CN111642081A - PCB solder mask production process - Google Patents
PCB solder mask production process Download PDFInfo
- Publication number
- CN111642081A CN111642081A CN202010500748.3A CN202010500748A CN111642081A CN 111642081 A CN111642081 A CN 111642081A CN 202010500748 A CN202010500748 A CN 202010500748A CN 111642081 A CN111642081 A CN 111642081A
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- pcb
- polyimide film
- solder mask
- baking
- production process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a PCB solder mask production process, which comprises the following steps: preparing raw materials, exposing a bonding pad, stacking thin films, fixing the stacked thin films, performing high-temperature hot-press molding, and baking and curing; compared with the traditional PCB production process, the PCB solder mask production process provided by the invention realizes zero emission, saves water and electricity and can greatly shorten the production period of the solder mask process through the solder mask process; the PCB can also have considerable flexibility; the production process of the invention cuts the windowing position of the PCB pad on the polyimide film (PI) by using the polyimide film (PI) with the single side coated with the semi-cured epoxy resin glue (or coated with the semi-cured acrylic acid) and using the processes of laser or die cutting and the like, then stacks and fixes the polyimide film (PI) with the cut windowing on the PCB body in a stacking way, and compresses and forms the polyimide film (PI) in a high-temperature and fast-critical way to finally obtain the solder mask which is superior to the printing ink, and the production process has the advantages of water saving, electricity saving, labor saving, production efficiency improvement, environmental protection and no pollution.
Description
Technical Field
The invention belongs to the technical field of PCB solder mask production, and particularly relates to a PCB solder mask production process.
Background
A PCB, i.e., a printed wiring board, which is called a printed board for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated. Printed wiring boards are now used very widely in the manufacture of electronic products.
Resistance welding, which is resistance welding, is a method of welding a desired object by applying pressure while locally heating the desired object using resistance heat generated by passing a current through the object and a contact portion as a heat source. And metal does not need to be filled during welding, the production efficiency is high, the deformation of a weldment is small, and the automation is easy to realize. Resistance welding is a method of heating a workpiece to a molten or plastic state by the effect of resistance heat generated by current flowing through the contact surface and adjacent regions of the workpiece to cause the workpiece to form a metallic bond, and is generally a welding method of joining workpieces by causing the workpiece to be under a certain electrode pressure and melting the contact surface between the two workpieces by the resistance heat generated when current passes through the workpiece. A larger current is typically used. To prevent arcing at the interface and to forge the weld metal, pressure is applied at all times during the welding process. In performing such resistance welding, it is important to obtain stable welding quality on the surface of the workpiece to be welded. Therefore, the contact surfaces between the electrode and the workpiece and between the workpiece and the workpiece must be cleaned before welding.
The traditional PCB production process generates more pollutants, wherein the pollutants generated in the production procedures of electroplating, circuit, solder resist and the like are the most; and the conventional PCB production process also consumes a large amount of water and electricity. For example, in the traditional solder mask process, a plurality of processes such as printing, pre-baking, alignment, exposure, development, post-baking and the like are required to be performed by using special PCB ink, so that the pad windowing can be performed, the process has high water and electricity energy consumption, low production efficiency, large amount of organic wastewater and waste gas, and high production cost. The invention aims to solve the defects in the prior art and provides a PCB solder mask production process.
Disclosure of Invention
In order to achieve the purpose, compared with the traditional PCB production process, the PCB solder mask production process provided by the invention realizes zero emission, water and electricity conservation through the solder mask process, and can greatly shorten the production period of the process; if the PCB with the thickness of less than 0.4mm is used for production, the product yield and the product reliability can be greatly improved, and the PCB can have considerable flexibility; the production process comprises the steps of coating a semi-cured epoxy resin adhesive (or semi-cured acrylic acid) on a polyimide film (PI) on a single surface, cutting a PCB pad windowing position on the polyimide film (PI) by using laser, stacking and fixing the cut polyimide film (PI) on a PCB body in a stacking mode, compacting and forming in a high-temperature and rapid mode, and finally obtaining a solder mask layer superior to ink.
The invention provides the following technical scheme: a PCB solder mask production process comprises the following steps:
s1, preparing raw materials, preparing a polyimide film with a single side coated with semi-cured epoxy resin glue or semi-cured acrylic acid, preparing a PCB substrate needing resistance welding, and dividing the prepared polyimide film and the PCB substrate into sizes to be produced;
s2, exposing the pads, windowing the polyimide film coated with the semi-cured epoxy resin glue or the semi-cured acrylic acid in the step S1 through laser, generating windowing pads on the surface of the polyimide film, and keeping the size parameters of the windowing pads of a plurality of groups of polyimide films consistent;
s3, stacking films, namely stacking a plurality of groups of polyimide films with the window pads kept consistent in the step S2, and ensuring that the polyimide films are aligned consistently to form a laminated structure A;
s4, fixing the stacked films, and stacking the stacked structure a formed by stacking the plurality of sets of polyimide films in the step S3 on the PCB substrate again to form a stacked structure B;
s5, high-temperature hot-press molding, namely transferring the laminated structure B formed by the polyimide film laminated structure and the PCB substrate in the step S4 into a quick hot-press machine, and carrying out high-temperature hot-press on the laminated structure B, so that the laminated structure B forms an integrated structure of the polyimide film and the PCB substrate;
and S6, baking and curing, namely baking and curing the integrated structure of the polyimide film and the PCB substrate which are subjected to the high-temperature hot pressing molding in the step S5, so as to produce the PCB process structure with the polyimide film solder mask layer.
Preferably, in step S1, the PCB substrate includes a PCB circuit layer and an FR4 substrate structure, and the PCB substrate is provided with a PCB via hole.
Preferably, in step S2, a laser used for windowing the polyimide film coated with the semi-solid acrylic is set as a DFB semiconductor laser.
Preferably, in step S5, the thickness of the integrated structure of the polyimide film and the PCB substrate is less than 0.4 mm.
Preferably, in step S5, the thermocompressor is configured as a pulsed rapid thermocompressor heated with hot oil.
Preferably, in step S6, the baking and curing step includes: 1. vertically and side by side placing an integrated structure of a polyimide film to be baked and cured and a PCB substrate on a shelf of an oven; 2. setting the baking temperature and the baking time of the baking oven, starting the baking oven, and recording baking parameters during baking; 3. baking at a preset baking temperature for a preset time, and waiting for the PCB to be cooled to normal temperature in an oven and taking out.
Preferably, the baking curing temperature of the integrated structure of the polyimide film and the PCB substrate is 150 +/-10 ℃.
Preferably, the baking curing time of the integrated structure of the polyimide film and the PCB substrate is 60-90 minutes.
The invention has the technical effects and advantages that: compared with the traditional PCB production process, the PCB solder mask production process provided by the invention realizes zero emission, saves water and electricity and can greatly shorten the production period of the solder mask process through the solder mask process; if the PCB with the thickness of less than 0.4mm is used for production, the product yield and the product reliability can be greatly improved, and the PCB can have considerable flexibility; the production process of the invention uses the polyimide film (PI) with one side coated with semi-cured epoxy resin glue (or coated with semi-cured acrylic acid), uses laser to cut the window position of the PCB pad on the polyimide film (PI), then uses the stacking mode to stack and fix the cut polyimide film (PI) on the PCB body, and compresses and forms the film in a high-temperature and quick mode, finally obtains the solder mask layer superior to ink, saves water, electricity, labor, environment and pollution, has no pollutant removal in the whole production process, shortens the production period, saves energy consumption, improves economic benefits, and can improve the production efficiency of the PCB while protecting the environment compared with the PCB solder mask process in the prior art.
Drawings
FIG. 1 is a process flow diagram of a conventional solder resist production process in the prior art;
FIG. 2 is a process flow diagram of the proposed novel PCB solder mask process of the present invention;
FIG. 3 is a schematic diagram of a PCB process structure produced by a conventional solder resist process in the prior art;
FIG. 4 is a schematic diagram of a PCB manufactured by the inventive process.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
A PCB solder mask production process comprises the following steps:
s1, preparing raw materials, preparing a polyimide film with a single side coated with semi-cured epoxy resin glue or semi-cured acrylic acid, preparing a PCB substrate needing resistance welding, and dividing the prepared polyimide film and the PCB substrate into sizes to be produced;
s2, exposing the pads, windowing the polyimide film coated with the semi-cured epoxy resin glue or the semi-cured acrylic acid in the step S1 through laser, generating windowing pads on the surface of the polyimide film, and keeping the size parameters of the windowing pads of a plurality of groups of polyimide films consistent;
s3, stacking films, namely stacking a plurality of groups of polyimide films with the window pads kept consistent in the step S2, and ensuring that the polyimide films are aligned consistently to form a laminated structure A;
s4, fixing the stacked films, and stacking the stacked structure a formed by stacking the plurality of sets of polyimide films in the step S3 on the PCB substrate again to form a stacked structure B;
s5, high-temperature hot-press molding, namely transferring the laminated structure B formed by the polyimide film laminated structure and the PCB substrate in the step S4 into a quick hot-press machine, and carrying out high-temperature hot-press on the laminated structure B, so that the laminated structure B forms an integrated structure of the polyimide film and the PCB substrate;
and S6, baking and curing, namely baking and curing the integrated structure of the polyimide film and the PCB substrate which are subjected to the high-temperature hot pressing molding in the step S5, so as to produce the PCB process structure with the polyimide film solder mask layer.
Further, in step S1, the PCB substrate includes a PCB circuit layer and an FR4 substrate structure, and the PCB substrate is provided with a PCB via hole.
Further, in step S2, a laser for windowing the polyimide film coated with the semi-solid acrylic is set as a DFB semiconductor laser.
Further, in step S5, the thickness of the integrated structure of the polyimide film and the PCB substrate is less than 0.4 mm.
Further, in step S5, the thermocompressor is configured as a pulsed rapid thermocompressor heated with hot oil.
Further, in step S6, the baking and curing step includes: 1. vertically and side by side placing an integrated structure of a polyimide film to be baked and cured and a PCB substrate on a shelf of an oven; 2. setting the baking temperature and the baking time of the baking oven, starting the baking oven, and recording baking parameters during baking; 3. baking at a preset baking temperature for a preset time, and waiting for the PCB to be cooled to normal temperature in an oven and taking out.
Further, the baking curing temperature of the integrated structure of the polyimide film and the PCB substrate is 150 +/-10 ℃.
Further, the baking curing time of the integrated structure of the polyimide film and the PCB substrate is 60-90 minutes.
In summary, the following steps: compared with the traditional PCB production process, the PCB solder mask production process provided by the invention realizes zero emission, saves water and electricity and can greatly shorten the production period of the solder mask process through the solder mask process; if the PCB with the thickness of less than 0.4mm is used for production, the product yield and the product reliability can be greatly improved, and the PCB can have considerable flexibility; the production process of the invention uses the polyimide film (PI) with one side coated with semi-cured epoxy resin glue (or coated with semi-cured acrylic acid), uses laser to cut the window position of the PCB pad on the polyimide film (PI), then uses the stacking mode to stack and fix the cut polyimide film (PI) on the PCB body, and compresses and forms the film in a high-temperature and quick mode, finally obtains the solder mask layer superior to ink, saves water, electricity, labor, environment and pollution, has no pollutant removal in the whole production process, shortens the production period, saves energy consumption, improves economic benefits, and can improve the production efficiency of the PCB while protecting the environment compared with the PCB solder mask process in the prior art.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. A PCB solder mask production process is characterized in that: the method comprises the following steps:
s1, preparing raw materials, preparing a polyimide film with a single side coated with semi-cured epoxy resin glue or semi-cured acrylic acid, preparing a PCB substrate needing resistance welding, and dividing the prepared polyimide film and the PCB substrate into sizes to be produced;
s2, exposing the pads, windowing the polyimide film coated with the semi-cured epoxy resin glue or the semi-cured acrylic acid in the step S1 through laser, generating windowing pads on the surface of the polyimide film, and keeping the size parameters of the windowing pads of a plurality of groups of polyimide films consistent;
s3, stacking films, namely stacking a plurality of groups of polyimide films with the window pads kept consistent in the step S2, and ensuring that the polyimide films are aligned consistently to form a laminated structure A;
s4, fixing the stacked films, and stacking the stacked structure a formed by stacking the plurality of sets of polyimide films in the step S3 on the PCB substrate again to form a stacked structure B;
s5, high-temperature hot-press molding, namely transferring the laminated structure B formed by the polyimide film laminated structure and the PCB substrate in the step S4 into a quick hot-press machine, and carrying out high-temperature hot-press on the laminated structure B, so that the laminated structure B forms an integrated structure of the polyimide film and the PCB substrate;
and S6, baking and curing, namely baking and curing the integrated structure of the polyimide film and the PCB substrate which are subjected to the high-temperature hot pressing molding in the step S5, so as to produce the PCB process structure with the polyimide film solder mask layer.
2. The PCB solder mask production process of claim 1, wherein: in step S1, the PCB substrate includes a PCB circuit layer and an FR4 substrate structure, and the PCB substrate is provided with a PCB via hole.
3. The PCB solder mask production process of claim 1, wherein: in step S2, a laser used for windowing the polyimide film coated with the semi-solid acrylic is set as a DFB semiconductor laser.
4. The PCB solder mask production process of claim 1, wherein: in step S5, the thickness of the integrated structure of the polyimide film and the PCB substrate is less than 0.4 mm.
5. The PCB solder mask production process of claim 1, wherein: in step S5, the thermocompressor is set to a pulsed rapid thermocompressor that is heated with hot oil.
6. The PCB solder mask production process of claim 1, wherein: in step S6, the baking and curing step includes: 1. vertically and side by side placing an integrated structure of a polyimide film to be baked and cured and a PCB substrate on a shelf of an oven; 2. setting the baking temperature and the baking time of the baking oven, starting the baking oven, and recording baking parameters during baking; 3. baking at a preset baking temperature for a preset time, and waiting for the PCB to be cooled to normal temperature in an oven and taking out.
7. The PCB solder mask production process of claim 6, wherein: the baking curing temperature of the integrated structure of the polyimide film and the PCB substrate is 150 +/-10 ℃.
8. The PCB solder mask production process of claim 6, wherein: the baking and curing time of the integrated structure of the polyimide film and the PCB substrate is 60-90 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010500748.3A CN111642081A (en) | 2020-06-04 | 2020-06-04 | PCB solder mask production process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010500748.3A CN111642081A (en) | 2020-06-04 | 2020-06-04 | PCB solder mask production process |
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| CN111642081A true CN111642081A (en) | 2020-09-08 |
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| CN202010500748.3A Pending CN111642081A (en) | 2020-06-04 | 2020-06-04 | PCB solder mask production process |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055468A (en) * | 2020-09-14 | 2020-12-08 | 珠海市晶昊电子科技有限公司 | Processing method of covering film on circuit board |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
| CN114885514A (en) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN115551205A (en) * | 2022-09-16 | 2022-12-30 | 广东成德电子科技股份有限公司 | Printed circuit board processing method |
| CN116867165A (en) * | 2023-08-22 | 2023-10-10 | 江西兆信精密电子有限公司 | Light sheet substrate backlight circuit board of mini LED keyboard module |
| US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040238205A1 (en) * | 2003-05-30 | 2004-12-02 | Dell Products L.P. | Printed circuit board with controlled solder shunts |
| CN104869756A (en) * | 2015-06-10 | 2015-08-26 | 金达(珠海)电路版有限公司 | Manufacturing method for hollowed-out board |
| CN107222979A (en) * | 2017-03-31 | 2017-09-29 | 长兴材料工业股份有限公司 | Method for preparing patterned covering film on substrate |
| CN209366221U (en) * | 2018-10-30 | 2019-09-10 | 广东冠锋科技股份有限公司 | A kind of high temperature baking sheet vehicle |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
-
2020
- 2020-06-04 CN CN202010500748.3A patent/CN111642081A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040238205A1 (en) * | 2003-05-30 | 2004-12-02 | Dell Products L.P. | Printed circuit board with controlled solder shunts |
| CN104869756A (en) * | 2015-06-10 | 2015-08-26 | 金达(珠海)电路版有限公司 | Manufacturing method for hollowed-out board |
| CN107222979A (en) * | 2017-03-31 | 2017-09-29 | 长兴材料工业股份有限公司 | Method for preparing patterned covering film on substrate |
| CN209366221U (en) * | 2018-10-30 | 2019-09-10 | 广东冠锋科技股份有限公司 | A kind of high temperature baking sheet vehicle |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055468A (en) * | 2020-09-14 | 2020-12-08 | 珠海市晶昊电子科技有限公司 | Processing method of covering film on circuit board |
| CN114885514A (en) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| WO2022166215A1 (en) * | 2021-02-05 | 2022-08-11 | 深南电路股份有限公司 | Method for manufacturing printed circuit board, and printed circuit board |
| US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
| CN115551205A (en) * | 2022-09-16 | 2022-12-30 | 广东成德电子科技股份有限公司 | Printed circuit board processing method |
| CN116867165A (en) * | 2023-08-22 | 2023-10-10 | 江西兆信精密电子有限公司 | Light sheet substrate backlight circuit board of mini LED keyboard module |
| CN116867165B (en) * | 2023-08-22 | 2024-04-12 | 江西兆信精密电子有限公司 | Light sheet substrate backlight circuit board of mini LED keyboard module |
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Application publication date: 20200908 |