TWI627053B - Method of fabricating magnetic collet - Google Patents

Abstract

A method of manufacturing a magnetic chuck includes: providing a mold including an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold; and the metal plate and An uncured rubber is sequentially inserted between the upper mold and the lower mold, at least one mold pin of the lower mold passes through at least one vacuum hole of the metal plate, and the uncured rubber is disposed on the metal plate; And forming the adsorption rubber attached to the metal plate by pressurizing the mold such that the upper mold and the lower mold contact each other.

Description

Method of manufacturing a magnetic chuck

The present invention relates to a method of making a magnetic chuck. The present invention also relates to a method of manufacturing a magnetic chuck in which a step of molding an adsorption rubber and a step of attaching the adsorption rubber and a metal plate are simultaneously performed.

The semiconductor package protects the semiconductor wafer from the external environment and electrically connects the semiconductor wafer to the electrical system by a physical bonding method.

Semiconductor packaging technology has become a subject of recent research, making the performance of semiconductor components, as well as the price, performance and reliability of the final product, depend on semiconductor packaging technology.

In the assembly process of a semiconductor package, a single wafer called a die is separated from the wafer and bonded to a package substrate such as a lead frame or a printed circuit board (PCB) by using an adhesive such as an epoxy resin. The process is called a wafer bonding process. The wafer bonding process is the first step for individually separating and fabricating a plurality of wafers on a wafer. Thus, the process of cutting and separating individual wafers precedes the wafer bonding process.

The assembly process of a semiconductor package requires the step of picking up and transporting individual wafers between a dicing process of a wafer having a plurality of wafers and a process of bonding the wafer to the package. A semiconductor wafer transfer device that picks up and transports a semiconductor wafer cut from a wafer has a chuck that directly contacts and picks up the wafer.

Generally, the collet includes: a vacuum application tube having a holder vacuum hole, a collet holder attached to a lower portion of the vacuum application tube and exposing a holder vacuum hole on the bottom surface, and a flexible adsorption rubber The flexible absorbing rubber has a rubber vacuum hole in communication with the vacuum hole of the holder and is inserted into the chuck holder and combined with the bottom surface of the chuck holder.

The bottom surface of the absorbing rubber of the collet may have flatness for smoothly adsorbing the semiconductor wafer while the chuck holder and the absorbing rubber are combined with each other. However, since the absorbing rubber is formed of a flexible material such as rubber, the adjustment of the flatness of the bottom surface of the absorbing rubber is not easy and the problem of deformation of the absorbing rubber may occur in the chuck holder and the absorbing rubber. When combined with each other. These problems may result in reduced adsorption of the semiconductor wafer and a decrease in adhesion between the wafer and the package substrate.

In order to solve the above problem, Korean Utility Model No. 20-0414775 proposes a wafer transfer apparatus in which a magnetic force is distributed to a chuck holder and suction, and a metal plate is combined with a chuck holder.

When the adsorbing rubber and the metal sheets are combined with each other, the adhesive may be chemically coated on the metal plate, or physically form a combined hole on the metal plate, and then the metal plate having the adhesive or the combined hole may be combined with the adsorbing rubber. For example, the adsorption rubber may be molded by using a mold having the same shape as the adsorption rubber, a metal plate corresponding to the molded adsorption rubber may be formed, and the adsorption rubber may be chemically or physically attached to the metal plate. Since the adsorption rubber and the metal sheets are individually formed and attached to each other, the uniformity of the product may be lowered, the adhesion may be deteriorated, or the productivity may be lowered due to the prolongation of the manufacturing time.

Further, when the molded adsorbent rubber is combined with the metal plate, voids or foreign matter may be generated at the attaching interface. As a result, the combined force of the adsorbing rubber and the metal plate and the flatness of the magnetic chuck are lowered. Further, when the adsorption rubber and the metal plate are combined with each other, the vacuum holes may not be aligned, or the vacuum holes may be blocked by the adhesive, so that the chuck does not work normally.

Fig. 1 is a view showing a method of manufacturing a magnetic chuck according to the prior art.

In Fig. 1, an uncured rubber 10, a mold 20, and a metal plate 30 are provided.

The mold 20 includes an upper mold 21 and a lower mold 22.

The upper mold 21 may include a mold groove (not shown) on one surface thereof.

The lower mold 22 may include at least one mold pin P ₁ on one surface thereof.

When the upper mold 21 and the lower mold 22 are pressurized to contact each other through a pressurizing device such as a press, each of the mold pins P _{1 of the} lower mold 22 passes through the mold groove of the upper mold 21 to contact the bottom surface of the mold groove ( That is, the inner side of the upper mold 21).

The metal plate 30 includes a plurality of vacuum holes h ₂ , and the adhesive 40 is coated on one surface of the metal plate 30 at a predetermined time.

When the adhesive 40 is coated on one surface of the metal plate 30, a void V may be formed on the surface, or the foreign matter F may be mixed to the surface.

Next, the uncured rubber 10 is disposed on the mold after the mold 22 between the groove 21 and the lower mold, the mold 20 is pressurized, so that the upper die 21 and lower die 22 are in contact with each other (step S _1). In step S _1, the uncured rubber 10 is pressurized and heated and cured, and the pin is formed through the mold and the mold pin P ₁ P ₁ has the same number of a plurality of vacuum holes h ₁ in the uncured rubber 10. As a result, the adsorption rubber 10' is formed.

Next, the upper mold 21 and lower mold 22 separated from each other (step S _2). As a result, an adsorption rubber 10' having a plurality of vacuum holes h ₁ is obtained. After Step S ₂ on FIG. 10 is a rubber suction 'sectional view, after the step S ₂ in FIG. 10 is a rubber suction' plan view.

Subsequently the surface, adsorption of the cleaning rubber 10 '(step S _3).

Next, the adhesive 40 is coated on one surface of the metal plate 30, and the adsorption rubber 10' is disposed on the adhesive 40. Adsorption rubber 10 'is attached to the metal plate pressurized to 30 (step S _4).

Next, the product is dried for a predetermined period of time to obtain Magnetic chuck 1 or 1 '(step S _5). Step ₅ S after the left is a magnetic chuck having a foreign matter and the void V 'sectional view, the center view after the step S ₅ is displayed offset magnetic cartridge 1' after a plan view, and a step S ₅ The figure on the right is a plan view showing the magnetic chuck 1 without misalignment and other defects.

In the cross-sectional view of the magnetic chuck 1' on the left, the magnetic chuck 1' has poor flatness due to the void V and foreign matter.

In the center of the magnetic chuck of FIG. 1 'in a plan view, the adsorption rubber 10' of the vacuum holes h _{1 2} h of alignment with the vacuum hole 30 of the metal plate.

In the plan view of the magnetic chuck 1 of the right drawing, the vacuum hole h _{1 of the} adsorption rubber 10' is very aligned with the vacuum hole h _{2 of the} metal plate 30. Although not shown, the magnetic chuck 1 does not include voids or foreign matter.

In the method of manufacturing a magnetic chuck according to the prior art, the yield of the normal magnetic chuck 1 without misalignment and defects (voids or foreign matter) is lowered.

Accordingly, the present invention is directed to a method of manufacturing a magnetic chuck comprising the steps of molding an adsorbent rubber and attaching an adsorbing rubber and a metal sheet, the method substantially eliminating one or more due to limitations and disadvantages of the prior art Questions.

A method of manufacturing a magnetic chuck includes: providing a mold including an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold; and the metal plate and An uncured rubber is sequentially inserted between the upper mold and the lower mold, at least one die pin of the lower mold passes through at least one vacuum hole of the metal plate, and the uncured rubber is disposed on the metal plate; And forming the adsorption rubber attached to the metal plate by pressurizing the mold such that the upper mold and the lower mold contact each other.

Heating the mold can be carried out at a temperature of from 50 °C to 250 °C.

The method may further include physically or chemically treating the surface of the metal sheet prior to inserting the metal sheet into the upper mold and the lower mold.

Physically treating the surface of the metal sheet can include forming a surface roughness on a surface of the metal sheet.

Chemically treating the surface of the metal sheet may include applying an adhesive to the surface of the metal sheet and drying the adhesive.

After the metal plate is inserted into the upper mold and the lower mold, the surface of the metal plate may be omitted from physical or chemical treatment.

Pressurizing the mold can be carried out at a pressure of 50 kgf to 500,000 kgf.

The absorbing rubber as a solidified substance of the uncured rubber may include at least one vacuum hole communicating with at least one vacuum hole of the metal plate.

The absorbing rubber may have a size smaller than the metal plate, and the entire absorbing rubber may be disposed within the boundary of the metal plate.

The method can further include separating the upper mold and the lower mold.

The metal sheet may further include at least one combined hole, and the at least one combined hole may be filled with a portion of the uncured rubber such that a portion of the absorbing rubber is disposed inside the at least one combined hole.

At least one of the mold pins of the lower mold may contact the inside of the upper mold when the mold is pressurized.

The upper mold may further include at least one auxiliary mold pin corresponding to at least one mold pin of the lower mold, and at least one mold pin of the lower mold may contact at least one auxiliary mold pin of the upper mold when the mold is pressurized.

The upper mold may include at least two components that are separated and combined with each other.

The foregoing description of the preferred embodiments of the invention,

1, 1'‧‧‧ magnetic chuck

5‧‧‧Magnetic chuck

10‧‧‧Uncured rubber

10'‧‧‧Adsorption rubber

20‧‧‧Mold

30‧‧‧Metal plates

21‧‧‧Upper mold

22‧‧‧ Lower mold

40‧‧‧Adhesive

50‧‧‧Magnetic chuck

100‧‧‧Uncured rubber

100'‧‧‧Adsorption rubber

200‧‧‧Mold

210‧‧‧Upper mold

220‧‧‧Next mold

300, 300', 300" ‧ ‧ metal plates

1000‧‧‧Uncured rubber

1000'‧‧‧Adsorption rubber

2000‧‧‧Mold

2100‧‧‧Upper mold

2200‧‧‧ Lower mold

3000‧‧‧Metal sheet

4000‧‧‧Adhesive layer

V‧‧‧ gap

F‧‧‧ Foreign objects

h ₁ , h ₂ , h ₃ , h ₄ , h ₅ , h ₆ ‧‧‧ vacuum holes

h _c ‧‧‧ combination hole

P ₁ , P ₂ , P ₃ ‧‧‧Mold pins

P ₂ '‧‧‧Auxiliary tool pin

S ₁₀₀ ~ S ₃₀₀ ‧ ‧ steps

S ₁ ~ S ₅ ‧ ‧ steps

S ₁₀₀₀ ~S ₅₀₀₀ ‧‧‧Steps

BR‧‧‧ Coating method

SP‧‧‧ spray method

AF‧‧‧Failed adhesion

The accompanying drawings illustrate the embodiments of the invention, and are in the In the drawings: FIG. 1 is a view showing a method of manufacturing a magnetic chuck according to the prior art; FIG. 2 is a view showing a method of manufacturing a magnetic chuck according to an embodiment of the present invention; and FIG. 3 is a view showing A cross-sectional view of various structures of a mold in a method for manufacturing a magnetic chuck according to an embodiment of the invention; and FIG. 4 is a plan view showing various structures of a metal plate in a method for manufacturing a magnetic chuck according to an embodiment of the present invention; And FIG. 5 is a view showing a method of manufacturing a magnetic chuck according to a comparative example of the present invention.

Reference will now be made in detail to the preferred embodiments embodiments illustrated

In the present invention, "clamp" refers to a portion of a semiconductor wafer transfer device that directly contacts a semiconductor wafer and that is drawn through the vacuum using the semiconductor wafer.

In the present invention, "magnetic chuck" means a chuck that is combined with a chuck holder due to magnetism.

In the present invention, "mold pin" means a pin for forming a vacuum hole in the absorbing rubber.

In the present invention, "vacuum hole" means a hole to which a vacuum is applied.

In the present invention, the "mold groove" is a groove in the mold, and means a groove for forming an absorbing rubber from the uncured rubber.

In the present invention, "surface roughness" means an arithmetic mean surface roughness Ra defined in a website (https://en.wikipedia.org/wiki/Surface_roughness).

In the context of the present invention, "curing" means that the molecules of the uncured rubber are connected to each other due to cross-linking such that the movement of the molecules is restricted, and then the cured rubber has a specific shape and a specific elastic chemical action. Since curing generally requires pressure and heat, curing is carried out by using a mold having a product shape and a heating pressure device.

Fig. 2 is a view showing a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

In Fig. 2, an uncured rubber 100, a mold 200, and a metal plate 300 are provided.

The uncured rubber 100 may have different physical properties and different chemical properties before and after the curing step. For example, since the uncured rubber 100 has unstable high fluidity before the curing step, the absorbing rubber 100' having a desired shape can transmit heat and pressure to the uncured rubber 100 in the mold 200 having a desired shape. obtain. As a result, the uncured rubber 100 is cured into the adsorption rubber 100'. The uncured rubber 100 can be formed from materials known to those skilled in the art.

The mold 200 may include an upper mold 210 and a lower mold 220.

The upper mold 210 may include a mold groove (not shown) on one surface thereof.

The lower mold 220 may include at least one mold pin P ₂ on one surface thereof. The number of at least one mold pin P ₂ may be 1 to 100, 2 to 90, 3 to 80, 5 to 60, 6 to 50, 7 to 40, 8 to 30, and 9 to 20.

The lower mold 220 and the at least one mold pin P ₂ may be formed integrally or may be separately formed to be combined with each other.

Further, the lower mold 220 and the at least one mold pin P ₂ may be formed of the same material or may be formed of different materials.

When the upper mold 210 and the lower mold 220 are pressurized to each other through a pressurizing device (not shown) such as a press (refer to as "pressurizing step of the mold 200"), each of the lower molds 220 The mold pin P ₂ passes through the mold groove of the upper mold 210 to contact the bottom surface of the mold groove (i.e., the inner side of the upper mold 210).

However, the invention is not limited to this structure. As FIG. 3 (A), FIG. 3 (B), FIG. 3 (C), and FIG. 3 (d), the upper mold 210 may further comprise at least one of the mold corresponding to the at least one auxiliary pin P ₂ The mold pin P ₂ ', and during the pressurizing step of the mold 200, at least one of the mold pins P _{2 of the} lower mold 220 may contact at least one of the auxiliary mold pins P ₂ ' of the upper mold 210.

The upper mold 210 and the at least one auxiliary mold pin P ₂ ' may be separately formed to be combined with each other or may be formed integrally.

Further, the upper mold 210 and the at least one auxiliary mold pin P ₂ ' may be formed of different materials or may be formed of the same material.

The upper mold 210 may include at least two portions combined with each other. For example, the upper mold 210 may include a first upper mold (not shown) and a second upper mold (not shown) that are separated and combined with each other. The second upper mold may be disposed between the first upper mold and the lower mold 220. At least one auxiliary mold pin P ₂ ' may be formed in the first upper mold, and a mold groove may be formed in the second upper mold. At least one mold pin P ₂ and at least one auxiliary mold pin P ₂ ′ pass through the at least one hole, and at least one combined hole for combining the second upper mold to the first upper mold may be formed in the second upper mold in.

The metal plate 300 may include at least one vacuum hole h ₃ . At least one vacuum hole h ₃ with the same number as the at least one mold pin 220 in the lower die P ₂ may have a metal plate 300. However, the invention is not limited to this structure. The number of at least one vacuum hole h ₃ in the metal plate 300 may be smaller than the number of at least one mold pin P ₂ in the lower mold 220. For example, the number of at least one vacuum hole h ₃ is 1, and the number of at least one mold pin P ₂ is greater than 2. A plurality of mold pins P ₂ may pass through one of the vacuum holes h ₃ .

Next, the mold 200 is heated. For example, the mold 200 may be disposed on a pressurizing device such as a press, and when the pressurizing device is heated, heat may be transferred from the pressurizing device to the mold 200 to heat the mold. For example, the mold 200 can be heated to between 50 ° C and 250 ° C, such as 180 ° C.

Next, the surface of the metal plate 300 may be physically or chemically treated before the metal plate 300 is inserted into the upper mold 210 and the lower mold 220.

Physically treating the surface of the metal plate 300 means that surface roughness is formed on the surface of the metal plate 300. As a result, a metal plate 300' having a physically treated surface is obtained.

The surface roughness may be from 0.1 μm to 1000 μm.

Chemically treating the surface of the metal plate 300 means that an adhesive (not shown) is applied to the surface of the metal plate 300 and the applied adhesive is dried. The solvent is removed from the adhesive by drying. As a result, a metal plate 300" having a chemically treated surface is obtained.

Since the adhesive is applied before the metal plate 300 is inserted into the mold 200, the structure of the mold 200 has no effect on the step of applying the adhesive. Therefore, the step of applying the adhesive can be easily performed by a coating method using a brush or a spray method, and the steps of applying the adhesive to the plurality of metal sheets 300 can be performed to improve productivity. In addition, it is possible to prevent defects such as bubbles generated by the adhesive at high temperatures and safety accidents such as burns. Since a sufficient preparation time is obtained after the application of the adhesive before the metal plate 300 is inserted into the mold 200, the step of drying the adhesive can be carried out under dry conditions to have excellent adhesion.

For example, the adhesive may include an epoxy adhesive having excellent heat resistance and excellent strength, an elastic adhesive having excellent toughness and excellent flexibility, excellent heat resistance, and excellent strength, both of which are One and a combination of the two.

Subsequently, a metal plate having a treated surface 300 'or 300 "and the uncured rubber 100 may be sequentially inserted in the upper mold and the lower mold 210 (step S ₁₀₀₎ 220, the mold in step S _100, the lower 220 Each of the mold pins P ₂ may penetrate at least one vacuum hole h ₃ of the metal plate 300' or 300" having the treatment surface, and insert the metal plate 300' or 300" having the treatment surface and the uncured rubber 100 so that The surface-treated metal plate 300' or 300" is disposed on the uncured rubber 100.

Next, the mold 200 may be pressurized such that the upper mold 210 and the lower mold 220 are in contact with each other (step _S200 ). The step of pressing the mold 200 may be performed at a pressure of 50 kgf (kg force) to 500000 kgf (for example, 5000 kgf).

In step S _200, the uncured rubber 100 can be pressurized and heated to cure, and since at least one mold pin P _2, having at least one mold pin P ₂ of the same number of the at least one vacuum hole h ₄ can be uncured rubber Formed in 100. Further, a curing reaction (for example, a crosslinking reaction) may occur in the interface between the uncured rubber 100 and the surface-treated metal plate 300' or 300", so that the uncured rubber 100 and the surface-treated metal plate 300' Or the adhesion between 300" increases. As a result, excellent adhesion rubber 100' (having at least one vacuum hole h ₄ ) and surface-treated metal plate 300' or 300" excellent contact and excellent adhesion are obtained.

As the cured material rubber uncured 100. adsorption rubber 100 'may comprise: at least one vacuum aperture h _4, the at least one vacuum hole h ₄ the metal plate 300 surface-treated' or 300 'of at least one vacuum hole h ₃ communicates .

Further, the adsorption rubber 100' may have a size smaller than the surface-treated metal plate 300' or 300", and the entire adsorption rubber 100' may be disposed within the boundary of the surface-treated metal plate 300' or 300".

Next, the upper mold 210 and the lower mold 220 are separated from each other (step _S300 ). As a result, the magnetic chuck 5 is obtained. After the step S ₃₀₀ of FIG upper is a sectional view of the magnetic chuck 5, the central view after the step S ₃₀₀ is a plan view of a magnetic chuck 5, and the lower step S ₃₀₀ in FIG After the substrate is a magnetic chuck 5 surface.

The magnetic chuck 5 can have the advantage that the contact between the adsorption rubber 100' and the surface-treated metal plate 300' or 300" is improved to prevent defects such as voids, the surface-treated metal plate 300' or 300" The alignment between the at least one vacuum hole h ₃ and the at least one vacuum hole h _{4 of the} absorbing rubber 100' is improved.

Further, by simultaneously performing the molding step of adsorbing the rubber 100' and the attaching step of the adsorbing rubber 100' and the surface-treated metal plate 300' or 300", the error rate of the product (ie, the magnetic chuck 5) is reduced and improved. Product productivity.

According to the method of manufacturing a magnetic chuck of the present invention, the method does not include physically or chemically treating the metal plate 300 after the metal plate 300 that has not been physically or chemically treated is inserted between the upper mold 210 and the lower mold 220. Surface steps. The excluded steps are shown in Figure 5, which has the disadvantages described below.

Fig. 3 is a cross-sectional view showing various structures of a mold for a method for manufacturing a magnetic chuck according to an embodiment of the present invention.

In Fig. 3, an upper mold 210, a lower mold 220, and a metal plate 300 having various structures can be used for a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

When the structure of one of the upper mold 210, the lower mold 220, and the metal plate 300 is changed, the structures of the other two of the upper mold 210, the lower mold 220, and the metal plate 300 may or may not be changed.

The upper mold 210 of the mold 200 shown in Figs. 3(b), 3(c), and 3(d) may include at least one auxiliary mold pin P ₂ ', which is different from Fig. 3(a) The upper mold 210 of the mold 200 is shown. In the pressurizing step of the mold 200, at least one auxiliary mold pin P ₂ ' may contact at least one mold pin P _{2 of the} lower mold 220.

Fig. 4 is a plan view showing various structures of a metal plate for a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

In Fig. 4, the shape of at least one of the vacuum holes h ₃ of the metal plate 300 can be variously changed.

As in FIG. 4 (b) and section 4 (c), the metal plate 300 may further include at least one combination hole h _c and at least one vacuum hole h _3.

In the step of pressing the mold 200, at least one combination hole h _c may be filled with an uncured rubber portion 100, and a portion of the molded rubber adsorbent 100 'may be disposed within at least one of the combination hole h _c. Thus, at least one combination hole h _c 100 may be used as a path of the uncured rubber, such that the adsorption rubber 100 'in contact with the metal plate and the bonding force between the properties 300 (i.e., adhesion).

Fig. 5 is a view showing a method of manufacturing a magnetic chuck according to a comparative embodiment of the present invention.

In Fig. 5, an uncured rubber 1000, a mold 2000, and a metal plate 3000 are provided.

The uncured rubber 1000 is cured to form an adsorption rubber 1000'.

The mold 2000 may include an upper mold 2100 and a lower mold 2200.

A mold groove (not shown) may be formed on one surface of the upper mold 2100.

At least one mold pin P ₃ may be formed on one surface of the lower mold 2200.

When the upper mold 2100 and the lower mold 2200 are pressurized to contact each other through a pressurizing device (not shown) such as a press, each of the mold pins P _{3 of the} lower mold 2200 passes through the mold groove of the upper mold 2100 to contact The bottom surface of the mold groove (i.e., the inner side of the upper mold 2100).

At least one vacuum hole h ₅ may be formed in the metal plate 3000. At least one of the vacuum holes h ₅ in the metal plate 3000 may have the same number as at least one of the mold pins P ₃ in the lower mold 2200.

Next, the mold 2000 is heated.

Next, the metal plate 3000 is inserted between the upper mold 2100 and the lower mold 2200 (step _S1000 ). In step S _1000, inserted into the metal plate 3000, 2200 so that each mold lower die pin P ₃ at least one vacuum aperture 3000 h ₅ through the metal plate to one correspondence manner.

Next, by using a brush or spraying method (SP) coating method (BR) the adhesive coated on the surface of the metal plate 3000 to form the adhesive layer 4000 (step S _2000).

Forming step will be described below disadvantage adhesive layer of S _2000.

The adhesive may include at least one solid component (e.g., a resin, an additive) and a solvent.

The solvent may include a liquid having a relatively low boiling point such as water, an alcohol or a combination thereof such that the solvent uniformly disperses the solid component, and the adhesive is easily coated on an object such as the metal plate 3000.

Generally, the adhesive can be applied to the object by a spraying method, a dipping method, and a coating method using a brush. However, after the metal plate 3000 is inserted into the mold 2000, when the adhesive is coated on the surface of the metal plate 3000, at least one vacuum hole h _{5 of the} metal plate 3000, at least one mold pin P _{3 of the} lower mold 2200, And it is difficult to apply an adhesive for aligning the interference of a mold member such as a pin (not shown).

Further, after the metal plate 3000 is inserted into the mold 2000, it is impossible to apply the adhesive by the dipping method, and the adhesive can be applied only by a coating method using a brush or a spray method. However, when the adhesive is applied by a coating method using a brush or a spray method, the adhesive may be applied on the non-contact surface of the metal plate 3000 and the mold 2000 (ie, other surfaces than the target contact surface) and It is coated on the target contact surface of the metal plate 3000. As a result, in the subsequent molding step of adsorbing the rubber 1000', the rubber is attached to the undesired portion, and therefore, the step of removing the rubber attached to the undesired portion is further required. Therefore, steps may not be performed continuously, thereby reducing productivity

Further, since the molded adsorption rubber 1000' requires high heat and a large pressure, the mold 2000 is usually preheated at a high temperature. As a result, when the metal plate 3000 is inserted into the mold 2000, the metal plate 3000 is also heated at a high temperature, which makes it difficult to apply the adhesive. When the adhesive is applied to the high temperature metal plate 3000, the evaporation of the solvent in the adhesive instantaneously generates a large amount of bubbles. As a result, the adhesive is unevenly coated on the surface of the metal plate 3000. Air bubbles generated from the surface of the metal plate 3000 block the metal plate 3000 at its interface Contact with the adsorption rubber 1000'. Therefore, defects such as a decrease in flatness of the product (i.e., magnetic chuck) and vacuum leakage due to poor adhesion may occur.

Next, the uncured rubber 1000 is inserted between the upper mold 2100 and the lower mold 2200 (step _S3000 ). In step _S3000 , the uncured rubber 1000 is placed on the metal plate 3000.

Next, the mold 2000 may be pressurized such that the upper mold 2100 and the lower mold 2200 are in contact with each other (step _S4000 ). In step S _4000, 1000 may be uncured rubber pressurized and heated to cure, and having at least one mold pin ₃ of the same number P of the at least one vacuum aperture h ₆ because at least one mold pin P ₃ can be an uncured rubber Formed in 1000. As a result, the adsorption rubber 1000' having at least one vacuum hole h ₆ is obtained.

Next, the upper mold 2100 and the lower mold 2200 are separated from each other (step _S5000 ). As a result, the magnetic chuck 50 is obtained. Fig. 5(a) is a plan view showing the magnetic chuck 50, and Figs. 5(b1), 5(b2), and 5(b3) are cross-sectional views showing the magnetic chuck 50 of various configurations.

FIGS. 5(a) and 5(b3) show that the adsorption rubber 1000' (ie, the cured product of the uncured rubber 1000) is even attached to the non-contact surface (ie, other surfaces than the target contact surface). Comparative example. Since the adsorption rubber 1000' needs to be removed in the subsequent step, the manufacturing process becomes complicated and the productivity is lowered. Specifically, Fig. 5 (b3) shows a comparative example in which the void V is further generated in the adsorption rubber 1000'.

Fig. 5 (b1) shows a comparative example in which adhesion failure AF occurs between the metal plate 3000 and the adsorption rubber 1000'.

Fig. 5 (b2) shows a comparative example in which foreign matter F and void V are generated in the adsorption rubber 1000'.

Therefore, the method of manufacturing a magnetic chuck according to an embodiment of the present invention has the following advantages.

First, by simultaneously performing the molding step of adsorbing the rubber and the attaching step of the rubber and the metal plate, the processing time is lowered and the productivity is improved.

Second, since voids or foreign matter are not present at the interface between the adsorption rubber and the metal plate, a magnetic chuck having excellent adhesion between the adsorption rubber and the metal plate and excellent flatness is obtained.

Third, the vacuum hole in the magnetic chuck is prevented from being clogged by the adhesive.

Fourth, the misalignment of the vacuum holes in the adsorption rubber and the vacuum holes in the metal plate is prevented.

Although the present invention has been described with reference to the exemplary embodiments, the invention is not limited to the embodiments. It will be apparent to those skilled in the art that various modifications and changes can be made to the method of making the magnetic chuck and the application of the method of the present invention without departing from the spirit or scope of the invention. Thus, the invention is intended to cover the modifications and modifications of the invention

The present application claims the benefit of priority to Korean Patent Application No. 10-2017-0019489, filed on Feb.

Claims (11)

A method of manufacturing a magnetic chuck, comprising: providing a mold comprising an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold Inserting the metal plate and the uncured rubber sequentially between the upper mold and the lower mold, the at least one mold pin of the lower mold passing through the at least one vacuum hole of the metal plate, and the uncured rubber setting On the metal plate; forming an adsorption rubber attached to the metal plate by pressurizing the mold to make the upper mold and the lower mold contact each other; and inserting the upper mold and the lower mold Prior to the metal sheet, a surface of the metal sheet is physically or chemically treated, wherein physically treating the surface of the metal sheet includes forming a surface roughness on the surface of the metal sheet, wherein the chemically treating the surface The surface of the metal sheet includes applying an adhesive on the surface of the metal sheet and drying the adhesive. A method of producing a magnetic chuck according to the invention of claim 1, wherein the heating is carried out at a temperature of from 50 ° C to 250 ° C. A method of manufacturing a magnetic chuck according to claim 1, wherein the surface of the metal plate is physically or chemically treated after the metal plate is inserted between the upper mold and the lower mold. A method of producing a magnetic chuck according to the above aspect of the invention, wherein the pressurization of the mold is performed under a pressure of 50 kgf to 500,000 kgf. A method of manufacturing a magnetic chuck according to claim 1, wherein the adsorbing rubber as a solidified substance of the uncured rubber includes at least one vacuum hole communicating with the at least one vacuum hole of the metal plate. A method of manufacturing a magnetic chuck according to claim 1, wherein the adsorbing rubber has a size smaller than that of the metal plate, and the entire adsorbing rubber is disposed within a boundary of the metal plate. The method of manufacturing a magnetic chuck according to claim 1, further comprising separating the upper mold and the lower mold. The method of manufacturing a magnetic chuck according to claim 1, wherein the metal plate further comprises at least one combined hole, and the at least one combined hole is filled with a portion of the uncured rubber such that a part of the absorbing rubber Provided inside the at least one combined hole. The method of manufacturing a magnetic chuck according to claim 1, wherein the at least one mold pin of the lower mold contacts an inner side of the upper mold when the mold is pressurized. The method of manufacturing a magnetic chuck according to claim 1, wherein the upper mold further comprises at least one auxiliary mold pin corresponding to the at least one mold pin of the lower mold, and pressurizing the mold The at least one mold pin of the lower mold is in contact with the at least one auxiliary mold pin of the upper mold. The method of manufacturing a magnetic chuck according to claim 1, wherein the upper mold comprises at least two components separated and combined with each other.