JP2007059207A - Illumination apparatus using led - Google Patents

Illumination apparatus using led Download PDF

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JP2007059207A
JP2007059207A JP2005243091A JP2005243091A JP2007059207A JP 2007059207 A JP2007059207 A JP 2007059207A JP 2005243091 A JP2005243091 A JP 2005243091A JP 2005243091 A JP2005243091 A JP 2005243091A JP 2007059207 A JP2007059207 A JP 2007059207A
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led
mounting
central
mounting substrate
main
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JP4492486B2 (en
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Kenichiro Tanaka
健一郎 田中
Yoji Urano
洋二 浦野
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Matsushita Electric Works Ltd
松下電工株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination apparatus easy to assemble, using LEDs capable of obtaining illumination light with uniform brightness. <P>SOLUTION: The illumination apparatus has a plurality of LED modules 1, and a nearly disc-shaped mounting base plate 2 made of metallic material on a main surface 2a at one side of which the plurality of LED modules are uniformly arranged. The LED modules 1 are electrically insulated from and thermally jointed to the mounting base plate 2. The mounting base plate is formed so as to increase its thickness as it is headed from central part in a mounting area of the LED modules 1 to peripheral part thereof, therefore, heat capacity of the mounting base plate 2 becomes small as it is headed to central part. Accordingly, the heat generated from LED modules 1 arranged at center part of the mounting base plate 2 becomes easy to radiate, unevenness of light emission efficiency of the LED modules 1 is restrained, and an illumination light with uniform brightness can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDを用いた照明器具に関するものである。   The present invention relates to a lighting fixture using LEDs.
近年、白色LEDの高出力化に伴って、光源として白色LEDを用いた照明器具の開発が進められている(例えば特許文献1参照)。   In recent years, with the increase in output of white LEDs, development of luminaires using white LEDs as light sources has been promoted (see, for example, Patent Document 1).
この種の照明器具では、所望の光出力を得るために複数個のLEDを用いており、図7に示すように被照射面の明るさを均一にするために、円板状のプリント配線板30の表面に、プリント配線板30の中心位置を中心とする複数の同心円周上に同一ピッチ角で複数個のLED31を配置している。
実開平3−112818号公報
In this type of lighting fixture, a plurality of LEDs are used to obtain a desired light output, and in order to make the brightness of the irradiated surface uniform as shown in FIG. On the surface of 30, a plurality of LEDs 31 are arranged at the same pitch angle on a plurality of concentric circles centered on the center position of the printed wiring board 30.
Japanese Utility Model Publication No. 3-112818
上記構成の照明器具では、高出力のLED31を用いているため、LED31への投入電力が大きく、そのためLED31の発熱が増大していた。ここで、明るさを均一にするために、図7に示すように複数のLED31を略一定の間隔でプリント配線板30に配置した場合、空気層に熱が逃げやすい周辺部に比べて、中央部は周りに配置された他のLED31の温度の影響を受けて温度が上昇しやすく、その結果中央部に配置されたLED31の発光効率が低下して、輝度むらが発生するという問題があった。   In the lighting fixture having the above-described configuration, since the high-power LED 31 is used, the input power to the LED 31 is large, and thus the heat generation of the LED 31 is increased. Here, in order to make the brightness uniform, when a plurality of LEDs 31 are arranged on the printed wiring board 30 at substantially constant intervals as shown in FIG. The part is easily affected by the temperature of the other LEDs 31 arranged around it, and as a result, the luminous efficiency of the LED 31 arranged in the central part is lowered, resulting in uneven brightness. .
このような問題を解決するために、特許文献1に示される照明器具では、LEDが実装されるプリント配線板を複数枚に分割し、複数枚のプリント配線板の間に隙間が形成されるように、複数枚のプリント配線板を厚み方向において位置をずらして配置しており、プリント配線板の間の隙間を通して空気を対流させることで、中央部に配置されたLEDの温度上昇を抑制しているが、プリント配線板の枚数が増えるために、組立作業の作業性が悪化するという問題があった。   In order to solve such a problem, in the lighting apparatus shown in Patent Document 1, the printed wiring board on which the LED is mounted is divided into a plurality of sheets, and a gap is formed between the plurality of printed wiring boards. A plurality of printed wiring boards are arranged at different positions in the thickness direction, and air is convected through the gaps between the printed wiring boards to suppress the temperature rise of the LED placed in the center. Since the number of wiring boards increases, there is a problem that workability of assembly work is deteriorated.
本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、組立作業が簡単で、輝度の均一な照明光が得られるLEDを用いた照明器具を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an illuminating device using an LED that is easy to assemble and obtains illumination light with uniform brightness. .
上記目的を達成するために、請求項1の発明は、複数のLEDと、一方の主表面に複数のLEDが均一に配置される取付基板とを備え、取付基板は、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成されたことを特徴とする。   In order to achieve the above object, the invention of claim 1 includes a plurality of LEDs and a mounting board on which a plurality of LEDs are uniformly arranged on one main surface, and the mounting board is a center in the LED mounting range. It is characterized in that the heat radiation property of the part is formed to be higher than the heat radiation property of the peripheral part.
この発明によれば、複数のLEDが均一に配置される取付基板を、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているので、周辺部に比べてLEDの発熱による温度上昇が大きい中央部の熱を放熱しやすくでき、その結果中央部と周辺部との温度差を低減できるから、中央部に配置されたLEDの発光効率の低下を抑制して、照明器具の輝度を均一にすることができる。しかも、取付基板自体が、LEDの取付範囲における中央部の放熱性を周辺部の放熱性よりも高くなるように形成されているので、取付基板を複数枚の基板に分割した場合に比べて、部品点数が少なくなり、組立の手間を簡単にできる。   According to the present invention, the mounting substrate on which the plurality of LEDs are uniformly arranged is formed so that the heat dissipation of the central part in the LED mounting range is higher than the heat dissipation of the peripheral part. Compared to the heat generated in the LED, the heat at the center can be easily dissipated, and as a result, the temperature difference between the center and the periphery can be reduced. Thus, the brightness of the lighting fixture can be made uniform. Moreover, since the mounting substrate itself is formed so that the heat dissipation of the central portion in the LED mounting range is higher than the heat dissipation of the peripheral portion, compared to the case where the mounting substrate is divided into a plurality of substrates, The number of parts is reduced and the assembly work can be simplified.
請求項2の発明は、請求項1の発明において、取付基板は、LEDの取付範囲における中央部から周辺部へ行くほど、厚み寸法が厚くなるように形成されたことを特徴とする。   The invention of claim 2 is characterized in that, in the invention of claim 1, the mounting board is formed such that the thickness dimension increases from the central part to the peripheral part in the LED mounting range.
この発明によれば、取付基板は、LEDの取付範囲における中央部の熱容量が、周辺部の熱容量に比べて小さくなるので、取付範囲の中央部に配置されたLEDの発熱が、取付基板の他方の主表面に伝導しやすくなり、その結果中央部のLEDの発熱を放熱しやすくなるから、取付範囲における中央部と周辺部との温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光が得られる。   According to this invention, since the heat capacity of the central portion in the mounting range of the LED is smaller than the heat capacity of the peripheral portion, the heat generation of the LED disposed in the central portion of the mounting range is caused by the other of the mounting substrate. As a result, it becomes easy to dissipate the heat generated by the LED in the center part, and as a result, the temperature difference between the center part and the peripheral part in the mounting range becomes small, and the luminous efficiency of the LED arranged in the center part The illumination light with uniform luminance can be obtained.
請求項3の発明は、請求項1の発明において、取付基板における他方の主表面を、一方の主表面に対して所定角度傾斜する傾斜面としたことを特徴とする。   The invention of claim 3 is characterized in that, in the invention of claim 1, the other main surface of the mounting substrate is an inclined surface inclined at a predetermined angle with respect to the one main surface.
この発明によれば、取付基板における他方の主表面に、一方の主表面に対して所定角度傾斜する傾斜面を形成しているので、一方の主表面の法線方向が鉛直方向と略直交し、且つ、鉛直上方ほど取付基板の厚みが厚くなるように、取付基板を配置すると、下側のLEDの発熱によって上側のLEDほど温度上昇が大きくなるが、取付基板の厚みは鉛直上方ほど厚くなっているので、上側ほど放熱性が高くなって、上側のLEDの温度上昇が抑制されるから、温度上昇による発光効率の低下が抑制され、照明器具の輝度を均一にすることができる。   According to the present invention, since the inclined surface inclined at a predetermined angle with respect to the one main surface is formed on the other main surface of the mounting substrate, the normal direction of the one main surface is substantially orthogonal to the vertical direction. And when the mounting board is arranged so that the thickness of the mounting board becomes thicker in the upper vertical direction, the temperature rises more in the upper LED due to the heat generation of the lower LED, but the thickness of the mounting board becomes thicker in the vertical upper direction. Therefore, the heat dissipation becomes higher toward the upper side, and the temperature rise of the upper LED is suppressed. Therefore, the decrease in light emission efficiency due to the temperature increase is suppressed, and the luminance of the lighting fixture can be made uniform.
請求項4の発明は、請求項3の発明において、傾斜面に、傾斜方向に沿って延びる複数の溝を形成したことを特徴とする。   The invention of claim 4 is characterized in that, in the invention of claim 3, a plurality of grooves extending along the inclined direction are formed on the inclined surface.
この発明によれば、傾斜面に形成した溝内を空気が通過することで、空気の流れが整流されるので、空気の対流が起きやすくなり、中央部のLEDの発熱を放熱しやすくなる。   According to the present invention, the air flow is rectified by passing the air through the groove formed in the inclined surface, so that air convection is likely to occur, and the heat generated by the central LED is easily radiated.
請求項5の発明は、請求項1の発明において、取付基板は、LEDの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする。   According to a fifth aspect of the present invention, in the first aspect of the present invention, the mounting substrate is higher in heat dissipation or radiation than the material in the central portion in the LED mounting range than the material in the peripheral portion. It is characterized by the material.
この発明によれば、取付範囲の中央部に配置されたLEDの発熱を放熱しやすくなるから、取付範囲における中央部に配置されたLEDと周辺部に配置されたLEDとの温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光を得ることができる。   According to the present invention, it is easy to dissipate the heat generated by the LED disposed in the central portion of the mounting range, so that the temperature difference between the LED disposed in the central portion and the LED disposed in the peripheral portion in the mounting range is reduced. In addition, it is possible to obtain illumination light with uniform luminance while suppressing a decrease in the light emission efficiency of the LED disposed in the central portion.
請求項1の発明によれば、複数のLEDが均一に配置される取付基板を、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているので、周辺部に比べてLEDの発熱による温度上昇が大きい中央部の熱を放熱しやすくでき、その結果中央部と周辺部との温度差を低減できるから、中央部に配置されたLEDの発光効率の低下を抑制して、照明器具の輝度を均一にすることができる。しかも、取付基板自体が、LEDの取付範囲における中央部の放熱性を周辺部の放熱性よりも高くなるように形成されているので、取付基板を複数枚の基板に分割した場合に比べて、部品点数が少なくなり、組立の手間を簡単にできる。   According to the invention of claim 1, since the mounting substrate on which a plurality of LEDs are uniformly arranged is formed so that the heat dissipation of the central portion in the LED mounting range is higher than the heat dissipation of the peripheral portion, It is easy to dissipate the heat of the central part where the temperature rise due to the heat generation of the LED is larger than that of the peripheral part. As a result, the temperature difference between the central part and the peripheral part can be reduced. It is possible to suppress the decrease and make the luminance of the lighting fixture uniform. Moreover, since the mounting substrate itself is formed so that the heat dissipation of the central portion in the LED mounting range is higher than the heat dissipation of the peripheral portion, compared to the case where the mounting substrate is divided into a plurality of substrates, The number of parts is reduced and the assembly work can be simplified.
請求項2の発明によれば、取付基板は、LEDの取付範囲における中央部の熱容量が、周辺部の熱容量に比べて小さくなるので、取付範囲の中央部に配置されたLEDの発熱が、取付基板の他方の主表面に伝導しやすくなり、その結果中央部のLEDの発熱を放熱しやすくなるから、取付範囲における中央部と周辺部との温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光が得られる。   According to the invention of claim 2, since the heat capacity of the central part in the attachment range of the LED is smaller than the heat capacity of the peripheral part, the heat generation of the LED arranged in the central part of the attachment range is attached to the attachment substrate. It becomes easy to conduct to the other main surface of the substrate, and as a result, it is easy to dissipate the heat generated by the LED in the center, so the temperature difference between the center and the periphery in the mounting range is reduced, and the LED arranged in the center In this way, illumination light with uniform brightness can be obtained.
請求項3の発明によれば、取付基板における他方の主表面に、一方の主表面に対して所定角度傾斜する傾斜面を形成しているので、一方の主表面の法線方向が鉛直方向と略直交し、且つ、鉛直上方ほど取付基板の厚みが厚くなるように、取付基板を配置すると、下側のLEDの発熱によって上側のLEDほど温度上昇が大きくなるが、取付基板の厚みは鉛直上方ほど厚くなっているので、上側ほど放熱性が高くなって、上側のLEDの温度上昇が抑制されるから、温度上昇による発光効率の低下が抑制され、照明器具の輝度を均一にすることができる。   According to the invention of claim 3, since the inclined surface inclined at a predetermined angle with respect to the one main surface is formed on the other main surface of the mounting substrate, the normal direction of the one main surface is the vertical direction. When the mounting board is arranged so that the thickness of the mounting board is substantially perpendicular and the upper part of the mounting board is thicker, the temperature of the upper LED is increased by the heat generation of the lower LED. Since it is thicker, the heat dissipation becomes higher on the upper side, and the temperature rise of the upper LED is suppressed, so that a decrease in luminous efficiency due to the temperature rise is suppressed, and the luminance of the lighting fixture can be made uniform. .
請求項4の発明によれば、傾斜面に形成した溝内を空気が通過することで、空気の流れが整流されるので、空気の対流が起きやすくなり、中央部のLEDの発熱を放熱しやすくなる。   According to the fourth aspect of the present invention, the air flow is rectified by passing the air through the groove formed in the inclined surface, so that air convection is likely to occur, and the heat generated by the central LED is radiated. It becomes easy.
請求項5の発明によれば、取付範囲の中央部に配置されたLEDの発熱を放熱しやすくなるから、取付範囲における中央部に配置されたLEDと周辺部に配置されたLEDとの温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光を得ることができる。   According to the invention of claim 5, since it becomes easy to dissipate the heat generated by the LED arranged in the central part of the attachment range, the temperature difference between the LED arranged in the central part and the LED arranged in the peripheral part in the attachment range. Is reduced, and it is possible to obtain illumination light with uniform brightness by suppressing a decrease in light emission efficiency of the LED disposed in the central portion.
以下に本発明の実施の形態を図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the drawings.
(実施形態1)
本発明の実施形態1を図1〜図4に基づいて説明する。本実施形態の照明器具は、複数のLEDモジュール1と、複数のLEDモジュール1が配置される取付基板2とを備え、図示しない電源装置から各LEDモジュール1に直流電源が供給されて、各LEDモジュール1が発光するようになっている。
(Embodiment 1)
A first embodiment of the present invention will be described with reference to FIGS. The lighting fixture of the present embodiment includes a plurality of LED modules 1 and a mounting substrate 2 on which the plurality of LED modules 1 are arranged, and direct current power is supplied to each LED module 1 from a power supply device (not shown) so that each LED The module 1 emits light.
各LEDモジュール1は、図3に示すように、矩形板状のLEDチップ10と、導電材料により略T形に形成され、幅広部11aにLEDチップ10が搭載されたチップ搭載部材11と、導電材料により略T形に形成され、幅広部12aがチップ搭載部材11の幅広部11aに離間して配置された端子板12と、LEDチップ10を囲むように配置されLEDチップ10の側面から放射された光をLEDチップ10の前方(図1中の左側)に放射させるリフレクタ13と、透光性を有する合成樹脂によりドーム形に形成されLEDチップ10を覆うようにしてリフレクタ13の前方に配置される保護カバー14とを備えている。ここで、リフレクタ13は、絶縁性を有するシート状の接着フィルムからなる固着材17を介してチップ搭載部材11および端子板12に取着されており、固着材17の中央にはLEDチップ10を露出させる丸孔17aが貫設されている。   As shown in FIG. 3, each LED module 1 includes a rectangular plate-shaped LED chip 10, a chip mounting member 11 that is formed in a substantially T shape with a conductive material, and the LED chip 10 is mounted on the wide portion 11 a, and a conductive material. It is formed in a substantially T shape with a material, and the wide portion 12a is disposed so as to surround the LED chip 10 and the terminal plate 12 disposed so as to be separated from the wide portion 11a of the chip mounting member 11, and is emitted from the side surface of the LED chip 10. A reflector 13 that radiates the emitted light to the front of the LED chip 10 (left side in FIG. 1) and a dome shape formed of a transparent synthetic resin is disposed in front of the reflector 13 so as to cover the LED chip 10. And a protective cover 14. Here, the reflector 13 is attached to the chip mounting member 11 and the terminal plate 12 via a fixing material 17 made of an insulating sheet-like adhesive film, and the LED chip 10 is placed at the center of the fixing material 17. A round hole 17a to be exposed is provided.
チップ搭載部材11および端子板12は金属板(例えば銅板など)からなるリードフレームを用いて形成され、絶縁性を有する合成樹脂により矩形枠状に成形された保持枠15に同時一体に成形されている。チップ搭載部材11および端子板12の幅広部11a,12aは保持枠15の内側に配置され、保持枠15の外側に突出するチップ搭載部材11および端子板12の部位がそれぞれ外部接続端子11b,12bとなる。また、チップ搭載部材11および端子板12と取付基板2との間にはグリーンシートからなる絶縁シート16が介在しており、チップ搭載部材11および端子板12と取付基板2との間を電気的に絶縁するとともに、熱的に結合している。尚、絶縁シート16はグリーンシートのようなシート状に成形したセラミックの未燒結体に限らず、例えば熱硬化性の固着材(例えばエポキシ樹脂など)を用いても良い。   The chip mounting member 11 and the terminal plate 12 are formed by using a lead frame made of a metal plate (for example, a copper plate), and are simultaneously and integrally formed on a holding frame 15 formed into a rectangular frame shape by an insulating synthetic resin. Yes. The wide portions 11a and 12a of the chip mounting member 11 and the terminal plate 12 are arranged inside the holding frame 15, and the portions of the chip mounting member 11 and the terminal plate 12 that protrude outside the holding frame 15 are external connection terminals 11b and 12b, respectively. It becomes. Further, an insulating sheet 16 made of a green sheet is interposed between the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2, and the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2 are electrically connected. Insulated and thermally coupled. The insulating sheet 16 is not limited to a ceramic unsintered body formed into a sheet shape such as a green sheet. For example, a thermosetting fixing material (such as an epoxy resin) may be used.
LEDチップ10は一表面側にアノード電極が形成されるとともに、他表面側にカソード電極が形成されており、アノード電極又はカソード電極の内の一方の電極が導電性のサブマウント部材18を介してチップ搭載部材11の幅広部11aに電気的に接続され、他方の電極が金属細線(例えば金細線、アルミニウム細線など)からなるボンディングワイヤ19を介して端子板12の幅広部12aに電気的に接続されている。   The LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side, and one of the anode electrode and the cathode electrode is interposed through a conductive submount member 18. It is electrically connected to the wide portion 11a of the chip mounting member 11, and the other electrode is electrically connected to the wide portion 12a of the terminal plate 12 via a bonding wire 19 made of a metal thin wire (for example, a gold thin wire, an aluminum thin wire, etc.). Has been.
取付基板2は、例えばアルミニウムや銅などの熱伝導率が高い金属により略円板形に形成されている。取付基板2の一方の主表面2aには、取付基板2の中心点を中心とする複数の同心円周上に同一ピッチ角で複数個のLEDモジュール1が取着され、各LEDモジュール1の間は図示しないリード線を介して直列に接続され、電源回路から電力が供給されて点灯するようになっている。尚、本実施形態では複数個のLEDモジュール1を直列接続しているが、複数個のLEDモジュール1の接続関係は直列接続に限定されるものではなく、複数個のLEDモジュール1を並列接続しても良いし、直列接続と並列接続とを組み合わせても良い。また複数個のLEDモジュール1の配置は図2の配置に限定されるものではなく、照明器具の使用用途などに合わせて適宜配置を設定すれば良い。   The mounting substrate 2 is formed in a substantially disk shape with a metal having high thermal conductivity such as aluminum or copper. A plurality of LED modules 1 are attached to one main surface 2a of the mounting substrate 2 at the same pitch angle on a plurality of concentric circles centered on the center point of the mounting substrate 2. They are connected in series via a lead wire (not shown), and are lit when power is supplied from the power supply circuit. In this embodiment, a plurality of LED modules 1 are connected in series. However, the connection relationship between the plurality of LED modules 1 is not limited to the series connection, and a plurality of LED modules 1 are connected in parallel. Alternatively, a series connection and a parallel connection may be combined. Further, the arrangement of the plurality of LED modules 1 is not limited to the arrangement shown in FIG. 2, and the arrangement may be appropriately set in accordance with the usage application of the lighting fixture.
一方、取付基板2の他方の主表面2bは、図1に示すように取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成されており、取付基板2の熱容量は中央部から周辺部に行くほど小さくなっている。ここで、取付基板2の一方の主表面2aには複数個のLEDモジュール1を均一に配置しており、LEDモジュール1の取付範囲において中央部に配置されたLEDモジュール1は、他のLEDモジュール1によって周りを囲まれているため放熱性が悪く、中央部のLEDモジュール1の温度上昇が、周辺部のLEDモジュール1の温度上昇に比べて大きくなるが、取付基板2の熱容量を中央部から周辺部へ行くほど小さくしているので、主表面2aの中央部に配置されたLEDモジュール1の発熱は、周辺部に配置されたLEDモジュール1に比べて効率良く反対側の主表面2bに伝導して放熱され、中心付近のLEDモジュール1の温度上昇を抑制することができる。したがって、取付基板2の主表面2aにおいて中心付近に配置されたLEDモジュール1と、周辺部に配置されたLEDモジュール1の温度上昇のばらつきを低減でき、発光効率のばらつきが抑制されるから、輝度むらを低減することができる。   On the other hand, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface such that the thickness dimension increases from the center position of the mounting substrate 2 to the outer periphery as shown in FIG. The heat capacity decreases from the center to the periphery. Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1 and the heat dissipation is poor, and the temperature rise of the LED module 1 at the center is larger than the temperature rise of the LED module 1 at the periphery, but the heat capacity of the mounting substrate 2 is increased from the center. Since it is made small so that it goes to a peripheral part, the heat_generation | fever of the LED module 1 arrange | positioned in the center part of the main surface 2a is efficiently conducted to the main surface 2b on the opposite side compared with the LED module 1 arrange | positioned in a peripheral part. The heat is dissipated and the temperature rise of the LED module 1 near the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, and the variation in luminous efficiency is suppressed. Unevenness can be reduced.
ところで、取付基板2の主表面2bを、取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成する代わりに、図4(a)に示すように取付基板2の背面側(主表面2aと反対側)に取付基板2の発熱を放熱する放熱部3を一体に設けても良い。放熱部3は取付基板2の背面側に突設された複数の板状の放熱フィン3aを備えている。ここで、取付基板2の径方向の断面において、複数の放熱フィン3aの先端を結んでできる曲線が包絡線となるように、中央の放熱フィン3aほど突出量が大きく形成されており、周辺部から中央部にいくほど放熱部3の放熱性が高くなっている。この放熱部3は取付基板2と一体に設けられているので、取付基板2の中央部(すなわちLEDモジュール1の取付範囲の中央部)の熱を放熱部3により効率良く放熱させることができ、中央部に配置されたLEDモジュール1の温度上昇を抑制して、輝度むらを低減することができる。   By the way, instead of forming the main surface 2b of the mounting substrate 2 into a concave curved surface that increases in thickness as it goes from the center position of the mounting substrate 2 to the outer peripheral portion, as shown in FIG. A heat radiating portion 3 for radiating heat generated by the mounting substrate 2 may be integrally provided on the back side (the side opposite to the main surface 2a). The heat dissipating part 3 includes a plurality of plate-like heat dissipating fins 3 a protruding from the back side of the mounting substrate 2. Here, in the radial cross section of the mounting substrate 2, the projecting amount of the central radiating fin 3 a is increased so that the curve formed by connecting the tips of the plurality of radiating fins 3 a becomes an envelope. The heat dissipating property of the heat dissipating part 3 increases as the distance from the center increases. Since the heat radiating part 3 is provided integrally with the mounting board 2, the heat of the central part of the mounting board 2 (that is, the central part of the mounting range of the LED module 1) can be efficiently radiated by the heat radiating part 3. An increase in temperature of the LED module 1 disposed in the central portion can be suppressed, and uneven brightness can be reduced.
なお、図4(a)に示す形態では取付基板2の背面に板状の放熱フィンを複数突設しているが、図4(c)に示すように放熱部3を取付基板2の背面に突設された複数本のロッド状の放熱フィン3bで構成し、取付基板2の中心位置に近い放熱フィン3bほど長さを長くすることで、中央部の放熱性を高めても良い。   In the form shown in FIG. 4A, a plurality of plate-like heat radiating fins are provided on the back surface of the mounting substrate 2, but the heat radiating portion 3 is provided on the back surface of the mounting substrate 2 as shown in FIG. A plurality of rod-shaped heat radiation fins 3b projecting from each other, and the heat radiation fins 3b closer to the center position of the mounting substrate 2 may be made longer to increase the heat radiation performance at the center.
また、図4(b)に示すように、図1に示す取付基板2の他方の主表面2bに、取付基板2の発熱を放熱する放熱器3’を取着しても良い。この放熱器3’は例えばアルミニウム等の熱伝導率の良好な金属材料により形成され、一方の表面が取付基板2の主表面2bに面接触する凸曲面に形成されるとともに、他方の主表面が中央部に行くほど突出量が大きくなるような凸曲面に形成されており、放熱器3の放熱性が周辺部から中央部にいくほど高くなっているから、取付基板2の中央部の発熱を効率良く、放熱させることができる。   Further, as shown in FIG. 4B, a radiator 3 'for radiating the heat generated by the mounting board 2 may be attached to the other main surface 2b of the mounting board 2 shown in FIG. The radiator 3 ′ is formed of a metal material having a good thermal conductivity such as aluminum, and has one surface formed in a convex curved surface in surface contact with the main surface 2b of the mounting substrate 2 and the other main surface being It is formed in a convex curved surface with a protruding amount that increases toward the center, and the heat dissipation performance of the radiator 3 increases from the periphery to the center. It is possible to dissipate heat efficiently.
(実施形態2)
本発明の実施形態2を図5(a)(b)に基づいて説明する。上述の実施形態1では、取付基板2の他方の主表面2bを、取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成しているのに対して、本実施形態では他方の主表面2bを、一方の主表面2aに対して所定角度傾斜するような傾斜面に形成してある。この主表面2bには、傾斜方向に沿って延びる複数の突壁21が略一定の間隔を開けて突設してあり、隣接する突壁21の間に傾斜方向に沿って延びる溝22が複数形成される。尚、主表面2bの形状以外は実施形態1と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIGS. In the first embodiment described above, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface that increases in thickness as it goes from the center position of the mounting substrate 2 to the outer peripheral portion. In the embodiment, the other main surface 2b is formed into an inclined surface that is inclined by a predetermined angle with respect to the one main surface 2a. A plurality of protruding walls 21 extending along the inclined direction are provided on the main surface 2b with a substantially constant interval, and a plurality of grooves 22 extending along the inclined direction are provided between the adjacent protruding walls 21. It is formed. In addition, since it is the same as that of Embodiment 1 except the shape of the main surface 2b, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.
ここで、図5(a)に示すように、取付基板2における一方の主表面2aの法線方向が鉛直方向と直交し、且つ、鉛直上側ほど取付基板2の厚みが厚くなるように、取付基板2を配置した場合、下側のLEDモジュール1の発熱によって上側のLEDモジュール1ほど温度上昇が大きくなるが、取付基板2の厚みは上側ほど厚くなっているので、上側のLEDモジュール1ほど放熱性が高くなって温度上昇が低減されるから、温度上昇による発光効率の低下が抑制されて、照明器具の輝度を均一にすることができる。また、主表面2bには傾斜方向に沿って延びる突壁21が複数突設され、隣接する突壁21の間に傾斜方向に沿って延びる溝22が形成されるので、溝22内部を空気が通過することによって空気の流れが整流され、空気の対流が起きやすくなり、放熱性を向上させることができる。尚、図5中の矢印は空気の流れを示している。   Here, as shown in FIG. 5 (a), the mounting substrate 2 is mounted so that the normal direction of one main surface 2a of the mounting substrate 2 is perpendicular to the vertical direction, and the thickness of the mounting substrate 2 increases toward the upper vertical side. When the substrate 2 is arranged, the temperature rises as the upper LED module 1 increases due to the heat generated by the lower LED module 1, but the thickness of the mounting substrate 2 increases as the upper LED module 1 increases. Therefore, the increase in temperature is reduced and the decrease in luminous efficiency due to the temperature increase is suppressed, and the luminance of the lighting fixture can be made uniform. Further, the main surface 2b is provided with a plurality of protruding walls 21 extending along the inclined direction, and a groove 22 extending along the inclined direction is formed between the adjacent protruding walls 21. By passing, the air flow is rectified, air convection is likely to occur, and heat dissipation can be improved. In addition, the arrow in FIG. 5 has shown the flow of air.
(実施形態3)
本発明の実施形態3について説明する。上述の実施形態1では、取付基板2の主表面2bを凹曲面に形成することによって、LEDモジュール1の取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているが、本実施形態では、図6に示すように取付基板2の主表面2bを平面形状に形成し、中央に丸孔23が貫設された円環部24と、円環部24の丸孔23内に嵌合される小径の芯部25とを一体に結合して取付基板2を構成している。尚、取付基板2の形状以外は実施形態1と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
(Embodiment 3)
Embodiment 3 of the present invention will be described. In the first embodiment described above, the main surface 2b of the mounting substrate 2 is formed in a concave curved surface so that the heat dissipation of the central part in the mounting range of the LED module 1 is higher than the heat dissipation of the peripheral part. However, in the present embodiment, as shown in FIG. 6, the main surface 2 b of the mounting substrate 2 is formed in a planar shape, and a circular portion 24 having a circular hole 23 penetrating in the center, and a circular shape of the circular portion 24. The mounting substrate 2 is configured by integrally connecting a small-diameter core portion 25 fitted in the hole 23. In addition, since it is the same as that of Embodiment 1 except the shape of the attachment board | substrate 2, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.
上述のように取付基板2は、LEDモジュール1の取付範囲における中心部(芯部25)と周辺部(円環部24)とが別々の材料により形成されており、芯部25は、円環部24に比べて放熱性又は熱伝導率が高い材料、或いは、円環部24に比べて輻射性が高い材料で形成しているので、取付基板2の周辺部に比べて中央部の放熱性又は輻射性を高めることができる。円環部24および芯部25の材料として例えば表1に示すような材料を用いることができ、これらの材料の中から熱伝導率が相対的に高い材料を芯部25に、熱伝導率が相対的に低い材料を円環部24に用いれば良い。また、黒化処理を施したCuや陽極酸化処理を施したAlを芯部25として用いたり、芯部25に黒色塗料を塗布しても良く、取付基板2の中心部ほど色を黒くすることで、中心部の熱輻射性を高めることができる。また、円環部24および芯部25は、それぞれ、単一の材料で形成しても良いし、複数の材料からなるものを組み合わせることで、放熱性や熱輻射性が取付基板2の中心部ほど高くなるように傾斜を持たせても良い。なお、円環部24および芯部25の材料や寸法は、LEDモジュール1の点灯状態における取付基板2の温度分布等を考慮して、適宜設定すれば良い。   As described above, the mounting substrate 2 is formed by using different materials for the central portion (core portion 25) and the peripheral portion (ring portion 24) in the mounting range of the LED module 1, and the core portion 25 is an annular ring. Since it is made of a material having high heat dissipation or thermal conductivity compared to the portion 24 or a material having high radiation compared to the annular portion 24, the heat dissipation of the central portion compared to the peripheral portion of the mounting substrate 2. Alternatively, radiation can be improved. For example, the materials shown in Table 1 can be used as the material of the annular portion 24 and the core portion 25. Among these materials, a material having a relatively high thermal conductivity is used for the core portion 25, and the thermal conductivity is high. A relatively low material may be used for the annular portion 24. Further, blackened Cu or anodized Al may be used as the core portion 25, or a black paint may be applied to the core portion 25, and the color of the central portion of the mounting substrate 2 is made blacker. Thus, the heat radiation property of the central portion can be enhanced. In addition, each of the annular portion 24 and the core portion 25 may be formed of a single material, or a combination of materials made of a plurality of materials allows heat dissipation and heat radiation to be the central portion of the mounting substrate 2. You may give it an inclination so that it may become so high. In addition, what is necessary is just to set the material and dimension of the annular part 24 and the core part 25 suitably in consideration of the temperature distribution etc. of the mounting substrate 2 in the lighting state of the LED module 1.
ここで、取付基板2の一方の主表面2aには複数個のLEDモジュール1を均一に配置しており、LEDモジュール1の取付範囲において中央部に配置されたLEDモジュール1は、他のLEDモジュール1によって周りを囲まれているため放熱性が悪く、中央部のLEDモジュール1の温度上昇が、周辺部のLEDモジュール1の温度上昇に比べて大きくなるが、取付基板2は、芯部25の材料が、円環部24の材料に比べて放熱性および輻射性が高い材料で形成されているので、主表面2aの中央部に配置されたLEDモジュール1の発熱は、周辺部に配置されたLEDモジュール1に比べて効率良く反対側の主表面2bに伝導されて、放熱されるから、中央部のLEDモジュール1の温度上昇を抑制することができる。したがって、取付基板2の主表面2aにおいて中心付近に配置されたLEDモジュール1と、周辺部に配置されたLEDモジュール1の温度上昇のばらつきを低減でき、発光効率のばらつきを低減して、輝度が均一な照明光を得ることができる。   Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1, the heat dissipation is poor, and the temperature rise of the LED module 1 in the central part is larger than the temperature rise of the LED module 1 in the peripheral part. Since the material is formed of a material having higher heat dissipation and radiation than the material of the annular portion 24, the heat generated by the LED module 1 disposed in the central portion of the main surface 2a is disposed in the peripheral portion. Compared to the LED module 1, it is efficiently conducted to the opposite main surface 2 b and dissipated, so that the temperature rise of the LED module 1 in the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, the variation in luminous efficiency can be reduced, and the luminance can be reduced. Uniform illumination light can be obtained.
なお、上述した実施形態1、2の照明器具において、本実施形態と同様に円環部24と芯部25とを結合して取付基板2を形成し、芯部25の材料を円環部24に比べて放熱性又は輻射性の内少なくとも何れか一方が高い材料を用いても良く、中央部のLEDモジュール1の温度上昇を抑制し、取付基板2における熱分布を均一にできる。   In addition, in the lighting fixture of Embodiment 1 and 2 mentioned above, the annular base part 24 and the core part 25 are couple | bonded similarly to this embodiment, the attachment board | substrate 2 is formed, and the material of the core part 25 is made into the annular part 24. Compared to the above, a material having at least one of heat dissipation and radiation properties may be used, and the temperature rise of the LED module 1 in the central portion can be suppressed, and the heat distribution on the mounting substrate 2 can be made uniform.
なお、本発明の精神と範囲に反することなしに、広範に異なる実施形態を構成することができることは明白なので、この発明は、特定の実施形態に制約されるものではない。   It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.
実施形態1を示す要部断面図である。FIG. 3 is a cross-sectional view of a main part showing Embodiment 1. 同上の要部の外観斜視図である。It is an external appearance perspective view of the principal part same as the above. 同上に用いるLEDモジュールの分解斜視図である。It is a disassembled perspective view of the LED module used for the same as the above. (a)〜(c)は同上の他の構成を示す要部断面図である。(A)-(c) is principal part sectional drawing which shows the other structure same as the above. 実施形態2を示し、(a)は要部断面図、(b)は取付基板の背面図である。Embodiment 2 is shown, (a) is a sectional view of the main part, (b) is a rear view of the mounting substrate. 実施形態3を示す要部断面図である。FIG. 6 is a cross-sectional view of a main part showing Embodiment 3. 従来の照明器具に用いるプリント配線板を示し、(a)は正面図、(b)は下側から見た側面図である。The printed wiring board used for the conventional lighting fixture is shown, (a) is a front view, (b) is the side view seen from the lower side.
符号の説明Explanation of symbols
1 LEDモジュール
2 取付基板
2a 主表面
1 LED module 2 Mounting board 2a Main surface

Claims (5)

  1. 複数のLEDと、一方の主表面に前記複数のLEDが均一に配置される取付基板とを備え、前記取付基板は、前記LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成されたことを特徴とするLEDを用いた照明器具。   A plurality of LEDs, and a mounting substrate on which the plurality of LEDs are uniformly arranged on one main surface, and the mounting substrate has a heat dissipation property at a central portion in a mounting range of the LEDs as compared with a heat dissipation property at a peripheral portion. A lighting fixture using LEDs, characterized by being formed to be high.
  2. 前記取付基板は、前記LEDの取付範囲における中央部から周辺部へ行くほど、厚み寸法が厚くなるように形成されたことを特徴とする請求項1記載のLEDを用いた照明器具。   The lighting fixture using an LED according to claim 1, wherein the mounting substrate is formed such that a thickness dimension increases from a central portion to a peripheral portion in a mounting range of the LED.
  3. 前記取付基板における他方の主表面を、一方の主表面に対して所定角度傾斜する傾斜面としたことを特徴とする請求項1記載のLEDを用いた照明器具。   The lighting apparatus using an LED according to claim 1, wherein the other main surface of the mounting substrate is an inclined surface inclined at a predetermined angle with respect to the one main surface.
  4. 前記傾斜面に、傾斜方向に沿って延びる複数の溝を形成したことを特徴とする請求項3記載のLEDを用いた照明器具。   The lighting fixture using LED according to claim 3, wherein a plurality of grooves extending along the tilt direction are formed on the tilted surface.
  5. 前記取付基板は、前記LEDの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする請求項1記載のLEDを用いた照明器具。   2. The mounting board according to claim 1, wherein a material of a central part in the LED mounting range is made of a material having at least one of heat dissipation and radiation that is higher than that of a peripheral part. Lighting equipment using LED.
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