CN113811087A - Production method of PCB blind hole applying PP rubber plug - Google Patents
Production method of PCB blind hole applying PP rubber plug Download PDFInfo
- Publication number
- CN113811087A CN113811087A CN202111017332.7A CN202111017332A CN113811087A CN 113811087 A CN113811087 A CN 113811087A CN 202111017332 A CN202111017332 A CN 202111017332A CN 113811087 A CN113811087 A CN 113811087A
- Authority
- CN
- China
- Prior art keywords
- glue
- pressing
- circuit board
- production method
- namely
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 71
- 239000003292 glue Substances 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 230000008021 deposition Effects 0.000 claims abstract description 11
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000010309 melting process Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000004743 Polypropylene Substances 0.000 description 51
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a production method of PCB blind holes by applying PP rubber plugs, which comprises the following steps: drilling, namely drilling the circuit board; step two: copper deposition, namely performing copper deposition on the circuit board in the step one; step three: copper plating, namely copper plating is carried out on the circuit board in the second step; step four: and pressing, namely pressing the circuit board in the third step by using PP glue, wherein the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process. In the pressing process, high-glue PP is selected for pressing, preheating is carried out from low temperature during pressing, PP glue flows into the holes to form the resin plug holes along with the pressure during pressing when the PP glue is melted, and the glue of PP flows into the blind holes during pressing by using a high-glue PP glue flowing mode, so that the resin plug hole plate is formed in one step, the production cost is saved, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) production, in particular to a production method of a PCB blind hole applying a PP (polypropylene) rubber plug.
Background
Along with the high performance requirement of electronic product to the PCB board, the PCB board demand of blind hole also is bigger and bigger, and the manufacture process of PCB board generally is: drilling, copper deposition, copper plating, resin hole plugging, resin polishing and pressing (circuit manufacturing), the blind hole manufacturing process of the traditional PCB is generally resin hole plugging, multiple processes are needed, resin is plugged into a product hole, the phenomena of resin insufficiency in the hole, foaming in the hole, flowing glue on a board surface and the like are easy to occur, the quality problem is easy to occur, and the operation mode of direct resin hole plugging can not completely meet the requirements of customers. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a production method of a PCB blind hole applying a PP rubber plug.
The invention is realized by the following technical scheme:
a production method of PCB blind holes applying PP rubber plugs comprises the following steps,
the method comprises the following steps: drilling, namely drilling the circuit board;
step two: copper deposition, namely performing copper deposition on the circuit board in the step one;
step three: copper plating, namely copper plating is carried out on the circuit board in the second step;
step four: and pressing, namely pressing the circuit board in the third step by using PP glue, wherein the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process.
Further, the pressing temperature in the PP glue melting process is 75-85 ℃, the pressing time is 9-11 min, and the pressing pressure is 5kg/cm2～7kg/cm2。
Furthermore, the pressing temperature of the PP gluing hole process is 105-115 ℃, the pressing time is 19-21 min, and the pressing pressure is 13kg/cm2～15kg/cm2。
Further, the pressing temperature of the PP adhesive and the circuit board in the combining process is 130-140 ℃, the pressing time is 17-19 min, and the pressing pressure is 17kg/cm2～19kg/cm2。
Further, the pressing temperature of the PP glue overflow plate surface flattening process is 180-185 ℃, the pressing time is 17-19 min, and the pressing pressure is 24kg/cm2～26kg/cm2。
Furthermore, the pressing temperature of the PP adhesive and the circuit board in the curing process is 184 DEG CAt the temperature of 188 ℃, the pressing time is 40min to 50min, and the pressing pressure is 24kg/cm2～26kg/cm2。
Compared with the prior art, the invention presses the circuit board by applying the PP glue, and the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process, so that the manufacturing process of the PCB is changed into the following steps: drilling, copper deposition, copper plating and pressing, wherein in the pressing process, high-glue PP is selected for use to perform pressing, preheating is performed from low temperature during pressing, PP glue is enabled to flow into holes to form resin plug holes along with the pressing pressure during melting, the high-glue PP glue flowing mode is used, the places needing the resin plug holes are enabled to flow into blind holes during pressing, resin plug holes and the polishing process are replaced, resin plug hole plates are formed in one step, the production cost is saved, and the production efficiency is improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A production method of PCB blind holes applying PP rubber plugs comprises the following steps,
the method comprises the following steps: drilling, namely drilling the circuit board;
step two: copper deposition, namely performing copper deposition on the circuit board in the step one;
step three: copper plating, namely copper plating is carried out on the circuit board in the second step;
step four: and pressing, namely pressing the circuit board in the third step by using PP glue, wherein the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process.
The pressing temperature in the PP glue melting process is 75-85 ℃, the pressing time is 9-11 min, and the pressing pressure is 5kg/cm2～7kg/cm2And the PP glue is slowly softened and melted.
The pressing temperature of the PP glue hole process is 105-115 ℃, the pressing time is 19-21 min, and the pressing pressure is 13kg/cm2～15kg/cm2And PP glue is allowed to slowly flow into the blind holes, so that sufficient filling is ensured.
The pressing temperature of the process of combining the PP glue and the circuit board is 130-140 ℃, the pressing time is 17-19 min, and the pressing pressure is 17kg/cm2～19kg/cm2And the PP glue is fully contacted with the circuit board.
The pressing temperature of the PP glue overflow plate surface flattening process is 180-185 ℃, the pressing time is 17-19 min, and the pressing pressure is 24kg/cm2～26kg/cm2And the PP glue is used for fully bonding the circuit board.
The press-fit temperature of the PP glue and the circuit board in the curing process is 184-188 ℃, the press-fit time is 40-50 min, and the press-fit pressure is 24kg/cm2～26kg/cm2And the PP glue is slowly cured to avoid being separated from the circuit board.
The invention presses the circuit board by applying the PP glue, wherein the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process, so that the manufacturing process of the PCB is changed into the following steps: drilling, copper deposition, copper plating and pressing, wherein in the pressing process, high-glue PP is selected for use to perform pressing, preheating is performed from low temperature during pressing, PP glue is enabled to flow into holes to form resin plug holes along with the pressing pressure during melting, the high-glue PP glue flowing mode is used, the places needing the resin plug holes are enabled to flow into blind holes during pressing, resin plug holes and the polishing process are replaced, resin plug hole plates are formed in one step, the production cost is saved, and the production efficiency is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A production method of PCB blind holes applying PP rubber plugs is characterized in that: comprises the following steps of (a) carrying out,
the method comprises the following steps: drilling, namely drilling the circuit board;
step two: copper deposition, namely performing copper deposition on the circuit board in the step one;
step three: copper plating, namely copper plating is carried out on the circuit board in the second step;
step four: and pressing, namely pressing the circuit board in the third step by using PP glue, wherein the pressing process comprises a PP glue melting process, a PP glue hole entering process, a PP glue and circuit board combining process, a PP glue overflow plate surface flattening process and a PP glue and circuit board curing process.
2. The production method of PCB blind holes applying PP plugs according to claim 1, which is characterized in that: the pressing temperature in the PP glue melting process is 75-85 ℃, the pressing time is 9-11 min, and the pressing pressure is 5kg/cm2～7kg/cm2。
3. The production method of PCB blind holes applying PP plugs according to claim 1, which is characterized in that: the pressing temperature of the PP glue hole process is 105-115 ℃, the pressing time is 19-21 min, and the pressing pressure is 13kg/cm2～15kg/cm2。
4. The production method of PCB blind holes applying PP plugs according to claim 1, which is characterized in that: the pressing temperature of the PP adhesive and the circuit board in the combining process is 130-140 ℃, the pressing time is 17-19 min, and the pressing pressure is 17kg/cm2～19kg/cm2。
5. The production method of PCB blind holes applying PP plugs according to claim 1, which is characterized in that: the pressing temperature of the PP glue overflow plate surface flattening process is 180-185 ℃, the pressing time is 17-19 min, and the pressing pressure is 24kg/cm2～26kg/cm2。
6. According to claimThe production method of the PCB blind hole applying the PP rubber plug in the claim 1 is characterized in that: the press-fit temperature of the PP adhesive and the circuit board in the curing process is 184-188 ℃, the press-fit time is 40-50 min, and the press-fit pressure is 24kg/cm2～26kg/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111017332.7A CN113811087A (en) | 2021-08-31 | 2021-08-31 | Production method of PCB blind hole applying PP rubber plug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111017332.7A CN113811087A (en) | 2021-08-31 | 2021-08-31 | Production method of PCB blind hole applying PP rubber plug |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113811087A true CN113811087A (en) | 2021-12-17 |
Family
ID=78894503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111017332.7A Pending CN113811087A (en) | 2021-08-31 | 2021-08-31 | Production method of PCB blind hole applying PP rubber plug |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113811087A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
| CN106413263A (en) * | 2016-11-16 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Circuit board pressing process without resin plug hole |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN207266381U (en) * | 2017-09-12 | 2018-04-20 | 广东科翔电子科技有限公司 | A kind of wiring board PP vacuum pressing-combinings consent structure |
| CN109640548A (en) * | 2018-12-29 | 2019-04-16 | 广州兴森快捷电路科技有限公司 | Prepreg compression method and PCB construction |
| CN110121240A (en) * | 2019-04-30 | 2019-08-13 | 胜宏科技（惠州）股份有限公司 | A kind of full glue compression method of aluminum substrate substituting filling holes with resin |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN111295049A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | POFV hole plugging method and circuit board |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
-
2021
- 2021-08-31 CN CN202111017332.7A patent/CN113811087A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
| CN106413263A (en) * | 2016-11-16 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Circuit board pressing process without resin plug hole |
| CN207266381U (en) * | 2017-09-12 | 2018-04-20 | 广东科翔电子科技有限公司 | A kind of wiring board PP vacuum pressing-combinings consent structure |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN109640548A (en) * | 2018-12-29 | 2019-04-16 | 广州兴森快捷电路科技有限公司 | Prepreg compression method and PCB construction |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN110121240A (en) * | 2019-04-30 | 2019-08-13 | 胜宏科技（惠州）股份有限公司 | A kind of full glue compression method of aluminum substrate substituting filling holes with resin |
| CN111295049A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | POFV hole plugging method and circuit board |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211217 |