JP2007059207A - Illumination apparatus using led - Google Patents

Illumination apparatus using led Download PDF

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JP2007059207A
JP2007059207A JP2005243091A JP2005243091A JP2007059207A JP 2007059207 A JP2007059207 A JP 2007059207A JP 2005243091 A JP2005243091 A JP 2005243091A JP 2005243091 A JP2005243091 A JP 2005243091A JP 2007059207 A JP2007059207 A JP 2007059207A
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led
mounting substrate
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portion
led modules
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JP4492486B2 (en )
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Kenichiro Tanaka
Yoji Urano
洋二 浦野
健一郎 田中
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Matsushita Electric Works Ltd
松下電工株式会社
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<P>PROBLEM TO BE SOLVED: To provide an illumination apparatus easy to assemble, using LEDs capable of obtaining illumination light with uniform brightness. <P>SOLUTION: The illumination apparatus has a plurality of LED modules 1, and a nearly disc-shaped mounting base plate 2 made of metallic material on a main surface 2a at one side of which the plurality of LED modules are uniformly arranged. The LED modules 1 are electrically insulated from and thermally jointed to the mounting base plate 2. The mounting base plate is formed so as to increase its thickness as it is headed from central part in a mounting area of the LED modules 1 to peripheral part thereof, therefore, heat capacity of the mounting base plate 2 becomes small as it is headed to central part. Accordingly, the heat generated from LED modules 1 arranged at center part of the mounting base plate 2 becomes easy to radiate, unevenness of light emission efficiency of the LED modules 1 is restrained, and an illumination light with uniform brightness can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDを用いた照明器具に関するものである。 The present invention relates to an illumination fixture using the LED.

近年、白色LEDの高出力化に伴って、光源として白色LEDを用いた照明器具の開発が進められている(例えば特許文献1参照)。 In recent years, with the higher output of the white LED, and (for example, see Patent Document 1) which is being developed lighting fixture using a white LED as a light source.

この種の照明器具では、所望の光出力を得るために複数個のLEDを用いており、図7に示すように被照射面の明るさを均一にするために、円板状のプリント配線板30の表面に、プリント配線板30の中心位置を中心とする複数の同心円周上に同一ピッチ角で複数個のLED31を配置している。 In this type of luminaire, the desired uses a plurality of LED in order to obtain a light output, in order to make uniform the brightness of the illuminated surface as shown in FIG. 7, a disc-shaped printed circuit board 30 surface of the are arranged a plurality of LED31 at the same pitch angle a plurality of concentric circumferentially around the center position of the printed wiring board 30.
実開平3−112818号公報 Real Hei 3-112818 Patent Publication

上記構成の照明器具では、高出力のLED31を用いているため、LED31への投入電力が大きく、そのためLED31の発熱が増大していた。 The luminaire of the above configuration, due to the use of LED 31 of high output, large input power to the LED 31, the heat generation of the LED 31 had been increased. ここで、明るさを均一にするために、図7に示すように複数のLED31を略一定の間隔でプリント配線板30に配置した場合、空気層に熱が逃げやすい周辺部に比べて、中央部は周りに配置された他のLED31の温度の影響を受けて温度が上昇しやすく、その結果中央部に配置されたLED31の発光効率が低下して、輝度むらが発生するという問題があった。 Here, in order to equalize the brightness, when placed on the printed circuit board 30 a plurality of LED31 at a substantially constant distance as shown in FIG. 7, as compared to the peripheral portions of heat easily escapes to the air layer, the central parts are temperature tends to rise under the influence of the deployed another temperature LED31 around, so that light emitting efficiency of the LED31 arranged in the central portion is lowered, there is a problem that luminance unevenness occurs .

このような問題を解決するために、特許文献1に示される照明器具では、LEDが実装されるプリント配線板を複数枚に分割し、複数枚のプリント配線板の間に隙間が形成されるように、複数枚のプリント配線板を厚み方向において位置をずらして配置しており、プリント配線板の間の隙間を通して空気を対流させることで、中央部に配置されたLEDの温度上昇を抑制しているが、プリント配線板の枚数が増えるために、組立作業の作業性が悪化するという問題があった。 To solve this problem, in the lighting fixture described in Patent Document 1, a printed wiring board on which the LED is mounted is divided into a plurality of sheets, so that a gap in the plurality of printed wiring plates are formed, a plurality of printed wiring boards are arranged by shifting the positions in the thickness direction, by convection of air through the gap between the printed circuit plates, but to suppress the temperature rise of the LED arranged at the center portion, printed for the number of the wiring board is increased, the workability of the assembly operation is disadvantageously deteriorated.

本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、組立作業が簡単で、輝度の均一な照明光が得られるLEDを用いた照明器具を提供することにある。 The present invention has been made in view of the above problems, and an object, the assembly work is easy to provide a lighting fixture using the LED uniform illumination light intensity is obtained .

上記目的を達成するために、請求項1の発明は、複数のLEDと、一方の主表面に複数のLEDが均一に配置される取付基板とを備え、取付基板は、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成されたことを特徴とする。 To achieve the above object, the invention of claim 1, comprising a plurality of LED, and a mounting substrate on which a plurality of LED on one main surface is uniformly disposed, the mounting substrate includes a central of the mounting range of the LED characterized in that the heat radiation parts are formed to be higher than the heat dissipation of the peripheral portion.

この発明によれば、複数のLEDが均一に配置される取付基板を、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているので、周辺部に比べてLEDの発熱による温度上昇が大きい中央部の熱を放熱しやすくでき、その結果中央部と周辺部との温度差を低減できるから、中央部に配置されたLEDの発光効率の低下を抑制して、照明器具の輝度を均一にすることができる。 According to the present invention, a mounting substrate on which a plurality of LED is uniformly arranged, so heat dissipation of the central portion of the attachment area of ​​the LED is formed to be higher than the heat dissipation of the peripheral portion, the peripheral portion compared temperature rise due to LED exotherm can easily dissipate large central portion of the heat, resulting from possible to reduce the temperature difference between the center and periphery, suppress a reduction in luminous efficiency of LED arranged in the central portion , it is possible to equalize the luminance of the luminaire. しかも、取付基板自体が、LEDの取付範囲における中央部の放熱性を周辺部の放熱性よりも高くなるように形成されているので、取付基板を複数枚の基板に分割した場合に比べて、部品点数が少なくなり、組立の手間を簡単にできる。 Moreover, the mounting substrate itself, since it is formed to be higher than the heat dissipation of the peripheral portion of the heat radiation of the central portion of the attachment area of ​​the LED, as compared with the case of dividing the mounting substrate on a plurality of substrates, the number of parts is reduced, it can be a labor of assembly easy.

請求項2の発明は、請求項1の発明において、取付基板は、LEDの取付範囲における中央部から周辺部へ行くほど、厚み寸法が厚くなるように形成されたことを特徴とする。 The invention of claim 2 is the invention of claim 1, the mounting substrate is closer to the peripheral portion from the central portion in the attachment area of ​​the LED, characterized in that it is formed so that the thickness dimension is increased.

この発明によれば、取付基板は、LEDの取付範囲における中央部の熱容量が、周辺部の熱容量に比べて小さくなるので、取付範囲の中央部に配置されたLEDの発熱が、取付基板の他方の主表面に伝導しやすくなり、その結果中央部のLEDの発熱を放熱しやすくなるから、取付範囲における中央部と周辺部との温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光が得られる。 According to the present invention, the mounting substrate, the heat capacity of the central portion of the mounting range of the LED, becomes smaller than the heat capacity of the peripheral portion, LED fever disposed in a central portion of the mounting range, other mounting substrate become major surface makes it easy to conduct, its because results easily radiate heat generated in the center portion of the LED, the temperature difference between the center and periphery of the attachment area is reduced, the LED arranged at the center portion luminous efficiency and a decrease in inhibition, brightness uniform illumination light can be obtained.

請求項3の発明は、請求項1の発明において、取付基板における他方の主表面を、一方の主表面に対して所定角度傾斜する傾斜面としたことを特徴とする。 The invention of claim 3 is the invention of claim 1, the other major surface of the mounting substrate, is characterized in that an inclined surface inclined by a predetermined angle with respect to one main surface.

この発明によれば、取付基板における他方の主表面に、一方の主表面に対して所定角度傾斜する傾斜面を形成しているので、一方の主表面の法線方向が鉛直方向と略直交し、且つ、鉛直上方ほど取付基板の厚みが厚くなるように、取付基板を配置すると、下側のLEDの発熱によって上側のLEDほど温度上昇が大きくなるが、取付基板の厚みは鉛直上方ほど厚くなっているので、上側ほど放熱性が高くなって、上側のLEDの温度上昇が抑制されるから、温度上昇による発光効率の低下が抑制され、照明器具の輝度を均一にすることができる。 According to the invention, on the other main surface of the mounting substrate, so forms an inclined surface inclined by a predetermined angle with respect to one main surface, the normal direction is a vertical direction and substantially perpendicular to one main surface and, as the thickness of the vertically upward as the mounting substrate becomes thicker, placing the mounting board, the temperature rise as the upper LED by heating the lower LED increases, the thickness of the mounting substrate becomes thicker vertically upward since it is, it can be made higher upper higher heat dissipation, since the temperature rise of the upper LED is suppressed, decrease in luminous efficiency due to temperature rise is suppressed, a uniform brightness of the luminaire.

請求項4の発明は、請求項3の発明において、傾斜面に、傾斜方向に沿って延びる複数の溝を形成したことを特徴とする。 The invention of claim 4 is the invention of claim 3, the inclined surface, and wherein the forming a plurality of grooves extending along the slope direction.

この発明によれば、傾斜面に形成した溝内を空気が通過することで、空気の流れが整流されるので、空気の対流が起きやすくなり、中央部のLEDの発熱を放熱しやすくなる。 According to the present invention, the inside was formed on the inclined surface groove by passing through the air, because the air flow is rectified, air convection is likely to occur, it is easy to radiate heat generated in the LED of the central portion.

請求項5の発明は、請求項1の発明において、取付基板は、LEDの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする。 The invention of claim 5 is the invention of claim 1, the mounting substrate, the material of the central portion of the attachment area of ​​the LED, as compared to the material of the peripheral portion is higher at least one of the heat radiation or radiative and characterized in that a material.

この発明によれば、取付範囲の中央部に配置されたLEDの発熱を放熱しやすくなるから、取付範囲における中央部に配置されたLEDと周辺部に配置されたLEDとの温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光を得ることができる。 According to the present invention, since the LED heat generation of which is arranged in the center portion of the attachment area is easily radiated, the temperature difference between the LED disposed in the LED and a peripheral portion arranged in the center portion of the attachment area is reduced , by suppressing the reduction in luminous efficiency of the LED arranged at the center portion, it can be brightness uniform illumination light.

請求項1の発明によれば、複数のLEDが均一に配置される取付基板を、LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているので、周辺部に比べてLEDの発熱による温度上昇が大きい中央部の熱を放熱しやすくでき、その結果中央部と周辺部との温度差を低減できるから、中央部に配置されたLEDの発光効率の低下を抑制して、照明器具の輝度を均一にすることができる。 According to the present invention, a mounting substrate on which a plurality of LED is uniformly arranged, so heat dissipation of the central portion of the attachment area of ​​the LED is formed to be higher than the heat dissipation of the peripheral portion, temperature rise due to LED exotherm can easily dissipate large central portion of the heat than the peripheral portion, resulting from possible to reduce the temperature difference between the central portion and the peripheral portion, of the LED arranged at the center portion luminous efficiency and suppressing a decrease, it can be made uniform brightness of the luminaire. しかも、取付基板自体が、LEDの取付範囲における中央部の放熱性を周辺部の放熱性よりも高くなるように形成されているので、取付基板を複数枚の基板に分割した場合に比べて、部品点数が少なくなり、組立の手間を簡単にできる。 Moreover, the mounting substrate itself, since it is formed to be higher than the heat dissipation of the peripheral portion of the heat radiation of the central portion of the attachment area of ​​the LED, as compared with the case of dividing the mounting substrate on a plurality of substrates, the number of parts is reduced, it can be a labor of assembly easy.

請求項2の発明によれば、取付基板は、LEDの取付範囲における中央部の熱容量が、周辺部の熱容量に比べて小さくなるので、取付範囲の中央部に配置されたLEDの発熱が、取付基板の他方の主表面に伝導しやすくなり、その結果中央部のLEDの発熱を放熱しやすくなるから、取付範囲における中央部と周辺部との温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光が得られる。 According to the invention of claim 2, the mounting substrate, the heat capacity of the central portion of the mounting range of the LED, becomes smaller than the heat capacity of the peripheral portion, LED fever disposed in a central portion of the mounting range, mounting easily conducted to the other major surface of the substrate, because the result is likely to radiate heat generated in the center portion of the LED, the temperature difference between the center and periphery of the attachment area is reduced, LED arranged in the central portion by suppressing the decrease in luminous efficiency, luminance uniform illumination light can be obtained.

請求項3の発明によれば、取付基板における他方の主表面に、一方の主表面に対して所定角度傾斜する傾斜面を形成しているので、一方の主表面の法線方向が鉛直方向と略直交し、且つ、鉛直上方ほど取付基板の厚みが厚くなるように、取付基板を配置すると、下側のLEDの発熱によって上側のLEDほど温度上昇が大きくなるが、取付基板の厚みは鉛直上方ほど厚くなっているので、上側ほど放熱性が高くなって、上側のLEDの温度上昇が抑制されるから、温度上昇による発光効率の低下が抑制され、照明器具の輝度を均一にすることができる。 According to the invention of claim 3, the other main surface of the mounting substrate, so forms an inclined surface inclined by a predetermined angle with respect to one main surface, the normal direction of the one main surface and the vertical direction substantially orthogonal, and, as the thickness of the vertically upward as the mounting substrate becomes thicker, placing the mounting board, the temperature rise as the upper LED by heating the lower LED increases, the thickness of the mounting substrate vertically above since the thicker the more, becomes higher upper higher heat dissipation, since the temperature rise of the upper LED is suppressed, decrease in luminous efficiency due to temperature rise is suppressed, it is possible to equalize the luminance of the luminaire .

請求項4の発明によれば、傾斜面に形成した溝内を空気が通過することで、空気の流れが整流されるので、空気の対流が起きやすくなり、中央部のLEDの発熱を放熱しやすくなる。 According to the invention of claim 4, the inside was formed on the inclined surface groove by passing through the air, because the air flow is rectified, air convection is likely to occur, and radiate heat generated in the LED of the central portion It becomes easier.

請求項5の発明によれば、取付範囲の中央部に配置されたLEDの発熱を放熱しやすくなるから、取付範囲における中央部に配置されたLEDと周辺部に配置されたLEDとの温度差が小さくなり、中央部に配置されたLEDの発光効率の低下を抑制して、輝度が均一な照明光を得ることができる。 According to the invention of claim 5, since the LED heat generation of which is arranged in the center portion of the attachment area is easily radiated, the temperature difference between the LED and disposed LED and a peripheral portion arranged in the center portion of the attachment area It decreases, while suppressing reduction in luminous efficiency of the LED arranged at the center portion, can be brightness uniform illumination light.

以下に本発明の実施の形態を図面に基づいて説明する。 It is described with reference to embodiments of the present invention with reference to the drawings hereinafter.

(実施形態1) (Embodiment 1)
本発明の実施形態1を図1〜図4に基づいて説明する。 The first embodiment of the present invention will be described with reference to FIGS. 本実施形態の照明器具は、複数のLEDモジュール1と、複数のLEDモジュール1が配置される取付基板2とを備え、図示しない電源装置から各LEDモジュール1に直流電源が供給されて、各LEDモジュール1が発光するようになっている。 Lighting device of the present embodiment, a plurality of LED modules 1, and a mounting substrate 2 having a plurality of LED modules 1 are arranged, the DC power is supplied from a power supply (not shown) to each LED module 1, each LED module 1 is adapted to emit light.

各LEDモジュール1は、図3に示すように、矩形板状のLEDチップ10と、導電材料により略T形に形成され、幅広部11aにLEDチップ10が搭載されたチップ搭載部材11と、導電材料により略T形に形成され、幅広部12aがチップ搭載部材11の幅広部11aに離間して配置された端子板12と、LEDチップ10を囲むように配置されLEDチップ10の側面から放射された光をLEDチップ10の前方(図1中の左側)に放射させるリフレクタ13と、透光性を有する合成樹脂によりドーム形に形成されLEDチップ10を覆うようにしてリフレクタ13の前方に配置される保護カバー14とを備えている。 Each LED module 1, as shown in FIG. 3, the LED chip 10 of a rectangular plate shape, a conductive material is formed in a substantially T-shaped, the chip mounting member 11 on which the LED chip 10 is mounted on the wide section 11a, conductor It is formed in a substantially T-shaped with the material, the wide portion 12a and the terminal plate 12 disposed at a distance from each other in the wide portion 11a of the chip mounting member 11 is disposed so as to surround the LED chip 10 is emitted from the side surface of the LED chip 10 and a reflector 13 for radiated forward of the LED chip 10 (the left side in FIG. 1) of light, so as to cover the LED chip 10 is formed in a dome shape is disposed in front of the reflector 13 of a synthetic resin having translucency and a protective cover 14 that. ここで、リフレクタ13は、絶縁性を有するシート状の接着フィルムからなる固着材17を介してチップ搭載部材11および端子板12に取着されており、固着材17の中央にはLEDチップ10を露出させる丸孔17aが貫設されている。 Here, the reflector 13 via the adhesive member 17 made of a sheet-like adhesive film having an insulating property are attached to the chip mounting member 11 and the terminal board 12, the LED chip 10 in the center of the fixing member 17 circular holes 17a to exposed is formed through.

チップ搭載部材11および端子板12は金属板(例えば銅板など)からなるリードフレームを用いて形成され、絶縁性を有する合成樹脂により矩形枠状に成形された保持枠15に同時一体に成形されている。 Chip mounting member 11 and the terminal plate 12 is formed using a lead frame made of a metal plate (e.g., copper plate etc.), it is molded simultaneously integrally with the holding frame 15 which is formed in a rectangular frame shape by synthetic resin having insulation properties there. チップ搭載部材11および端子板12の幅広部11a,12aは保持枠15の内側に配置され、保持枠15の外側に突出するチップ搭載部材11および端子板12の部位がそれぞれ外部接続端子11b,12bとなる。 Wide section 11a of the chip mounting member 11 and the terminal plate 12, 12a is disposed inside the holding frame 15, the chip mounting member 11 and the portion of the terminal plate 12 is externally connected to terminal 11b protrude outward of the holding frame 15, 12b to become. また、チップ搭載部材11および端子板12と取付基板2との間にはグリーンシートからなる絶縁シート16が介在しており、チップ搭載部材11および端子板12と取付基板2との間を電気的に絶縁するとともに、熱的に結合している。 Between the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2 and the insulating sheet 16 made of a green sheet is interposed, electrical between the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2 and it insulates, thermally coupled to. 尚、絶縁シート16はグリーンシートのようなシート状に成形したセラミックの未燒結体に限らず、例えば熱硬化性の固着材(例えばエポキシ樹脂など)を用いても良い。 The insulating sheet 16 is not limited to the non-sintered body of a ceramic that is formed into a sheet such as a green sheet may be used for example thermosetting fixing material (e.g., epoxy resin).

LEDチップ10は一表面側にアノード電極が形成されるとともに、他表面側にカソード電極が形成されており、アノード電極又はカソード電極の内の一方の電極が導電性のサブマウント部材18を介してチップ搭載部材11の幅広部11aに電気的に接続され、他方の電極が金属細線(例えば金細線、アルミニウム細線など)からなるボンディングワイヤ19を介して端子板12の幅広部12aに電気的に接続されている。 LED chip 10 with an anode electrode formed on one surface side and a cathode electrode is formed on the other surface side, one of the electrodes of the anode electrode or cathode electrode via a conductive sub-mount member 18 is electrically connected to the wide portion 11a of the chip mounting member 11, electrically connected to the wide portion 12a of the terminal plate 12 through the bonding wire 19 and the other electrode made of a metal thin wire (e.g., gold thin wire, aluminum thin wire, etc.) It is.

取付基板2は、例えばアルミニウムや銅などの熱伝導率が高い金属により略円板形に形成されている。 Mounting substrate 2 is, for example thermal conductivity, such as aluminum or copper is formed in a substantially disk shape by a high metal. 取付基板2の一方の主表面2aには、取付基板2の中心点を中心とする複数の同心円周上に同一ピッチ角で複数個のLEDモジュール1が取着され、各LEDモジュール1の間は図示しないリード線を介して直列に接続され、電源回路から電力が供給されて点灯するようになっている。 On one main surface 2a of the mounting substrate 2, a plurality of LED modules 1 at the same pitch angle a plurality of concentric circumferentially around the center point of the mounting substrate 2 is mounted, between the LED module 1 are connected in series via a lead wire (not shown), the power from the power supply circuit is adapted to light is supplied. 尚、本実施形態では複数個のLEDモジュール1を直列接続しているが、複数個のLEDモジュール1の接続関係は直列接続に限定されるものではなく、複数個のLEDモジュール1を並列接続しても良いし、直列接続と並列接続とを組み合わせても良い。 Incidentally, a plurality of LED module 1 in this embodiment has connected in series, the connection relationship of the plurality of LED modules 1 is not limited to series connection, parallel connection of a plurality of LED modules 1 also it may be, may be combined with the parallel connection and series connection. また複数個のLEDモジュール1の配置は図2の配置に限定されるものではなく、照明器具の使用用途などに合わせて適宜配置を設定すれば良い。 The arrangement of the plurality of LED modules 1 is not limited to the arrangement in FIG. 2, it may be set as appropriate aligned with the like intended use of the luminaire.

一方、取付基板2の他方の主表面2bは、図1に示すように取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成されており、取付基板2の熱容量は中央部から周辺部に行くほど小さくなっている。 On the other hand, the other major surface 2b of the mounting substrate 2 is formed on the concave surface such that the thickness closer to the outer peripheral portion from the central position of the mounting substrate 2 as shown in FIG. 1 becomes thicker, the mounting substrate 2 heat capacity is smaller as it goes from the central portion to the peripheral portion. ここで、取付基板2の一方の主表面2aには複数個のLEDモジュール1を均一に配置しており、LEDモジュール1の取付範囲において中央部に配置されたLEDモジュール1は、他のLEDモジュール1によって周りを囲まれているため放熱性が悪く、中央部のLEDモジュール1の温度上昇が、周辺部のLEDモジュール1の温度上昇に比べて大きくなるが、取付基板2の熱容量を中央部から周辺部へ行くほど小さくしているので、主表面2aの中央部に配置されたLEDモジュール1の発熱は、周辺部に配置されたLEDモジュール1に比べて効率良く反対側の主表面2bに伝導して放熱され、中心付近のLEDモジュール1の温度上昇を抑制することができる。 Here, on one main surface 2a of the mounting substrate 2 are disposed a plurality of LED modules 1 uniformly, LED modules 1 disposed in the central portion in the attachment area of ​​the LED module 1, the other LED module poor heat dissipation because it is surrounded around by one, the temperature rise of the LED module 1 of the central portion, but larger than the temperature rise of the LED module 1 of the peripheral portion, the heat capacity of the mounting substrate 2 from the central portion is made smaller as it goes to the peripheral portion, the heat generation of the LED module 1 arranged at the center portion of the main surface 2a are transferred to the main surface 2b of efficiently opposite as compared with the LED module 1, which is arranged in the peripheral portion it is to heat radiation, the temperature rise of the LED module 1 in the vicinity of the center can be suppressed. したがって、取付基板2の主表面2aにおいて中心付近に配置されたLEDモジュール1と、周辺部に配置されたLEDモジュール1の温度上昇のばらつきを低減でき、発光効率のばらつきが抑制されるから、輝度むらを低減することができる。 Thus, the LED module 1 arranged in the vicinity of the center in the main surface 2a of the mounting substrate 2 can reduce the variation in the temperature rise of the LED module 1 arranged in the peripheral portion, since variation in light emission efficiency is suppressed, luminance it is possible to reduce the non-uniformity.

ところで、取付基板2の主表面2bを、取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成する代わりに、図4(a)に示すように取付基板2の背面側(主表面2aと反対側)に取付基板2の発熱を放熱する放熱部3を一体に設けても良い。 Incidentally, a main surface 2b of the mounting substrate 2, instead of the thickness from the center of the mounting substrate 2 toward the outer peripheral portion is formed on the concave surface, such as thicker, FIGS. 4 (a) as shown in the mounting substrate 2 heat radiating section 3 for radiating heat generated by the mounted substrate 2 on the rear side (the main surface 2a opposite) of may be provided integrally. 放熱部3は取付基板2の背面側に突設された複数の板状の放熱フィン3aを備えている。 Heat radiating section 3 has a plurality of plate-like radiation fins 3a protruding from the rear side of the mounting substrate 2. ここで、取付基板2の径方向の断面において、複数の放熱フィン3aの先端を結んでできる曲線が包絡線となるように、中央の放熱フィン3aほど突出量が大きく形成されており、周辺部から中央部にいくほど放熱部3の放熱性が高くなっている。 Here, in the radial cross section of the mounting substrate 2, as a curve formed by connecting the tips of the plurality of heat radiating fins 3a is an envelope, the amount of protrusion as the center of the heat radiating fins 3a are larger, the peripheral portion heat dissipation of the heat radiating section 3 toward the central portion is higher from. この放熱部3は取付基板2と一体に設けられているので、取付基板2の中央部(すなわちLEDモジュール1の取付範囲の中央部)の熱を放熱部3により効率良く放熱させることができ、中央部に配置されたLEDモジュール1の温度上昇を抑制して、輝度むらを低減することができる。 Since the heat radiating section 3 is provided integrally with the mounting substrate 2, the central portion of the mounting substrate 2 heat (i.e. the central portion of the attachment area of ​​the LED module 1) by the radiation unit 3 can be efficiently dissipated, to suppress the temperature rise of the LED module 1 arranged in the center portion, it is possible to reduce brightness unevenness.

なお、図4(a)に示す形態では取付基板2の背面に板状の放熱フィンを複数突設しているが、図4(c)に示すように放熱部3を取付基板2の背面に突設された複数本のロッド状の放熱フィン3bで構成し、取付基板2の中心位置に近い放熱フィン3bほど長さを長くすることで、中央部の放熱性を高めても良い。 While in the embodiment shown in FIGS. 4 (a) is more protruded a plate-shaped heat radiation fins on the back of the mounting substrate 2, the heat radiating section 3 as shown in FIG. 4 (c) to the back of the mounting substrate 2 constituted by a plurality of rod-radiating fins 3b which projects, as radiating fins 3b close to the center position of the mounting substrate 2 by increasing the length, may enhance the heat dissipation of the central portion.

また、図4(b)に示すように、図1に示す取付基板2の他方の主表面2bに、取付基板2の発熱を放熱する放熱器3'を取着しても良い。 Further, as shown in FIG. 4 (b), to the other main surface 2b of the mounting substrate 2 shown in FIG. 1, it may be attached to the radiator 3 'for radiating heat generated by the mounting substrate 2. この放熱器3'は例えばアルミニウム等の熱伝導率の良好な金属材料により形成され、一方の表面が取付基板2の主表面2bに面接触する凸曲面に形成されるとともに、他方の主表面が中央部に行くほど突出量が大きくなるような凸曲面に形成されており、放熱器3の放熱性が周辺部から中央部にいくほど高くなっているから、取付基板2の中央部の発熱を効率良く、放熱させることができる。 The radiator 3 'is formed by a metal material of good thermal conductivity, such as aluminum, with one surface formed into a convex curved surface in surface contact with the main surface 2b of the mounting substrate 2, the other major surface amount of protrusion toward the central portion is formed into a convex curved surface is larger, because the heat radiation of the radiator 3 is higher toward the center portion from the peripheral portion, the heating of the central portion of the mounting substrate 2 efficiently, it can be radiated.

(実施形態2) (Embodiment 2)
本発明の実施形態2を図5(a)(b)に基づいて説明する。 The second embodiment of the present invention will be described with reference to FIG. 5 (a) (b). 上述の実施形態1では、取付基板2の他方の主表面2bを、取付基板2の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成しているのに対して、本実施形態では他方の主表面2bを、一方の主表面2aに対して所定角度傾斜するような傾斜面に形成してある。 In the above-described first embodiment, the other major surface 2b of the mounting substrate 2, while the thickness from the center of the mounting substrate 2 toward the outer peripheral portion is formed on the concave surface, such as thicker, the the other major surface 2b in the embodiment, are formed on the inclined surface as inclined at a predetermined angle with respect to one main surface 2a. この主表面2bには、傾斜方向に沿って延びる複数の突壁21が略一定の間隔を開けて突設してあり、隣接する突壁21の間に傾斜方向に沿って延びる溝22が複数形成される。 The main surface 2b has a plurality of projecting wall 21 extending along the inclination direction is Yes and projected spaced a substantially constant distance, the groove 22 extending along the inclined direction between adjacent projecting wall 21 are several It is formed. 尚、主表面2bの形状以外は実施形態1と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since other shape of the main surface 2b is similar to the first embodiment, the same components are denoted by the same reference numerals, and a description thereof will be omitted.

ここで、図5(a)に示すように、取付基板2における一方の主表面2aの法線方向が鉛直方向と直交し、且つ、鉛直上側ほど取付基板2の厚みが厚くなるように、取付基板2を配置した場合、下側のLEDモジュール1の発熱によって上側のLEDモジュール1ほど温度上昇が大きくなるが、取付基板2の厚みは上側ほど厚くなっているので、上側のLEDモジュール1ほど放熱性が高くなって温度上昇が低減されるから、温度上昇による発光効率の低下が抑制されて、照明器具の輝度を均一にすることができる。 Here, as shown in FIG. 5 (a), the normal direction of the one main surface 2a are perpendicular to the vertical direction in the mounting substrate 2, and, as the thickness of the mounting substrate 2 is thicker vertical upper side, mounting If the substrate 2 is disposed, the temperature rises more LED module 1 of the upper by heat generation of the LED module 1 of the lower side increases, the thickness of the mounting substrate 2 is made thick as the upper, as the upper of the LED module 1 radiator since the temperature rise sex becomes high is reduced, is suppressed decrease in luminous efficiency due to temperature rise, it is possible to equalize the luminance of the luminaire. また、主表面2bには傾斜方向に沿って延びる突壁21が複数突設され、隣接する突壁21の間に傾斜方向に沿って延びる溝22が形成されるので、溝22内部を空気が通過することによって空気の流れが整流され、空気の対流が起きやすくなり、放熱性を向上させることができる。 Further, the main surface 2b is the projecting wall 21 is more protruded extending along the inclination direction, the groove 22 extending along the inclined direction between adjacent projecting wall 21 is formed, the inner groove 22 is air rectified airflow by passing air convection likely to occur, it is possible to improve heat dissipation. 尚、図5中の矢印は空気の流れを示している。 Arrows in FIG. 5 shows the flow of air.

(実施形態3) (Embodiment 3)
本発明の実施形態3について説明する。 It will be described a third embodiment of the present invention. 上述の実施形態1では、取付基板2の主表面2bを凹曲面に形成することによって、LEDモジュール1の取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているが、本実施形態では、図6に示すように取付基板2の主表面2bを平面形状に形成し、中央に丸孔23が貫設された円環部24と、円環部24の丸孔23内に嵌合される小径の芯部25とを一体に結合して取付基板2を構成している。 In the above-described first embodiment, by forming a main surface 2b of the mounting substrate 2 to the concave surface, the heat dissipation of the central portion of the attachment area of ​​the LED module 1 is formed to be higher than the heat dissipation of the peripheral portion are, but in the present embodiment, formed in a planar shape of the main surface 2b of the mount substrate 2, as shown in FIG. 6, an annular portion 24 which round hole 23 is formed through the center, round of the annular portion 24 a small diameter of the core portion 25 to be fitted into the bore 23 constitutes a mounting substrate 2 bonded together. 尚、取付基板2の形状以外は実施形態1と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since other configuration of the mounting board 2 is the same as the first embodiment, the same components are denoted by the same reference numerals, and a description thereof will be omitted.

上述のように取付基板2は、LEDモジュール1の取付範囲における中心部(芯部25)と周辺部(円環部24)とが別々の材料により形成されており、芯部25は、円環部24に比べて放熱性又は熱伝導率が高い材料、或いは、円環部24に比べて輻射性が高い材料で形成しているので、取付基板2の周辺部に比べて中央部の放熱性又は輻射性を高めることができる。 Mounting substrate 2 as described above, the center portion of the attachment area of ​​the LED module 1 with the peripheral portion (core portion 25) and (annular portion 24) is formed by a separate material, the core portion 25, a circular ring material is highly heat dissipation or thermal conductivity than section 24, or, since the radiation resistance as compared with the annular portion 24 is formed of high material, the central portion of the heat radiation as compared with the peripheral portion of the mounting substrate 2 or it is possible to enhance the radiation resistance. 円環部24および芯部25の材料として例えば表1に示すような材料を用いることができ、これらの材料の中から熱伝導率が相対的に高い材料を芯部25に、熱伝導率が相対的に低い材料を円環部24に用いれば良い。 Can be a material shown as the material of the annular portion 24 and the core 25, for example, Table 1, a relatively high material thermal conductivity among these materials the core portion 25, the thermal conductivity the relatively low material may be used to annular portion 24. また、黒化処理を施したCuや陽極酸化処理を施したAlを芯部25として用いたり、芯部25に黒色塗料を塗布しても良く、取付基板2の中心部ほど色を黒くすることで、中心部の熱輻射性を高めることができる。 Also, or an Al subjected to Cu or anodizing treatment was subjected to blackening treatment as the core unit 25 may be coated with a black paint to the core 25, to black color as the central portion of the mounting substrate 2 in, it is possible to enhance the heat radiation property of the heart. また、円環部24および芯部25は、それぞれ、単一の材料で形成しても良いし、複数の材料からなるものを組み合わせることで、放熱性や熱輻射性が取付基板2の中心部ほど高くなるように傾斜を持たせても良い。 Further, the annular portion 24 and the core 25, respectively, may be formed of a single material, the combination of which consisting of a plurality of materials, heat dissipation and the center portion of the heat radiation property is attached substrate 2 as the inclination may be to have a to be higher. なお、円環部24および芯部25の材料や寸法は、LEDモジュール1の点灯状態における取付基板2の温度分布等を考慮して、適宜設定すれば良い。 The material and dimensions of the annular portion 24 and the core 25, taking into consideration the temperature distribution and the like of the mounting substrate 2 in the lighting state of the LED module 1, may be set as appropriate.

ここで、取付基板2の一方の主表面2aには複数個のLEDモジュール1を均一に配置しており、LEDモジュール1の取付範囲において中央部に配置されたLEDモジュール1は、他のLEDモジュール1によって周りを囲まれているため放熱性が悪く、中央部のLEDモジュール1の温度上昇が、周辺部のLEDモジュール1の温度上昇に比べて大きくなるが、取付基板2は、芯部25の材料が、円環部24の材料に比べて放熱性および輻射性が高い材料で形成されているので、主表面2aの中央部に配置されたLEDモジュール1の発熱は、周辺部に配置されたLEDモジュール1に比べて効率良く反対側の主表面2bに伝導されて、放熱されるから、中央部のLEDモジュール1の温度上昇を抑制することができる。 Here, on one main surface 2a of the mounting substrate 2 are disposed a plurality of LED modules 1 uniformly, LED modules 1 disposed in the central portion in the attachment area of ​​the LED module 1, the other LED module poor heat dissipation because it is surrounded around by one, the temperature rise of the LED module 1 of the central portion, but larger than the temperature rise of the LED module 1 of the peripheral portion, the mounting substrate 2, the core 25 material, since heat dissipation and radiation resistance than the material of the annular portion 24 is formed of a material having a high heat generation of the LED module 1 arranged at the center portion of the main surface 2a are arranged in the periphery compared to the LED module 1 is conducted to the main surface 2b of efficiently opposite from the heat radiation, it is possible to suppress the temperature rise of the LED module 1 of the central portion. したがって、取付基板2の主表面2aにおいて中心付近に配置されたLEDモジュール1と、周辺部に配置されたLEDモジュール1の温度上昇のばらつきを低減でき、発光効率のばらつきを低減して、輝度が均一な照明光を得ることができる。 Thus, the LED module 1 arranged in the vicinity of the center in the main surface 2a of the mounting substrate 2 can reduce the variation in the temperature rise of the LED module 1 arranged in the periphery, to reduce the variation in luminous efficiency, luminance it is possible to obtain uniform illumination light.

なお、上述した実施形態1、2の照明器具において、本実施形態と同様に円環部24と芯部25とを結合して取付基板2を形成し、芯部25の材料を円環部24に比べて放熱性又は輻射性の内少なくとも何れか一方が高い材料を用いても良く、中央部のLEDモジュール1の温度上昇を抑制し、取付基板2における熱分布を均一にできる。 Incidentally, in the lighting fixture of the first and second embodiments described above, this embodiment, as same as the above coupling the annular portion 24 and the core portion 25 to form a mounting substrate 2, the annular portion of material of the core portion 25 24 may be used heat dissipation or radiative least one material having high among compared to suppresses the temperature rise of the LED module 1 of the central part, it can be heat distribution in the mounting substrate 2 uniformly.

なお、本発明の精神と範囲に反することなしに、広範に異なる実施形態を構成することができることは明白なので、この発明は、特定の実施形態に制約されるものではない。 Incidentally, without departing from the spirit and scope of the present invention, since obvious that it is possible to construct a wide range in different embodiments, the invention is not to be restricted to the specific embodiments.

実施形態1を示す要部断面図である。 It is a fragmentary cross-sectional view showing Embodiment 1. 同上の要部の外観斜視図である。 It is an external perspective view of a main portion of the same. 同上に用いるLEDモジュールの分解斜視図である。 It is an exploded perspective view of the LED module used for the same as above. (a)〜(c)は同上の他の構成を示す要部断面図である。 (A) ~ (c) is a fragmentary cross-sectional view showing another structure of the same. 実施形態2を示し、(a)は要部断面図、(b)は取付基板の背面図である。 Shows an embodiment 2, (a) is a fragmentary cross-sectional view, a rear view of (b) mounting a substrate. 実施形態3を示す要部断面図である。 It is a fragmentary cross-sectional view showing a third embodiment. 従来の照明器具に用いるプリント配線板を示し、(a)は正面図、(b)は下側から見た側面図である。 It shows the printed circuit board for use in conventional lighting fixtures, (a) is a front view, a side view seen from (b) is lower.

符号の説明 DESCRIPTION OF SYMBOLS

1 LEDモジュール 2 取付基板 2a 主表面 1 LED module 2 mounting substrate 2a main surface

Claims (5)

  1. 複数のLEDと、一方の主表面に前記複数のLEDが均一に配置される取付基板とを備え、前記取付基板は、前記LEDの取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成されたことを特徴とするLEDを用いた照明器具。 A plurality of LED, and a mounting substrate on which the plurality of LED on one main surface is uniformly disposed, the mounting substrate, rather than heat dissipation of the peripheral portion heat dissipation of the central portion of the attachment area of ​​the LED lighting fixture using the LED, characterized in that it is formed to be higher.
  2. 前記取付基板は、前記LEDの取付範囲における中央部から周辺部へ行くほど、厚み寸法が厚くなるように形成されたことを特徴とする請求項1記載のLEDを用いた照明器具。 It said mounting substrate includes an illumination fixture using an LED according to claim 1, characterized in that the central portion of the attachment area of ​​the LED toward the peripheral portion, which is formed so that the thickness dimension is increased.
  3. 前記取付基板における他方の主表面を、一方の主表面に対して所定角度傾斜する傾斜面としたことを特徴とする請求項1記載のLEDを用いた照明器具。 The other main surface of the mounting substrate, an illumination fixture using an LED according to claim 1, characterized in that an inclined surface inclined at a predetermined angle with respect to one main surface.
  4. 前記傾斜面に、傾斜方向に沿って延びる複数の溝を形成したことを特徴とする請求項3記載のLEDを用いた照明器具。 Wherein the inclined surface, an illumination fixture using an LED as claimed in claim 3, wherein the forming a plurality of grooves extending along the slope direction.
  5. 前記取付基板は、前記LEDの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする請求項1記載のLEDを用いた照明器具。 The mounting substrate, the material of the central portion of the attachment area of ​​the LED, as compared to the material of the peripheral portion, according to claim 1, characterized in that at least one of the heat dissipation or radiation resistance was high material lighting fixture using the the LED.
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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087649A (en) * 2007-09-28 2009-04-23 Nichia Corp Illumination unit and illuminating lamp using the same
JP2009289772A (en) * 2008-05-27 2009-12-10 Rohm Co Ltd Led lamp
JP2009295577A (en) * 2008-06-02 2009-12-17 Advanced Optoelectronic Technology Inc Light-emitting diode light source module
JP2009296021A (en) * 2007-08-10 2009-12-17 Panasonic Electric Works Co Ltd Package and semiconductor device
KR20110091705A (en) * 2008-10-31 2011-08-12 오스람 옵토 세미컨덕터스 게엠베하 Lighting module
JP2011165529A (en) * 2010-02-11 2011-08-25 Denso Corp Liquid crystal display device
US8044428B2 (en) 2007-08-10 2011-10-25 Panasonic Electric Works SUNX Co., Ltd. Package and semiconductor device for preventing occurrence of false connection
CN102261596A (en) * 2011-09-09 2011-11-30 霸士电器(上海)有限公司 Led Light
JP2012151086A (en) * 2011-01-14 2012-08-09 Lg Innotek Co Ltd Backlight unit and display device using this
JP2012216538A (en) * 2011-03-31 2012-11-08 Kobe Steel Ltd Heat sink for led illumination
CN103311233A (en) * 2012-03-12 2013-09-18 光宝电子(广州)有限公司 Light emitting diode packaging structure
JP2014160756A (en) * 2013-02-20 2014-09-04 Stanley Electric Co Ltd Light emitting element module
WO2015098512A1 (en) * 2013-12-25 2015-07-02 株式会社オートネットワーク技術研究所 Electroconductive member
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
CN105098046A (en) * 2014-05-19 2015-11-25 四川新力光源股份有限公司 LED light source substrate, method for manufacturing LED light source substrate and LED light source
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002102164A (en) * 2000-10-04 2002-04-09 Asahi Optical Co Ltd Processor for electronic endoscope and light source for endoscope
JP2003115204A (en) * 2001-10-04 2003-04-18 Toyoda Gosei Co Ltd Shading reflection type device and light source
JP2003303511A (en) * 2002-10-03 2003-10-24 Ccs Inc Lighting system
JP2004528698A (en) * 2001-05-26 2004-09-16 ゲルコアー リミテッド ライアビリティ カンパニー High power led module for illumination spot
JP2005093097A (en) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
JP2005149943A (en) * 2003-11-17 2005-06-09 Seiko Epson Corp Light source device and projector using this
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002102164A (en) * 2000-10-04 2002-04-09 Asahi Optical Co Ltd Processor for electronic endoscope and light source for endoscope
JP2004528698A (en) * 2001-05-26 2004-09-16 ゲルコアー リミテッド ライアビリティ カンパニー High power led module for illumination spot
JP2003115204A (en) * 2001-10-04 2003-04-18 Toyoda Gosei Co Ltd Shading reflection type device and light source
JP2003303511A (en) * 2002-10-03 2003-10-24 Ccs Inc Lighting system
JP2005093097A (en) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
JP2005149943A (en) * 2003-11-17 2005-06-09 Seiko Epson Corp Light source device and projector using this
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US8044428B2 (en) 2007-08-10 2011-10-25 Panasonic Electric Works SUNX Co., Ltd. Package and semiconductor device for preventing occurrence of false connection
JP2009296021A (en) * 2007-08-10 2009-12-17 Panasonic Electric Works Co Ltd Package and semiconductor device
JP4670985B2 (en) * 2007-08-10 2011-04-13 パナソニック電工株式会社 Package and the semiconductor device
JP2009087649A (en) * 2007-09-28 2009-04-23 Nichia Corp Illumination unit and illuminating lamp using the same
JP2009289772A (en) * 2008-05-27 2009-12-10 Rohm Co Ltd Led lamp
JP2009295577A (en) * 2008-06-02 2009-12-17 Advanced Optoelectronic Technology Inc Light-emitting diode light source module
US9484329B2 (en) 2008-10-24 2016-11-01 Cree, Inc. Light emitter array layout for color mixing
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9322514B2 (en) 2008-10-31 2016-04-26 Osram Opto Semiconductors Gmbh Lighting module
KR101662857B1 (en) * 2008-10-31 2016-10-05 오스람 옵토 세미컨덕터스 게엠베하 Lighting module
KR20110091705A (en) * 2008-10-31 2011-08-12 오스람 옵토 세미컨덕터스 게엠베하 Lighting module
JP2011165529A (en) * 2010-02-11 2011-08-25 Denso Corp Liquid crystal display device
JP2012151086A (en) * 2011-01-14 2012-08-09 Lg Innotek Co Ltd Backlight unit and display device using this
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
JP2012216538A (en) * 2011-03-31 2012-11-08 Kobe Steel Ltd Heat sink for led illumination
CN102261596A (en) * 2011-09-09 2011-11-30 霸士电器(上海)有限公司 Led Light
CN103311233A (en) * 2012-03-12 2013-09-18 光宝电子(广州)有限公司 Light emitting diode packaging structure
JP2014160756A (en) * 2013-02-20 2014-09-04 Stanley Electric Co Ltd Light emitting element module
WO2015098512A1 (en) * 2013-12-25 2015-07-02 株式会社オートネットワーク技術研究所 Electroconductive member
CN105098046A (en) * 2014-05-19 2015-11-25 四川新力光源股份有限公司 LED light source substrate, method for manufacturing LED light source substrate and LED light source

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