TWI627053B - Method of fabricating magnetic collet - Google Patents

Method of fabricating magnetic collet Download PDF

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Publication number
TWI627053B
TWI627053B TW106123996A TW106123996A TWI627053B TW I627053 B TWI627053 B TW I627053B TW 106123996 A TW106123996 A TW 106123996A TW 106123996 A TW106123996 A TW 106123996A TW I627053 B TWI627053 B TW I627053B
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Taiwan
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mold
metal plate
rubber
magnetic chuck
upper mold
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TW106123996A
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Chinese (zh)
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TW201741119A (en
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李香伊
高秉天
李東雲
崔栽寧
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沛可科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/185Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/189Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the parts being joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2021/00Use of unspecified rubbers as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

一種製造磁性夾頭的方法包括:提供包含具有至少一個模具槽的上模具和具有至少一個模具銷的下模具的模具;提供具有至少一個真空孔的金屬板;加熱該模具;將該金屬板和一未固化的橡膠順序地插入在該上模具與該下模具之間,該下模具的至少一個模具銷穿過該金屬板的至少一個真空孔,且該未固化橡膠設置在該金屬板上;以及透過對該模具加壓來形成貼附在該金屬板上的吸附橡膠,使得該上模具和該下模具彼此接觸。 A method of manufacturing a magnetic chuck includes: providing a mold including an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold; and the metal plate and An uncured rubber is sequentially inserted between the upper mold and the lower mold, at least one mold pin of the lower mold passes through at least one vacuum hole of the metal plate, and the uncured rubber is disposed on the metal plate; And forming the adsorption rubber attached to the metal plate by pressurizing the mold such that the upper mold and the lower mold contact each other.

Description

製造磁性夾頭的方法 Method of manufacturing a magnetic chuck

本發明涉及一種製造磁性夾頭的方法。本發明還涉及一種製造磁性夾頭的方法,其中,同時進行模製吸附橡膠的步驟和貼附該吸附橡膠和一金屬板的步驟。 The present invention relates to a method of making a magnetic chuck. The present invention also relates to a method of manufacturing a magnetic chuck in which a step of molding an adsorption rubber and a step of attaching the adsorption rubber and a metal plate are simultaneously performed.

半導體封裝保護半導體晶片免受外部環境的影響,並通過物理綁定方法將半導體晶片電連接到電氣系統。 The semiconductor package protects the semiconductor wafer from the external environment and electrically connects the semiconductor wafer to the electrical system by a physical bonding method.

半導體封裝技術已經成為最近研究的課題,使得半導體元件的性能、以及最終產品的價格、性能和可靠性取決於半導體封裝技術。 Semiconductor packaging technology has become a subject of recent research, making the performance of semiconductor components, as well as the price, performance and reliability of the final product, depend on semiconductor packaging technology.

在半導體封裝的組裝過程中,將稱為晶粒的單個晶片與晶圓分離,並藉由使用諸如環氧樹脂的黏著劑將其貼合到封裝基板如引線框架或印刷電路板(PCB)的過程稱為晶片接合過程。該晶片接合過程是用於在晶圓上個別分離和製造複數晶片的第一步驟。因此,切割和分離個別晶片的過程先於該晶片接合過程。 In the assembly process of a semiconductor package, a single wafer called a die is separated from the wafer and bonded to a package substrate such as a lead frame or a printed circuit board (PCB) by using an adhesive such as an epoxy resin. The process is called a wafer bonding process. The wafer bonding process is the first step for individually separating and fabricating a plurality of wafers on a wafer. Thus, the process of cutting and separating individual wafers precedes the wafer bonding process.

半導體封裝的組裝過程需要在具有複數個晶片之晶圓的切割過程與該晶片結合至封裝體的過程之間拾取和輸送個別晶片的步驟。拾取和輸送從晶圓切割下來的半導體晶片的半導體晶片輸送裝置具有直接接觸和拾取該晶片的夾頭。 The assembly process of a semiconductor package requires the step of picking up and transporting individual wafers between a dicing process of a wafer having a plurality of wafers and a process of bonding the wafer to the package. A semiconductor wafer transfer device that picks up and transports a semiconductor wafer cut from a wafer has a chuck that directly contacts and picks up the wafer.

通常,夾頭包括:具有夾持器真空孔的真空施加管、連接到真空施加管的下部位並將底表面上的夾持器真空孔暴露的夾頭夾持器、以及可撓性吸附橡膠,該可撓性吸附橡膠具有與夾持器真空孔連通的橡膠真空孔,並插入夾頭夾持器中且與夾頭夾持器的底表面組合。 Generally, the collet includes: a vacuum application tube having a holder vacuum hole, a collet holder attached to a lower portion of the vacuum application tube and exposing a holder vacuum hole on the bottom surface, and a flexible adsorption rubber The flexible absorbing rubber has a rubber vacuum hole in communication with the vacuum hole of the holder and is inserted into the chuck holder and combined with the bottom surface of the chuck holder.

夾頭的吸附橡膠的底表面可以具有用於平滑地吸附半導體晶片的平坦度,同時夾頭夾持器和吸附橡膠彼此組合。然而,由於吸附橡膠是由諸如橡膠之類的可撓性材料所形成,因此吸附橡膠的底表面的平坦度的調節不容易並且吸附橡膠的形變的問題可能發生在夾頭夾持器與吸附橡膠彼此組合時。這些問題可能導致半導體晶片的吸附降低以及晶片與封裝基板之間的黏著力下降。 The bottom surface of the absorbing rubber of the collet may have flatness for smoothly adsorbing the semiconductor wafer while the chuck holder and the absorbing rubber are combined with each other. However, since the absorbing rubber is formed of a flexible material such as rubber, the adjustment of the flatness of the bottom surface of the absorbing rubber is not easy and the problem of deformation of the absorbing rubber may occur in the chuck holder and the absorbing rubber. When combined with each other. These problems may result in reduced adsorption of the semiconductor wafer and a decrease in adhesion between the wafer and the package substrate.

為了解決上述問題,韓國實用新型專利第20-0414775號提出一種晶片輸送裝置,其中磁力被分配給夾頭夾持器和吸附,且金屬板與夾頭夾持器組合。 In order to solve the above problem, Korean Utility Model No. 20-0414775 proposes a wafer transfer apparatus in which a magnetic force is distributed to a chuck holder and suction, and a metal plate is combined with a chuck holder.

當吸附橡膠和金屬板彼此組合時,黏著劑可以化學方式塗覆在金屬板上,或者以物理方式在金屬板上形成組合孔,然後將具有黏著劑或組合孔的金屬板與吸附橡膠組合。例如,吸附橡膠可以透過使用具有與吸附橡膠相同形狀的模具來模製、可以形成與模製的吸附橡膠相對應的金屬板、以及吸附橡膠可以化學或物理方式貼附到金屬板上。由於吸附橡膠和金屬板個別形成並且彼此貼附,所以可能降低產品的均勻性,貼附性可能變差,或者由於製造時間的延長而導致生產率降低。 When the adsorbing rubber and the metal sheets are combined with each other, the adhesive may be chemically coated on the metal plate, or physically form a combined hole on the metal plate, and then the metal plate having the adhesive or the combined hole may be combined with the adsorbing rubber. For example, the adsorption rubber may be molded by using a mold having the same shape as the adsorption rubber, a metal plate corresponding to the molded adsorption rubber may be formed, and the adsorption rubber may be chemically or physically attached to the metal plate. Since the adsorption rubber and the metal sheets are individually formed and attached to each other, the uniformity of the product may be lowered, the adhesion may be deteriorated, or the productivity may be lowered due to the prolongation of the manufacturing time.

此外,當模製的吸附橡膠與金屬板組合時,可能在貼附介面處產生空隙或異物。結果,吸附橡膠和金屬板的組合力和磁性夾頭的平坦度降低。此外,當吸附橡膠和金屬板彼此組合時,真空孔可能不對齊,或者真空孔可能被黏著劑阻塞,使得夾頭不能正常工作。 Further, when the molded adsorbent rubber is combined with the metal plate, voids or foreign matter may be generated at the attaching interface. As a result, the combined force of the adsorbing rubber and the metal plate and the flatness of the magnetic chuck are lowered. Further, when the adsorption rubber and the metal plate are combined with each other, the vacuum holes may not be aligned, or the vacuum holes may be blocked by the adhesive, so that the chuck does not work normally.

第1圖是顯示根據先前技術之製造磁性夾頭的方法的視圖。 Fig. 1 is a view showing a method of manufacturing a magnetic chuck according to the prior art.

在第1圖中,設置未固化橡膠10、模具20、和金屬板30。 In Fig. 1, an uncured rubber 10, a mold 20, and a metal plate 30 are provided.

模具20包括上模具21和下模具22。 The mold 20 includes an upper mold 21 and a lower mold 22.

上模具21可以在其一個表面上包括模具槽(圖中未示)。 The upper mold 21 may include a mold groove (not shown) on one surface thereof.

下模具22可以在其一個表面上包括至少一個模具銷P1The lower mold 22 may include at least one mold pin P 1 on one surface thereof.

當上模具21和下模具22透過諸如壓力機的加壓裝置被加壓以彼此接觸時,下模具22的每個模具銷P1穿過上模具21的模具槽以接觸模具槽的底表面(即,上模具21的內側)。 When the upper mold 21 and the lower mold 22 are pressurized to contact each other through a pressurizing device such as a press, each of the mold pins P 1 of the lower mold 22 passes through the mold groove of the upper mold 21 to contact the bottom surface of the mold groove ( That is, the inner side of the upper mold 21).

金屬板30包括複數個真空孔h2,並且黏著劑40在預定的時間被塗覆在金屬板30的一個表面上。 The metal plate 30 includes a plurality of vacuum holes h 2 , and the adhesive 40 is coated on one surface of the metal plate 30 at a predetermined time.

當黏著劑40塗覆在金屬板30的一個表面上時,可以在該表面上形成空隙V,或者異物F可以混合到該表面。 When the adhesive 40 is coated on one surface of the metal plate 30, a void V may be formed on the surface, or the foreign matter F may be mixed to the surface.

接下來,在將未固化橡膠10設置在上模具21和下模具22之間的模具槽中之後,模具20被加壓,使得上模具21和下模具22彼此接觸(步驟S1)。在步驟S1中,未固化的橡膠10被加壓和加熱固化,並且透過模具銷P1在未固化橡膠10中形成與模具銷P1具有相同數目的複數個真空孔h1。結果,形成吸附橡膠10'。 Next, the uncured rubber 10 is disposed on the mold after the mold 22 between the groove 21 and the lower mold, the mold 20 is pressurized, so that the upper die 21 and lower die 22 are in contact with each other (step S 1). In step S 1, the uncured rubber 10 is pressurized and heated and cured, and the pin is formed through the mold and the mold pin P 1 P 1 has the same number of a plurality of vacuum holes h 1 in the uncured rubber 10. As a result, the adsorption rubber 10' is formed.

接下來,上模具21和下模具22彼此分離(步驟S2)。結果,得到具有複數個真空孔h1的吸附橡膠10'。步驟S2之後的上圖是顯示吸附橡膠10'的剖面圖,在步驟S2之後的下圖是顯示吸附橡膠10'的平面圖。 Next, the upper mold 21 and lower mold 22 separated from each other (step S 2). As a result, an adsorption rubber 10' having a plurality of vacuum holes h 1 is obtained. After Step S 2 on FIG. 10 is a rubber suction 'sectional view, after the step S 2 in FIG. 10 is a rubber suction' plan view.

接下來,清潔吸附橡膠10'的表面(步驟S3)。 Subsequently the surface, adsorption of the cleaning rubber 10 '(step S 3).

接下來,黏著劑40塗覆在金屬板30的一個表面上,並且吸附橡膠10'設置在黏著劑40上。吸附橡膠10'被加壓以貼附到金屬板30(步驟S4)。 Next, the adhesive 40 is coated on one surface of the metal plate 30, and the adsorption rubber 10' is disposed on the adhesive 40. Adsorption rubber 10 'is attached to the metal plate pressurized to 30 (step S 4).

接下來,將產品乾燥一預定的時間以獲得磁性夾頭1或1'(步驟S5)。步驟S5之後的左圖是顯示具有空隙V和異物的磁性夾頭1'的剖面圖,步驟S5之後的中央圖是顯示有錯位的磁性夾頭1'的平面圖,以及步驟S5之後的右圖是顯示沒有錯位和其他缺陷的磁性夾頭1的平面圖。 Next, the product is dried for a predetermined period of time to obtain Magnetic chuck 1 or 1 '(step S 5). Step 5 S after the left is a magnetic chuck having a foreign matter and the void V 'sectional view, the center view after the step S 5 is displayed offset magnetic cartridge 1' after a plan view, and a step S 5 The figure on the right is a plan view showing the magnetic chuck 1 without misalignment and other defects.

在左圖的磁性夾頭1'的剖面圖中,磁性夾頭1'由於空隙V和異物而具有平坦度不良。 In the cross-sectional view of the magnetic chuck 1' on the left, the magnetic chuck 1' has poor flatness due to the void V and foreign matter.

在中央圖的磁性夾頭1'的平面圖中,吸附橡膠10'的真空孔h1與金屬板30的真空孔h2不對準。 In the center of the magnetic chuck of FIG. 1 'in a plan view, the adsorption rubber 10' of the vacuum holes h 1 2 h of alignment with the vacuum hole 30 of the metal plate.

在右圖的磁性夾頭1的平面圖中,吸附橡膠10'的真空孔h1與金屬板30的真空孔h2非常對準。儘管圖中未示,磁性夾頭1不包括空隙或異物。 In the plan view of the magnetic chuck 1 of the right drawing, the vacuum hole h 1 of the adsorption rubber 10' is very aligned with the vacuum hole h 2 of the metal plate 30. Although not shown, the magnetic chuck 1 does not include voids or foreign matter.

在根據先前技術的製造磁性夾頭的方法中,沒有錯位和缺陷(空隙或異物)的正常磁性夾頭1的產量下降。 In the method of manufacturing a magnetic chuck according to the prior art, the yield of the normal magnetic chuck 1 without misalignment and defects (voids or foreign matter) is lowered.

因此,本發明涉及一種製造磁性夾頭的方法,其中包括模製吸附橡膠的步驟和貼附吸附橡膠和金屬板的步驟,該方法基本上消除了由於先前技術的限制和缺點導致的一個或多個問題。 Accordingly, the present invention is directed to a method of manufacturing a magnetic chuck comprising the steps of molding an adsorbent rubber and attaching an adsorbing rubber and a metal sheet, the method substantially eliminating one or more due to limitations and disadvantages of the prior art Questions.

一種製造磁性夾頭的方法包括:提供包括具有至少一個模具槽的上模具和具有至少一個模具銷的下模具的模具;提供具有至少一個真空孔的金屬板;加熱該模具;將該金屬板和未固化的橡膠順序地插入在該上模具與該下模具之間,該下模具的至少一個模銷穿過該金屬板的至少一個真空孔,且該未固化橡膠被設置在該金屬板上;以及透過對該模具加壓來形成貼附在該金屬板上的吸附橡膠,使得該上模具和該下模具彼此接觸。 A method of manufacturing a magnetic chuck includes: providing a mold including an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold; and the metal plate and An uncured rubber is sequentially inserted between the upper mold and the lower mold, at least one die pin of the lower mold passes through at least one vacuum hole of the metal plate, and the uncured rubber is disposed on the metal plate; And forming the adsorption rubber attached to the metal plate by pressurizing the mold such that the upper mold and the lower mold contact each other.

加熱該模具可以在50℃至250℃的溫度下進行。 Heating the mold can be carried out at a temperature of from 50 °C to 250 °C.

該方法還可進一步包括在將該金屬板插入該上模具和該下模具之前以物理或化學方式處理該金屬板的表面。 The method may further include physically or chemically treating the surface of the metal sheet prior to inserting the metal sheet into the upper mold and the lower mold.

以物理方式處理該金屬板的表面可包括在該金屬板的表面上形成表面粗糙度。 Physically treating the surface of the metal sheet can include forming a surface roughness on a surface of the metal sheet.

以化學方式處理該金屬板的表面可包括在該金屬板的表面上塗覆黏著劑,並乾燥該黏著劑。 Chemically treating the surface of the metal sheet may include applying an adhesive to the surface of the metal sheet and drying the adhesive.

在將該金屬板插入該上模具和該下模具之後,可以省略掉物理或化學方式處理該金屬板的表面。 After the metal plate is inserted into the upper mold and the lower mold, the surface of the metal plate may be omitted from physical or chemical treatment.

加壓該模具可以在50kgf至500000kgf的壓力下進行。 Pressurizing the mold can be carried out at a pressure of 50 kgf to 500,000 kgf.

作為該未固化橡膠的固化物質的該吸附橡膠可以包括與該金屬板的至少一個真空孔連通的至少一個真空孔。 The absorbing rubber as a solidified substance of the uncured rubber may include at least one vacuum hole communicating with at least one vacuum hole of the metal plate.

該吸附橡膠可以具有小於該金屬板的尺寸,並且整個吸附橡膠可以設置在該金屬板的邊界內。 The absorbing rubber may have a size smaller than the metal plate, and the entire absorbing rubber may be disposed within the boundary of the metal plate.

該方法可進一步包括分離該上模具和該下模具。 The method can further include separating the upper mold and the lower mold.

該金屬板還可以包括至少一個組合孔,並且該些至少一個組合孔可填充有該未固化橡膠的一部分,使得該吸附橡膠的一部分設置在該些至少一個組合孔的內部。 The metal sheet may further include at least one combined hole, and the at least one combined hole may be filled with a portion of the uncured rubber such that a portion of the absorbing rubber is disposed inside the at least one combined hole.

該下模具的至少一個模具銷可以在該模具加壓時接觸該上模具的內側。 At least one of the mold pins of the lower mold may contact the inside of the upper mold when the mold is pressurized.

該上模具可進一步包括至少一個對應於該下模具的至少一個模具銷的輔助模具銷,並且該下模具的至少一個模具銷可以在加壓該模具時接觸該上模具的至少一個輔助模具銷。 The upper mold may further include at least one auxiliary mold pin corresponding to at least one mold pin of the lower mold, and at least one mold pin of the lower mold may contact at least one auxiliary mold pin of the upper mold when the mold is pressurized.

該上模具可以包括彼此分離並組合的至少兩個部件。 The upper mold may include at least two components that are separated and combined with each other.

應當理解,上述一般描述和以下詳細描述都是示例性和說明性的,並且旨在提供對所請求保護的本發明的進一步解釋。 The foregoing description of the preferred embodiments of the invention,

1、1'‧‧‧磁性夾頭 1, 1'‧‧‧ magnetic chuck

5‧‧‧磁性夾頭 5‧‧‧Magnetic chuck

10‧‧‧未固化橡膠 10‧‧‧Uncured rubber

10'‧‧‧吸附橡膠 10'‧‧‧Adsorption rubber

20‧‧‧模具 20‧‧‧Mold

30‧‧‧金屬板 30‧‧‧Metal plates

21‧‧‧上模具 21‧‧‧Upper mold

22‧‧‧下模具 22‧‧‧ Lower mold

40‧‧‧黏著劑 40‧‧‧Adhesive

50‧‧‧磁性夾頭 50‧‧‧Magnetic chuck

100‧‧‧未固化橡膠 100‧‧‧Uncured rubber

100'‧‧‧吸附橡膠 100'‧‧‧Adsorption rubber

200‧‧‧模具 200‧‧‧Mold

210‧‧‧上模具 210‧‧‧Upper mold

220‧‧‧下模具 220‧‧‧Next mold

300、300'、300"‧‧‧金屬板 300, 300', 300" ‧ ‧ metal plates

1000‧‧‧未固化橡膠 1000‧‧‧Uncured rubber

1000'‧‧‧吸附橡膠 1000'‧‧‧Adsorption rubber

2000‧‧‧模具 2000‧‧‧Mold

2100‧‧‧上模具 2100‧‧‧Upper mold

2200‧‧‧下模具 2200‧‧‧ Lower mold

3000‧‧‧金屬板 3000‧‧‧Metal sheet

4000‧‧‧黏著劑層 4000‧‧‧Adhesive layer

V‧‧‧空隙 V‧‧‧ gap

F‧‧‧異物 F‧‧‧ Foreign objects

h1、h2、h3、h4、h5、h6‧‧‧真空孔 h 1 , h 2 , h 3 , h 4 , h 5 , h 6 ‧‧‧ vacuum holes

hc‧‧‧組合孔 h c ‧‧‧ combination hole

P1、P2、P3‧‧‧模具銷 P 1 , P 2 , P 3 ‧‧‧Mold pins

P2'‧‧‧輔助模具銷 P 2 '‧‧‧Auxiliary tool pin

S100~S300‧‧‧步驟 S 100 ~ S 300 ‧ ‧ steps

S1~S5‧‧‧步驟 S 1 ~ S 5 ‧ ‧ steps

S1000~S5000‧‧‧步驟 S 1000 ~S 5000 ‧‧‧Steps

BR‧‧‧塗佈方法 BR‧‧‧ Coating method

SP‧‧‧噴霧方法 SP‧‧‧ spray method

AF‧‧‧黏著失敗 AF‧‧‧Failed adhesion

附圖說明本發明的實施例,並且與說明書描述一起用於解釋本發明的原理,其中該附圖係包括以提供對本發明的進一步理解並且被併入及構成本說明書的一部分。在圖式中:第1圖是顯示根據先前技術製造之磁性夾頭的方法的視圖;第2圖是顯示根據本發明實施例之製造磁性夾頭的方法的視圖;第3圖是顯示根據本發明實施例之用於製造磁性夾頭的方法中的模具的各種結構的剖面圖;第4圖是顯示根據本發明實施例之用於製造磁性夾頭的方法中的金屬板的各種結構的平面圖;以及第5圖是顯示根據本發明比較示例之製造磁性夾頭的方法的視圖。 The accompanying drawings illustrate the embodiments of the invention, and are in the In the drawings: FIG. 1 is a view showing a method of manufacturing a magnetic chuck according to the prior art; FIG. 2 is a view showing a method of manufacturing a magnetic chuck according to an embodiment of the present invention; and FIG. 3 is a view showing A cross-sectional view of various structures of a mold in a method for manufacturing a magnetic chuck according to an embodiment of the invention; and FIG. 4 is a plan view showing various structures of a metal plate in a method for manufacturing a magnetic chuck according to an embodiment of the present invention; And FIG. 5 is a view showing a method of manufacturing a magnetic chuck according to a comparative example of the present invention.

現在將詳細參考較佳實施例,其示例說明在附圖中。 Reference will now be made in detail to the preferred embodiments embodiments illustrated

在本發明中,“夾頭”是指直接接觸半導體晶片並透過使用真空撿取該半導體晶片的半導體晶片輸送裝置的一部分。 In the present invention, "clamp" refers to a portion of a semiconductor wafer transfer device that directly contacts a semiconductor wafer and that is drawn through the vacuum using the semiconductor wafer.

在本發明中,“磁性夾頭”是指由於磁性而與夾頭夾持器組合的夾頭。 In the present invention, "magnetic chuck" means a chuck that is combined with a chuck holder due to magnetism.

在本發明中,“模具銷”是指用於在吸附橡膠中形成真空孔的銷。 In the present invention, "mold pin" means a pin for forming a vacuum hole in the absorbing rubber.

在本發明中,“真空孔”是指施加真空的孔。 In the present invention, "vacuum hole" means a hole to which a vacuum is applied.

在本發明中,“模具槽”是模具中的凹槽,並且是指用於從未固化橡膠形成吸附橡膠的凹槽。 In the present invention, the "mold groove" is a groove in the mold, and means a groove for forming an absorbing rubber from the uncured rubber.

在本發明中,“表面粗糙度”是指在網站(https://en.wikipedia.org/wiki/Surface_roughness)中定義的算術平均表面粗糙度Ra。 In the present invention, "surface roughness" means an arithmetic mean surface roughness Ra defined in a website (https://en.wikipedia.org/wiki/Surface_roughness).

在本發明內容中,“固化”是指未固化的橡膠的分子由於交聯鍵結而彼此連接使得該些分子的運動受到限制,然後固化橡膠具有特定形狀和特定彈性的化學作用。由於固化通常需要壓力和熱量,所以透過使用具有產品形狀的模具和加熱壓力裝置來進行固化。 In the context of the present invention, "curing" means that the molecules of the uncured rubber are connected to each other due to cross-linking such that the movement of the molecules is restricted, and then the cured rubber has a specific shape and a specific elastic chemical action. Since curing generally requires pressure and heat, curing is carried out by using a mold having a product shape and a heating pressure device.

第2圖是顯示根據本發明實施例之製造磁性夾頭的方法的視圖。 Fig. 2 is a view showing a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

在第2圖中,提供未固化橡膠100、模具200、和金屬板300。 In Fig. 2, an uncured rubber 100, a mold 200, and a metal plate 300 are provided.

未固化的橡膠100可以在固化步驟之前和之後具有不同的物理性質和不同的化學性質。例如,由於未固化橡膠100在固化步驟之前具有不穩定的高流動性,所以具有所需形狀的吸附橡膠100'可以透過對具有所需形狀的模具200中的未固化橡膠100施加熱量和壓力來獲得。結果,未固化的橡膠100固化成吸附橡膠100'。未固化的橡膠100可以由本領域技術人員已知的材料形成。 The uncured rubber 100 may have different physical properties and different chemical properties before and after the curing step. For example, since the uncured rubber 100 has unstable high fluidity before the curing step, the absorbing rubber 100' having a desired shape can transmit heat and pressure to the uncured rubber 100 in the mold 200 having a desired shape. obtain. As a result, the uncured rubber 100 is cured into the adsorption rubber 100'. The uncured rubber 100 can be formed from materials known to those skilled in the art.

模具200可以包括上模具210和下模具220。 The mold 200 may include an upper mold 210 and a lower mold 220.

上模具210可以在其一個表面上包括模具凹槽(圖中未示)。 The upper mold 210 may include a mold groove (not shown) on one surface thereof.

下模具220可以在其一個表面上包括至少一個模具銷P2。至少一個模具銷P2的數量可以是1至100、2至90、3至80、5至60、6至50、7至40、8至30、和9至20。 The lower mold 220 may include at least one mold pin P 2 on one surface thereof. The number of at least one mold pin P 2 may be 1 to 100, 2 to 90, 3 to 80, 5 to 60, 6 to 50, 7 to 40, 8 to 30, and 9 to 20.

下模具220和至少一個模具銷P2可以形成為一體或可以單獨形成以彼此組合。 The lower mold 220 and the at least one mold pin P 2 may be formed integrally or may be separately formed to be combined with each other.

此外,下模具220和至少一個模具銷P2可以由相同的材料形成或者可以由不同的材料形成。 Further, the lower mold 220 and the at least one mold pin P 2 may be formed of the same material or may be formed of different materials.

當上模具210和下模具220透過加壓裝置(圖中未示)如壓床(press)被加壓以彼此接觸(即稱為“模具200的加壓步驟)時,下模具220的每一個模具銷P2穿過上模具210的模具槽,以接觸模具槽的底表面(即,上模具210的內側)。 When the upper mold 210 and the lower mold 220 are pressurized to each other through a pressurizing device (not shown) such as a press (refer to as "pressurizing step of the mold 200"), each of the lower molds 220 The mold pin P 2 passes through the mold groove of the upper mold 210 to contact the bottom surface of the mold groove (i.e., the inner side of the upper mold 210).

然而,本發明不限於此結構。如第3圖(a)、第3圖(b)、第3圖(c)、和第3圖(d)所示,上模具210可以進一步包括對應於至少一個模具銷P2的至少一個輔助模具銷P2',並且在對模具200的加壓步驟期間,下模具220的至少一個模具銷P2可以接觸上模具210的至少一個輔助模具銷P2'。 However, the invention is not limited to this structure. As FIG. 3 (A), FIG. 3 (B), FIG. 3 (C), and FIG. 3 (d), the upper mold 210 may further comprise at least one of the mold corresponding to the at least one auxiliary pin P 2 The mold pin P 2 ', and during the pressurizing step of the mold 200, at least one of the mold pins P 2 of the lower mold 220 may contact at least one of the auxiliary mold pins P 2 ' of the upper mold 210.

上模具210和至少一個輔助模銷P2'可以單獨地形成為彼此組合或者可以形成為一體。 The upper mold 210 and the at least one auxiliary mold pin P 2 ' may be separately formed to be combined with each other or may be formed integrally.

此外,上模具210和至少一個輔助模具銷P2'可以由不同的材料形成或者可以由相同的材料形成。 Further, the upper mold 210 and the at least one auxiliary mold pin P 2 ' may be formed of different materials or may be formed of the same material.

上模具210可以包括彼此組合的至少兩個部分。例如,上模具210可以包括彼此分離並組合的第一上模具(圖中未示)和第二上模具(圖中未示)。該第二上模具可以設置在第一上模具與下模具220之間。至少一個輔助模具銷P2'可以形成在該第一上模具中,並且模具槽可以形成在該第二上模具中。至少一個模具銷P2和至少一個輔助模具銷P2'穿過至少一個孔,並且用於將該第二上模具組合到該第一上模具的至少一個組合孔可以形成在該第二上模具中。 The upper mold 210 may include at least two portions combined with each other. For example, the upper mold 210 may include a first upper mold (not shown) and a second upper mold (not shown) that are separated and combined with each other. The second upper mold may be disposed between the first upper mold and the lower mold 220. At least one auxiliary mold pin P 2 ' may be formed in the first upper mold, and a mold groove may be formed in the second upper mold. At least one mold pin P 2 and at least one auxiliary mold pin P 2 ′ pass through the at least one hole, and at least one combined hole for combining the second upper mold to the first upper mold may be formed in the second upper mold in.

金屬板300可以包括至少一個真空孔h3。金屬板300中的至少一個真空孔h3可以具有與下模具220中的至少一個模具銷P2相同的數量。然而,本發明不限於此結構。金屬板300中的至少一個真空孔h3的數量可以小於下模具220中的至少一個模具銷P2的數量。例如,至少一個真空孔h3的數量為1,並且至少一個模具銷P2的數量大於2。複數個模具銷P2可穿過真空孔h3中的1個。 The metal plate 300 may include at least one vacuum hole h 3 . At least one vacuum hole h 3 with the same number as the at least one mold pin 220 in the lower die P 2 may have a metal plate 300. However, the invention is not limited to this structure. The number of at least one vacuum hole h 3 in the metal plate 300 may be smaller than the number of at least one mold pin P 2 in the lower mold 220. For example, the number of at least one vacuum hole h 3 is 1, and the number of at least one mold pin P 2 is greater than 2. A plurality of mold pins P 2 may pass through one of the vacuum holes h 3 .

接下來,加熱模具200。例如,模具200可以設置在諸如壓力機的加壓裝置上,並且當加壓裝置被加熱時,熱量可以從加壓裝置傳輸到模具200以加熱模具。例如模具200可以被加熱到50℃至250℃,例如180℃。 Next, the mold 200 is heated. For example, the mold 200 may be disposed on a pressurizing device such as a press, and when the pressurizing device is heated, heat may be transferred from the pressurizing device to the mold 200 to heat the mold. For example, the mold 200 can be heated to between 50 ° C and 250 ° C, such as 180 ° C.

接下來,在將金屬板300插入上模具210和下模具220之前,金屬板300的表面可以以物理方式或化學方式處理。 Next, the surface of the metal plate 300 may be physically or chemically treated before the metal plate 300 is inserted into the upper mold 210 and the lower mold 220.

以物理方式處理金屬板300的表面,意味著在金屬板300的表面上形成表面粗糙度。結果,獲得具有物理處理表面的金屬板300'。 Physically treating the surface of the metal plate 300 means that surface roughness is formed on the surface of the metal plate 300. As a result, a metal plate 300' having a physically treated surface is obtained.

該表面粗糙度可以為0.1μm至1000μm。 The surface roughness may be from 0.1 μm to 1000 μm.

以化學方式處理金屬板300的表面,意味著在金屬板300的表面上塗覆黏著劑(圖中未示)並乾燥所塗覆的黏著劑。溶劑透過乾燥從該黏著劑中去除。結果,得到具有化學處理表面的金屬板300"。 Chemically treating the surface of the metal plate 300 means that an adhesive (not shown) is applied to the surface of the metal plate 300 and the applied adhesive is dried. The solvent is removed from the adhesive by drying. As a result, a metal plate 300" having a chemically treated surface is obtained.

由於在將金屬板300插入模具200之前塗覆黏著劑,所以模具200的結構對塗佈黏著劑的步驟沒有影響。因此,可以通過使用刷子或噴霧法的塗佈方法輕易地進行塗佈黏著劑的步驟,並且可以對複數個金屬板300進行塗佈黏著劑的步驟以提高生產率。此外,可以防止由於高溫下的黏著劑產生氣泡的缺陷和諸如灼傷的安全事故。由於在將金屬板300插入模具200之前塗佈黏著劑之後獲得足夠的製備時間,所以乾燥黏著劑的步驟可以通過乾燥條件進行,從而具有優異的黏著性。 Since the adhesive is applied before the metal plate 300 is inserted into the mold 200, the structure of the mold 200 has no effect on the step of applying the adhesive. Therefore, the step of applying the adhesive can be easily performed by a coating method using a brush or a spray method, and the steps of applying the adhesive to the plurality of metal sheets 300 can be performed to improve productivity. In addition, it is possible to prevent defects such as bubbles generated by the adhesive at high temperatures and safety accidents such as burns. Since a sufficient preparation time is obtained after the application of the adhesive before the metal plate 300 is inserted into the mold 200, the step of drying the adhesive can be carried out under dry conditions to have excellent adhesion.

例如,黏著劑可以包括具有優異的耐熱性和優異的強度的環氧黏著劑、具有優異的韌性和優異的可撓性和優異的耐熱性和優異的強度的彈性黏著劑,以上兩者其中之一及兩者的組合。 For example, the adhesive may include an epoxy adhesive having excellent heat resistance and excellent strength, an elastic adhesive having excellent toughness and excellent flexibility, excellent heat resistance, and excellent strength, both of which are One and a combination of the two.

接下來,具有經處理的表面的金屬板300'或300"和未固化橡膠100可以順序地插入在上模具210與下模具220之間(步驟S100),在步驟S100中,下模具220的每個模具銷P2可以穿透具有處理表面的金屬板300'或300"的至少一個真空孔h3,並且插入具有處理表面的金屬板300'或300"和未固化橡膠100,使得經表面處理的金屬板300'或300"設置在未固化橡膠100。 Subsequently, a metal plate having a treated surface 300 'or 300 "and the uncured rubber 100 may be sequentially inserted in the upper mold and the lower mold 210 (step S 100) 220, the mold in step S 100, the lower 220 Each of the mold pins P 2 may penetrate at least one vacuum hole h 3 of the metal plate 300' or 300" having the treatment surface, and insert the metal plate 300' or 300" having the treatment surface and the uncured rubber 100 so that The surface-treated metal plate 300' or 300" is disposed on the uncured rubber 100.

接下來,模具200可以被加壓,使得上模具210和下模具220彼此接觸(步驟S200)。加壓模具200的步驟可以以50kgf(公斤力)至500000kgf(例如5000kgf)的壓力進行。 Next, the mold 200 may be pressurized such that the upper mold 210 and the lower mold 220 are in contact with each other (step S200 ). The step of pressing the mold 200 may be performed at a pressure of 50 kgf (kg force) to 500000 kgf (for example, 5000 kgf).

在步驟S200中,未固化橡膠100可以被加壓和加熱以固化,並且由於至少一個模具銷P2,具有與至少一個模具銷P2相同數量的至少一個真空孔h4可以在未固化橡膠100中形成。此外,在未固化橡膠100和經表面處理的金屬板300'或300"之間的介面中可能發生固化反應(例如,交聯反應),使得未固化橡膠100與經表面處理的金屬板300'或300"之間的黏著力增加。結果,得到優異的吸附橡膠100'(具有至少一個真空孔h4)和經表面處理的金屬板300'或300"的優異接觸性和優異黏著力。 In step S 200, the uncured rubber 100 can be pressurized and heated to cure, and since at least one mold pin P 2, having at least one mold pin P 2 of the same number of the at least one vacuum hole h 4 can be uncured rubber Formed in 100. Further, a curing reaction (for example, a crosslinking reaction) may occur in the interface between the uncured rubber 100 and the surface-treated metal plate 300' or 300", so that the uncured rubber 100 and the surface-treated metal plate 300' Or the adhesion between 300" increases. As a result, excellent adhesion rubber 100' (having at least one vacuum hole h 4 ) and surface-treated metal plate 300' or 300" excellent contact and excellent adhesion are obtained.

作為未固化橡膠100的固化材料的吸附橡膠100'可以包括:至少一個真空孔h4,該至少一個真空孔h4與經表面處理的金屬板300'或300"的至少一個真空孔h3連通。 As the cured material rubber uncured 100. adsorption rubber 100 'may comprise: at least one vacuum aperture h 4, the at least one vacuum hole h 4 the metal plate 300 surface-treated' or 300 'of at least one vacuum hole h 3 communicates .

此外,吸附橡膠100'可以具有小於經表面處理的金屬板300'或300"的尺寸,並且整個吸附橡膠100'可以設置在經表面處理的金屬板300'或300"的邊界內。 Further, the adsorption rubber 100' may have a size smaller than the surface-treated metal plate 300' or 300", and the entire adsorption rubber 100' may be disposed within the boundary of the surface-treated metal plate 300' or 300".

接下來,上模具210和下模具220彼此分離(步驟S300)。結果,獲得磁性夾頭5。步驟S300之後的上圖是顯示磁性夾頭5的剖面圖,步驟S300之後的中央圖是顯示磁性夾頭5的平面圖,以及在步驟S300之後的下圖是顯示磁性夾頭5的底表面。 Next, the upper mold 210 and the lower mold 220 are separated from each other (step S300 ). As a result, the magnetic chuck 5 is obtained. After the step S 300 of FIG upper is a sectional view of the magnetic chuck 5, the central view after the step S 300 is a plan view of a magnetic chuck 5, and the lower step S 300 in FIG After the substrate is a magnetic chuck 5 surface.

磁性夾頭5可具有以下優點,吸附橡膠100'與經表面處理的金屬板300'或300"之間的接觸性得到改善,防止諸如空隙等缺陷,經表面處理的金屬板300'或300"的至少一個真空孔h3與吸附橡膠100'的至少一個真空孔h4之間的對準得到改善。 The magnetic chuck 5 can have the advantage that the contact between the adsorption rubber 100' and the surface-treated metal plate 300' or 300" is improved to prevent defects such as voids, the surface-treated metal plate 300' or 300" The alignment between the at least one vacuum hole h 3 and the at least one vacuum hole h 4 of the absorbing rubber 100' is improved.

此外,透過同時進行吸附橡膠100'的模製步驟以及吸附橡膠100'和經表面處理的金屬板300'或300"的貼附步驟,減少產品(即,磁性夾頭5)的錯誤率並提高產品的生產率。 Further, by simultaneously performing the molding step of adsorbing the rubber 100' and the attaching step of the adsorbing rubber 100' and the surface-treated metal plate 300' or 300", the error rate of the product (ie, the magnetic chuck 5) is reduced and improved. Product productivity.

根據本發明的製造磁性夾頭的方法,該方法不包括在未經物理或化學方式處理的金屬板300插入於上模具210與下模具220之間之後,以物理或化學方式處理金屬板300的表面的步驟。排除的步驟顯示在第5圖中,其具有以下所述的缺點。 According to the method of manufacturing a magnetic chuck of the present invention, the method does not include physically or chemically treating the metal plate 300 after the metal plate 300 that has not been physically or chemically treated is inserted between the upper mold 210 and the lower mold 220. Surface steps. The excluded steps are shown in Figure 5, which has the disadvantages described below.

第3圖是顯示根據本發明實施例之用於製造磁性夾頭的方法的模具的各種結構的剖面圖。 Fig. 3 is a cross-sectional view showing various structures of a mold for a method for manufacturing a magnetic chuck according to an embodiment of the present invention.

在第3圖中,上模具210、下模具220和具有各種結構的金屬板300可被用於根據本發明實施例之製造磁性夾頭的方法。 In Fig. 3, an upper mold 210, a lower mold 220, and a metal plate 300 having various structures can be used for a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

當上模具210、下模具220、和金屬板300中的其中一個的結構改變時,上模具210、下模具220、和金屬板300中的另外兩個的結構可改變或可不改變。 When the structure of one of the upper mold 210, the lower mold 220, and the metal plate 300 is changed, the structures of the other two of the upper mold 210, the lower mold 220, and the metal plate 300 may or may not be changed.

第3圖(b)、第3圖(c)、和第3圖(d)所示的模具200的上模具210可以包括至少一個輔助模具銷P2',這不同於第3圖(a)所示之模具200的上模具210。在對模具200的加壓步驟中,至少一個輔助模具銷P2'可接觸下模具220的至少一個模具銷P2The upper mold 210 of the mold 200 shown in Figs. 3(b), 3(c), and 3(d) may include at least one auxiliary mold pin P 2 ', which is different from Fig. 3(a) The upper mold 210 of the mold 200 is shown. In the pressurizing step of the mold 200, at least one auxiliary mold pin P 2 ' may contact at least one mold pin P 2 of the lower mold 220.

第4圖是顯示根據本發明實施例之用於製造磁性夾頭的方法的金屬板的各種結構的平面圖。 Fig. 4 is a plan view showing various structures of a metal plate for a method of manufacturing a magnetic chuck according to an embodiment of the present invention.

在第4圖中,金屬板300的至少一個真空孔h3的形狀可以作各種改變。 In Fig. 4, the shape of at least one of the vacuum holes h 3 of the metal plate 300 can be variously changed.

如第4圖(b)和第4圖(c)所示,金屬板300可以進一步包括至少一個組合孔hc以及至少一個真空孔h3As in FIG. 4 (b) and section 4 (c), the metal plate 300 may further include at least one combination hole h c and at least one vacuum hole h 3.

在對模具200的加壓步驟中,至少一個組合孔hc可以填充一部分未固化橡膠100,並且模製的吸附橡膠100'的一部分可以設置在至少一個組合孔hc的內部。因此,至少一個組合孔hc可以用作未固化橡膠100的路徑,使得吸附橡膠100'與金屬板300之間的接觸性能和結合力(即黏著力)。 In the step of pressing the mold 200, at least one combination hole h c may be filled with an uncured rubber portion 100, and a portion of the molded rubber adsorbent 100 'may be disposed within at least one of the combination hole h c. Thus, at least one combination hole h c 100 may be used as a path of the uncured rubber, such that the adsorption rubber 100 'in contact with the metal plate and the bonding force between the properties 300 (i.e., adhesion).

第5圖是顯示根據本發明比較實施例的磁性夾頭的製造方法的視圖。 Fig. 5 is a view showing a method of manufacturing a magnetic chuck according to a comparative embodiment of the present invention.

在第5圖中,提供未固化橡膠1000、模具2000、和金屬板3000。 In Fig. 5, an uncured rubber 1000, a mold 2000, and a metal plate 3000 are provided.

未固化橡膠1000固化以形成吸附橡膠1000'。 The uncured rubber 1000 is cured to form an adsorption rubber 1000'.

模具2000可以包括上模具2100和下模具2200。 The mold 2000 may include an upper mold 2100 and a lower mold 2200.

模具槽(圖中未示)可以形成在上模具2100的一個表面上。 A mold groove (not shown) may be formed on one surface of the upper mold 2100.

至少一個模具銷P3可以形成在下模具2200的一個表面上。 At least one mold pin P 3 may be formed on one surface of the lower mold 2200.

當上模具2100和下模具2200透過諸如壓力機的加壓裝置(圖中未示)被加壓以彼此接觸時,下模具2200的每個模具銷P3穿過上模具2100的模具槽以接觸該模具槽的底表面(即,上模具2100的內側)。 When the upper mold 2100 and the lower mold 2200 are pressurized to contact each other through a pressurizing device (not shown) such as a press, each of the mold pins P 3 of the lower mold 2200 passes through the mold groove of the upper mold 2100 to contact The bottom surface of the mold groove (i.e., the inner side of the upper mold 2100).

至少一個真空孔h5可以形成在金屬板3000中。金屬板3000中的至少一個真空孔h5可以具有與下模具2200中的至少一個模具銷P3相同的數量。 At least one vacuum hole h 5 may be formed in the metal plate 3000. At least one of the vacuum holes h 5 in the metal plate 3000 may have the same number as at least one of the mold pins P 3 in the lower mold 2200.

接下來,加熱模具2000。 Next, the mold 2000 is heated.

接下來,金屬板3000插入在上模具2100與下模具2200之間(步驟S1000)。在步驟S1000中,插入金屬板3000,使得下模具2200的每個模具銷P3以一對一對應的方式穿過金屬板3000的至少一個真空孔h5Next, the metal plate 3000 is inserted between the upper mold 2100 and the lower mold 2200 (step S1000 ). In step S 1000, inserted into the metal plate 3000, 2200 so that each mold lower die pin P 3 at least one vacuum aperture 3000 h 5 through the metal plate to one correspondence manner.

接下來,通過使用刷子或噴霧法(SP)的塗佈方法(BR)將黏著劑塗佈在金屬板3000的表面上以形成黏著劑層4000(步驟S2000)。 Next, by using a brush or spraying method (SP) coating method (BR) the adhesive coated on the surface of the metal plate 3000 to form the adhesive layer 4000 (step S 2000).

下面將說明形成黏著劑層的步驟S2000的缺點。 Forming step will be described below disadvantage adhesive layer of S 2000.

黏著劑可以包括至少一種固體成份(例如樹脂、添加劑)和溶劑。 The adhesive may include at least one solid component (e.g., a resin, an additive) and a solvent.

溶劑可以包括具有相對低沸點的液體如水、醇或其組合,使得溶劑均勻地分散固體成份,並且黏著劑容易地塗佈在諸如金屬板3000的物體上。 The solvent may include a liquid having a relatively low boiling point such as water, an alcohol or a combination thereof such that the solvent uniformly disperses the solid component, and the adhesive is easily coated on an object such as the metal plate 3000.

通常,黏著劑可以通過噴霧方法、浸漬方法和使用刷子的塗佈方法塗佈在物體上。然而,在金屬板3000插入到模具2000中後,當黏著劑塗佈在金屬板3000的表面上時,由於金屬板3000的至少一個真空孔h5、下模具2200的至少一個模具銷P3、以及用於對準諸如銷(圖中未示)的模具元件的干涉而難以塗佈黏著劑。 Generally, the adhesive can be applied to the object by a spraying method, a dipping method, and a coating method using a brush. However, after the metal plate 3000 is inserted into the mold 2000, when the adhesive is coated on the surface of the metal plate 3000, at least one vacuum hole h 5 of the metal plate 3000, at least one mold pin P 3 of the lower mold 2200, And it is difficult to apply an adhesive for aligning the interference of a mold member such as a pin (not shown).

此外,在金屬板3000插入模具2000中之後,不可能通過浸漬方法塗佈黏著劑,並且黏著劑可以僅通過使用刷子或噴霧方法的塗佈方法進行塗佈。然而,當黏著劑通過使用刷子或噴霧方法的塗佈方法塗佈時,黏著劑可能塗佈在金屬板3000和模具2000的非接觸表面(即,除目標接觸表面之外的其他表面)上以及塗佈在金屬板3000的目標接觸面上。結果,在隨後的吸附橡膠1000'的模製步驟中,橡膠會貼附在不期望的部分上,因此,需要進一步進行去除貼附在不期望的部分上的橡膠的步驟。因此,可能不能連續地執行步驟,進而降低生產率 Further, after the metal plate 3000 is inserted into the mold 2000, it is impossible to apply the adhesive by the dipping method, and the adhesive can be applied only by a coating method using a brush or a spray method. However, when the adhesive is applied by a coating method using a brush or a spray method, the adhesive may be applied on the non-contact surface of the metal plate 3000 and the mold 2000 (ie, other surfaces than the target contact surface) and It is coated on the target contact surface of the metal plate 3000. As a result, in the subsequent molding step of adsorbing the rubber 1000', the rubber is attached to the undesired portion, and therefore, the step of removing the rubber attached to the undesired portion is further required. Therefore, steps may not be performed continuously, thereby reducing productivity

此外,由於模製吸附橡膠1000'需要高熱和很大的壓力,所以模具2000通常在高溫下預熱。結果,當金屬板3000插入模具2000中時,金屬板3000也被高溫加熱,這就難以塗覆黏著劑。當黏著劑塗覆在高溫的金屬板3000上時,黏著劑中的溶劑蒸發會瞬間產生大量氣泡。結果,黏著劑不均勻地塗覆在金屬板3000的表面上。從金屬板3000的表面產生的氣泡在其介面處阻礙金屬板3000 和吸附橡膠1000'的接觸。因此,可能會發生諸如產品(即,磁性夾頭)的平坦度降低的缺陷以及由於黏著性差而引起的真空洩漏。 Further, since the molded adsorption rubber 1000' requires high heat and a large pressure, the mold 2000 is usually preheated at a high temperature. As a result, when the metal plate 3000 is inserted into the mold 2000, the metal plate 3000 is also heated at a high temperature, which makes it difficult to apply the adhesive. When the adhesive is applied to the high temperature metal plate 3000, the evaporation of the solvent in the adhesive instantaneously generates a large amount of bubbles. As a result, the adhesive is unevenly coated on the surface of the metal plate 3000. Air bubbles generated from the surface of the metal plate 3000 block the metal plate 3000 at its interface Contact with the adsorption rubber 1000'. Therefore, defects such as a decrease in flatness of the product (i.e., magnetic chuck) and vacuum leakage due to poor adhesion may occur.

接下來,未固化橡膠1000插入在上模具2100與下模具2200之間(步驟S3000)。在步驟S3000中,未固化橡膠1000置在金屬板3000上。 Next, the uncured rubber 1000 is inserted between the upper mold 2100 and the lower mold 2200 (step S3000 ). In step S3000 , the uncured rubber 1000 is placed on the metal plate 3000.

接下來,模具2000可以被加壓,使得上模具2100和下模具2200彼此接觸(步驟S4000)。在步驟S4000中,未固化橡膠1000可以被加壓和加熱以固化,並且具有與至少一個模具銷P3相同數量的至少一個真空孔h6由於至少一個模具銷P3而可在未固化橡膠1000中形成。結果,取得具有至少一個真空孔h6的吸附橡膠1000'。 Next, the mold 2000 may be pressurized such that the upper mold 2100 and the lower mold 2200 are in contact with each other (step S4000 ). In step S 4000, 1000 may be uncured rubber pressurized and heated to cure, and having at least one mold pin 3 of the same number P of the at least one vacuum aperture h 6 because at least one mold pin P 3 can be an uncured rubber Formed in 1000. As a result, the adsorption rubber 1000' having at least one vacuum hole h 6 is obtained.

接下來,上模具2100和下模具2200彼此分離(步驟S5000)。結果,獲得磁性夾頭50。第5圖(a)是顯示磁性夾頭50的平面圖、以及第5圖(b1)、第5圖(b2)、和第5圖(b3)是顯示各種結構的磁性夾頭50的剖面圖。 Next, the upper mold 2100 and the lower mold 2200 are separated from each other (step S5000 ). As a result, the magnetic chuck 50 is obtained. Fig. 5(a) is a plan view showing the magnetic chuck 50, and Figs. 5(b1), 5(b2), and 5(b3) are cross-sectional views showing the magnetic chuck 50 of various configurations.

第5圖(a)和第5圖(b3)是顯示吸附橡膠1000'(即,未固化橡膠1000的固化物)甚至貼附到非接觸表面(即,除了目標接觸表面之外的其他表面)的比較例。由於需要在後續步驟中去除吸附橡膠1000',所以製造過程變得複雜並且生產率降低。具體而言,第5圖(b3)是顯示在吸附橡膠1000'中進一步產生空隙V的比較例。 FIGS. 5(a) and 5(b3) show that the adsorption rubber 1000' (ie, the cured product of the uncured rubber 1000) is even attached to the non-contact surface (ie, other surfaces than the target contact surface). Comparative example. Since the adsorption rubber 1000' needs to be removed in the subsequent step, the manufacturing process becomes complicated and the productivity is lowered. Specifically, Fig. 5 (b3) shows a comparative example in which the void V is further generated in the adsorption rubber 1000'.

第5圖(b1)是顯示在金屬板3000和吸附橡膠1000'之間發生黏著失敗AF的比較例。 Fig. 5 (b1) shows a comparative example in which adhesion failure AF occurs between the metal plate 3000 and the adsorption rubber 1000'.

第5圖(b2)是顯示在吸附橡膠1000'中發生異物F和空隙V的比較例。 Fig. 5 (b2) shows a comparative example in which foreign matter F and void V are generated in the adsorption rubber 1000'.

因此,根據本發明實施例中的製造磁性夾頭的方法具有如下優點。 Therefore, the method of manufacturing a magnetic chuck according to an embodiment of the present invention has the following advantages.

首先,透過同時進行吸附橡膠的模製步驟和橡膠與金屬板的貼附步驟,降低處理時間,並提高生產率。 First, by simultaneously performing the molding step of adsorbing the rubber and the attaching step of the rubber and the metal plate, the processing time is lowered and the productivity is improved.

第二,由於在吸附橡膠與金屬板之間的介面處沒有出現空隙或異物,所以獲得具有吸附橡膠與金屬板之間優異結合力和優異平坦度的磁性夾頭。 Second, since voids or foreign matter are not present at the interface between the adsorption rubber and the metal plate, a magnetic chuck having excellent adhesion between the adsorption rubber and the metal plate and excellent flatness is obtained.

第三,防止磁性夾頭中的真空孔被黏著劑堵塞。 Third, the vacuum hole in the magnetic chuck is prevented from being clogged by the adhesive.

第四,防止吸附橡膠中之真空孔和金屬板中的真空孔的無法對準。 Fourth, the misalignment of the vacuum holes in the adsorption rubber and the vacuum holes in the metal plate is prevented.

儘管本發明參考例示性實施例進行了闡述說明,但是本發明不限於該些實施例。對於本領域技術人員顯而易見的是,在不脫離本發明的精神或範圍的情況下,可以對製造磁性夾頭的方法和本發明中方法的應用進行各種修改和變化。因此,本發明旨在覆蓋本發明的修改和變化,只要它們在所附申請專利範圍及其等同物的範圍內。 Although the present invention has been described with reference to the exemplary embodiments, the invention is not limited to the embodiments. It will be apparent to those skilled in the art that various modifications and changes can be made to the method of making the magnetic chuck and the application of the method of the present invention without departing from the spirit or scope of the invention. Thus, the invention is intended to cover the modifications and modifications of the invention

本申請主張於2017年2月13日提交的韓國專利申請第10-2017-0019489號的優先權的權益,該專利申請的全部內容在此通過引用併入本文。 The present application claims the benefit of priority to Korean Patent Application No. 10-2017-0019489, filed on Feb.

Claims (11)

一種製造磁性夾頭的方法,包括:提供一模具,該模具包括具有至少一個模具槽的一上模具和具有至少一個模具銷的一下模具;提供具有至少一個真空孔的一金屬板;加熱該模具;將該金屬板和未固化橡膠順序地插入在該上模具與該下模具之間,該下模具的該至少一個模具銷穿過該金屬板的該至少一個真空孔,且該未固化橡膠設置在該金屬板上;透過對該模具加壓來形成貼附在該金屬板上的一吸附橡膠,使得該上模具和該下模具彼此接觸;以及於該上模具與該下模具之間插入該金屬板之前,以物理或化學方式處理該金屬板的一表面,其中,以物理方式處理該金屬板的該表面包括在該金屬板的該表面上形成表面粗糙度,其中,以化學方式處理該金屬板的該表面包括在該金屬板的該表面上塗佈黏著劑並乾燥該黏著劑。 A method of manufacturing a magnetic chuck, comprising: providing a mold comprising an upper mold having at least one mold groove and a lower mold having at least one mold pin; providing a metal plate having at least one vacuum hole; heating the mold Inserting the metal plate and the uncured rubber sequentially between the upper mold and the lower mold, the at least one mold pin of the lower mold passing through the at least one vacuum hole of the metal plate, and the uncured rubber setting On the metal plate; forming an adsorption rubber attached to the metal plate by pressurizing the mold to make the upper mold and the lower mold contact each other; and inserting the upper mold and the lower mold Prior to the metal sheet, a surface of the metal sheet is physically or chemically treated, wherein physically treating the surface of the metal sheet includes forming a surface roughness on the surface of the metal sheet, wherein the chemically treating the surface The surface of the metal sheet includes applying an adhesive on the surface of the metal sheet and drying the adhesive. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,加熱該模具係在50℃至250℃的溫度下進行。 A method of producing a magnetic chuck according to the invention of claim 1, wherein the heating is carried out at a temperature of from 50 ° C to 250 ° C. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,於該上模具與該下模具之間插入該金屬板之後,省略掉物理或化學方式處理該金屬板的該表面。 A method of manufacturing a magnetic chuck according to claim 1, wherein the surface of the metal plate is physically or chemically treated after the metal plate is inserted between the upper mold and the lower mold. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,對該模具加壓係在50kgf至500000kgf的壓力下進行。 A method of producing a magnetic chuck according to the above aspect of the invention, wherein the pressurization of the mold is performed under a pressure of 50 kgf to 500,000 kgf. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,作為該未固化橡膠的固化物質的該吸附橡膠包括與該金屬板的該至少一個真空孔連通的至少一個真空孔。 A method of manufacturing a magnetic chuck according to claim 1, wherein the adsorbing rubber as a solidified substance of the uncured rubber includes at least one vacuum hole communicating with the at least one vacuum hole of the metal plate. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,該吸附橡膠具有小於該金屬板的尺寸,並且該吸附橡膠的整體設置在該金屬板的邊界內。 A method of manufacturing a magnetic chuck according to claim 1, wherein the adsorbing rubber has a size smaller than that of the metal plate, and the entire adsorbing rubber is disposed within a boundary of the metal plate. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,進一步包括分離該上模具和該下模具。 The method of manufacturing a magnetic chuck according to claim 1, further comprising separating the upper mold and the lower mold. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,該金屬板進一步包括至少一個組合孔,並且該至少一個組合孔填充有該未固化橡膠的一部分,使得該吸附橡膠的一部分設置在該至少一個組合孔的內部。 The method of manufacturing a magnetic chuck according to claim 1, wherein the metal plate further comprises at least one combined hole, and the at least one combined hole is filled with a portion of the uncured rubber such that a part of the absorbing rubber Provided inside the at least one combined hole. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,該下模具的該至少一個模具銷在該模具加壓時接觸該上模具的內側。 The method of manufacturing a magnetic chuck according to claim 1, wherein the at least one mold pin of the lower mold contacts an inner side of the upper mold when the mold is pressurized. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,該上模具進一步包括與該下模具的該至少一個模具銷相對應的至少一個輔助模具銷,並且在對該模具加壓時該下模具的該至少一個模具銷與該上模具的該至少一個輔助模具銷接觸。 The method of manufacturing a magnetic chuck according to claim 1, wherein the upper mold further comprises at least one auxiliary mold pin corresponding to the at least one mold pin of the lower mold, and pressurizing the mold The at least one mold pin of the lower mold is in contact with the at least one auxiliary mold pin of the upper mold. 依據申請專利範圍第1項所述之製造磁性夾頭的方法,其中,該上模具包括彼此分離並組合的至少兩個部件。 The method of manufacturing a magnetic chuck according to claim 1, wherein the upper mold comprises at least two components separated and combined with each other.
TW106123996A 2017-02-13 2017-07-18 Method of fabricating magnetic collet TWI627053B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101192371B1 (en) * 2012-04-25 2012-10-17 (주)지텍 A thin type carrier plate for forming the external electrode and fabricating method its
KR101570764B1 (en) * 2014-02-27 2015-11-20 주식회사 페코텍 Collet for boding semiconductor die

Family Cites Families (3)

* Cited by examiner, † Cited by third party
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JP4142674B2 (en) * 2005-07-29 2008-09-03 株式会社日本製鋼所 Mold apparatus and method for producing molded body using the same
KR200414775Y1 (en) * 2006-02-10 2006-04-24 한양정밀 (주) apparatus for transfering die
KR100860231B1 (en) * 2007-08-10 2008-09-24 차용철 Apparatus and method for electrode adhesion of matrix net

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101192371B1 (en) * 2012-04-25 2012-10-17 (주)지텍 A thin type carrier plate for forming the external electrode and fabricating method its
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