CN108133886A - A kind of method of DBC substrate backs grinding - Google Patents
A kind of method of DBC substrate backs grinding Download PDFInfo
- Publication number
- CN108133886A CN108133886A CN201711306894.7A CN201711306894A CN108133886A CN 108133886 A CN108133886 A CN 108133886A CN 201711306894 A CN201711306894 A CN 201711306894A CN 108133886 A CN108133886 A CN 108133886A
- Authority
- CN
- China
- Prior art keywords
- brush roll
- grinding
- dbc substrate
- backs
- dbc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000000227 grinding Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 2
- 238000003701 mechanical milling Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention is bad to solve the problems, such as that double-sided copper-clad ceramic base plate surface is uneven, increase mechanical milling tech before thermal dispersant coatings technique is applied, by the way that unlike material brush roll is selected to combine, a kind of method of DBC substrate backs grinding is provided, DBC substrate back copper faces are ground and polished, achieve the purpose that flatten substrate back.
Description
Technical field
The invention belongs to DBC substrate manufactures fields, and in particular to a kind of method of DBC substrate backs grinding.
Background technology
When double-sided copper-clad ceramic substrate (DBC substrates) is for power device package, in its first device of positive (circuit surface) welding
Part, and the back side (radiating surface) is welded with copper soleplate, and the heat diffusion of generation is gone out.Due to DBC substrates and copper soleplate thermal expansion
Coefficient is different, and large-area welding leads to solder joint fatigue, and power device thermal cycling capability is caused to decline.To improve thermal cycling capability,
Gradually thermal dispersant coatings, the technique being directly bonded on radiator are applied in DBC substrate backs now during encapsulation using a kind of.But
This packaging technology is more demanding to DBC substrate back surface state：Surface need to be smooth, and nothing is uneven, plate face warpage is small.
See Fig. 1.
By copper sheet and ceramics, sintering forms DBC substrates at high temperature, and because of high-temperature substrates, to generate warpage bad, simultaneously
Generating sintering bubble sometimes at copper sheet and Ceramic bond face causes copper sheet raised, these are bad to cause plate face uneven.Due to
Thermal dispersant coatings are very thin, can not fill up the gap not between platen surface and radiator so that DBC substrate backs cannot be complete with radiator
Full fitting, causes the heat generated not spread in time, device easily fails.
Existing DBC substrate manufactures industry mainly realizes DBC substrate surface process by using chemical solvent, this process
Oxide on surface can only be removed, is unable to reach the purpose of flattened faces.
Invention content
The present invention is bad to solve the problems, such as that DBC substrate surfaces are uneven, and scheme is increases before thermal dispersant coatings technique is applied
Add mechanical milling tech, by the way that unlike material brush roll is selected to combine, a kind of method of DBC substrate backs grinding is provided, to DBC bases
Back copper face is ground and polishes, and achievees the purpose that flatten DBC substrate backs.
The technical scheme is that：A kind of method of DBC substrate backs grinding, applied to apply thermal dispersant coatings technique it
Before, it is as follows：
Step 1: setting hard brush roll one, substrate back first grinds primary through hard brush roll；
(1) hard brush roll speed is set as 1.0~2.0m/min；
(2) control of back side copper face amount of grinding is in the range of 10um~30um；
(3) hard brush roll mesh number：400~900#；Electric current：0.4~0.9A；
Step 2: setting soft brush roll three, substrate back is polished three times again through soft brush roll；
(1) soft brush roll speed is set as 1.0~2.0m/min；
(2) soft brush roll mesh number：200~600#；Electric current：0.6~1.2A；
(3) roughness control is in Ra after polishing<2、Rz<In the range of 16.
Further, in step 1, hard brush roll speed is set as 1.5m/min.
Further, in step 2, soft brush roll speed is set as 1.5m/min.
Further, in step 1, hard brush roll mesh number：600#.
Further, in step 2, soft brush roll mesh number：300#.
The beneficial effects of the invention are as follows：Back side copper face is ground with hard brush roll, by controlling copper face amount of grinding, is come real
It now reduces plate face warpage degree and reduces the purpose of the copper sheet protrusion caused by being sintered bubble.With soft brush roll to the back side copper that has ground
Face is polished.Improve appearance and keep certain roughness.
Description of the drawings
When Fig. 1 is used for power device package for DBC substrates, in its positive (circuit surface) welding component, and the back side applies and dissipates
Hot coating, the structure diagram being directly bonded on radiator.
In figure：1 is welding component, and 2 be substrate front side, and 3 be ceramics, and 4 be radiator, and 5 be thermal dispersant coatings, and 6 be substrate
The back side.
Specific embodiment
The present invention is described further below in conjunction with the accompanying drawings
The present invention is solves the problems, such as that the influence that is uneven of DBC substrate backs is bonded with radiator, by increasing mechanical grinding
Grinding process, to achieve the purpose that flatten DBC substrate backs.
It is as follows：
Step 1: setting hard brush roll one, substrate back first grinds primary through hard brush roll；
(1) hard brush roll speed is set as 1.0~2.0m/min；
(2) control of back side copper face amount of grinding is in the range of 10um~30um；
(3) hard brush roll mesh number：400~900#；Electric current：0.4~0.9A；
Step 2: setting soft brush roll three, substrate back is polished three times again through soft brush roll；
(1) soft brush roll speed is set as 1.0~2.0m/min；
(2) soft brush roll mesh number：200~600#；Electric current：0.6~1.2A；
(3) roughness control is in Ra after polishing<2、Rz<In the range of 16.
By inventing implementation above, can be uneven DBC substrate backs leveling, and when encapsulation is bonded completely with radiator,
The heat that power device generates can be spread out in time.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (5)
1. a kind of method of DBC substrate backs grinding, before painting thermal dispersant coatings technique, it is characterised in that：Specific steps
It is as follows：
Step 1: setting hard brush roll one, substrate back first grinds primary through hard brush roll；
(1) hard brush roll speed is set as 1.0~2.0m/min；
(2) control of back side copper face amount of grinding is in the range of 10um~30um；
(3) hard brush roll mesh number：400~900#；Electric current：0.4~0.9A；
Step 2: setting soft brush roll three, substrate back is polished three times again through soft brush roll；
(1) soft brush roll speed is set as 1.0~2.0m/min；
(2) soft brush roll mesh number：200~600#；Electric current：0.6~1.2A；
(3) roughness control is in Ra after polishing<2、Rz<In the range of 16.
2. a kind of method of DBC substrate backs grinding according to claim 1, it is characterised in that：In step 1, hard brush roll
Speed is set as 1.5m/min.
3. a kind of method of DBC substrate backs grinding according to claim 1, it is characterised in that：In step 2, soft brush roll
Speed is set as 1.5m/min.
4. a kind of method of DBC substrate backs grinding according to claim 1, it is characterised in that：In step 1, hard brush roll
Mesh number：600#.
5. a kind of method of DBC substrate backs grinding according to claim 1, it is characterised in that：In step 2, soft brush roll
Mesh number：300#.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306894.7A CN108133886A (en) | 2017-12-11 | 2017-12-11 | A kind of method of DBC substrate backs grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306894.7A CN108133886A (en) | 2017-12-11 | 2017-12-11 | A kind of method of DBC substrate backs grinding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108133886A true CN108133886A (en) | 2018-06-08 |
Family
ID=62390099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711306894.7A Pending CN108133886A (en) | 2017-12-11 | 2017-12-11 | A kind of method of DBC substrate backs grinding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108133886A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224008A (en) * | 2021-03-17 | 2021-08-06 | 江苏富乐德半导体科技有限公司 | Method for reducing poor wrinkle and pimple of DCB product |
| CN113453437A (en) * | 2021-06-22 | 2021-09-28 | 江苏富乐德半导体科技有限公司 | Method for treating surface defects of copper-clad ceramic substrate |
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|---|---|---|---|---|
| CN1163318A (en) * | 1996-01-16 | 1997-10-29 | 三井金属矿业株式会社 | Electrolytic copper foil for printed circuit board and its producing method |
| CN1880061A (en) * | 2005-06-13 | 2006-12-20 | 新日铁化学株式会社 | Copper cladded laminates and its production method |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101716744A (en) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
| CN101764121A (en) * | 2010-01-08 | 2010-06-30 | 湖南大学 | Interlayer insulated stacked composite material and preparation method thereof |
| CN104072186A (en) * | 2013-03-27 | 2014-10-01 | 比亚迪股份有限公司 | A preparing method of a ceramic copper-clad plate |
| CN104412720A (en) * | 2012-05-02 | 2015-03-11 | 陶瓷技术有限责任公司 | Method for producing ceramic circuit boards from ceramic substrates having metal-filled vias |
| CN104538313A (en) * | 2014-12-23 | 2015-04-22 | 南京航空航天大学 | Method for filling through hole of aluminum oxide ceramic substrate with copper |
| CN105845582A (en) * | 2016-04-28 | 2016-08-10 | 东莞市凯昶德电子科技股份有限公司 | Preparation method of ceramic substrate used for IGBT packaging |
| CN106413273A (en) * | 2016-11-01 | 2017-02-15 | 江门崇达电路技术有限公司 | Board surface copper particle improving process |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
| CN106658977A (en) * | 2015-10-29 | 2017-05-10 | 碁鼎科技秦皇岛有限公司 | Line production method of circuit board and circuit board produced by using method |
-
2017
- 2017-12-11 CN CN201711306894.7A patent/CN108133886A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1163318A (en) * | 1996-01-16 | 1997-10-29 | 三井金属矿业株式会社 | Electrolytic copper foil for printed circuit board and its producing method |
| CN1880061A (en) * | 2005-06-13 | 2006-12-20 | 新日铁化学株式会社 | Copper cladded laminates and its production method |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101716744A (en) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
| CN101764121A (en) * | 2010-01-08 | 2010-06-30 | 湖南大学 | Interlayer insulated stacked composite material and preparation method thereof |
| CN104412720A (en) * | 2012-05-02 | 2015-03-11 | 陶瓷技术有限责任公司 | Method for producing ceramic circuit boards from ceramic substrates having metal-filled vias |
| CN104072186A (en) * | 2013-03-27 | 2014-10-01 | 比亚迪股份有限公司 | A preparing method of a ceramic copper-clad plate |
| CN104538313A (en) * | 2014-12-23 | 2015-04-22 | 南京航空航天大学 | Method for filling through hole of aluminum oxide ceramic substrate with copper |
| CN106658977A (en) * | 2015-10-29 | 2017-05-10 | 碁鼎科技秦皇岛有限公司 | Line production method of circuit board and circuit board produced by using method |
| CN105845582A (en) * | 2016-04-28 | 2016-08-10 | 东莞市凯昶德电子科技股份有限公司 | Preparation method of ceramic substrate used for IGBT packaging |
| CN106413273A (en) * | 2016-11-01 | 2017-02-15 | 江门崇达电路技术有限公司 | Board surface copper particle improving process |
| CN106535506A (en) * | 2016-12-15 | 2017-03-22 | 泰和电路科技（惠州）有限公司 | Via hole filling method, welding pad manufacturing method, welding pad and circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224008A (en) * | 2021-03-17 | 2021-08-06 | 江苏富乐德半导体科技有限公司 | Method for reducing poor wrinkle and pimple of DCB product |
| CN113453437A (en) * | 2021-06-22 | 2021-09-28 | 江苏富乐德半导体科技有限公司 | Method for treating surface defects of copper-clad ceramic substrate |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201120 Address after: Building 3, 181 Shanlian Road, Baoshan District, Shanghai, 200444 Applicant after: Shanghai fulewa Semiconductor Technology Co., Ltd Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Applicant before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180608 |