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、発光ダイオード（以下、ＬＥＤ）を光源とし、特に蛍光灯の代替として用いることができるＬＥＤランプに関する。   The present invention relates to an LED lamp that uses a light emitting diode (hereinafter referred to as LED) as a light source, and can be used as an alternative to a fluorescent lamp.

図５は、従来のＬＥＤランプの一例を断面図で示している（たとえば特許文献１参照）。同図に示されたＬＥＤランプＸは、長矩形状の基板９１と、基板９１上に搭載された複数のＬＥＤ９２と、基板９１を収容する管９３と、端子９４と、を備えている。基板９には、複数のＬＥＤ９２および端子９４に接続される図示しない配線パターンが形成されている。このＬＥＤランプＸは、端子９４を一般用蛍光灯照明器具のソケットの差込口に嵌合させることにより、複数のＬＥＤ９２を発光させることができるように構成されている。   FIG. 5 shows a cross-sectional view of an example of a conventional LED lamp (see, for example, Patent Document 1). The LED lamp X shown in the figure includes a long rectangular substrate 91, a plurality of LEDs 92 mounted on the substrate 91, a tube 93 that accommodates the substrate 91, and a terminal 94. A wiring pattern (not shown) connected to the plurality of LEDs 92 and the terminals 94 is formed on the substrate 9. This LED lamp X is configured such that a plurality of LEDs 92 can emit light by fitting a terminal 94 into an insertion port of a socket of a general fluorescent lamp lighting fixture.

しかしながら、ＬＥＤランプＸでは、複数のＬＥＤ９２の発光時に生じる熱を十分に外部へ排出することが困難であった。ＬＥＤ９２は、過度に高温である状態が続くと光量が減少したり発する光が変色したりする傾向がある。このため、複数のＬＥＤ９２からの放熱にバラツキがあると、ＬＥＤランプＸに部分的な光量の不均一や色むらが発生するという問題があった。   However, in the LED lamp X, it is difficult to sufficiently discharge the heat generated when the plurality of LEDs 92 emit light to the outside. The LED 92 tends to reduce the amount of light or change the color of emitted light when the state of excessively high temperature continues. For this reason, when there is variation in heat dissipation from the plurality of LEDs 92, there is a problem that the LED lamp X has partial non-uniform light amount and color unevenness.

実開平６−５４１０３号公報Japanese Utility Model Publication No. 6-54103

本発明は、上記した事情のもとで考え出されたものであって、光量の均一化および色むらの防止を図ることが可能なＬＥＤランプを提供することをその課題とする。   The present invention has been conceived under the circumstances described above, and an object thereof is to provide an LED lamp capable of achieving uniform light quantity and preventing uneven color.

本発明によって提供されるＬＥＤランプは、複数のＬＥＤチップと、上記複数のＬＥＤチップからの熱が伝達される放熱部材と、を備えるＬＥＤランプであって、上記複数のＬＥＤチップはこれらの主出射方向と直角である方向において１次元的または２次元的に離散配置されており、上記放熱部材は、上記複数のＬＥＤチップの主出射方向視においてそれぞれが上記複数のＬＥＤチップのいずれかと重なり、かつ上記主出射方向後方に突出する複数の突起を有しているとともに、上記複数の突起は、上記複数のＬＥＤチップが離散配置された配置領域の中心寄りに位置するものほど、表面積が大であることを特徴としている。   The LED lamp provided by the present invention is an LED lamp comprising a plurality of LED chips and a heat radiating member to which heat from the plurality of LED chips is transmitted, wherein the plurality of LED chips emits the main emission thereof. Are arranged one-dimensionally or two-dimensionally in a direction perpendicular to the direction, and each of the heat dissipating members overlaps one of the plurality of LED chips in a main emission direction view of the plurality of LED chips, and In addition to having a plurality of protrusions protruding rearward in the main emission direction, the plurality of protrusions have a larger surface area as they are located closer to the center of the arrangement area where the plurality of LED chips are discretely arranged. It is characterized by that.

このような構成によれば、上記複数の突起のうち上記配置領域の中心に近いものほど放熱効果が高い。これにより、上記複数のＬＥＤチップのうち上記中心に近いものほど高温となってしまうことを回避可能である。これは、上記ＬＥＤランプの光量の均一化および色むらの防止を図るのに適している。   According to such a configuration, the closer to the center of the arrangement region among the plurality of protrusions, the higher the heat dissipation effect. Thereby, it can be avoided that the closer to the center among the plurality of LED chips, the higher the temperature. This is suitable for making the light quantity of the LED lamp uniform and preventing color unevenness.

本発明の好ましい実施の形態においては、上記放熱部材は、上記複数の突起を連結し、上記複数の突起よりも上記複数のＬＥＤチップ寄りに位置する板状部を有する。このような構成によれば、上記複数の突起がぐらつくことを防止可能である。また、上記複数の突起のうちいずれかが過度に高温となってしまうことを抑制することができる。   In a preferred embodiment of the present invention, the heat dissipation member has a plate-like portion that connects the plurality of protrusions and is positioned closer to the plurality of LED chips than the plurality of protrusions. According to such a configuration, the plurality of protrusions can be prevented from wobbling. Moreover, it can suppress that any one of said several protrusion becomes high temperature too much.

本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。   Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。   Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

図１〜図４は、本発明に係るＬＥＤランプの一例を示している。本実施形態のＬＥＤランプＡは、基板１、放熱部材２、および複数のＬＥＤモジュール３を備えている。なお、図１〜図３においては、理解の便宜上金属配線層１１，１２、金属層１３，１５および保護層１６を省略している。   1 to 4 show an example of an LED lamp according to the present invention. The LED lamp A of this embodiment includes a substrate 1, a heat radiating member 2, and a plurality of LED modules 3. In FIG. 1 to FIG. 3, the metal wiring layers 11 and 12, the metal layers 13 and 15, and the protective layer 16 are omitted for convenience of understanding.

基板１は、たとえばガラスエポキシ製であり、長矩形状に形成されている。図４に示すように、基板１は、表面側に形成され互いに離間する金属配線層１１，１２、裏面側に形成された金属層１３、スルーホール１４、スルーホール１４の内面を覆う金属層１５、および、金属配線層１１，１２を覆う保護層１６を備えている。金属層１５は金属配線層１１と金属層１３とを導通させるように形成されている。金属配線層１１，１２および金属層１３，１５は、たとえばＣｕによって形成されている。なお、本実施形態とは異なり、基板１は、たとえばＡｌからなる基材に絶縁膜および金属配線層を積層させた構造であってもよい。   The substrate 1 is made of glass epoxy, for example, and is formed in a long rectangular shape. As shown in FIG. 4, the substrate 1 includes metal wiring layers 11 and 12 formed on the front surface side and spaced apart from each other, a metal layer 13 formed on the back surface side, a through hole 14, and a metal layer 15 covering the inner surface of the through hole 14. And a protective layer 16 covering the metal wiring layers 11 and 12. The metal layer 15 is formed so that the metal wiring layer 11 and the metal layer 13 are electrically connected. The metal wiring layers 11 and 12 and the metal layers 13 and 15 are made of Cu, for example. Unlike this embodiment, the substrate 1 may have a structure in which an insulating film and a metal wiring layer are laminated on a base material made of, for example, Al.

ＬＥＤモジュール３は、基板１を介して放熱部材２に支持されており、主出射方向Ｎが基板１の厚さ方向を向くように配置されている。図４に示すようにＬＥＤモジュール３は、ＬＥＤ３１、互いに離間する金属製のリード３２，３３、ワイヤ３４、および、樹脂パッケージ３５を備えている。図１に示すように、本実施形態においては、複数のＬＥＤモジュール３は、略矩形状の配置領域３Ａ内において、３行×５列のマトリクス状に配置されている。ＬＥＤランプＡには、たとえば乳白色の半透明樹脂からなる拡散透過カバー（図示略）が設けられている。複数のＬＥＤモジュール３からの光は、この拡散透過カバーによって拡散されるように透過する。これにより、ＬＥＤランプＡは、比較的均一に照射可能とされている。   The LED module 3 is supported by the heat dissipating member 2 via the substrate 1 and is disposed so that the main emission direction N faces the thickness direction of the substrate 1. As shown in FIG. 4, the LED module 3 includes an LED 31, metal leads 32 and 33 that are spaced apart from each other, a wire 34, and a resin package 35. As shown in FIG. 1, in the present embodiment, the plurality of LED modules 3 are arranged in a matrix of 3 rows × 5 columns in a substantially rectangular arrangement region 3A. The LED lamp A is provided with a diffuse transmission cover (not shown) made of, for example, milky white translucent resin. Light from the plurality of LED modules 3 is transmitted so as to be diffused by the diffusion transmission cover. Thereby, the LED lamp A can be irradiated relatively uniformly.

ＬＥＤ３１は、たとえばｎ型半導体層およびｐ型半導体層と、これらに挟まれた活性層とが積層された構造とされている。ＬＥＤ３１は、たとえばＧａＮ系半導体からなる場合、青色光を発光可能である。ＬＥＤ３１は、リード３２に搭載されている。さらに、ＬＥＤ３１の上面は、ワイヤ３４を介してリード３３に接続されている。リード３２は金属配線層１１に接続されており、リード３３は金属配線層１２に接続されている。   The LED 31 has, for example, a structure in which an n-type semiconductor layer and a p-type semiconductor layer and an active layer sandwiched between them are stacked. For example, when the LED 31 is made of a GaN-based semiconductor, it can emit blue light. The LED 31 is mounted on the lead 32. Further, the upper surface of the LED 31 is connected to the lead 33 via the wire 34. The lead 32 is connected to the metal wiring layer 11, and the lead 33 is connected to the metal wiring layer 12.

樹脂パッケージ３５は、ＬＥＤ３１およびワイヤ３４を保護するためのものである。樹脂パッケージ３５は、ＬＥＤ３１からの光に対して透光性を有するたとえばエポキシ樹脂を用いて形成されている。また、樹脂パッケージ３５に、青色光によって励起されることにより黄色光を発する蛍光材料を混入すれば、ＬＥＤモジュール３から白色光を出射させることが可能となる。   The resin package 35 is for protecting the LED 31 and the wire 34. The resin package 35 is formed by using, for example, an epoxy resin having translucency with respect to the light from the LED 31. In addition, if a fluorescent material that emits yellow light when excited by blue light is mixed in the resin package 35, white light can be emitted from the LED module 3.

放熱部材２は、たとえばＡｌによって形成されており、板状部２０および複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃを有している。板状部２０は基板１に接合された部分であり、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃを支持している。   The heat radiating member 2 is made of, for example, Al, and includes a plate-like portion 20 and a plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c. The plate-like portion 20 is a portion joined to the substrate 1 and supports a plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c.

複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃは、板状部２０から基板１とは反対側に突出しており、図１に示すように主出射方向Ｎ視において複数のＬＥＤモジュール３と重なるようにマトリクス状の配置とされている。図１〜図３に示すように、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃは、配置領域３Ａの中心Ｏに近いものほど断面積が大であり、かつ突出高さが高い。たとえば、図３に示すように、中心Ｏと重なる位置にある突起２１ａは、これに隣接する２つの突起２１ｂよりも断面積が大であり突出高さが高い。そして、両側に位置する２つの突起２１ｃは、本図に示された複数の突起２１ａ，２１ｂ，２１ｃの中で最も断面積が小であり、突出高さが低い。   The plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c protrude from the plate-like portion 20 to the opposite side of the substrate 1, and as shown in FIG. It is arranged in a matrix so as to overlap. As shown in FIGS. 1 to 3, the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c have a larger sectional area and a higher protruding height as they are closer to the center O of the arrangement region 3A. For example, as shown in FIG. 3, the protrusion 21a at the position overlapping the center O has a larger sectional area and a higher protrusion height than the two protrusions 21b adjacent to the protrusion 21a. The two protrusions 21c located on both sides have the smallest cross-sectional area among the plurality of protrusions 21a, 21b, and 21c shown in the figure, and the protrusion height is low.

次に、ＬＥＤランプＡの作用について説明する。   Next, the operation of the LED lamp A will be described.

マトリクス状に配置された複数のＬＥＤモジュール３は、配置領域３Ａの中心Ｏに近いものほど、これに隣接するＬＥＤモジュール３によって放熱が阻害されやすい。しかし、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃは、中心Ｏに近いものほど表面積が大である。このため、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃを経由した放熱量は、複数のＬＥＤモジュール３のうち中心Ｏに近いものほど大となる。したがって、複数のＬＥＤモジュール３の放熱を均一化することが可能であり、光量の均一化や色むらの防止を図ることができる。板状部２０によって複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃが連結された構造は、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃがぐらついたりすることを防止するとともに、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃのいずれかが過度に高温となることを防止するのに適している。   As the plurality of LED modules 3 arranged in a matrix form are closer to the center O of the arrangement region 3A, heat radiation is more easily inhibited by the LED modules 3 adjacent thereto. However, the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c have a larger surface area as they are closer to the center O. For this reason, the heat dissipation amount via the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c increases as the LED module 3 is closer to the center O. Accordingly, the heat radiation of the plurality of LED modules 3 can be made uniform, and the amount of light can be made uniform and uneven color can be prevented. The structure in which the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c are connected by the plate-like portion 20 prevents the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c from wobbling, It is suitable for preventing any of the plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c from becoming excessively high temperature.

本発明に係るＬＥＤランプは、上述した実施形態に限定されるものではない。本発明に係るＬＥＤランプの各部の具体的な構成は、種々に設計変更自在である。   The LED lamp according to the present invention is not limited to the embodiment described above. The specific configuration of each part of the LED lamp according to the present invention can be varied in design in various ways.

放熱部材２としては、板状部２０を有するものに限定されず、複数の突起２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃのみによって構成されたものでもよい。本発明で言う複数の突起の表面積を大とする手法としては、断面積および突出高さを大とすることに限定されず、たとえば突起の表面を凹凸状とすることによって表面積を拡大してもよい。本発明で言うＬＥＤチップは、ＬＥＤモジュールの形態とされたものに限定されず、たとえば基板に直接ダイボンディングされたＬＥＤチップであってもよい。本発明に係るＬＥＤランプは様々な形態とすることが可能であり、いわゆる直管蛍光灯または環状蛍光灯に類似の形態としてもよい。   The heat radiating member 2 is not limited to the one having the plate-like portion 20, and may be constituted only by a plurality of protrusions 21a, 21b, 21c, 22a, 22b, and 22c. The method for increasing the surface area of the plurality of protrusions referred to in the present invention is not limited to increasing the cross-sectional area and the protrusion height. For example, even if the surface area is increased by making the protrusion surface uneven. Good. The LED chip referred to in the present invention is not limited to the LED module, and may be, for example, an LED chip that is directly die-bonded to a substrate. The LED lamp according to the present invention can have various forms, and may have a form similar to a so-called straight tube fluorescent lamp or annular fluorescent lamp.

本発明に係るＬＥＤランプの一例を示す要部平面図である。It is a principal part top view which shows an example of the LED lamp which concerns on this invention. 図１に示すＬＥＤランプの斜視図である。It is a perspective view of the LED lamp shown in FIG. 図１のＩＩＩ−ＩＩＩ線に沿う要部断面図である。It is principal part sectional drawing in alignment with the III-III line of FIG. 図１のＩＶ−ＩＶ線に沿う要部拡大断面図である。It is a principal part expanded sectional view which follows the IV-IV line of FIG. 従来のＬＥＤランプの一例を示す断面図である。It is sectional drawing which shows an example of the conventional LED lamp.

符号の説明Explanation of symbols

Ａ ＬＥＤランプ
Ｏ 中心
１ 基板
２ 放熱部材
３ ＬＥＤモジュール
３Ａ 配置領域
１１，１２ 金属配線層
１３，１５ 金属層
１４ スルーホール
１６ 保護層
２０ 板状部
２１ａ,２１ｂ，２１ｃ，２２ａ，２２ｂ，２２ｃ 突起
３１ ＬＥＤチップ
３２，３３ リード
３４ ワイヤ
３５ 樹脂パッケージ A LED lamp O Center 1 Substrate 2 Heat radiating member 3 LED module 3A Arrangement area 11, 12 Metal wiring layers 13, 15 Metal layer 14 Through hole 16 Protective layer 20 Plate-like portions 21a, 21b, 21c, 22a, 22b, 22c Projection 31 LED chip 32, 33 Lead 34 Wire 35 Resin package

Claims (2)

複数のＬＥＤチップと、
上記複数のＬＥＤチップからの熱が伝達される放熱部材と、
を備えるＬＥＤランプであって、
上記複数のＬＥＤチップはこれらの主出射方向と直角である方向において１次元的または２次元的に離散配置されており、
上記放熱部材は、上記複数のＬＥＤチップの主出射方向視においてそれぞれが上記複数のＬＥＤチップのいずれかと重なり、かつ上記主出射方向後方に突出する複数の突起を有しているとともに、
上記複数の突起は、上記複数のＬＥＤチップが離散配置された配置領域の中心寄りに位置するものほど、表面積が大であることを特徴とする、ＬＥＤランプ。 A plurality of LED chips;
A heat radiating member to which heat from the plurality of LED chips is transmitted;
An LED lamp comprising:
The plurality of LED chips are arranged one-dimensionally or two-dimensionally in a direction perpendicular to the main emission direction,
The heat dissipating member has a plurality of protrusions each overlapping with any of the plurality of LED chips in the main emission direction view of the plurality of LED chips and protruding rearward in the main emission direction,
The LED lamp characterized in that the plurality of protrusions have a larger surface area as they are located closer to the center of the arrangement area where the plurality of LED chips are discretely arranged. 上記放熱部材は、上記複数の突起を連結し、上記複数の突起よりも上記複数のＬＥＤチップ寄りに位置する板状部を有する、請求項１に記載のＬＥＤランプ。   2. The LED lamp according to claim 1, wherein the heat dissipating member includes a plate-like portion that connects the plurality of protrusions and is positioned closer to the plurality of LED chips than the plurality of protrusions.
JP2008137411A 2008-05-26 2008-05-27 Led lamp Pending JP2009289772A (en)

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US12/471,634 US7973332B2 (en) 2008-05-26 2009-05-26 Lamp and method of making the same

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